Test fixture and test machine for wafer to receive test probe card

Abstract

The utility model provides a test fixture and a test machine for a wafer to receive a test probe card, which belong to the technical field of test fixtures and comprise a circuit board fixedly mounted on the test machine; the circuit board is provided with a plurality of contacts and a plurality of joints, and each joint is electrically connected with the corresponding contact; the needle plate is fixed on one side, facing the testing machine, of the circuit board; and a plurality of spring needles are arranged in the needle plate and are in one-to-one correspondence contact with the test points on the wafer test receiving probe card and the contacts on the circuit board respectively. The beneficial effects are that the spring needles integrated on the needle plate are in contact with test points on the wafer receiving test probe card, the spring needles transmit test point signals to the contacts on the circuit board, and the signal reading is realized through the joint, so that the accurate and automatic contact with dense test points on the wafer receiving test probe card is realized, the test workload is reduced, and the test efficiency is improved. Errors and time consumption caused by human factors are avoided, and the automation level of the whole testing process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of test fixtures, and in particular to a wafer acceptance test probe card test fixture and a test machine. Background Art

[0002] Wafer acceptance test (WAT) is carried out after wafer tape-out and before quality inspection. It aims to verify whether each individual chip on the wafer meets the design requirements in terms of electrical characteristics and functionality, so as to ensure chip quality and improve yield.

[0003] The WAT probe card is a test interface that primarily tests bare chips. It connects the test equipment to the chip and transmits signals to test chip parameters. The WAT probe card integrates a large number of probes that can directly contact the chip pads or bumps on the wafer to form a stable electrical connection. Through the probe card, the test equipment can send test signals to the chip and collect feedback data, enabling a comprehensive evaluation of chip performance.

[0004] Existing WAT tests require manual clicking of test points on a WAT probe card to obtain test data. Due to the large number of test points on a WAT probe card, manual clicking consumes a significant amount of time and effort. Furthermore, the test points on a WAT probe card are typically small and compact, making it difficult to guarantee that manual clicks will land accurately on the test points every time. Furthermore, prolonged manual operation can easily lead to operator fatigue, further reducing test accuracy and efficiency. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a wafer acceptance test probe card test fixture and a test machine.

[0006] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0007] A wafer acceptance test probe card test fixture, comprising:

[0008] A circuit board, the circuit board being fixedly mounted on the test machine; the circuit board having a plurality of contacts and a plurality of connectors, each of the connectors being electrically connected to a corresponding contact;

[0009] A needle board is fixed to the side of the circuit board facing the test machine; a plurality of spring needles are provided in the needle board, and the plurality of spring needles respectively correspond to the test points on the wafer acceptance test probe card and the contacts of the circuit board; one end of each spring needle contacts the test point, and the other end of the spring needle contacts the contact.

[0010] Preferably, the circuit board is fixedly mounted on the test machine via a mounting frame.

[0011] Preferably, the mounting frame is in a circular ring shape.

[0012] Preferably, the mounting frame is provided with a circuit board mounting portion, and the circuit board is fixed on the circuit board mounting portion;

[0013] The mounting frame is fixedly mounted on the testing machine platform via fasteners.

[0014] Preferably, the mounting frame is further provided with a handle.

[0015] Preferably, the test platform is provided with a positioning pin hole;

[0016] The wafer receiving test probe card test fixture is also provided with positioning pins corresponding to the positioning pin holes.

[0017] Preferably, the circuit board is a printed circuit board.

[0018] Preferably, the needle plate comprises:

[0019] The first needle plate and the second needle plate are provided with a plurality of penetrating needle holes, and the plurality of spring needles are respectively placed in the corresponding needle holes, and both ends of the spring needles are exposed from the needle plates.

[0020] Preferably, the connector and the corresponding contact do not overlap in a vertical projection of the circuit board.

