High-stability metalized film capacitor based on multilayer electrode design
Through the film capacitor designed by multi-layer electrodes, the interdigital inner electrode group and the double-layer outer electrode structure are integrated, the local breakdown and damage problems of film capacitors in complex environments are solved, self-healing and stability improvement are achieved, and the efficiency and flexibility of capacitors are improved.
Patent Information
- Application Number
- CN202421209996.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-05-29
AI Technical Summary
Thin film capacitors are prone to local breakdown or fatigue damage under changing electric fields and complex environments, resulting in device failure and affecting stability and safety. At the same time, traditional metal foil electrodes affect volume efficiency, making it difficult to achieve miniaturization and integration.
The multi-layer electrode design is adopted, and the integrated interdigital inner electrode group is arranged and wound in the interdigital form by a metallized dielectric film. The nano-zinc layer and nano-silver layer alternately form the inner electrode. The outer electrode adopts a double-layer structure of copper layer and aluminum foil, combined with vacuum nanoevaporation technology, to achieve self-repair of local damage and improve stability.
It enhances the stability and safety of film capacitors, improves usage efficiency, simplifies production processes, and improves conductive efficiency through nano-scale interface contact, enhances flexibility and stability.
Smart Images

Figure CN223218131U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of film capacitors, in particular to a high-stability metallized film capacitor based on a multi-layer electrode design. Background Art
[0002] Film capacitors have the characteristics of wide frequency range, wide voltage range, large current range, large capacitance range, and wide temperature range. They are widely used in medical, automotive, military, communications, electronics, oil and gas exploration and other fields. They are core components of devices such as electric vehicle inverters, medical pacemakers, high-voltage direct current transmission systems, and aircraft carrier electromagnetic catapults. However, in actual work, under changing electric fields and complex environments, local breakdown or fatigue damage caused by the dielectric material inside the film capacitor will lead to overall failure of the device, which undoubtedly reduces the stability and safety of the film capacitor. In addition, traditional film capacitors use metal foil as electrodes, which damages the volume efficiency of film capacitors and affects the miniaturization, integration, and lightweight application of capacitors. Utility Model Content
[0003] The purpose of this utility model is to overcome the shortcomings of the existing technology and provide a high-stability metallized film capacitor based on a multi-layer electrode design. The multi-layer electrode structure design can achieve self-repair of local breakdown and damage failure in the film capacitor, thereby improving the overall stability and safety of the capacitor. At the same time, this structural design can effectively increase the utilization efficiency of the film capacitor and simplify the production process.
[0004] The technical solution of the utility model is as follows:
[0005] A high-stability metallized film capacitor based on a multi-layer electrode design comprises a resin housing and a capacitor core encapsulated within the resin housing. The inner structure of the capacitor core employs an integrated interdigitated inner electrode group, which is composed of multiple metallized dielectric films arranged and wound in an interdigitated form. The metallized dielectric film comprises a nanozinc layer having a square array deposited on the surface of a polymer film by masking, serving as the first inner electrode layer. A porous resin is then filled in the gaps between the square arrays of the nanozinc layer, and a continuous layer of nanosilver is then deposited on the nanozinc layer. External electrodes are connected to both sides of the integrated interdigitated inner electrode group, and lead wire pins are extended to achieve external connections.
[0006] Furthermore, the outer structure of the capacitor core includes an isolation layer, a protective layer and a tape, and the capacitor core is composed of an integrated interdigitated inner electrode group, an isolation layer, a protective layer and a tape from the inside to the outside.
[0007] Furthermore, the polymer film is a polypropylene film or a polyvinylidene fluoride film.
[0008] Furthermore, the outer electrode adopts a double-layer structure, which is composed of a first layer of copper and a second layer of aluminum foil.
[0009] Compared with the prior art, the beneficial effect of the present invention is that the core of the capacitor core of the present invention adopts an integrated interdigitated inner electrode group, which is composed of multiple metallized dielectric films arranged and wound in an interdigitated form. The metallized dielectric film is a first-layer inner electrode formed by vapor-depositing a nano-zinc layer with a square array on the surface of a polymer film by a mask method, and filling the gaps in the square array of the nano-zinc layer with a porous resin, and then vapor-depositing a continuous layer of nano-silver on the first-layer inner electrode.
[0010] (1) The use of vacuum nano-evaporation technology can effectively reduce the volume and cost waste caused by metal foil. At the same time, due to the nano-scale interface contact, the conduction path is more efficient and stable;
[0011] (2) The double-layer inner electrode structure enhances the safety and stability of the thin film capacitor. The melting point of the zinc-plated layer (420°C) is much lower than that of the silver-plated layer (962°C). When the film undergoes local electrical breakdown and thermal damage, the high temperature generated locally will melt the zinc electrode layer with a low melting point, and the damaged zinc electrode will quickly escape to the gap in the array, thereby achieving the self-healing property of quickly opening the damaged part without affecting the overall operation. At the same time, the silver electrode has the highest conductivity among metals, which plays a role in efficiently connecting the zinc electrode layer and concentrating the charge.
