Adjustable optical production detection module for chip processing

Abstract

The utility model relates to the technical field of chip production equipment, in particular to an adjustable optical production detection module for chip processing, which comprises an optical production platform, an optical system and a conveying plate, the optical system is used for generating incident light meeting surface plasmon resonance requirements, the conveying plate is provided with a plurality of material clamps for fixing chip base materials, and the conveying plate is provided with a plurality of material clamps. A production positioning mechanism composed of an upper plate body, a lower plate body and a fixing plate is arranged on the optical production platform, linear grooves are formed in the opposite faces of the upper plate body and the lower plate body, and a containing groove used for containing a conveying plate is formed between the two linear grooves. And the control mechanism is used for continuously adjusting the relative positions of the optical system, the detector and the chip base material and enabling the light beam to enter the center of a substrate of the chip base material. A light beam can be incident to the center of the substrate of the chip base material, so that the purpose of accurately positioning to ensure the production quality is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production equipment, in particular to an adjustable optical production detection module for chip processing. Background Art

[0002] Surface plasmon resonance (SPR) is a new technology developed in the 1990s. It uses the SPR principle to monitor the interaction between ligands and analytes on biosensor chips. When a beam of p-polarized light is incident on the end face of a prism within a certain angle range, surface plasmon waves are generated at the interface between the prism and a metal film (Au or Ag). When the propagation constant of the incident light wave matches that of the surface plasmon wave, free electrons within the metal film resonate, creating a surface plasmon resonance. During analysis, a biomolecular recognition membrane is first affixed to the surface of the sensor chip. The sample to be tested is then passed over the chip. Molecules in the sample that interact with the biomolecular recognition membrane cause a change in the refractive index of the gold film, ultimately resulting in a change in the SPR angle. By monitoring this SPR angle change, information such as the analyte's concentration, affinity, kinetic constant, and specificity can be obtained.

[0003] Biomolecular interaction analysis is a novel biosensing technique based on the SPR principle. It eliminates the need for labeling and purification of biological components. Under natural conditions, sensor chips enable real-time, in situ, and dynamic measurement of interactions between biomolecules such as peptides, proteins, oligonucleotides, and oligosaccharides, as well as viruses, bacteria, cells, and small molecules. Surface plasmon resonance (SPR) is a key enhancement mechanism for surface-enhanced Raman spectroscopy. Due to the size and quantum effects of noble metal nanoparticles, SPR can be induced by excitation light, significantly enhancing the Raman scattering signal and enabling trace detection.

[0004] However, when preparing chemical chips, the accuracy of the position where the light beam is incident on the chip substrate, thereby achieving accurate positioning, is a key step in ensuring production quality. Based on this, an adjustable optical production inspection module for chip processing is provided. Summary of the Invention

[0005] In response to the above-mentioned deficiencies in the existing technology, an adjustable optical production inspection module for chip processing is provided, which allows the light beam to be incident on the center of the base of the chip substrate, thereby achieving accurate positioning to ensure production quality.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: an adjustable optical production detection module for chip processing, including an optical production platform, and an optical system for generating incident light that meets the requirements of surface plasmon resonance, and also including a conveying plate, on which a plurality of material clamps for fixing the chip substrate are provided, and a production positioning mechanism composed of a corresponding upper plate body, a lower plate body and a fixing plate for connecting the two is provided on the optical production platform, and linear grooves are provided on the opposite surfaces of the upper plate body and the lower plate body, and a receiving groove for accommodating the conveying plate is formed between the two linear grooves, and also includes a detector located on the reflected light path, a control mechanism for continuously adjusting the relative position of the optical system and the detector and the chip substrate, so that the light beam is incident on the center of the base of the chip substrate, and a controller.

[0007] The above-mentioned adjustable optical production detection module for chip processing, the optical system includes an infrared laser generator, a polarization crystal, and a chopper.

[0008] The above-mentioned adjustable optical production detection module for chip processing, the control mechanism includes a positioning plate arranged on the optical production platform, and a plurality of screw stepper motors arranged on the positioning plate, an optical axis is provided on the positioning plate, a drive plate is provided on the screw stepper motor, a bearing seat for mounting the optical axis linear bearing connected to the drive plate is provided on the optical axis, a plurality of semicircular plate bodies are provided on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide are provided on the plate body, an upper slide seat and a lower slide seat running along the annular slide seat are provided on the upper slide seat, A detector mounting seat for mounting a detector and a photoelectric switch detection plate are provided on the slide; an infrared laser generator mounting seat for mounting an infrared laser generator and a polarization crystal mounting seat for mounting a polarization crystal are provided on the lower slide; a first driving rod with two ends respectively connected to the upper slide and the driving plate for rotation is provided between the upper slide and the driving plate; a second driving rod with two ends respectively connected to the lower slide and the driving plate for rotation is provided between the lower slide and the driving plate; a passage groove for allowing the conveyor plate to pass is provided on the plate body, and the screw stepper motor is connected to the controller signal.

[0009] The above-mentioned adjustable optical production detection module for chip processing, wherein the detector is a silicon photocell and an operational amplifier.