[0021] The present invention also provides a testing machine, comprising:

[0022] A carrying portion, for carrying a wafer under test to receive a test probe card, wherein the wafer under test receives a test probe card having a plurality of test points;

[0023] The mounting portion is used to mount the wafer acceptance test probe card test fixture, wherein one end of the spring pin of the wafer acceptance test probe card test fixture contacts the test point on the wafer acceptance test probe card.

[0024] The advantages or beneficial effects of the technical solution of the utility model are:

[0025] The test fixture proposed by the present invention contacts the test points on the wafer acceptance test probe card through the spring needles integrated on the needle board. The spring needles transmit the test point signals to the contacts on the circuit board, and the signals are read through the connectors, thereby achieving accurate and automatic contact with the dense test points on the wafer acceptance test probe card. Compared with the traditional manual clicking method, the test workload is reduced; at the same time, the operation difficulty is reduced, the errors and time consumption caused by human factors are avoided, and the automation level of the overall test process is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a wafer receiving probe card test fixture in a preferred embodiment 1 of the present invention;

[0027] Figure 2 This is a schematic diagram of the reverse side of the circuit board in the preferred embodiment 1 of the present utility model;

[0028] Figure 3 This is a bottom view of a wafer receiving probe card test fixture in the preferred embodiment 1 of the present invention;

[0029] Figure 4 This is a structural diagram of the needle plate in the preferred embodiment 1 of the present utility model;

[0030] Figure 5 This is an exploded diagram of the installation of the test fixture in the preferred embodiment 1 of the present utility model;

[0031] Figure 6 This is a schematic structural diagram of a wafer receiving probe card test fixture in a preferred embodiment 2 of the present invention;

[0032] Figure 7 This is a bottom view of a wafer receiving probe card test fixture in preferred embodiment 2 of the present invention.

[0033] Description of reference numerals:

[0034] 100. Test fixture; 101. Circuit board; 102. Contact; 103. Connector; 104. Pin board; 1041. First pin board; 1042. Second pin board; 1043. Spring pin; 105. Mounting frame; 1051. Inner circle; 1052. Outer circle; 1053. Support rod; 1054. Circuit board mounting portion; 106. Handle; 107. Handle support rod; 108. Locating pin; 109. Second mounting hole; 110. Fastener; 111. Screw hole; 200. Wafer acceptance test probe card; 300. Test machine; 301. Carrying portion; 302. Mounting portion; 3021. First mounting hole; 303. Positioning block; 304. Positioning pin hole. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0037] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0038] WAT probe cards are used to perform functional tests on bare ICs before they are packaged, screening out defective products before proceeding to the packaging process. Currently, WAT probe cards are mainly divided into two types based on their design:

[0039] Round Card: This type of probe card features a circular design and is suitable for specific applications, particularly when a symmetrical layout around a center point is required. Round probe cards may be more suitable in certain test environments, such as those that require minimizing edge effects or evenly distributing test points on a round wafer.

[0040] Square Card: This type of probe card typically has a square or rectangular shape and is suitable for testing over a larger area. The square design provides more space for probe placement, accommodating varying test densities.

[0041] Example 1

[0042] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 In a preferred embodiment of the present invention, based on the above-mentioned problems existing in the prior art, a wafer acceptance test probe card test fixture is provided, which is suitable for wafer cards and includes:

[0043] The circuit board 101 is fixedly mounted on the test machine 300 ; the circuit board 101 has a plurality of contacts 102 and a plurality of connectors 103 , each connector 103 being electrically connected to a corresponding contact 102 ;

[0044] The needle board 104 is fixed to the side of the circuit board 101 facing the test machine 300; a plurality of spring needles 1043 are provided in the needle board 104, and the plurality of spring needles 1043 correspond one-to-one to the test points on the wafer acceptance test probe card 200 and the contacts 102 of the circuit board 101; one end of each spring needle 1043 contacts the test point, and the other end of the spring needle 1043 contacts the contact 102.