[0012] (3) In addition, the double-layer structure of the external electrode effectively improves the flexibility and stability of the thin film capacitor. The copper layer of the first layer has good conductivity and low cost, and the aluminum foil of the second layer can effectively prevent the oxidation of copper. At the same time, due to the deformation characteristics of aluminum, the flexibility and extensibility of the electrode part of the material are greatly increased. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0014] Figure 1 This is a schematic structural diagram of a high-stability metallized film capacitor based on a multi-layer electrode design provided by the utility model;
[0015] Figure 2 This is a schematic structural diagram of the integrated interdigital inner electrode group of the present invention;
[0016] Figure 3This is a schematic structural diagram of the metallized dielectric film of the present invention. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0018] In order to illustrate the technical solution of the present invention, specific embodiments are provided below.
[0019] Example
[0020] See also Figure 1 This embodiment provides a high-stability metallized film capacitor based on a multi-layer electrode design, including a resin shell 1 and a capacitor core 2 encapsulated inside the resin shell 1. The inner structure of the capacitor core 2 adopts an integrated interdigitated inner electrode group 21. The two sides of the integrated interdigitated inner electrode group 21 are connected to the external electrodes 3 and lead-out wire pins 4 to achieve external connection. The outer structure of the capacitor core 2 includes an isolation layer 22, a protective layer 23 and a tape 24. The capacitor core 2 is composed of the integrated interdigitated inner electrode group 21, the isolation layer 22, the protective layer 23 and the tape 24 from the inside to the outside.
[0021] Combine Figure 2 As shown, the integrated interdigitated inner electrode group 21 is composed of multiple metallized dielectric films 211 arranged and wound in an interdigitated form. The metallized dielectric films 211 are single-layer single-sided structures. Two adjacent metallized dielectric films 211 are arranged in an interdigitated manner and are wound to form the integrated interdigitated inner electrode group 21.
[0022] The isolation layer 22 , the protective layer 23 , and the adhesive tape 24 of the outer structure respectively serve to isolate the energy storage unit, protect against external impact, and connect the capacitor core 2 and the resin housing 1 .
[0023] The metallized dielectric film 211 is prepared by a vacuum evaporation machine, combined with Figure 3As shown, a nano-zinc layer 2112 with a square array is deposited on the surface of a polymer film 2111 using a mask method as the first internal electrode. A porous resin is then filled in the gaps between the square arrays of the nano-zinc layer 2112. Finally, a continuous layer of nano-silver 2113 is deposited on the nano-zinc layer 2112, thereby forming a stable double-layer internal electrode structure. Polymer film 2111 can be made of polypropylene or polyvinylidene fluoride film, produced through biaxial orientation or casting to form a continuous, uniform, and stable polymer film. By adopting vacuum nano-evaporation technology, the volume and cost waste caused by metal foil can be effectively reduced. At the same time, due to the nano-level interface contact, the conduction path is more efficient and stable; and the double-layer inner electrode structure enhances the safety and stability of the thin film capacitor. The melting point of the zinc-plated layer (420°C) is much lower than that of the silver-plated layer (962°C). When the film undergoes local electrical breakdown and thermal damage, the locally generated high temperature will melt the low-melting-point zinc electrode layer, and the damaged zinc electrode will quickly dissipate to the array gap, thereby achieving the self-healing property of quickly opening the damaged part without affecting the overall operation. At the same time, the silver electrode has the highest conductivity among metals, which plays a role in efficiently connecting the zinc electrode layer and concentrating the charge.
[0024] In addition, the external electrode 3 also adopts a double-layer structure, which consists of a first layer of copper layer 31 and a second layer of aluminum foil 32. The first layer is formed by spraying to form the first copper layer external electrode, and then a layer of aluminum foil 32 is cured on the formed copper layer external electrode to serve as the second aluminum foil external electrode. Then, the wire pin 4 is led out to achieve external connection. The double-layer structure of the external electrode 3 effectively improves the flexibility and stability of the thin film capacitor. The first layer of copper layer 31 has good conductivity and low cost. The second layer of aluminum foil 32 can effectively prevent copper oxidation. At the same time, due to the deformation characteristics of aluminum, the flexibility and extensibility of the material electrode part are greatly increased.
[0025] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A high-stability metallized film capacitor based on a multi-layer electrode design, comprising a resin housing and a capacitor core encapsulated within the resin housing, characterized in that: The inner layer structure of the capacitor core adopts an integrated interdigitated inner electrode group, which is composed of multiple metallized dielectric films arranged and wound in an interdigitated form. The metallized dielectric film is a first layer of inner electrode formed by vapor-depositing a nano-zinc layer with a square array on the surface of a polymer film through a mask method, and filling the gaps in the square array of the nano-zinc layer with a porous resin, and then vapor-depositing a continuous layer of nano-silver on the nano-zinc layer. The two sides of the integrated interdigitated inner electrode group are connected to external electrodes and lead out wire pins to achieve external connection.
2. The high-stability metallized film capacitor based on a multi-layer electrode design according to claim 1, characterized in that: The outer layer structure of the capacitor core includes an isolation layer, a protective layer and an adhesive tape. The capacitor core is composed of an integrated interdigitated inner electrode group, an isolation layer, a protective layer and an adhesive tape from the inside to the outside.
3. The high-stability metallized film capacitor based on a multi-layer electrode design according to claim 1, characterized in that: The polymer film is a polypropylene film or a polyvinylidene fluoride film.
4. The high-stability metallized film capacitor based on a multi-layer electrode design according to claim 1, characterized in that: The outer electrode adopts a double-layer structure, which is composed of a first layer of copper and a second layer of aluminum foil.