Composite morphology measuring instrument

Abstract

The utility model discloses a shape composite measuring instrument, which comprises a rack, and a fixed base is arranged at the upper end of the rack. And a supporting assembly is mounted above the fixed base. The Y-axis movement module penetrates through the interval part between the supporting assembly and the fixed base and is arranged on the fixed base. And the Y-axis motion module is in sliding connection with the Y-axis moving platform. An X-axis movement module is transversely arranged on the supporting assembly. The X-axis movement module is in sliding connection with the X-axis moving platform. A Z-axis movement module is installed on the X-axis movement platform and connected with the Z-axis movement platform in a sliding mode. The Z-axis mobile platform is provided with a probe assembly, a morphology detection assembly and a laser scanning assembly. The beneficial effects of the utility model lie in that the device has the advantage of rapid, large-area and high-precision measurement. The shape combined type measuring instrument can replace an imaging instrument and a three-coordinate detector line laser contourgraph to complete measurement work of three kinds of equipment, and the assembling cost and the labor cost of a detection instrument are reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor testing equipment, in particular to a composite shape measuring instrument. Background Art

[0002] Topography metrology instruments are critical equipment used in the semiconductor industry to measure and analyze the surface characteristics of semiconductor materials. They accurately assess key parameters such as surface roughness, texture, warpage, and contamination defects, thereby ensuring the quality and performance stability of semiconductor devices during the manufacturing process. These instruments play a crucial role in ensuring the reliability of semiconductor devices.

[0003] Among them, laser-based topography measurement instruments, thanks to their superior high-resolution, fast, non-contact measurement capabilities, are widely used for inspecting wafer surface topography, roughness, and step height. However, this type of inspection equipment still has shortcomings when inspecting semiconductor components such as wafers and SiC-coated graphite susceptors. For example, Chinese invention patent publication number CN107607056B, entitled "Laser Topography Detector," includes a laser, an imaging lens, a spot detector, an oscillating rotary axis, an oscillating drive, an oscillating angle detector, a signal processor, and a scanning mirror. While it uses an oscillating scanning method to detect object contours, it streamlines the information processing method to determine point positions for rapid results, resulting in strong real-time performance and high reliability. However, when measuring areas such as holes and grooves, this type of line laser inspection equipment can experience obstruction of the laser reflection path, resulting in significant measurement accuracy deviations and even the inability to measure certain areas. Furthermore, when the inspected object is made of materials with strong light absorption, measurement accuracy often decreases or the inspection results become invalid. Utility Model Content

[0004] (1) Problems to be solved

[0005] The technical problem to be solved by the utility model is to provide a composite shape measuring instrument in view of the current status of the existing technology.

[0006] (2) Technical solution

[0007] The utility model is realized by the following technical solution: a morphology composite measuring instrument, comprising a frame, wherein a fixed base is installed at the upper end of the frame. A support assembly is installed above the fixed base. A Y-axis motion module passes through the interval between the support assembly and the fixed base and is arranged on the fixed base. The Y-axis motion module is slidably connected to the Y-axis moving platform. An X-axis motion module is arranged laterally on the support assembly. The X-axis motion module is slidably connected to the X-axis moving platform. A Z-axis motion module is installed on the X-axis moving platform, and the Z-axis motion module is slidably connected to the Z-axis moving platform. The Z-axis moving platform is installed with a probe assembly, a morphology detection assembly and a laser scanning assembly.

[0008] Using this technical solution, the semiconductor DUT is placed on a fixed base. The Y-axis motion module drives the fixed base for forward and backward movement. The X-axis motion module drives the probe assembly, topography detection assembly, and laser scanning assembly for left and right movement. The Z-axis motion module drives the probe assembly, topography detection assembly, and laser scanning assembly for left and right and up and down movement. To measure the external topography of the semiconductor DUT, the line laser scanning assembly first performs laser scanning to acquire surface point cloud data. Simultaneously, the topography detection assembly acquires a two-dimensional image of the semiconductor DUT's surface, and the probe triggers point data. This data is then transmitted to an industrial computer, where the point location relationship is programmed by the host computer to set the point sampling path. Next, based on the host computer software parameters and actual selections, the visual algorithm combines these data to form an image with height and dimensions corresponding to the actual position. This data is then converted into a three-dimensional or two-dimensional mapping image using a three-dimensional representation and color mapping algorithm. This data, through data compensation and algorithmic processing, enables comprehensive, non-destructive inspection of semiconductor samples.

[0009] Furthermore, the support assembly includes a support bracket 1 and a support bracket 2 symmetrically distributed on both sides of the fixed base, and the upper ends of the support bracket 1 and the support bracket 2 are connected to the same crossbeam. Displacement sensors are provided on the crossbeam and the fixed base.