[0045] Specifically, in the embodiment of the present invention, the wafer test probe card 200 is carried on the test machine 300 , the test fixture 100 is installed on the test machine 300 , and the test fixture 100 is located above the wafer test probe card 200 .

[0046] The test fixture 100 includes a pin board 104 and a circuit board 101. The pin board 104 has spring pins 1043 corresponding to the test points, and the circuit board 101 has contacts 102 and connectors 103 corresponding to the test points.

[0047] In this embodiment, Figure 1 As shown, the connector 103 is located on the front side of the printed circuit board; Figure 2 As shown, the contact 102 is located on the reverse side of the printed circuit board so as to contact the spring pins 1043 in the needle plate 104. The circuit board is also provided with a plurality of screw holes 111 so as to be fixedly connected to the needle plate 104 by fasteners such as screws.

[0048] The spring needle 1043 integrated in the needle board 104 contacts the test point on the wafer acceptance test probe card 200, and the spring needle 1043 transmits the test point signal to the contact 102 on the circuit board 101, and then transmits it to the connector 103 through the signal layer of the circuit board 101. The connector 103 is connected to an external device (such as a test device) through a cable to lead out the test point signal to realize signal reading.

[0049] The spring needles 1043 integrated in the needle board 104 achieve precise and automatic contact with the dense test points on the wafer acceptance test probe card. During the test process, there is no need for manual clicking of the test points, which reduces the test workload, reduces the difficulty of operation, avoids errors and time consumption caused by human factors, and improves the automation level of the overall test process.

[0050] As a preferred embodiment, the circuit board 101 is fixedly mounted on the test machine 300 via a mounting frame 105 .

[0051] Specifically, by providing the mounting frame 105 , the circuit board is securely mounted; at the same time, direct contact of external objects with the circuit board 101 is reduced by physical isolation, thereby avoiding potential damage to the circuit board 101 caused by improper handling or operation by testers.

[0052] As a preferred embodiment, the mounting frame 105 is in a circular shape.

[0053] Specifically, the annular mounting frame includes an inner circle 1051 , an outer circle 1052 and support rods 1053 connecting the inner circle 1051 and the outer circle 1052 . The support rods 1053 are evenly distributed between the inner circle 1051 and the outer circle 1052 .

[0054] In this embodiment, the inner circle 1051 , the outer circle 1052 and the support rod 1053 are integrally formed.

[0055] As a preferred embodiment, the mounting frame 105 is provided with a circuit board mounting portion 1054 , and the circuit board 101 is fixed to the circuit board mounting portion 1054 ;

[0056] The mounting bracket 105 is fixedly mounted on the testing machine 300 via fasteners 110 .

[0057] In this embodiment, grooves are formed on the inner circle 1051 and the outer circle 1052 of the mounting frame 105 to serve as the circuit board mounting portion 1054 for placing the circuit board 101 .

[0058] During the installation of the circuit board 101 , the circuit board 101 is placed on the circuit board mounting portion 1054 of the mounting frame 105 , and the circuit board 101 is fixed to the mounting frame 105 using screws or other fasteners.

[0059] During the installation of the test fixture 100 , the test fixture 100 is placed on the mounting portion 302 of the test machine 300 . After the test fixture 100 and the test machine 300 are accurately positioned, screws (such as M4 screws) or other fasteners 110 are used to fix the test fixture 100 on the test machine 300 .

[0060] As a preferred embodiment, a handle 106 is further provided on the mounting frame 105 .

[0061] In this embodiment, the handle 106 is in the shape of a horizontal bar and is disposed on a side of the mounting frame 105 away from the testing machine 300 .

[0062] In this embodiment, two handles 106 can be provided, and the two handles 106 are symmetrically arranged on the mounting frame 105. Preferably, the two handles 106 are symmetrically arranged on the outer circle 1052.

[0063] In this embodiment, both ends of the handle 106 are respectively arranged on the outer circle 1052 through the handle support rods 107.

