Injection molding copper bar and motor controller

Abstract

The utility model provides an injection molding copper bar and a motor controller, relates to the technical field of motor control, and solves the problem that the safety and stability of a motor controller system are easily affected due to poor performance of an injection molding copper bar provided in the related technology. The injection molding copper bar comprises the copper bar assembly, the resin layer and the plastic packaging part which are sequentially arranged from inside to outside, the pits are formed in the surface of the copper bar assembly, the nanoscale pits in the surface of the copper bar are filled with the resin to form the resin layer, the plastic packaging part is formed through the injection molding process to wrap the copper bar assembly, and therefore the copper bar assembly is formed. According to the injection molding copper bar, the resin and the metal form high-strength combination, dense combination is achieved, the bonding strength of the prepared injection molding copper bar is higher, and therefore the performance of the injection molding copper bar is improved, the overall performance of a motor controller system is improved, and the stability and safety of the motor controller system during operation are improved.

Description

Technical Field

[0001] The present application relates to the field of motor control technology, and in particular to an injection-molded copper busbar and a motor controller. Background Art

[0002] New energy vehicles are becoming a mainstream component of the automotive industry due to their low emissions and high energy efficiency. The motor controller system is a core component of their system architecture, converting the battery's DC power into the AC power required to drive the motor. High-pressure injection-molded copper busbars are key components in the motor controller system, carrying high currents and directly impacting the system's efficiency and reliability. The through-cylinder seal prevents electrical connection between the motor controller system and the external environment, ensuring its safety and stability.

[0003] However, in the related art, injection-molded copper busbars are usually designed with corresponding glue filling grooves, and the glue filling grooves are glued to achieve sealing; or the glue is pre-wetted and then the wet glue is squeezed out through the plastic-coated copper busbar bolts to achieve sealing. However, during long-term operation, the performance of the injection-molded copper busbar may degrade or even malfunction due to reasons such as increased temperature and excessive current. Therefore, in corresponding performance tests such as durability tests and aging tests, the bonding strength of the injection-molded copper busbars provided in the related art is poor, and they are prone to falling off, which in turn has an adverse effect on the stable operation of the motor controller system. Therefore, the performance of the injection-molded copper busbars provided in the related art is poor and is likely to affect the safety and stability of the motor controller system. Utility Model Content

[0004] The present application provides an injection-molded copper busbar and a motor controller, which solves the problem that the injection-molded copper busbar provided in the related art has poor performance and easily affects the safety and stability of the motor controller system. The injection-molded copper busbar of the present application has good performance and high bonding strength, which helps to improve the safety and stability of the motor controller system.

[0005] In a first aspect, the present application provides an injection-molded copper busbar, which comprises a copper busbar assembly, a resin layer, and a plastic encapsulation member arranged sequentially from the inside to the outside;

[0006] Among them, the surface of the copper busbar assembly is provided with nano-scale pits, which are formed by electrolytic corrosion of electrolyte; the resin layer includes nano-scale protrusions, which are adapted to the pits, and the resin layer fills the pits on the surface of the copper busbar assembly through several protrusions; the plastic encapsulation is injection-molded to encapsulate the copper busbar assembly through an injection molding process, and the connection terminals of the copper busbar assembly are exposed on the plastic encapsulation, and the connection terminals are used to connect to a three-phase power supply.

[0007] In a second aspect, the present application also provides a motor controller, which includes the injection-molded copper busbar as described in the above aspects.