[0010] The above-mentioned adjustable optical production inspection module for chip processing is provided with a reciprocating electric cylinder on the fixed plate, and a blocking rod for blocking the material clamp is provided on the reciprocating electric cylinder. The reciprocating electric cylinder is connected to the controller signal.

[0011] The above-mentioned adjustable optical production inspection module for chip processing is provided with a positioning groove for accommodating a material clamp on the conveying plate, and the material clamp includes a chip substrate carrier plate corresponding to the positioning groove, and a carrier groove adapted to the chip substrate is opened on the chip substrate carrier plate, and a fixed clamp and a telescopic clamp are respectively provided on both sides of the carrier groove, and the telescopic clamp includes a fixed base and a sliding clamp provided on the fixed base, a compression spring for driving the sliding clamp is provided in the fixed base, a guide positioning pin is provided between the sliding clamp and the fixed base, and connecting screws for connecting the chip substrate carrier plate and the conveying plate are provided on both sides of the chip substrate carrier plate.

[0012] The beneficial effect of this utility model's adjustable optical production inspection module for chip processing lies in its ability to consist of an optical prism and, in ascending order, a metal film, a self-assembled film, and a molecularly imprinted polymer film coated thereon. This device utilizes a control mechanism to mechanically rotate the chip around the center of its coating surface. During the drive process, a lead screw stepper motor utilizes displacement angle measurement to control angular displacement, continuously adjusting the relative positions of incident light, the detector, and the chip substrate, ensuring that the light beam is incident on the center of the chip substrate, thereby achieving accurate positioning and ensuring production quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the control mechanism;

[0014] Figure 2 Schematic diagram of the structure of the upper slide;

[0015] Figure 3 It is a structural diagram of the lower slide seat;

[0016] Figure 4 It is a structural diagram of the connection between the reciprocating electric cylinder and the fixed plate;

[0017] Figure 5 It is a structural diagram of the lower slide seat;

[0018] Figure 6 Schematic diagram of the structure of the upper slide;

[0019] Figure 7 It is a structural diagram of the plate;

[0020] Figure 8 It is a structural diagram of the conveying plate;

[0021] Figure 9 It is a structural diagram of the material clamp;

[0022] Figure 10 Schematic diagram of the structure of the optical production platform. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1-10 As shown, the adjustable optical production inspection module for chip processing includes an optical production platform 1 and an optical system for generating incident light that meets surface plasmon resonance requirements. It also includes a conveyor plate 2 equipped with multiple material clamps for securing chip substrates. A production positioning mechanism is installed on the optical production platform, consisting of an upper plate 3, a lower plate 4, and a fixing plate 5 for connecting them. Linear grooves 6 are defined on the opposing surfaces of the upper and lower plates 3 and 4, forming a receiving slot for the conveyor plate 2. The module also includes a detector located in the reflected light path, a control mechanism for continuously adjusting the relative position of the optical system and detector to the chip substrate to ensure that the light beam is incident on the center of the chip substrate base, and a controller. The optical system includes an infrared laser generator, a polarization crystal 18, and a chopper. The chopper is an electronic chopper. The detector is a silicon photocell and an operational amplifier for filtering, amplification, and transmission. The controller is a PLC.

[0025] The control mechanism includes a positioning plate 7 provided on the optical production platform 1, and a plurality of screw stepper motors 8 provided on the positioning plate 7, an optical axis 9 is provided on the positioning plate 7, a drive plate 10 is provided on the screw stepper motor 8, an optical axis linear bearing seat connected to the drive plate 10 is provided on the optical axis 9, a bearing seat for mounting the optical axis linear bearing connected to the drive plate 10 is provided on the optical axis 9, a plurality of semicircular plate bodies 11 are provided on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide 12 are provided on the plate body 11, an upper slide 13 and a lower slide 14 running along the annular slide 12 are provided on the annular slide 12, and an upper slide 13 and a lower slide 14 running along the annular slide 12 are provided on the upper slide 13 is provided with a detector mounting seat 15 for mounting a detector, and a photoelectric switch detection board 16, an infrared laser generator mounting seat 17 for mounting an infrared laser generator, and a polarization crystal mounting seat for mounting a polarization crystal 18 are provided on the lower slide 14, a first driving rod 22 is provided between the upper slide 13 and the driving plate, and its two ends are respectively connected to the upper slide 13 and the driving plate 10 for rotation, a second driving rod 19 is provided between the lower slide 14 and the driving plate 10, and a passage groove is provided on the plate body 11 for allowing the conveying plate 2 to pass, and the screw stepping motor is connected to the controller signal.

[0026] A reciprocating electric cylinder 20 is provided on the fixed plate 5, and a blocking rod 21 for blocking the material clamp is provided on the reciprocating electric cylinder 20. The reciprocating electric cylinder 20 is connected to the controller signal to facilitate the rapid positioning of the conveying plate.