[0064] The provision of the handle 106 can facilitate the operator to move or adjust the position of the test fixture, further avoiding the risk of direct human contact with the circuit board 101.

[0065] As a preferred embodiment, wherein Figure 5 As shown, the test platform 300 is provided with a positioning pin hole 304;

[0066] The wafer receiving test probe card test fixture 100 is further provided with positioning pins 108 corresponding to the positioning pin holes 304 .

[0067] In this embodiment, two positioning pins 108 can be provided. The two positioning pins 108 are fixedly provided below the handle 106 respectively.

[0068] Furthermore, a positioning block 303 is provided on the test machine, and a positioning pin hole 304 is provided on the positioning block 303 .

[0069] In this embodiment, the positioning block 303 is in a convex shape.

[0070] In this embodiment, there are two positioning blocks 303 , which are symmetrically arranged. The positioning blocks 303 are located in the area surrounded by the inner circle 1051 , the outer circle 1052 and the support rod 1053 .

[0071] The positioning pin 108 is provided below the handle 106 and is located in the area enclosed by the inner circle 1051, the outer circle 1052 and the support rod 1053. By matching and aligning the positioning pin 108 with the positioning pin hole 304, the test fixture 100 and the test machine 300 are installed and positioned.

[0072] During the installation process, the positioning pins 108 are inserted into the corresponding positioning pin holes 304 , thereby ensuring the correct position and orientation of the test fixture 100 on the test machine 300 .

[0073] Furthermore, the mounting portion 302 of the test machine 300 is provided with a first mounting hole 3021 ;

[0074] like Figure 5 As shown, second mounting holes 109 are provided on the outer circle 1052 of the test fixture 100 at positions corresponding to the first mounting holes 3021 .

[0075] During the installation process, after the locating pin 108 is inserted into the corresponding locating pin hole 304, a fastener 110 (such as a screw) is used to pass through the second mounting hole 109 and the first mounting hole 3021 in sequence, and the test fixture 100 is fixedly installed on the test machine 300 by tightening.

[0076] As a preferred embodiment, the circuit board 101 is a printed circuit board.

[0077] In this embodiment, the printed circuit board is provided with through holes for inserting connectors 103. Multiple connectors 103 are respectively plugged into the circuit board 101 and electrically connected to corresponding contacts 102 through the wiring layer and signal layer of the printed circuit board.

[0078] As a preferred embodiment, wherein Figure 4 As shown, the needle plate 104 includes:

[0079] The first needle plate 1041 and the second needle plate 1042 are provided with a plurality of penetrating needle holes, and a plurality of spring needles 1043 are respectively placed in the corresponding needle holes, and both ends of the spring needles 1043 are exposed from the needle plates.

[0080] In this embodiment, the first needle plate 1041 and the second needle plate 1042 have the same structure and both have corresponding holes.

[0081] Specifically, considering that the two ends of the spring needle 1043 are slightly thinner and the middle diameter is slightly larger than the two ends, in this embodiment, the needle plate 104 is composed of a first needle plate 1041 and a second needle plate 1042. The two have the same structural design and are densely covered with multiple penetrating pinholes. The number and position of the pinholes on the first needle plate 1041 and the second needle plate 1042 correspond one-to-one to the test points on the WAT probe card.

[0082] During the installation process of the spring pin 1043, first align one end of the spring pin 1043 with the corresponding pinhole on the first pin plate 1041 and gently push it in until its end is completely extended from the other side of the first pin plate 1041. Then, align the other end of the spring pin 1043 with the corresponding pinhole on the second pin plate 1042 and push it in until it is also completely extended from the other side of the second pin plate 1042, thus obtaining a pin plate that corresponds to the probe on the WAT probe card.

[0083] Both ends of the spring pin 1043 maintain sufficient exposed length to facilitate subsequent circuit connection or testing operations.

