Vibration reduction type 3D profile measuring instrument

Abstract

The utility model provides a vibration damping type 3D profile measuring instrument, relates to the measuring equipment field, the vibration damping type 3D profile measuring instrument comprises a measuring instrument main body, a mounting plate and a plurality of groups of vibration damping assemblies, first the mounting plate applies irregular stress to a buffer member, the buffer member moves along the inner side wall of a bearing member, and the vibration damping assemblies are arranged on the bearing member; the sliding body slides in the bearing piece along the inner side wall of the buffering piece, so that components in the bearing piece move up and down, extrusion force in two opposite directions is applied to the elastic piece, the stress of the elastic piece for restoring the initial state is stronger, the vibration stress between the measuring instrument main body and the mounting plate is reduced, and the measurement accuracy is improved. At the moment, resistance grooves formed in the two sides of the sliding body are matched with the bearing piece, so that the friction force is increased, the movement range between the buffering piece and the bearing piece is reduced, and the vibration between the measuring instrument main body and the mounting plate is effectively reduced by matching with the elastic piece; errors caused by vibration during measurement and scanning of the measuring instrument are reduced.

Description

Technical Field

[0001] The utility model relates to the field of measuring equipment, in particular to a vibration-damping 3D contour measuring instrument. Background Art

[0002] 3D profile measuring instruments typically use optical principles, such as laser triangulation and structured light methods. Taking laser triangulation as an example, the instrument emits a laser beam onto the surface of the object being measured, receives the reflected light through an optical sensor, and calculates the height information of each point on the object's surface based on the laser irradiation angle and the position change of the reflected light, thereby constructing the object's three-dimensional profile. The main feature is the high-precision non-contact measurement of micron-level or even higher precision, which meets the needs of high-precision measurement of precision parts, molds, etc., without causing damage to the measured object. It is suitable for objects of various materials, including soft, fragile, and easily deformed objects.

[0003] Today's 3D profile measuring instruments usually adopt two scanning states: handheld scanning or fixed track scanning. When scanning objects in the handheld and fixed track states, vibrations are inevitable, which has a certain impact on the accuracy of the measuring instrument in scanning objects. The method commonly used to reduce the vibration of 3D profile measuring instruments is to add shock-absorbing pads at their joints. Although the shock-absorbing pads have a certain shock-absorbing effect on slight vibrations, they have a poor vibration-reducing effect on larger vibrations when manually holding the instrument and when starting, stopping, and changing tracks on the fixed track. Therefore, the scanning accuracy of the measuring instrument for precision objects is affected to a certain extent, and unnecessary deformation errors are easily generated, thereby reducing the scanning accuracy.

[0004] Therefore, it is necessary to provide a new vibration-damping 3D profile measuring instrument to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a vibration-damping 3D profile measuring instrument.

[0006] The utility model provides a vibration-damping 3D profile measuring instrument comprising: a measuring instrument body, a mounting plate, and a plurality of groups of vibration-damping components. The top surface of the measuring instrument body is provided with a plurality of movable grooves for movably mounting the plurality of groups of vibration-damping components. The plurality of groups of vibration-damping components are respectively located inside the plurality of movable grooves, and the bottoms of the plurality of groups of vibration-damping components are integrally connected to the bottom ends of the movable grooves.

[0007] The vibration damping assembly includes a buffer part and a supporting part. The buffer part is located inside the supporting part, and the top end of the buffer part is connected to the top of the supporting part through an elastic part. A sliding body matching the internal surface of the buffer part is slidably installed inside the supporting part. The inner side walls of the buffer part are respectively fitted with the two end surfaces of the sliding body, and resistance grooves are provided on both side surfaces of the sliding body.

[0008] Preferably, the buffer component includes a buffer shell and two inclined blocks, the two inclined blocks are arranged opposite to each other, and the two inclined blocks are both located inside the buffer shell and are integrally connected to the buffer shell. One side surface of the two inclined blocks are respectively fitted with the two ends of the sliding body, and a first mounting ring is fixedly provided at the top end of the buffer shell, and one end of the elastic component is sleeved on the surface of the first mounting ring.

[0009] Preferably, the supporting member includes a supporting shell and a supporting column, the bottom of the supporting column is integrally connected to the bottom end of the supporting shell, and a movable column is slidably installed inside the supporting column, the outer surface of the movable column is in contact with the inner wall of the supporting column, and a second mounting ring is fixed to the top of the movable column, and the other end of the elastic member is sleeved on the surface of the second mounting ring.