[0027] A positioning groove 23 for accommodating a material clamp is provided on the conveying plate 2, and the material clamp includes a chip substrate carrier plate 24 corresponding to the positioning groove, and a carrier groove adapted to the chip substrate is opened on the chip substrate carrier plate 24, and a fixed clamp 25 and a telescopic clamp are respectively provided on both sides of the carrier groove, and the telescopic clamp includes a fixed base 26 and a sliding clamp 27 provided on the fixed base 26, a compression spring for driving the sliding clamp is provided in the fixed base 26, a guide positioning pin 29 is provided between the sliding clamp and the fixed base, and connecting screws for connecting the chip substrate carrier plate 24 to the conveying plate 2 are provided on both sides of the chip substrate carrier plate 24.

[0028] The operating process of this adjustable optical production inspection module for chip processing is as follows: an operator secures multiple assembled chip substrates to be fabricated via a material clamp on a conveyor plate, which is then pushed to a production positioning mechanism. An infrared laser generator generates incident light that meets surface plasmon resonance requirements. The light emitted by the infrared laser generator is converted by a polarizer into a fixed-frequency P-polarized incident light beam that is incident on the chip substrate. A lead screw stepper motor mechanically rotates around the center of the chip substrate's coated surface. A silicon photocell is placed in the reflected light path, directly receiving the optical signal. A digital analog (AD) converter (ADC) converts the analog signal into a digital signal. As the lead screw stepper motor is driven, the digital signal changes, interacting with a displacement angle measurement sensor. When the desired value is reached, the lead screw stepper motor stops driving, locking the angle. This means that the relative positions of the incident light, the silicon photocell detector, and the chip substrate are continuously adjusted to determine the change in angle adjustment, ensuring that the light beam is incident on the center of the chip substrate's base, thereby achieving accurate positioning and ensuring production quality.

[0029] Of course, the above description is not a limitation of the present invention, and the present invention is not limited to the above examples. Changes, modifications, additions or substitutions made by ordinary technicians in this technical field within the essential scope of the present invention should also fall within the scope of protection of the present invention.

Claims

1. Adjustable optical production inspection module for chip processing, characterized by: The device comprises an optical production platform and an optical system for generating incident light that meets the requirements of surface plasmon resonance. The device also comprises a conveying plate on which a plurality of material clamps for fixing chip substrates are provided. The optical production platform is provided with a production positioning mechanism consisting of a corresponding upper plate body, a lower plate body, and a fixing plate for connecting the two. Linear grooves are provided on the opposing surfaces of the upper plate body and the lower plate body, and a receiving groove for accommodating the conveying plate is formed between the two linear grooves. The device also comprises a detector located on the reflected light path, a control mechanism for continuously adjusting the relative position of the optical system and the detector with the chip substrate to make the light beam incident on the center of the base of the chip substrate, and a controller.

2. The adjustable optical production inspection module for chip processing according to claim 1 is characterized in that: The optical system includes an infrared laser generator, a polarization crystal, and a chopper.

3. The adjustable optical production inspection module for chip processing according to claim 2 is characterized in that: The control mechanism includes a positioning plate arranged on the optical production platform, and multiple lead screw stepper motors arranged on the positioning plate, an optical axis is provided on the positioning plate, a drive plate is provided on the lead screw stepper motor, a bearing seat for installing the optical axis linear bearing connected to the drive plate is provided on the optical axis, multiple semicircular plate bodies are provided on the production positioning mechanism, a displacement angle measurement sensor and a semicircular annular slide are provided on the plate body, an upper slide and a lower slide running along the annular slide are provided on the annular slide, a detector mounting seat for installing a detector and a photoelectric switch detection plate are provided on the upper slide, an infrared laser generator mounting seat for installing an infrared laser generator and a polarization crystal mounting seat for installing a polarization crystal are provided on the lower slide, a first driving rod with two ends respectively connected to the upper slide and the drive plate for rotation is provided between the upper slide and the drive plate, a second driving rod with two ends respectively connected to the lower slide and the drive plate for rotation is provided between the lower slide and the drive plate, a passage groove for allowing the conveying plate to pass is opened on the plate body, and the lead screw stepper motor is connected to the controller signal.

4. The adjustable optical production inspection module for chip processing according to claim 3 is characterized in that: The detector is a silicon photocell and an operational amplifier.

5. The adjustable optical production inspection module for chip processing according to claim 4 is characterized in that: A reciprocating electric cylinder is arranged on the fixed plate, a blocking rod for blocking the material clamp is arranged on the reciprocating electric cylinder, and the reciprocating electric cylinder is connected to the controller signal.

6. The adjustable optical production inspection module for chip processing according to claim 5 is characterized in that: A positioning groove for accommodating a material clamp is provided on the conveying plate, and the material clamp includes a chip substrate carrier plate corresponding to the positioning groove, a carrier groove adapted to the chip substrate is provided on the chip substrate carrier plate, and a fixed clamp and a telescopic clamp are respectively provided on both sides of the carrier groove, and the telescopic clamp includes a fixed base and a sliding clamp provided on the fixed base, a compression spring for driving the sliding clamp is provided in the fixed base, a guide positioning pin is provided between the sliding clamp and the fixed base, and connecting screws for connecting the chip substrate carrier plate and the conveying plate are provided on both sides of the chip substrate carrier plate.

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