Driving module applied to brushless motor of food processor

Abstract

The utility model discloses a brushless motor driving module applied to a food processor. The driving module comprises a board body, an IPM module, an MCU module, an EMC module, a switch power supply module and a surge resistor. The IPM module is arranged at one end, close to the first short edge, of the first long edge of the board body; the MCU module is arranged on the board body; the EMC module is arranged at one end, close to the second short edge, of the second long edge of the board body; the switching power supply module is arranged on the second short side; the surge resistor is arranged between the switching power supply module and the EMC module along the second short side; the EMC module supplies power to the switching power supply module through the surge resistor. Thus, the electromagnetic interference on the EMC module is reduced through the surge resistor, the electromagnetic interference on the EMC module is small under the condition that both the EMC module and the switching power supply module are arranged in the same short edge direction of the board body, and meanwhile, the electromagnetic interference on other components can be reduced due to the fact that the wiring distance between the EMC module and the switching power supply module is short.

Description

Technical Field

[0001] The utility model relates to the technical field of household electrical appliances, and in particular to a driving module of a brushless motor used in a food processing machine. Background Art

[0002] With the advancement of science and technology, more and more categories of food processing machines have emerged, such as juicers, blenders, etc. The food processing machines of the related art usually include a housing and a brushed motor. For example: Chinese utility model patent CN201721001278.6. However, due to the working principle of the DC brush motor itself, the use of a DC brush motor requires carbon brushes and a commutator, but the spark interference between the carbon brushes and the commutator is large, and the friction of the carbon brushes easily produces carbon powder accumulation, which poses a risk of damaging the circuit board and shortening the life of the food processing machine. In order to improve this problem, Chinese utility model patent CN202322590933.8 discloses a drive module for a brushless motor used in a food processing machine and a food processing machine. The patent discloses the use of a brushless motor in a food processing machine to solve the problem of large spark interference between the carbon brushes and the commutator. However, in this patent, the EMC module and the switching power supply module are directly arranged next to each other on the same short side of the board. The EMC module is an AC high-voltage module. Installing the switching power module next to the EMC module will cause the components of the EMC module and the components near the wiring between the switching power module and the EMC module to be subject to greater electromagnetic interference. Utility Model Content

[0003] The purpose of the present application is to provide a brushless motor drive module for a food processing machine, so as to solve the electromagnetic interference problem of the brushless motor drive module in the existing food processing machine.

[0004] To achieve the above objectives, the present invention provides a brushless motor drive module for a food processing machine, the drive module comprising:

[0005] plate body;

[0006] An IPM module is provided at one end of the first long side of the plate body close to the first short side; the IPM module is used to connect to the brushless motor and convert the direct current into a three-phase current to power the brushless motor;

[0007] An MCU module is provided on the board; the MCU module is used to control the operation of the driving module;

[0008] An EMC module is provided at one end of the second long side of the board body close to the second short side, the EMC module is electrically connected to the IPM module and the power supply, and is used to eliminate common mode and differential mode interference;

[0009] A switching power supply module is provided on the second short side; the switching power supply module is connected to the IPM module, the EMC module, and the MCU module; the switching power supply module is used to convert the strong electricity flowing out of the EMC module into weak electricity;

[0010] A surge resistor is provided between the switching power supply module and the EMC module along the second short side; the EMC module supplies power to the switching power supply module through the surge resistor.

[0011] The present application provides a surge resistor between the EMC module and the switching power supply module, and isolates the switching power supply module and the EMC module in physical space based on the surge resistor, thereby avoiding electromagnetic interference between the EMC module and the switching power supply module. The physical dimensions of the switching power supply module and the EMC module can be as close as possible, greatly compressing the length of the short side of the board, and realizing a small space layout of the board. At the same time, due to the surge resistor, the EMC module has a good isolation effect on the switching power supply module. Therefore, under the premise of ensuring a small space layout of the board, the EMC module and the switching power supply module are kept as far apart as possible to avoid mutual electromagnetic interference between the EMC module and the switching power supply module.

[0012] In an optional implementation of a brushless motor drive module for a food processing machine, the switching power supply module includes: a power supply chip, arranged on the second short side and located on a side of the surge resistor away from the EMC module; and a transformer, arranged on the second short side and located on a side of the power supply chip away from the EMC module.