[0010] Preferably, both ends of the sliding body pass through the surface of the supporting column and the surface of the movable column, and the sliding bodies are located inside the supporting column and the movable column in a sliding connection. Damping columns are fixed on both sides of the movable column, and the damping columns are located inside the resistance groove, and the surface of the damping column is in contact with the surface of the resistance groove.

[0011] Preferably, the inner side wall of the bearing shell is in contact with the outer surface of the lower middle part of the buffer shell, and the upper middle part of the buffer shell extends outside the bearing shell. The bearing shell provides activity space for the buffer shell and limits the maximum value of the activity space.

[0012] Preferably, the bottom of the mounting plate is fixedly connected to the tops of the plurality of buffer shells, and a plurality of mounting grooves are provided on the surface of the mounting plate.

[0013] Compared with related technologies, the vibration-damping 3D profile measuring instrument provided by the present invention has the following beneficial effects:

[0014] When vibration occurs between the measuring instrument body and the mounting plate, the mounting plate first applies irregular stress to the buffer. At this time, the outer surface of the buffer moves irregularly along the inner wall of the supporting part, and its sliding body slides along the inner wall of the buffer inside the supporting part, causing the components inside the supporting part to move up and down, applying two extrusion forces in opposite directions to the elastic part. The rebound pressure of the elastic part will be doubled, making the restoring force to return to the initial state stronger, reducing the stress between the measuring instrument body and the mounting plate. At this time, the resistance grooves on both sides of the sliding body cooperate with the supporting part to increase the friction force, thereby reducing the range of movement between the buffer and the supporting part, and then cooperating with the auxiliary rebound of the elastic part, it effectively reduces the vibration between the measuring instrument body and the mounting plate, thereby reducing the error caused by vibration during measurement scanning of the measuring instrument. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a vibration-damping 3D profile measuring instrument provided by the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of a vibration-damping 3D profile measuring instrument provided by the utility model from another perspective;

[0017] Figure 3 This is a schematic diagram of the disassembled structure of a vibration-damping 3D profile measuring instrument provided by the utility model;

[0018] Figure 4 A partial cross-sectional schematic diagram of the measuring instrument body and the vibration reduction assembly provided by the utility model;

[0019] Figure 5 A partial cross-sectional schematic diagram of the measuring instrument body and the vibration reduction assembly provided by the utility model from another perspective;

[0020] Figure 6 A schematic cross-sectional view of the vibration reduction assembly provided by the present invention;

[0021] Figure 7 This is a schematic cross-sectional view of the vibration reduction assembly provided by the present invention in another state;

[0022] Figure 8 This is a schematic diagram of the disassembled structure of the buffer provided by the utility model;

[0023] Figure 9 This is a schematic diagram of the cross-sectional structure of the movable column and the sliding body provided by the utility model.

[0024] Numbers in the figure: 1. Measuring instrument body; 2. Mounting plate; 3. Vibration reduction assembly; 4. Movable groove; 5. Buffer member; 6. Support member; 7. Elastic member; 8. Sliding body; 9. Resistance groove; 10. Buffer shell; 11. Tilting block; 12. First mounting ring; 13. Support shell; 14. Support column; 15. Movable column; 16. Damping column; 17. Mounting groove; 18. Second mounting ring. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and implementation examples.

[0026] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 as well as Figure 9 ,in, Figure 1 This is a schematic diagram of the overall structure of a vibration-damping 3D profile measuring instrument provided by the utility model;

[0027] Figure 2 This is a schematic diagram of the overall structure of a vibration-damping 3D profile measuring instrument provided by the utility model from another perspective; Figure 3 This is a schematic diagram of the disassembled structure of a vibration-damping 3D profile measuring instrument provided by the utility model;

[0028] Figure 4 A partial cross-sectional schematic diagram of the measuring instrument body and the vibration reduction assembly provided by the utility model; Figure 5 A partial cross-sectional schematic diagram of the measuring instrument body and the vibration reduction assembly provided by the utility model from another perspective; Figure 6 A schematic cross-sectional view of the vibration reduction assembly provided by the present invention; Figure 7 This is a schematic cross-sectional view of the vibration reduction assembly provided by the present invention in another state; Figure 8 This is a schematic diagram of the disassembled structure of the buffer provided by the utility model; Figure 9 This is a schematic diagram of the cross-sectional structure of the movable column and the sliding body provided by the utility model.