[0084] In this embodiment, the number and positions of the spring pins 1043 and the corresponding contacts 102 correspond one-to-one to the test points on the wafer acceptance test probe card 200 .

[0085] In this embodiment, the spring pins 1043 and the corresponding test points and contacts 102 overlap with each other in vertical projection.

[0086] As a preferred embodiment, the connector 103 and the corresponding contact 102 do not overlap in a vertical projection of the circuit board 101 .

[0087] Specifically, considering the large number of probe test points on the probe card, its small design size, and compact layout, this embodiment provides contacts 102 and connectors 103, and innovatively plans the layout of the contacts 102 and connectors 103. Specifically, the number of contacts 102 and connectors 103 corresponds one-to-one, and in a vertical projection of the circuit board 101, the contacts 102 and connectors 103 do not overlap, avoiding spatial conflicts caused by overlapping contacts due to the larger connector size.

[0088] In the preferred embodiment described above, the test fixture 100 is inserted into the corresponding locating pin hole 304 on the test platform 300 via the locating pin 108. Three M4 screws are then inserted through the second mounting hole 109 and the first mounting hole 3021 to secure the test fixture 100 to the test platform 300. This precise positioning and simple structural design make it easier to operate.

[0089] At the same time, the spring needle 1043 will contact the test point on the WAT probe card, and the spring needle 1043 will transmit the test point signal of the WAT probe card to the circuit board 101 above, and transmit the test point signal to the external test equipment through the cable through the connector 103, realizing direct reading of the signal, saving the work of manually clicking the test point, thereby greatly improving work efficiency.

[0090] Example 2

[0091] See also Figure 6 and Figure 7 In a preferred embodiment of the present invention, based on the above-mentioned problems existing in the prior art, a wafer acceptance test probe card test fixture is provided, which is suitable for square cards.

[0092] For the convenience of description, the wafer acceptance test probe card test jig applicable to square cards will be referred to as a square card test jig, and the wafer acceptance test probe card test jig applicable to round cards will be referred to as a round card test jig.

[0093] The structure of the square card test fixture is generally similar to that of the above-mentioned round card test fixture, both of which include a circuit board 101 and a pin board 104 . The circuit board 101 also includes contacts 102 and connectors 103 , and the pin board 104 includes spring pins 1043 .

[0094] During the test process, the signal conduction path is the test point (or probe) of the WAT probe card → the spring pin 1043 → the contact 102 on the circuit board 101 → the connector 103 → the external device.

[0095] The square card has a different number and layout of test points than the round card. The square card test fixture differs from the round card test fixture only in the layout of the spring pins 1043 on the pin board 104 and the contacts 102 and connectors 103 on the circuit board 101.

[0096] Furthermore, in this embodiment, a recessed platform is provided on the inner circle 1051 of the mounting frame 105 to serve as a circuit board mounting portion 1054 for placing the circuit board 101. During the installation process of the circuit board 101, the circuit board 101 is placed on the recessed platform and fixed to the mounting frame 105 using screws or other fasteners.

[0097] Example 3

[0098] The present invention further provides a test machine, which is applicable to the test fixture of the above-mentioned embodiment 1 or embodiment 2, comprising:

[0099] The carrier portion 301 is used to carry the wafer under test to receive the test probe card 200 , and the wafer under test to receive the test probe card 200 has a plurality of test points;

[0100] The mounting portion 302 is used to mount the wafer acceptance test probe card test jig 100 as described above. One end of the spring pin 1043 of the wafer acceptance test probe card test jig 100 contacts the test point on the wafer acceptance test probe card 200 .

[0101] In this embodiment, the test points are probes on the wafer receiving test probe card 200. The wafer receiving test probe card 200 is placed on the carrier 301 of the test machine 300.

[0102] The test fixture 100 is mounted on the mounting portion 302 of the test machine 300 . Preferably, the supporting portion 301 is a supporting groove recessed in the mounting portion 302 .