[0013] In this application, by placing the transformer on the side of the power chip away from the EMC module, the transformer can be far away from the high-voltage part, which can reduce high-frequency interference in space and improve the effect of the EMC module.

[0014] In an optional implementation of a brushless motor drive module for a food processing machine, a ratio of a first vertical distance to a second vertical distance is 0.2 to 0.5; the first vertical distance is the vertical distance between the surge resistor and the power chip; and the second vertical distance is the vertical distance between the surge resistor and the transformer.

[0015] In the present application, by setting the ratio of the vertical distances between the surge resistor, the power chip and the transformer, the distances between the surge resistor, the power chip and the transformer can be made close enough, thereby shortening the wiring distance.

[0016] In an optional implementation of the brushless motor drive module for a food processing machine, the power chip and the transformer are sequentially arranged along the second short side in a straight line or a substantially straight line.

[0017] In this application, by arranging the surge resistor, power chip and transformer in a straight line or a nearly straight line, the wiring can be made as short as possible, thereby preventing electromagnetic interference caused by excessive wiring to other surrounding devices.

[0018] In an optional implementation of a brushless motor drive module for a food processing machine, the switching power supply module further includes: a low-voltage step-down chip, disposed on a side of the transformer away from the second short side; a first electrolytic capacitor, disposed between the EMC module and the power supply chip; and a plurality of second electrolytic capacitors, each of the second electrolytic capacitors being arranged in a line and disposed on a side of the low-voltage step-down chip close to the second long side.

[0019] In this application, several second electrolytic capacitors are energy storage filter capacitors for low-voltage step-down (LDO) chips and should be placed close enough to the LDO. Arranging the second electrolytic capacitors in a line and placing them close together can shorten the wiring distance and further shorten the length of the long side of the board.

[0020] In an optional implementation of a brushless motor drive module for a food processor, the EMC module includes: a first X capacitor disposed along the second short side; and a power input terminal including two connection terminals disposed on both sides of the first X capacitor along the second short side of the board.

[0021] In the present application, by arranging the connection terminals on both sides of the first X capacitor and utilizing the gap between the first X capacitor and other components to set the connection terminals, rather than allocating positions for setting them separately on the board, the distance between the short sides of the board can be shortened, thereby facilitating a smaller board.

[0022] In an optional implementation of a brushless motor drive module for a food processing machine, the EMC module further includes: a plurality of Y capacitors, a second X capacitor, a common-mode inductor, and a varistor arranged in sequence along the long side; the common-mode inductor is arranged vertically relative to the plate.

[0023] In this application, placing the common-mode inductor vertically occupies a smaller area of the board than placing it horizontally. Therefore, placing the common-mode inductor vertically can further reduce the area of the board, thereby making the driver module smaller.

[0024] In an optional implementation of a brushless motor drive module for a food processing machine, the drive module further includes: a cover-opening detection module, which is close to the MCU module and electrically connected to the MCU module; the cover-opening detection module is used to provide an electrical signal to the MCU module.

[0025] In this application, the cover-opening detection module is set close to the MCU module, which can shorten the distance for the cover-opening detection module to transmit signals to the MCU module, so as to facilitate the transmission of accurate signals to the MCU module.

[0026] In an optional implementation of a brushless motor drive module for a food processing machine, the drive module further includes: a cover-opening detection module, which is located between the IPM module and the switching power supply module; the cover-opening detection module is electrically connected to the IPM module and the switching power supply module; the cover-opening detection module is used to disconnect the power supply from the switching power supply module to the IPM module when the food processing machine is in the state of opening the cover.

[0027] In the present application, by disconnecting the power supply from the switching power supply module to the IPM module when the food processor is in the open state, the motor can stop rotating to drive the blade to stop rotating when the cover is opened, thereby protecting the safety of the user.

[0028] In an optional implementation of a brushless motor drive module for a food processing machine, the drive module further includes: an energy storage capacitor, arranged on the first short side; a high-frequency filter capacitor, arranged at one end of the first short side close to the first long side; a rectifier bridge, arranged on a side of the energy storage capacitor away from the first short side; and a thermistor, arranged on a side of the rectifier bridge away from the energy storage capacitor.