[0029] In the specific implementation process, Figures 1-9 As shown, the present invention provides a vibration-damping 3D profile measuring instrument, comprising a measuring instrument body 1, a mounting plate 2, and a plurality of vibration-damping components 3. The top surface of the measuring instrument body 1 is provided with a plurality of movable grooves 4 for movably mounting the plurality of vibration-damping components 3. The plurality of vibration-damping components 3 are respectively located within the plurality of movable grooves 4, and the bottoms of the plurality of vibration-damping components 3 are integrally connected to the bottom ends of the movable grooves 4.

[0030] The vibration reduction assembly 3 includes a buffer 5 and a bearing 6. The buffer 5 is located inside the bearing 6, and the top of the buffer 5 is connected to the top of the bearing 6 by an elastic member 7. A sliding body 8 that matches the inner surface of the buffer 5 is slidably installed inside the bearing 6. The inner sidewalls of the buffer 5 are respectively in contact with the two end surfaces of the sliding body 8, and resistance grooves 9 are provided on both sides of the sliding body 8.

[0031] It should be noted that the vertical cross-section of the sliding body 8 is arranged in an N-shape, and it slides movably inside the supporting member 6 so as to drive the movable column 15 to move up and down, thereby applying stress to the elastic member 7.

[0032] The buffer member 5 includes a buffer shell 10 and two tilting blocks 11. The two tilting blocks 11 are arranged opposite to each other, and both tilting blocks 11 are located inside the buffer shell 10 and are integrally connected to the buffer shell 10. One side surface of the two tilting blocks 11 is respectively in contact with the two ends of the sliding body 8. A first mounting ring 12 is fixed to the top of the buffer shell 10, and one end of the elastic member 7 is sleeved on the surface of the first mounting ring 12.

[0033] It should be noted that the elastic member 7 is a spring.

[0034] The supporting member 6 includes a supporting shell 13 and a supporting column 14. The bottom of the supporting column 14 is integrally connected to the bottom end of the supporting shell 13, and a movable column 15 is slidably installed inside the supporting column 14. The outer surface of the movable column 15 is in contact with the inner wall of the supporting column 14, and a second mounting ring 18 is fixed to the top of the movable column 15, and the other end of the elastic member 7 is sleeved on the surface of the second mounting ring 18.

[0035] In a specific embodiment, the inner wall of the bearing shell 13 fits with the outer surface of the lower middle part of the buffer shell 10, and the upper middle part of the buffer shell 10 extends outside the bearing shell 13. The bearing shell 13 provides activity space for the buffer shell 10 and limits the maximum value of the activity space.

[0036] Both ends of the sliding body 8 penetrate the surface of the bearing column 14 and the surface of the movable column 15, and the sliding body 8 is located inside the bearing column 14 and the movable column 15 in a sliding connection. Damping columns 16 are fixed on both sides of the movable column 15, and the damping columns 16 are located inside the resistance groove 9, and the surface of the damping column 16 is in contact with the surface of the resistance groove 9.

[0037] It should be noted that the surface of the sliding body 8 passing through the supporting column 14 is a slide groove that allows the entire sliding body 8 to slide, and the surface of the sliding body 8 passing through the movable column 15 is a slide groove that only allows the cross-section of the central part of the sliding body 8 to slide. Since the sliding body 8 only allows the cross-section of the central part to pass through the inside of the movable column 15, the movable column 15 moves up and down along the surface of the sliding body 8, and at the same time, the second mounting ring 18 provided on the top of the sliding body 8 cooperates with the first mounting ring 12 provided on the top of the buffer shell 10, so that it applies bidirectional stress to the elastic member 7 at the same time, and then applies pressure in two different directions to the elastic member 7 between the buffer shell 10 and the movable column 15.

[0038] The bottom of the mounting plate 2 is fixedly connected to the top of the plurality of buffer shells 10, and a plurality of mounting grooves 17 are opened on the surface of the mounting plate 2;

[0039] It should be noted that the mounting slot 17 can be connected to a fixed slide rail and a handheld bracket to measure and scan the 3D contour of an object.