[0008] The injection-molded copper busbar of the present application has pits formed on the surface of the copper busbar assembly, and resin is filled in the nano-scale pits on the surface of the copper busbar to form a resin layer, and a plastic encapsulation is formed through an injection molding process to wrap the copper busbar assembly, so that the resin and the metal form a high-strength bond, achieving a dense bond, so that the bonding strength of the prepared injection-molded copper busbar is higher, thereby improving the performance of the injection-molded copper busbar, and then improving the overall performance of the motor controller system, which helps to improve the stability and safety of the motor controller system during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic structural diagram of a first copper busbar sub-assembly provided in one embodiment of the present application;

[0010] Figure 2 A schematic structural diagram of a second copper busbar subassembly provided in one embodiment of the present application;

[0011] Figure 3 A schematic structural diagram of a third copper busbar sub-assembly provided in one embodiment of the present application;

[0012] Figure 4 A schematic structural diagram of a fourth copper busbar sub-assembly provided in one embodiment of the present application;

[0013] Figure 5 A schematic structural diagram of an injection-molded copper busbar provided in one embodiment of the present application;

[0014] Figure 6 A schematic diagram of the broken line of bonding strength in a durability test provided in one embodiment of the present application;

[0015] Figure 7 A schematic diagram of a bonding strength curve in an aging test provided in one embodiment of the present application. DETAILED DESCRIPTION

[0016] The embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and examples. It will be understood that the specific embodiments described herein are merely used to explain the embodiments of the present application, rather than to limit the embodiments of the present application. It should also be noted that, for ease of description, only portions related to the embodiments of the present application, rather than all structures, are shown in the accompanying drawings. After reading this specification, those skilled in the art should be able to understand that, as long as the technical features do not contradict each other, any combination of the technical features may constitute an optional embodiment.

[0017] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates that the objects associated before and after are in an "or" relationship. In the description of this application, "multiple" means two or more, and "several" means one or more.

[0018] New energy vehicles are gradually becoming the mainstream of automotive industry development due to their low emissions and high energy efficiency. In new energy vehicles, the motor controller system is one of the core parts. The motor controller system is used to convert the direct current of the battery into the alternating current required by the motor to drive the motor.

[0019] For the motor controller, the design of the high-pressure injection-molded copper busbar and the through-cylinder sealing structure is crucial. The high-pressure injection-molded copper busbar is a key component in the motor controller system. It is responsible for transmitting large currents, and its performance directly affects the efficiency and reliability of the motor controller system. The through-cylinder sealing structure is designed to prevent electrical connection between the inside of the motor controller system and the external environment, ensuring the safety and stability of the motor controller system.

[0020] However, in the related art, injection-molded copper busbars are usually designed with corresponding glue filling grooves, and the glue filling grooves are glued to achieve sealing; or the glue is pre-wetted and then the wet glue is squeezed out through the plastic-coated copper busbar bolts to achieve sealing. However, during long-term operation, the performance of the injection-molded copper busbar may degrade or even malfunction due to reasons such as increased temperature and excessive current. Therefore, in corresponding performance tests such as durability tests and aging tests, the bonding strength of the injection-molded copper busbars provided in the related art is poor, and they are prone to falling off, which in turn has an adverse effect on the stable operation of the motor controller system. Therefore, the performance of the injection-molded copper busbars provided in the related art is poor and is likely to affect the safety and stability of the motor controller system.

[0021] In this regard, the present application provides an injection-molded copper busbar, which can be used as a copper busbar in a motor controller to ensure the safety and stability of the motor controller system. In the present application, the injection-molded copper busbar includes a copper busbar assembly, a resin layer, and a plastic encapsulation member arranged sequentially from the inside to the outside. The surface of the copper busbar assembly is provided with nanoscale pits, which are formed by electrolytic corrosion of an electrolyte. Optionally, in one embodiment, pure copper is used as the material of the copper busbar. The prepared injection-molded copper busbar needs to undergo electrolytic corrosion treatment, such as by electrolyzing the copper busbar using an electrolytic cell. It is conceivable that an electrolyte, such as an electrolyte including a sodium hydroxide solution or a copper sulfate solution, is injected into the electrolytic cell to corrode the copper busbar placed in the electrolytic cell through the electrolyte, so that pits are formed on the surface of the copper busbar. It should be noted that the electrolytic corrosion effect of the copper busbar can be controlled by adjusting electrolysis parameters such as temperature, voltage, and electrolysis time, so that the pits formed on the surface of the copper busbar can meet the preparation requirements.