[0029] In this application, placing the energy storage capacitor and the EMC module on two opposite short sides can make the center of gravity of the circuit board more balanced. Placing the high-frequency filter capacitor close to the energy storage capacitor can save more space and also improve the filtering effect.

[0030] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0032] Figure 1 This is a schematic diagram of module connections in one embodiment of the present invention;

[0033] Figure 2 This is a schematic diagram of the planar layout of a plate body in one embodiment of the present invention;

[0034] Figure 3This is a schematic diagram of the planar layout of a plate body in another embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the three-dimensional layout of the plate body in one embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the planar layout of a plate body in another embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of module connection in another embodiment of the present invention.

[0038] Description of reference numerals:

[0039] 1-Drive module; 10-Board; 20-IPM module; 30-MCU module; 40-EMC module; 41-First X capacitor; 42-Power input terminal; 43-Y capacitor; 44-Second X capacitor; 45-Common mode inductor; 46-Varistor; 47-Fuse; 50-Switching power supply module; 51-Power chip; 52-Transformer; 53-Low voltage step-down chip; 54-First electrolytic capacitor; 55-Second electrolytic capacitor; 60-Surge resistor; 70-Brushless motor; 80-Lid opening detection module; 81-Magnetic control switch docking terminal; 82-Hall switch docking terminal; 90-Rectifier filter circuit; 91-Energy storage capacitor; 92-High frequency filter capacitor; 93-Rectifier bridge; 94-Thermistor; 100-Key display circuit; 110-Heat sink; 120-Buzzer; 130-Power supply module DETAILED DESCRIPTION

[0040] In order to more clearly illustrate the overall concept of the present invention, a detailed description is given below in combination with the accompanying drawings by way of examples.

[0041] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific implementation methods disclosed below.

[0042] like Figures 1 to 6As shown, the present invention provides a driving module 1 for a brushless motor 70 of a food processing machine. The driving module 1 includes a board 10 , an IPM module 20 , an MCU module 30 , an EMC module 40 , a switching power supply module 50 and a surge resistor 60 . The IPM module 20 is arranged at one end of the first long side of the board 10 close to the first short side; the IPM module 20 is used to connect to the brushless motor 70 and convert the DC current into a three-phase current to power the brushless motor 70; the MCU module 30 is arranged on the board 10; the MCU module 30 is used to control the operation of the drive module 1; the EMC module 40 is arranged at one end of the second long side of the board 10 close to the second short side, the EMC module 40 is electrically connected to the IPM module 20 and the power supply, and is used to eliminate common-mode and differential-mode interference; the switching power supply module 50 is arranged on the second short side; the switching power supply module 50 is connected to the IPM module 20, the EMC module 40, and the MCU module 30; the switching power supply module 50 is used to convert the strong current flowing out of the EMC module into weak current, and then output it to each module for low-voltage power supply; the surge resistor 60 is arranged between the switching power supply module 50 and the EMC module 40 along the second short side; the EMC module 40 supplies power to the switching power supply module 50 through the surge resistor 60.

[0043] The EMC module 40 is powered by AC power, and the switching power supply module 50 needs to be as far away from the AC power supply as possible. Close proximity can cause electromagnetic interference between the two components, minimizing high-frequency interference. However, the layout of the board 10 must also be considered, maximizing space utilization within the board 10 to make it more compact and miniaturized, ultimately miniaturizing the entire device.

[0044] A surge resistor 60 is provided between the EMC module 40 and the switching power supply module 50. This physically isolates the switching power supply module 50 from the EMC module 40, effectively preventing electromagnetic interference between the two modules. This allows the switching power supply module 50 and the EMC module 40 to be placed as close together as possible, significantly reducing the length of the short side of the board 10 and achieving a compact layout. Furthermore, the surge resistor 60 effectively isolates the EMC module 40 from the switching power supply module 50. Therefore, while maintaining a compact layout of the board 10, the EMC module 40 and the switching power supply module 50 can be kept as far apart as possible to prevent electromagnetic interference between them.

[0045] It should be noted that the board 10 may be a circuit board, and the material may be ceramic, alumina ceramic, aluminum nitride ceramic, thick copper, etc.

[0046] It should be noted that the IPM module 20 (Intelligent Power Module, Chinese name for intelligent power module) can have a motor connection terminal for connecting to the brushless motor 70 to drive the brushless motor 70 to rotate. Exemplarily, the brushless motor 70 can be electrically connected to the motor connection terminal on the board 10 via a 3-pin cable.