[0010] Furthermore, the first guide rail assembly of the Y-axis motion module passes through the spacer along the Y-axis direction and is installed on the fixed base; the first guide rail assembly is provided with a connecting slider fixedly connected to the Y-axis moving platform.

[0011] Furthermore, the first guide rail assembly includes three Y-axis guide rails placed in parallel and a follower shield arranged on the Y-axis guide rails; baffles are connected to both ends of the Y-axis guide rails; one end of the follower shield is connected to the baffle, and the other end is connected to the Y-axis moving platform through a connecting piece; the fixed base is installed with an anti-collision assembly located below the follower shield.

[0012] Furthermore, the second guide rail assembly of the X-axis motion module is installed horizontally on the crossbeam; the second guide rail assembly includes two X-axis guide rails placed in parallel and a follower shield set on the X-axis guide rail; the X-axis guide rail is equipped with a movable slider fixedly connected to the X-axis moving platform; baffles are connected to both ends of the X-axis guide rail; one end of the follower shield is connected to the baffle, and the other end is connected to the X-axis moving platform through a connector; anti-collision components are installed on both sides of the crossbeam. The anti-collision component includes anti-collision blocks and anti-collision glue, which can absorb the impact force generated by the collision. In addition, drag chains are set on the crossbeam, fixed base and mounting base to protect, collect and manage cables. The dressing boards distributed on the fixed base and support components also play a role in tidying up the cables.

[0013] Furthermore, the mounting base of the Z-axis motion module is fixed on the X-axis moving platform; the upper end of the mounting base is installed with an end mounting plate; the end mounting plate is fixed with a motor connected to one end of the screw rod, and the other end of the screw rod is connected to the Z-axis moving platform; the mounting base is arranged with two Z-axis guide rails placed along the Z-axis direction, and the Z-axis guide rails are slidingly connected to the Z-axis moving platform; the mounting base is installed with an anti-collision component located below the end mounting plate; the Z-axis moving platform is connected to the adapter plate; the probe assembly, the morphology detection assembly and the laser scanning assembly are installed on the adapter plate; the lens of the morphology detection assembly and the laser outlet of the laser scanning assembly are placed toward the fixed base.

[0014] Furthermore, an electrical cabinet and an industrial computer are installed on one side of the rack; a start button, a lighted button, and an emergency stop button are set on one side of the rack; legs and rollers are installed at the bottom of the rack; a pneumatic arm is installed on one side of the fixed base; and a three-color lighting lamp is installed on the top of the support assembly.

[0015] Furthermore, the control module of the industrial computer has built-in host computer software; the industrial computer is used to complete the tasks of automatic control, data acquisition, process monitoring and equipment management.

[0016] (3) Beneficial effects

[0017] The utility model integrates a probe assembly, a shape detection assembly, and a laser scanning assembly, and uses a three-coordinate drive module to precisely control the mobile measurement assembly. Each assembly synchronously collects shape information without interfering with each other. Hole areas that cannot be detected by laser detection can also be captured by the lens of the shape detection assembly to obtain a two-dimensional surface image and a three-dimensional simulated image after subsequent processing. This equipment can meet the requirements of non-contact, pollution-free, damage-free, and precise measurement in semiconductor device testing; it has the advantages of fast, large-area, and high-precision measurement. Using a single shape composite measuring instrument can replace the measurement work of three devices: an imager, a three-coordinate detector, and a line laser profiler. Only one person is required to complete the entire detection work, reducing the assembly cost and labor cost of the detection instrument. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0019] Figure 1 This is a three-dimensional diagram of a composite topography measuring instrument according to the present invention;

[0020] Figure 2 This is a top view of a composite topographic measuring instrument according to the present invention;

[0021] Figure 3This is a schematic structural diagram of the Y-axis motion module in the composite topography measuring instrument described in the present invention;

[0022] Figure 4 This is a schematic structural diagram of the X-axis motion module in the composite topography measuring instrument described in the present invention;

[0023] Figure 5 It is a structural schematic diagram of the Z-axis motion module in a composite topography measuring instrument described in the present invention.