[0022] The resin layer is located between the copper busbar assembly and the plastic encapsulation, and includes nanoscale protrusions that fit into the recesses, allowing the resin layer to fill the recesses on the surface of the copper busbar assembly through the protrusions thereon. It is conceivable that the resin layer can be formed by resin injected during the injection molding process, that is, during the injection molding process, the resin is injected so that the resin fills the recesses on the surface of the copper busbar assembly, forming the protrusions on the resin layer.

[0023] The plastic encapsulation is injection-molded around the copper busbar assembly. Similarly, the resin layer on the copper busbar assembly is also encapsulated by the plastic encapsulation. However, the copper busbar assembly's wiring terminals are exposed outside the plastic encapsulation. In other words, the plastic encapsulation only covers the copper busbar assembly, leaving the copper busbar assembly's wiring terminals exposed outside the plastic encapsulation. These terminals are used to connect to the three-phase power supply.

[0024] It is conceivable that, in one embodiment, when the copper busbar assembly is subjected to electrolytic corrosion treatment, part of its structure is immersed in the electrolyte. For ease of description, the area on the surface of the copper busbar assembly that is immersed in the electrolyte and electrolytically corroded is referred to as the immersion area, and the remaining area is referred to as the non-immersion area. Accordingly, pits are formed in the immersion area. It is conceivable that the resin layer covers the immersion area so that the resin can fill the pits on the copper busbar assembly, and the immersion area of the copper busbar assembly is wrapped by a plastic encapsulation member so that this part can form a high-strength bond, thereby improving the bonding strength of the injection-molded copper busbar. It should be noted that when the copper busbar assembly is subjected to electrolytic corrosion treatment, the entire copper busbar assembly can be placed in the electrolyte so that pits are formed on the surface of the copper busbar assembly.

[0025] It can be seen from the above scheme that the injection-molded copper busbar of the present application has pits formed on the surface of the copper busbar assembly, and resin is filled in the nano-scale pits on the surface of the copper busbar to form a resin layer, and a plastic package is formed through the injection molding process to wrap the copper busbar assembly, so that the resin and the metal form a high-strength bond, achieving a dense bond, so that the bonding strength of the prepared injection-molded copper busbar is higher, thereby improving the performance of the injection-molded copper busbar, and then improving the overall performance of the motor controller system, which helps to improve the stability and safety of the motor controller system during operation.

[0026] In some embodiments, the copper bar assembly includes a first copper bar sub-component, a second copper bar sub-component, a third copper bar sub-component, and a fourth copper bar sub-component. The first copper bar sub-component, the second copper bar sub-component, the third copper bar sub-component, and the fourth copper bar sub-component are all formed with nano-scale pits on their surfaces, and the first copper bar sub-component, the second copper bar sub-component, the third copper bar sub-component, and the fourth copper bar sub-component are all fixed by a plastic encapsulation. Wherein, the main body of the first copper bar sub-component, the main body of the second copper bar sub-component, and the main body of the third copper bar sub-component are all located outside the plastic encapsulation to serve as terminals on the copper bar assembly for connecting to a three-phase power supply. For example, for the three-phase UVW of the three-phase power supply, the U phase can be connected through the first copper bar sub-component, the V phase can be connected through the second copper bar sub-component, and the W phase can be connected through the third copper bar sub-component.

[0027] It is conceivable that, in one embodiment, in order to better connect to the three-phase power supply, the terminal is provided with a wiring hole and a chamfered corner, wherein the wiring hole and the chamfered corner are both used to connect to the power connector of the corresponding three-phase power supply. It is understandable that wiring holes are provided on the main body of the first copper bar sub-assembly, the main body of the second copper bar sub-assembly, and the main body of the third copper bar sub-assembly to connect to the three-phase power supply. The power connector of the corresponding three-phase power supply can be a connector corresponding to the three phases UVW, so that different wiring terminals correspond to different phases. It should be noted that the aperture of each wiring hole is set according to actual application requirements.