[0047] It should be noted that the MCU module 30 (Microcontroller Unit, Chinese name is micro control unit) is used to control some or all modules on the driving module 1 so that the driving module 1 can work better. It can be understood that the MCU module includes an MCU processor.

[0048] It should be noted that the EMC module 40 (Electro Magnetic Compatibility) can have an electrical energy input terminal 42 for connecting to the power supply module 130 to direct the current provided by the power supply module 130 to the driver module 1. The EMC module 40 has a filtering function, which can reduce the interference of the current flowing from the power supply module 130 on the driver module 1, and also reduce the interference of the driver module 1 on the power supply module 130. The power supply module 130 can be 220V AC.

[0049] It should be noted that the plate body 10 can be a quadrilateral, with the four sides enclosing the quadrilateral serving as the first long side, the second long side, the first short side, and the second short side, respectively. Exemplarily, the quadrilateral is a rectangle, with the two long sides of the rectangle serving as the first long side and the second long side, respectively. The two short sides of the rectangle serve as the first short side and the second short side, respectively. Exemplarily, the plate body 10 can be a rectangle with missing corners. Exemplarily, the plate body 10 can be a rectangle with an arc, wherein the arc is used to connect the two sides of the rectangle.

[0050] It should be noted that the term "located on the first short side of the board 10" means that the distance between the electronic component and the first short side is less than the distance between the electronic component and the second short side. Similarly, the term "located on the second short side of the board 10" means that the distance between the electronic component and the second short side is less than the distance between the electronic component and the first short side. The term "located on the first long side of the board 10" means that the distance between the electronic component and the first long side is less than the distance between the electronic component and the second long side. The term "located on the second long side of the board 10" means that the distance between the electronic component and the second long side is less than the distance between the electronic component and the first long side. The term "distance between an electronic component and a side" may refer to the distance between the center position of the electronic component and the side. It is understood that the electronic component described herein may refer to a single component on the driver module 1, such as a surge resistor 60 or an electrolytic capacitor. It may also refer to a module, such as an EMC module 40 or an IPM module 20. It is worth noting that since a module may include multiple components, the center position of a module may be the average position calculated from the center positions of all components in the module.

[0051] As an optional embodiment of the present application, the switching power supply module 50 includes a power chip 51 and a transformer 52. The power chip 51 is disposed on the second short side, on the side of the surge resistor 60 away from the EMC module 40. The transformer 52 is disposed on the second short side, on the side of the power chip 51 away from the EMC module 40.

[0052] It is understandable that since the transformer 52 and the power chip 51 in the switching power supply module 50 are more likely to generate electromagnetic interference with the EMC module 40, the transformer and the power chip are physically isolated via the surge resistor 60. Since the transformer is more susceptible to electromagnetic interference than the power chip 51, the transformer is placed on the side of the power chip away from the EMC module. Under the premise of a small space on the board, the transformer is separated from the high-voltage parts as far as possible, which can reduce high-frequency interference in space and improve the effect of the EMC module.

[0053] In the above optional embodiment, the vertical distance between the surge resistor 60 and the power chip 51 can be referred to as the first vertical distance. The vertical distance between the surge resistor 60 and the transformer 52 can be referred to as the second vertical distance. In the driver module 1 of the present application, the ratio of the first vertical distance to the second vertical distance can be set to 0.2 to 0.5. For example, the first vertical distance is 4.5 mm and the second vertical distance is 15 mm.

[0054] It is understood that when the ratio of the first vertical distance to the second vertical distance is 0.2 to 0.5, by setting the ratio of the vertical distances between the surge resistor, power chip, and transformer, the distances between the surge resistor, power chip, and transformer can be sufficiently close, thereby shortening the wiring distance. If the ratio is too large or too small, the board space may not be compact enough, or the components may be too close, resulting in excessive electromagnetic interference.

[0055] It should be noted that the vertical distance refers to the distance in the vertical direction. Since components are three-dimensional, the positions occupied by the components when placed on the board 10 form a range. A position within the range occupied by the components can be selected to represent the component. The distance between the vertical coordinates representing the positions of the two components is then determined as the vertical distance between the two components.