[0024] The reference numerals are as follows:

[0025] 1. Frame; 2. Fixed base; 3. Support assembly; 4. Y-axis motion module; 5. X-axis motion module; 6. Z-axis motion module; 7. Probe assembly; 8. Morphology detection assembly; 9. Laser scanning assembly; 10. Baffle; 11. Connector; 12. Follow-up shield; 13. Anti-collision assembly; 101. Electrical cabinet; 102. Industrial computer; 103. Start button; 104. Illuminated button; 105. Emergency stop button; 106. Support foot; 107. Roller; 201. Pneumatic arm; 202. Three-color lighting; 301. Support bracket 1 ; 302, support bracket 2; 303, beam; 401, Y-axis moving platform; 402, first guide rail assembly; 403, spacer; 404, connecting slider; 405, Y-axis guide rail; 501, X-axis moving platform; 502, second guide rail assembly; 503, X-axis guide rail; 504, mover slider; 601, Z-axis moving platform; 602, mounting base; 603, end mounting plate; 604, screw; 605, motor; 606, Z-axis guide rail; 607, adapter plate; 608, lens; 609, laser outlet. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0027] In the description of this application, it should be understood that the terms "thickness", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] See also Figure 1-Figure 5 The utility model provides a technical solution: a morphology composite measuring instrument, including a frame, a fixed base is installed on the upper end of the frame. A support assembly is installed above the fixed base. The Y-axis motion module passes through the interval between the support assembly and the fixed base and is arranged on the fixed base. The Y-axis motion module is slidably connected to the Y-axis moving platform. An X-axis motion module is arranged horizontally on the support assembly. The X-axis motion module is slidably connected to the X-axis moving platform. A Z-axis motion module is installed on the X-axis moving platform, and the Z-axis motion module is slidably connected to the Z-axis moving platform. The Z-axis moving platform is installed with a probe assembly, a morphology detection assembly and a laser scanning assembly. The semiconductor object to be tested is placed on the fixed base, and the Y-axis motion module can drive the fixed base to move forward and backward. The X-axis motion module can drive the probe assembly, the morphology detection assembly, and the laser scanning assembly to move left and right. The Z-axis motion module can drive the probe assembly, the morphology detection assembly, and the laser scanning assembly to move left and right and up and down. When measuring the external topography of a semiconductor object under test, a line laser scanning component is first used to acquire surface point cloud data. Simultaneously, a two-dimensional image of the semiconductor object's surface is acquired using a topography detection component, and probe-trigger dotting is used to collect point data. This data is then transmitted to an industrial computer, where the point acquisition path is set by programming the point relationships on the host computer. Next, based on the host computer software parameters and actual selections, these data are combined using a visual algorithm to form an image with height and dimensions corresponding to the actual position. This data is then converted into a three-dimensional or two-dimensional mapping image using a three-dimensional representation and color mapping algorithm. This allows for comprehensive, non-destructive inspection of semiconductor samples through data compensation and algorithmic processing.

[0029] Preferably, the support assembly includes support brackets 1 and 2 symmetrically located on either side of a fixed base. The upper ends of support brackets 1 and 2 are connected to a common crossbeam. Displacement sensors are mounted on the crossbeam and the fixed base to detect component motion data in real time and provide feedback to the industrial computer.

[0030] Preferably, the first guide rail assembly of the Y-axis motion module passes through the spacer along the Y-axis direction and is installed on the fixed base; the first guide rail assembly is provided with a connecting slider fixedly connected to the Y-axis moving platform.

[0031] Preferably, the first guide rail assembly includes three parallel Y-axis guide rails and a follower shield mounted on the Y-axis guide rails; baffles are connected to both ends of the Y-axis guide rails. The follower shield is connected to the baffle at one end and to the Y-axis movable platform via a connector at the other end; the fixed base is mounted with an anti-collision assembly positioned below the follower shield. The follower shield is used to prevent dust, reduce environmental interference with the equipment, and improve the operational stability of the equipment.

[0032] Preferably, the second guide rail assembly of the X-axis motion module is horizontally installed on the crossbeam, and the second guide rail assembly includes two X-axis guide rails placed side by side and a follower shield arranged on the X-axis guide rail. The X-axis guide rail is equipped with a movable slider fixedly connected to the X-axis moving platform; baffles are connected to both ends of the X-axis guide rail; one end of the follower shield is connected to the baffle, and the other end is connected to the X-axis moving platform through a connector; anti-collision components are installed on both sides of the crossbeam. The anti-collision component includes anti-collision blocks and anti-collision glue, which can absorb the impact force generated by the collision. In addition, drag chains are provided on the crossbeam, the fixed base and the mounting base, which can protect, collect and manage cables. The dressing plates distributed on the fixed base and the support assembly can also tidy up the cables.

[0033] Preferably, the mounting base of the Z-axis motion module is fixed to the X-axis mobile platform, and an end mounting plate is mounted on the upper end of the mounting base. The end mounting plate is fixed with a motor connected to one end of a screw, and the other end of the screw is connected to the Z-axis mobile platform. The mounting base is arranged with two Z-axis guide rails placed along the Z-axis direction, and the Z-axis guide rails are slidably connected to the Z-axis mobile platform. The mounting base is installed with an anti-collision assembly below the end mounting plate; the Z-axis mobile platform is connected to the adapter plate; the probe assembly, the shape detection assembly, and the laser scanning assembly are mounted on the adapter plate; the lens of the shape detection assembly and the laser outlet of the laser scanning assembly are placed toward the fixed base.