[0028] In addition, chamfered corners are formed on the terminal, that is, the corners on the terminal of the first copper bar sub-component, the second copper bar sub-component and the third copper bar sub-component are cut into bevels, so that the terminal can better connect to the power connector of the corresponding three-phase power supply.

[0029] Figure 1 This is a structural diagram of the first copper busbar sub-component 110 provided in one embodiment of the present application, as shown in FIG. Figure 1As shown, in one embodiment, the first copper bar sub-component 110 includes a pair of first ejector pins 101, that is, two first ejector pins 101 are provided on the first copper bar sub-component 110, and both first ejector pins 101 are located at the bent portion of the first copper bar sub-component 110. The bent portion is located on a first side of the main body of the first copper bar sub-component 110, for example, the first side is the left side. Moreover, the bottom of the first ejector pin 101 is deflected in a first direction toward the main body of the first copper bar sub-component 110 by a first preset angle. As shown in the figure, with the left-right direction as the first direction, it can be understood that if the main body of the first copper bar sub-component 110 is regarded as the inner side, the first ejector pin 101 is deflected inward, that is, deflected to the right, and the corresponding deflection angle is the first preset angle. For example, in some embodiments, the first preset angle is set to 30°, so that the first ejector pin 101 can be deflected toward the main body.

[0030] In addition, the first ejector pin 101 is bent in the second direction toward the main portion of the first copper bar sub-component 110. As shown in the figure, with the up-down direction as the second direction, the first ejector pin 101 is further bent upward so that the direction of the first ejector pin 101 is parallel to the plane where the main portion of the first copper bar sub-component 110 is located, so that the plastic encapsulation can better wrap the copper bar sub-component and improve the bonding strength of the formed injection-molded copper bar.

[0031] Figure 2 This is a schematic structural diagram of a second copper bar sub-assembly 120 provided in accordance with an embodiment of the present application. In one embodiment, the second copper bar sub-assembly 120 includes a pair of second ejector pins 102. Specifically, two second ejector pins 102 are provided on the second copper bar sub-assembly 120. The second ejector pins 102 are located below the main body of the second copper bar sub-assembly 120 and are bent toward the main body of the second copper bar sub-assembly 120 so that the orientation of the second ejector pins 102 is parallel to the plane of the main body of the second copper bar sub-assembly 120. As shown in the figure, both second ejector pins 102 are bent upward so that the orientation of the second ejector pins 102 is parallel to the plane of the main body of the second copper bar sub-assembly 120. The spatial structure formed between the main body of the second copper bar sub-assembly 120 and the second ejector pins 102 helps the resulting plastic encapsulation better encapsulate the second copper bar sub-assembly 120 during the injection molding process.

[0032] Figure 3 This is a schematic structural diagram of a third copper bar sub-component 130 provided in one embodiment of the present application. In one embodiment, the third copper bar sub-component 130 includes a pair of third ejector pins 103, that is, two third ejector pins 103 are provided on the third copper bar sub-component 130. The third ejector pins 103 are located at a bent portion of the third copper bar sub-component 130, and the bent portion is located on the second side of the main body of the third copper bar sub-component 130. Figure 3As shown, the bent portion of the third copper bar sub-component 130 is located to the right of its main portion. In the figure, the left-right direction is the first direction, and the up-down direction is the second direction. Accordingly, the bottom portion of the third copper bar sub-component 130 is bent in a first direction toward the main portion of the third copper bar sub-component 130. Specifically, the bent portion is bent leftward toward the main portion of the third copper bar sub-component 130, for example, by a first predetermined angle, so that the third ejector pins 103 can be deflected toward the main portion of the third copper bar sub-component 130. Furthermore, the third ejector pins 103 are also bent in a second direction toward the main portion of the third copper bar sub-component 130. For example, the third ejector pins 103 are bent upward so that their orientation is parallel to the plane of the main portion of the third copper bar sub-component 130. Similarly, the spatial structure formed between the main portion of the third copper bar sub-component 130 and the third ejector pins 103 helps to better encapsulate the third copper bar sub-component 130 during the injection molding process.