[0056] Combine Figure 5 As shown, for example, the coordinate of the surge resistor 60 closest to the first long side on the board 10 is selected to represent the position of the surge resistor 60. The coordinate of the power chip 51 closest to the second long side on the board 10 is selected to represent the position of the power chip 51. The coordinate of the transformer 52 closest to the second long side on the board 10 is selected to represent the position of the transformer 52. By calculating the vertical coordinate representing the position of the surge resistor 60 minus the vertical coordinate representing the position of the power chip 51, the vertical distance between the surge resistor 60 and the power chip 51 is obtained. By calculating the vertical coordinate representing the position of the surge resistor 60 minus the vertical coordinate representing the position of the transformer 52, the vertical distance between the surge resistor 60 and the transformer 52 is obtained. Combined Figure 5 As shown, H1 represents the vertical distance between the surge resistor 60 and the power chip 51 , and H2 represents the vertical distance between the surge resistor 60 and the transformer 52 .

[0057] In the above optional embodiment, the surge resistor 60 , the power chip 51 and the transformer 52 are sequentially arranged along the second short side in a straight line or approximately in a straight line.

[0058] It can be understood that in the present application, by arranging the surge resistor 60, the power chip 51 and the transformer in a straight line or an approximately straight line, the wiring can be made as short as possible, thereby preventing electromagnetic interference to other surrounding devices caused by over-winding of the wiring.

[0059] The center position of the surge resistor 60 can be referred to as the first center position. The center position of the power chip 51 can be referred to as the second center position. The center position of the transformer 52 can be referred to as the third center position. The surge resistor 60, the power chip 51, and the transformer 52 are arranged in sequence along the second short side in a straight line. The straight line on which the center position of the surge resistor 60, the center position of the power chip 51, and the center position of the transformer 52 are located can be parallel to the second short side. The surge resistor 60, the power chip 51, and the transformer 52 are arranged in sequence along the second short side in an approximately straight line. The difference between the horizontal coordinate of the first center position and the horizontal coordinate of the second center position can be less than the first preset difference, and the difference between the horizontal coordinate of the second center position and the horizontal coordinate of the third center position can be less than the first preset difference.

[0060] The first preset difference may be set according to the experience of engineers, for example, 1 mm, 2 mm, etc.

[0061] It can be understood that the EMC module 40 needs to transmit strong electricity to the transformer 52 through the surge resistor 60, and then transmit it to the power chip 51 by the transformer 52. This solution isolates the EMC module 40 and the power chip 51 through the surge resistor 60, and locates the transformer 52 on the side of the power chip 51 away from the surge resistor 60. The EMC module 40, the surge resistor 60, the power chip 51 and the transformer 52 are arranged in sequence from top to bottom along the second short side of the board 10. This can shorten the wiring distance from the EMC module 40 to the power chip 51 in the switching power supply module 50, and make the wiring path as straight and close as possible without loops, so as to prevent electromagnetic interference to other surrounding components caused by excessive wiring.

[0062] As an optional embodiment of the present application, the switching power supply module 50 further includes: a low-voltage step-down chip 53, a first electrolytic capacitor 54, and a plurality of second electrolytic capacitors 55. The low-voltage step-down chip 53 is disposed on the side of the transformer 52 away from the second short side; the first electrolytic capacitor 54 is disposed between the EMC module 40 and the power supply chip 51; and the plurality of second electrolytic capacitors 55 are arranged in a line and disposed on the side of the low-voltage step-down chip 53 close to the second long side.

[0063] It is understood that the second electrolytic capacitors are energy storage filter capacitors for the low-voltage step-down (LDO) chip and should be placed close to the LDO. Arranging the second electrolytic capacitors in a line and placing them close together can shorten the wiring distance along the long side of the board, further shortening the length of the long side of the board.

[0064] The number of the second electrolytic capacitors 55 can be set by engineers based on experience. For example, three second electrolytic capacitors 55 can be set, or four second electrolytic capacitors 55 can be set.

[0065] The second electrolytic capacitors 55 may be arranged in a line such that the difference between the vertical coordinates of the center positions of the second electrolytic capacitors 55 is less than a second preset difference. It is understood that the second preset difference may be set by engineers based on experience, such as 1 mm, 2 mm, etc.