[0040] The working principle provided by the utility model is as follows:

[0041] When vibration occurs between the measuring instrument body 1 and the mounting plate 2, the mounting plate 2 first applies irregular stress to the buffer shell 10. At this time, the outer side of the buffer shell 10 moves irregularly along the bearing shell 13, and the sliding body 8 slides along the surface of the internal oblique block of the buffer shell 10, inside the bearing column 14 and inside the movable column 15. At the same time, the movable column 15 is driven by the sliding column to move up and down on the internal surface of the bearing column 14. At this time, the elastic member 7 between the top end of the buffer shell 10 and the top end of the movable column 15 is subjected to irregular squeezing in two directions. At this time, the rebound pressure of the elastic member 7 is greater, making its restoring force to the initial state stronger, thereby reducing the vibration between the measuring instrument body 1 and the mounting plate 2. At this time, the resistance grooves 9 on both sides of the sliding body 8 and the resistance columns on both sides of the movable body cooperate with each other, thereby increasing the friction force to reduce the range of movement between the buffer shell 10 and the bearing shell 13, and with the assistance of the elastic member 7, the vibration between the measuring instrument body 1 and the mounting plate 2 is effectively reduced.

[0042] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A vibration-damping 3D profile measuring instrument, characterized in that: include: A measuring instrument body (1), a mounting plate (2), and a plurality of groups of vibration reduction components (3); a top surface of the measuring instrument body (1) is provided with a plurality of movable grooves (4) for movably mounting the plurality of groups of vibration reduction components (3); the plurality of groups of vibration reduction components (3) are respectively located inside the plurality of movable grooves (4); and the bottoms of the plurality of groups of vibration reduction components (3) are all integrally connected to the bottom ends of the movable grooves (4); The vibration damping assembly (3) includes a buffer (5) and a supporting member (6), wherein the buffer (5) is located inside the supporting member (6), and the top end of the buffer (5) is connected to the top of the supporting member (6) via an elastic member (7), and a sliding body (8) matching the internal surface of the buffer (5) is slidably installed inside the supporting member (6), the inner side wall of the buffer (5) is respectively fitted with the two end surfaces of the sliding body (8), and resistance grooves (9) are provided on both side surfaces of the sliding body (8).

2. The vibration-damping 3D profile measuring instrument according to claim 1, characterized in that: The buffer member (5) includes a buffer shell (10) and two tilting blocks (11), the two tilting blocks (11) are arranged opposite to each other, and the two tilting blocks (11) are both located inside the buffer shell (10) and are connected to the buffer shell (10) in an integral manner, and one side surface of the two tilting blocks (11) is respectively fitted with the two ends of the sliding body (8), and a first mounting ring (12) is fixedly provided at the top end of the buffer shell (10), and one end of the elastic member (7) is sleeved on the surface of the first mounting ring (12).

3. The vibration-damping 3D profile measuring instrument according to claim 2, characterized in that: The supporting member (6) includes a supporting shell (13) and a supporting column (14), the bottom of the supporting column (14) is integrally connected to the bottom end of the inner portion of the supporting shell (13), and a movable column (15) is slidably installed inside the supporting column (14), the outer surface of the movable column (15) is in contact with the inner wall of the supporting column (14), and the top end of the movable column (15) is fixedly provided with the second mounting ring (18), and the other end of the elastic member (7) is sleeved on the surface of the second mounting ring (12).

4. The vibration-damping 3D profile measuring instrument according to claim 3, characterized in that: Both ends of the sliding body (8) pass through the surface of the bearing column (14) and the surface of the movable column (15), and the sliding body (8) is located inside the bearing column (14) and the movable column (15) in a sliding connection. Damping columns (16) are fixed on both sides of the movable column (15), and the damping columns (16) are located inside the resistance groove (9), and the surface of the damping column (16) is in contact with the surface of the resistance groove (9).

5. The vibration-damping 3D profile measuring instrument according to claim 4, characterized in that: The inner side wall of the bearing shell (13) fits with the outer surface of the lower middle portion of the buffer shell (10), and the upper middle portion of the buffer shell (10) extends outside the bearing shell (13). The bearing shell (13) serves as a spatial movement limiter for the buffer shell (10).

6. The vibration-damping 3D profile measuring instrument according to claim 5, characterized in that: The bottom of the mounting plate (2) is fixedly connected to the top of the plurality of buffer shells (10), and a plurality of mounting grooves (17) are provided on the surface of the mounting plate (2).

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