[0033] Figure 4 A schematic structural diagram of a fourth copper bar sub-assembly 140 is provided in accordance with an embodiment of the present application. As shown in the figure, in one embodiment, the fourth copper bar sub-assembly 140 includes three pairs of fourth ejector pins 104. The main body of the fourth copper bar sub-assembly 140 is an arc-shaped curved portion corresponding to a second preset angle, and the three pairs of fourth ejector pins 104 are spaced apart in the main body of the fourth copper bar sub-assembly 140. It should be noted that in some embodiments, the second preset angle is set to 67.5°, so that the fourth copper bar sub-assembly 140 has a corresponding curvature.

[0034] It is understood that each pair of fourth thimbles 104 is spaced apart, that is, two fourth thimbles 104 on the fourth copper bar sub-component 140 form a pair, and the spacing between each pair of fourth thimbles 104 can be the same or different, such as the distance between the first pair and the second pair is the first distance, and the distance between the second pair and the third pair is the second distance, and the first distance can be equal to the second distance, or it can be unequal. In addition, in each pair of fourth thimbles 104, the spacing between the two fourth thimbles 104 is the same. Moreover, the fourth thimbles 104 are also bent toward the main portion of the fourth copper bar sub-component 140 so that the direction of the fourth thimbles 104 is perpendicular to the plane where the main portion of the fourth copper bar sub-component 140 is located. As shown in the figure, the fourth thimbles 104 are bent upward so that the direction of the fourth thimbles 104 is perpendicular to the plane where the main portion of the fourth copper bar sub-component 140 is located. The plastic encapsulation produced by injection molding wraps around the fourth copper bar sub-component 140 . The plastic encapsulation also has a curvature to fit the fourth copper bar sub-component 140 .

[0035] Figure 5A schematic structural diagram of an injection-molded copper busbar provided in accordance with an embodiment of the present application is shown in the figure. The injection-molded copper busbar comprises a copper busbar assembly, a resin layer, and a plastic encapsulation member 210. Pits are formed on the surface of the copper busbar assembly, and resin is filled into the nanoscale pits on the surface of the copper busbar to form a resin layer. The resin layer comprises protrusions adapted to the pits. The plastic encapsulation member 210 is encapsulated in the copper busbar assembly through an injection molding process. Similarly, the resin layer on the surface of the copper busbar assembly is also encapsulated by the plastic encapsulation member 210. However, the connection terminals of the copper busbar assembly are exposed to the plastic encapsulation member 210, i.e., the plastic encapsulation member 210 only encapsulates part of the copper busbar assembly, and the connection terminals of the copper busbar assembly are exposed outside the plastic encapsulation member 210. The connection terminals are used to connect to a three-phase power supply.

[0036] The copper busbar assembly includes a first copper busbar sub-assembly 110, a second copper busbar sub-assembly 120, a third copper busbar sub-assembly 130, and a fourth copper busbar sub-assembly. The main bodies of the first copper busbar sub-assembly 110, the second copper busbar sub-assembly 120, and the third copper busbar sub-assembly 130 are all located outside the plastic encapsulation 210, serving as terminals for connecting to a three-phase power supply. Furthermore, each terminal is provided with a wiring hole 201 and a chamfered corner for connecting to a power connector of a corresponding three-phase power supply.

[0037] A pair of first thimbles 101 are provided on the first copper bar component 110, a pair of second thimbles 102 are provided on the second copper bar component 120, a pair of third thimbles 103 are provided on the third copper bar component 130, and three pairs of fourth thimbles 104 are provided on the fourth copper bar component. The first thimbles 101, second thimbles 102, third thimbles 103, and fourth thimbles 104 are all bent upward and are also exposed outside the plastic packaging component 210.

[0038] It is understood that the first ejector pin 101 is located at the bent portion of the first copper bar sub-component 110, and the bent portion of the first copper bar sub-component 110 is located to the left of the main portion of the first copper bar sub-component 110. The bottom of the first ejector pin 101 is bent at a first preset angle, such as 30°, in a first direction toward the main portion of the first copper bar sub-component 110, and the first ejector pin 101 is bent in a second direction toward the main portion of the first copper bar sub-component 110 so that the orientation of the first ejector pin 101 is parallel to the plane of the main portion of the first copper bar sub-component 110.