[0066] For example, assume there are three second electrolytic capacitors 55. Assume the center position of electrolytic capacitor A is center position a, the center position of electrolytic capacitor B is center position b, and the center position of electrolytic capacitor C is center position c. The difference between the vertical coordinates of center positions a and b is d, the difference between the vertical coordinates of center positions a and c is e, and the difference between the vertical coordinates of center positions b and c is f. If the difference d, the difference e, and the difference f are all less than the second preset difference, then electrolytic capacitors A, electrolytic capacitors B, and electrolytic capacitors C are arranged in a line.

[0067] The switching power supply module 50 is set in the manner of the present application. The switching power supply module 50 is located in the lower right corner of the circuit board and is isolated from the AC high-voltage part. In particular, the transformer 52 of the switching power supply module 50 is very far away from the high-voltage part, which can reduce high-frequency interference spatially to improve the EMC effect. At the same time, the switching power supply module 50 can provide 5V and 15V voltages to provide low-voltage power to each module on the board 10. Since the first electrolytic capacitor 54 needs to be electrically connected to the EMC module 40 through the surge resistor 60, and the first electrolytic capacitor 54 needs to be electrically connected to the surge resistor 60 and the transformer 52, placing the first electrolytic capacitor 54 between the EMC module 40 and the power chip 51 can reduce line routing. Since the second electrolytic capacitor 55 is the energy storage filter capacitor of the low-voltage step-down chip 53, it should be set close enough to the low-voltage step-down chip 53. By arranging the second electrolytic capacitor 55 on the side of the low-voltage step-down chip 53 close to the second long side and arranging multiple second electrolytic capacitors 55 in a line, the wiring distance can be shortened and the length of the long side of the board 10 can be further shortened.

[0068] As an optional embodiment of the present application, the EMC module 40 includes a first X-capacitor 41 and a power input terminal 42. The first X-capacitor 41 is disposed along the second short side of the board 10. The power input terminal 42 includes two connection terminals disposed on either side of the first X-capacitor 41 along the second short side of the board 10.

[0069] It is understandable that by arranging the connection terminals on both sides of the first X capacitor 41 and utilizing the gap between the first X capacitor and other components to set the connection terminals, rather than allocating positions for setting the connection terminals separately on the board, the distance between the short sides of the board can be shortened, thereby facilitating a smaller board.

[0070] As an optional embodiment of the present application, the EMC module 40 further includes: a plurality of Y capacitors 43, a second X capacitor 44, a common-mode inductor 45, and a varistor 46, sequentially arranged along the second long side. The common-mode inductor 45 is disposed vertically relative to the board 10. Furthermore, a fuse 47 is disposed between the common-mode inductor 45 and the first X capacitor 41, on the side of the varistor 46 away from the second long side.

[0071] It is understandable that placing the common-mode inductor vertically occupies a smaller area of the board than placing it horizontally. Therefore, placing the common-mode inductor vertically can further reduce the area of the board, thereby making the driver module smaller.

[0072] For example, four Y capacitors 43 may be provided, for example, a first Y capacitor, a second Y capacitor, a third Y capacitor, and a fourth Y capacitor. Thus, by providing a greater number of Y capacitors 43 , the stability of the EMC module 40 can be improved.

[0073] This application arranges the EMC module 40 in the upper right corner of the front of the board 10, placing it close to the incoming AC mains power line and isolating it from high-frequency circuits such as the MCU module 30 and the IPM module 20, thereby enhancing the effectiveness of the EMC module 40. Furthermore, by placing terminal blocks along the second short side of the board 10, clamping them on either side of the first X-capacitor 41, and disposing the fuse 47 and varistor 46 between the common-mode inductor 45 and the first X-capacitor 41, this placement reduces the length of the short side of the board 10 compared to distributing the fuse 47 and varistor 46 outside the common-mode inductor 45 and the first X-capacitor 41. Furthermore, by attaching the common-mode inductor 45 vertically to the board 10, the length of the long side of the board 10 can be reduced compared to attaching it horizontally to the board 10. By arranging the first X capacitor 41 , the varistor 46 , the fuse 47 , and the Y capacitor 43 in sequence from right to left along the second long side, the layout structure of the components can be made more compact.