[0103] After the test fixture 100 is installed, the annular mounting frame 105 contacts the mounting portion of the test machine 300, and the needle plate 104 below the circuit board 101 is located in the supporting groove and contacts the test point of the test probe card 200 on the tested wafer in the supporting groove.

[0104] Furthermore, a positioning block 303 is provided on the test machine, and a positioning pin hole 304 is provided on the positioning block 303 .

[0105] In this embodiment, the positioning block is in a "convex" shape.

[0106] In this embodiment, there are two positioning blocks 303 , which are symmetrically arranged on the mounting portion 302 and located on both sides of the bearing portion 301 .

[0107] In this embodiment, the positioning block 303 is located in the area surrounded by the inner circle 1051 , the outer circle 1052 and the support rod 1053 .

[0108] By matching and aligning the positioning pins 108 and the positioning pin holes 304 , the test fixture 100 and the test machine 300 are installed and positioned.

[0109] The advantages or beneficial effects of adopting the above technical solution are: the test fixture proposed by the present invention contacts the test points on the wafer acceptance test probe card through the spring needles integrated on the needle board, and the spring needles transmit the test point signals to the contacts on the circuit board, and the signals are read through the connectors, thereby achieving accurate and automatic contact with the dense test points on the wafer acceptance test probe card. Compared with the traditional manual clicking method, it reduces the testing workload; at the same time, it reduces the difficulty of operation, avoids errors and time consumption caused by human factors, and improves the automation level of the overall testing process.

[0110] The above are only preferred embodiments of the present invention and do not limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the contents of this specification and illustrations should be included in the protection scope of the present invention.

Claims

1. A wafer acceptance test probe card test fixture, characterized in that: include: A circuit board, the circuit board being fixedly mounted on the test machine; the circuit board having a plurality of contacts and a plurality of connectors, each of the connectors being electrically connected to a corresponding contact; A needle board is fixed to the side of the circuit board facing the test machine; a plurality of spring needles are provided in the needle board, and the plurality of spring needles respectively correspond to the test points on the wafer acceptance test probe card and the contacts of the circuit board; one end of each spring needle contacts the test point, and the other end of the spring needle contacts the contact.

2. The wafer acceptance test probe card test fixture according to claim 1, wherein: The circuit board is fixedly mounted on the test machine via a mounting frame.

3. The wafer acceptance test probe card test fixture according to claim 2, wherein: The mounting frame is in the shape of a circular ring.

4. The wafer acceptance test probe card test fixture according to claim 2, wherein: The mounting frame is provided with a circuit board mounting portion, and the circuit board is fixed on the circuit board mounting portion; The mounting frame is fixedly mounted on the testing machine platform via fasteners.

5. The wafer acceptance test probe card test fixture according to claim 2, wherein: The mounting frame is also provided with a handle.

6. The wafer acceptance test probe card test fixture according to claim 1, wherein: The test machine is provided with a positioning pin hole; The wafer receiving test probe card test fixture is also provided with positioning pins corresponding to the positioning pin holes.

7. The wafer acceptance test probe card test fixture according to claim 1, wherein: The circuit board is a printed circuit board.

8. The wafer acceptance test probe card test fixture according to claim 1, wherein: The needle plate comprises: The first needle plate and the second needle plate are provided with a plurality of penetrating needle holes, and the plurality of spring needles are respectively placed in the corresponding needle holes, and both ends of the spring needles are exposed from the needle plates.

9. The wafer acceptance test probe card test fixture according to claim 1, wherein: The joints and the corresponding contacts do not overlap in a vertical projection of the circuit board.

10. A testing machine, characterized in that: include: A carrying portion, for carrying a wafer under test to receive a test probe card, wherein the wafer under test receives a test probe card having a plurality of test points; The mounting portion is used to mount the wafer acceptance test probe card test fixture according to any one of claims 1 to 9, wherein one end of the spring pin of the wafer acceptance test probe card test fixture contacts a test point on the wafer acceptance test probe card.

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