[0039] The second thimble 102 is located at the lower part of the main part of the second copper bar sub-component 120, and the second thimble 102 is bent toward the main part of the second copper bar sub-component 120 so that the direction of the second thimble 102 is parallel to the plane where the main part of the second copper bar sub-component 120 is located.

[0040] The third ejector pin 103 is located at the bent portion of the third copper bar sub-component 130, which is located to the right of the main portion of the third copper bar sub-component 130. The bottom of the third ejector pin 103 is bent in a first direction toward the main portion of the third copper bar sub-component 130 at a first predetermined angle, such as 30°. The third ejector pin 103 is also bent in a second direction toward the main portion of the third copper bar sub-component 130, such that the orientation of the third ejector pin 103 is parallel to the plane of the main portion of the third copper bar sub-component 130.

[0041] The fourth ejector pin 104 is bent toward the main portion of the fourth copper bar sub-component so that the direction of the fourth ejector pin 104 is perpendicular to the plane where the main portion of the fourth copper bar sub-component is located, and the main portion of the fourth copper bar sub-component is an arc-shaped curved portion corresponding to the second preset angle (such as 67.5°).

[0042] Figure 6 This is a broken line diagram of the bonding strength in the durability test provided in one embodiment of the present application. The injection-molded copper busbar of the present application and the injection-molded copper busbar prepared by the related technology were subjected to durability tests, such as Figure 6 As shown in the figure, in the hot and cold cycle durability test at -40℃, 30min (minutes) ~ 150℃, 30min (minutes), the bonding strength of the two is shown in the figure. Figure 6 The horizontal axis represents the number of cycles (in times), and the vertical axis represents the bonding strength (in MPa). The broken line 301 corresponds to the bonding strength of the injection-molded copper busbar of the present application, and the broken line 302 corresponds to the bonding strength of the injection-molded copper busbar prepared by the related art. Figure 6 It can be seen that the bonding strength of the injection-molded copper busbar of the present application is higher and more stable, which helps to improve the stability and safety of the motor controller system during operation.

[0043] and Figure 7 This is a schematic diagram of a bonding strength curve in an aging test provided in an embodiment of the present application. Similarly, the injection-molded copper busbar of the present application and the injection-molded copper busbar prepared by the related technology were subjected to aging tests, such as high-temperature and high-humidity aging tests under conditions of 85°C and 85% RH (Relative Humidity). The bonding strength of the two is shown in the figure. Figure 7 The horizontal axis represents the aging time (in h), and the vertical axis represents the bonding strength (in MPa). The broken line 401 corresponds to the bonding strength of the injection-molded copper busbar of the present application, and the broken line 402 corresponds to the bonding strength of the injection-molded copper busbar prepared by the related art. Figure 5 It can be seen that the bonding strength of the injection-molded copper busbar of the present application is higher and more stable, which helps to improve the stability and safety of the motor controller system during operation.

[0044] It can be seen that the bonding strength of the injection-molded copper busbar of the present application is higher, and its good performance is reflected in the durability test and aging test. The high bonding strength of the injection-molded copper busbar can improve the performance of the copper busbar, thereby improving the overall performance of the motor controller system, and helping to improve the stability and safety of the motor controller system during operation.

[0045] The present application also provides a motor controller, which includes the above-mentioned injection-molded copper busbar. The injection-molded copper busbar has high bonding strength, so that the stability and safety of the motor controller can be guaranteed during the operation of the motor controller, which is conducive to stable and safe operation of the system.

[0046] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0047] Note that the above are only preferred embodiments of the present application and the technical principles employed. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present application. The scope of the present application is determined by the scope of the appended claims.