[0074] In this application, the driving module 1 may include a cover opening detection module (such as Figure 4 As shown), the driving module 1 may also not include a cover opening detection module (as shown Figure 5 shown).

[0075] Specifically, combined Figure 4As shown, the cover-opening detection module 80 is located near the MCU module 30 and is electrically connected to the MCU module 30. Furthermore, the cover-opening detection module 80 is located between the IPM module 20 and the switching power module 50 and is electrically connected to both the IPM module 20 and the switching power module 50. The cover-opening detection module 80 is used to provide an electrical signal to the MCU module 30 and to disconnect the power supply from the switching power module 50 to the IPM module 20 when the cover of the food processor is opened.

[0076] It is understood that placing the lid-opening detection module close to the MCU module can shorten the distance the lid-opening detection module needs to transmit signals to the MCU module, thereby facilitating accurate signal transmission to the MCU module. By disconnecting the power supply from the switching power module to the IPM module when the lid of the food processor is open, the motor can be stopped, thereby stopping the blades and protecting user safety.

[0077] In the above optional embodiment, the cover opening detection module 80 may include: a magnetic control switch docking terminal 81 or a Hall switch docking terminal 82. The magnetic control switch docking terminal 81 can be connected to an external magnetic control switch, and the Hall switch docking terminal 82 can be connected to an external Hall switch.

[0078] For example, the magnetic switch can be electrically connected to the magnetic switch docking terminal 81 on the board 10 via a 2-pin cable to control the on / off of the power supply circuit provided by the switching power supply module 50 to the IPM module 20 .

[0079] As an optional embodiment of the present application, the driver module 1 further includes a rectifier and filter circuit 90. The rectifier and filter circuit 90 includes an energy storage capacitor 91, a high-frequency filter capacitor 92, a rectifier bridge 93, and a thermistor 94. The energy storage capacitor 91 is disposed on the first short side; the high-frequency filter capacitor 92 is disposed on the end of the first short side close to the first long side; the rectifier bridge 93 is disposed on the side of the energy storage capacitor 91 away from the first short side; and the thermistor 94 is disposed on the side of the rectifier bridge 93 away from the energy storage capacitor 91.

[0080] It's understandable that placing the energy storage capacitors and EMC modules on opposite short sides can help balance the center of gravity of the circuit board. Placing the high-frequency filter capacitors close to the energy storage capacitors can save space and improve filtering performance.

[0081] The high-frequency filter capacitor 92 is, for example, a high-voltage CBB capacitor.

[0082] As an optional embodiment of the present application, the driver module 1 further includes a heat sink 110, which is attached to the IPM module 20 and the rectifier bridge 93 to dissipate heat from the IPM module 20 and the rectifier bridge 93. In this way, the IPM module 20 and the rectifier bridge 93 share a heat sink 110, which can save space and cost.

[0083] Exemplarily, the heat sink 110 and the IPM module 20 may be fixed by screws, and an air inlet duct of the food processor may be provided above the IPM module 20 so that cold air passes through the IPM module 20 and the rectifier bridge 93 to achieve better heat dissipation.

[0084] This application sets up a thermistor 94 without any components around it, so that the heat source will not interfere with other components. By sharing a heat sink 110 with the rectifier bridge 93 and the IPM module 20, the layout on the board 10 is more compact, which saves more space on the board 10, and thus the wiring power supply loop is shorter, the loss is lower, and the heat generation is lower. The energy storage capacitor 91 is distributed on the edge of the board on the first short side, so that it is closer to the IPM module 20, the wiring loop is shorter and smoother, and the center of gravity of the board 10 is more balanced. The high-frequency filter capacitor 92 is distributed at the pins of the energy storage capacitor 91, and the filtering effect is better. In addition, the high-frequency filter capacitor 92 is distributed in the lower left corner of the board 10, close to the energy storage capacitor 91, which can save more space.

[0085] As an optional embodiment of the present application, the driver module 1 further includes a buzzer 120. The buzzer 120 is located near the MCU module 30 and is electrically connected to the MCU module 30. Thus, by placing the buzzer 120 near the MCU module 30, the wiring distance between the MCU and the buzzer 120 can be shortened.

[0086] It is understood that the term "close" in this application can be understood as being within a preset range. For example, if the cover opening detection module 80 is close to the MCU module 30, the distance between the center coordinates of the cover opening detection module 80 and the center coordinates of the MCU module 30 may be less than a preset distance.