[0034] Ideally, an electrical cabinet and industrial computer are installed on one side of the rack to house and coordinate the electrical and control systems. A start button, illuminated button, and emergency stop button are located on the front of the rack to facilitate machine operation. Feet and rollers are installed at the bottom of the rack to move and support the equipment. A pneumatic arm is mounted on one side of the fixed base, providing placement for a monitor, keyboard, and mouse. Connecting the monitor to the control system facilitates operator access to the equipment and adjustment of operating parameters. A three-color light is installed on top of the support assembly to indicate the equipment's operating status and illuminate a specific color when necessary.

[0035] Preferably, the control module of the industrial computer has built-in host computer software; the industrial computer is used to complete the tasks of automatic control, data acquisition, process monitoring and equipment management.

[0036] To summarize, some of the functions of this device include: 3D visualization of the object being measured, flatness measurement, XY dimension measurement, hole measurement, depth and height measurement, warpage measurement, and contamination defect measurement. It is particularly suitable for measuring semiconductor wafers and SiC-coated graphite susceptors.

[0037] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A composite topography measuring instrument, characterized in that: The machine comprises a frame, a fixed base is installed on the upper end of the frame; a support assembly is installed above the fixed base; a Y-axis motion module passes through the spacer between the support assembly and the fixed base and is arranged on the fixed base; the Y-axis motion module is slidably connected to the Y-axis moving platform; an X-axis motion module is arranged laterally on the support assembly; the X-axis motion module is slidably connected to the X-axis moving platform; a Z-axis motion module is installed on the X-axis moving platform, and the Z-axis motion module is slidably connected to the Z-axis moving platform; the Z-axis moving platform is installed with a probe assembly, a morphology detection assembly and a laser scanning assembly.

2. A composite topography measuring instrument according to claim 1, characterized in that: The support assembly includes a support bracket 1 and a support bracket 2 symmetrically distributed on both sides of the fixed base, and the upper ends of the support bracket 1 and the support bracket 2 are connected to the same crossbeam.

3. The composite topography measuring instrument according to claim 1, characterized in that: The first guide rail assembly of the Y-axis motion module passes through the spacer along the Y-axis direction and is installed on the fixed base; the first guide rail assembly is provided with a connecting slider fixedly connected to the Y-axis moving platform.

4. The composite topography measuring instrument according to claim 3, characterized in that: The first guide rail assembly includes three Y-axis guide rails placed in parallel and a follower shield arranged on the Y-axis guide rails; baffles are connected to both ends of the Y-axis guide rails; one end of the follower shield is connected to the baffle, and the other end is connected to the Y-axis moving platform through a connecting piece; the fixed base is equipped with an anti-collision assembly located below the follower shield.

5. The composite topography measuring instrument according to claim 2, characterized in that: The second guide rail assembly of the X-axis motion module is installed horizontally on the crossbeam; the second guide rail assembly includes two X-axis guide rails placed in parallel and a follower shield arranged on the X-axis guide rails; the X-axis guide rail is equipped with a movable slider fixedly connected to the X-axis moving platform; both ends of the X-axis guide rail are connected to baffles; one end of the follower shield is connected to the baffle, and the other end is connected to the X-axis moving platform through a connecting piece; anti-collision components are installed on both sides of the crossbeam.

6. The composite topography measuring instrument according to claim 1, characterized in that: The mounting base of the Z-axis motion module is fixed on the X-axis moving platform; an end mounting plate is installed on the upper end of the mounting base; a motor connected to one end of the screw rod is fixed on the end mounting plate, and the other end of the screw rod is connected to the Z-axis moving platform; the mounting base is arranged with two Z-axis guide rails placed along the Z-axis direction, and the Z-axis guide rails are slidingly connected to the Z-axis moving platform; the mounting base is installed with an anti-collision component located below the end mounting plate; the Z-axis moving platform is connected to the adapter plate; the probe assembly, the morphology detection assembly and the laser scanning assembly are installed on the adapter plate; the lens of the morphology detection assembly and the laser outlet of the laser scanning assembly are placed facing the fixed base.

7. The composite topography measuring instrument according to claim 1, characterized in that: An electrical cabinet and an industrial computer are installed on one side of the rack; a start button, a lighted button, and an emergency stop button are set on one side of the rack; legs and rollers are installed at the bottom of the rack; a pneumatic arm is installed on one side of the fixed base; and a three-color lighting lamp is installed on the top of the support assembly.

8. The composite topography measuring instrument according to claim 7, characterized in that: The control module of the industrial computer has a built-in host computer software; the industrial computer is used to complete the tasks of automatic control, data acquisition, process monitoring and equipment management.

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