Claims

1. An injection-molded copper busbar, characterized in that: It includes a copper busbar assembly, a resin layer and a plastic encapsulation member arranged in sequence from the inside to the outside; The surface of the copper busbar assembly is provided with nano-scale pits, which are formed by electrolytic corrosion of an electrolyte; The resin layer includes nano-scale protrusions, the protrusions are adapted to the pits, and the resin layer fills the pits on the surface of the copper busbar assembly through the protrusions; The plastic encapsulation part encapsulates the copper busbar assembly through an injection molding process, and the connection terminals of the copper busbar assembly are exposed from the plastic encapsulation part, and the connection terminals are used to connect to a three-phase power supply.

2. The injection-molded copper busbar according to claim 1, characterized in that: The copper bar assembly includes a first copper bar sub-component, a second copper bar sub-component, a third copper bar sub-component and a fourth copper bar sub-component; Nanoscale pits are provided on the surface of the first copper bar sub-component, the surface of the second copper bar sub-component, the surface of the third copper bar sub-component, and the surface of the fourth copper bar sub-component; The first copper bar sub-component, the second copper bar sub-component, the third copper bar sub-component and the fourth copper bar sub-component are fixed by the plastic encapsulation component, and the main part of the first copper bar sub-component, the main part of the second copper bar sub-component and the main part of the third copper bar sub-component are all located outside the plastic encapsulation component to serve as connection terminals on the copper bar assembly for connecting to a three-phase power supply.

3. The injection-molded copper busbar according to claim 1 or 2, characterized in that: The wiring terminals are each provided with a wiring hole and a chamfered corner, and the wiring hole and the chamfered corner are both used to connect to a power connector corresponding to the three-phase power supply.

4. The injection-molded copper busbar according to claim 2, characterized in that: The first copper bar sub-component includes a pair of first thimbles, the first thimbles are located at a bent portion of the first copper bar sub-component, and the bent portion of the first copper bar sub-component is located at a first side of a main portion of the first copper bar sub-component; The bottom of the first ejector pin is bent at a first preset angle in a first direction toward the main portion of the first copper bar sub-component, and the first ejector pin is bent in a second direction toward the main portion of the first copper bar sub-component, so that the direction of the first ejector pin is parallel to the plane where the main portion of the first copper bar sub-component is located, and the first direction and the second direction are perpendicular to each other.

5. The injection-molded copper busbar according to claim 2, characterized in that: The second copper bar sub-component includes a pair of second thimbles, which are located at the lower part of the main part of the second copper bar sub-component, and the second thimbles are bent toward the main part of the second copper bar sub-component so that the direction of the second thimbles is parallel to the plane where the main part of the second copper bar sub-component is located.

6. The injection-molded copper busbar according to claim 2, characterized in that: The third copper bar sub-component includes a pair of third thimbles, the third thimbles are located at a bent portion of the third copper bar sub-component, and the bent portion of the third copper bar sub-component is located at the second side of the main body of the third copper bar sub-component; The bottom of the third ejector pin is bent at a first preset angle in a first direction toward the main portion of the third copper bar sub-component, and the third ejector pin is bent in a second direction toward the main portion of the third copper bar sub-component, so that the direction of the third ejector pin is parallel to the plane where the main portion of the third copper bar sub-component is located, and the first direction and the second direction are perpendicular to each other.

7. The injection-molded copper busbar according to claim 4 or 6, characterized in that: The first preset angle is 30°.

8. The injection-molded copper busbar according to claim 2, characterized in that: The fourth copper bar sub-component includes three pairs of fourth thimbles, each pair of the fourth thimbles is arranged at intervals, and the fourth thimbles are bent toward the main part of the fourth copper bar sub-component so that the direction of the fourth thimbles is perpendicular to the plane where the main part of the fourth copper bar sub-component is located, and the main part of the fourth copper bar sub-component is an arc-shaped curved part corresponding to the second preset angle.

9. The injection-molded copper busbar according to claim 8, characterized in that: The second preset angle is 67.5°.

10. A motor controller, characterized in that: The motor controller comprises the injection-molded copper busbar according to any one of claims 1 to 9.

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