[0087] As an optional embodiment of the present application, the MCU module 30 is disposed between the IPM module 20 and the switching power module 50 along the long side of the board 10. This allows the MCU module 30 to be closer to the IPM, enabling better control of the motor drive. Furthermore, the MCU module 30 is also closer to the switching power module 50, enabling better power supply to drive the various modules on the board 10.

[0088] As an optional embodiment of the present application, the driving module 1 further includes a key display circuit 100. The key display circuit 100 is connected to the MCU module 30 and the switching power supply module 50; the key display circuit 100 is used to display the working status of the food processor and receive power control signals.

[0089] For example, the key display circuit 100 may be a display panel, wherein the display panel may include a power line, a ground line, a DAT data signal line, an SCK clock signal line, and a KEY key signal line.

[0090] It should be noted that the display panel may be a touch screen display, and the user can select whether the power signal of the driver module 1 is turned on or off by touching the touch screen display. The display panel may also be a display panel with buttons and a display screen, and the user can select whether the power signal of the driver module 1 is turned on or off by pressing the buttons. The signal generated by the user touching the display screen or pressing the button to control the power state of the driver module 1 is referred to as a power control signal.

[0091] In the present application, the MCU module 30 and the switching power supply module 50 are connected through the key display circuit 100, and the working status of the food processor is displayed, which allows the user to intuitively view the working status of the food processor. At the same time, the user can conveniently control the food processor through the key display circuit 100.

[0092] The technical solutions protected by this utility model are not limited to the above-described embodiments. It should be noted that the combination of the technical solutions of any one embodiment with the technical solutions of one or more other embodiments falls within the scope of protection of this utility model. Although the above description of this utility model has been provided in detail using general instructions and specific embodiments, it is obvious to those skilled in the art that modifications or improvements can be made based on this utility model. Therefore, such modifications or improvements made without departing from the spirit of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A drive module for a brushless motor used in a food processing machine, characterized in that: The driving module includes: plate body; An IPM module is provided at one end of the first long side of the plate body close to the first short side; the IPM module is used to connect to the brushless motor and convert the direct current into a three-phase current to power the brushless motor; An MCU module is provided on the board; the MCU module is used to control the operation of the driving module; An EMC module is provided at one end of the second long side of the board body close to the second short side, the EMC module is electrically connected to the IPM module and the power supply, and is used to eliminate common mode and differential mode interference; A switching power supply module is provided on the second short side; the switching power supply module is connected to the IPM module, the EMC module, and the MCU module; the switching power supply module is used to convert the strong electricity flowing out of the EMC module into weak electricity; A surge resistor is provided between the switching power supply module and the EMC module along the second short side; the EMC module supplies power to the switching power supply module through the surge resistor.

2. The driving module according to claim 1, wherein: The switching power supply module includes: a power chip, arranged on the second short side and located on a side of the surge resistor away from the EMC module; The transformer is arranged on the second short side and is located on a side of the power chip away from the EMC module.

3. The driving module according to claim 2, characterized in that: The ratio of the first vertical distance to the second vertical distance is 0.2 to 0.5; the first vertical distance is the vertical distance between the surge resistor and the power chip; the second vertical distance is the vertical distance between the surge resistor and the transformer.

4. The driving module according to claim 2, wherein: The surge resistor, the power chip and the transformer are sequentially arranged along the second short side in a straight line or an approximately straight line.

5. The driving module according to claim 2, characterized in that: The switching power supply module further includes: a low-voltage step-down chip, arranged on a side of the transformer away from the second short side; A first electrolytic capacitor is provided between the EMC module and the power chip; A plurality of second electrolytic capacitors are arranged in a line and are disposed on a side of the low-voltage step-down chip close to the second long side.

6. The driving module according to claim 1, wherein: The EMC module includes: A first X capacitor is provided at the edge of the second short side; An electric energy input end, the electric energy input end comprising two connection terminals arranged on both sides of the first X capacitor along the second short side direction of the board.

7. The driving module according to claim 1, characterized in that: The EMC module further comprises: A plurality of Y capacitors, a second X capacitor, a common-mode inductor, and a varistor are sequentially arranged along the second long side; the common-mode inductor is vertically arranged relative to the plate.

8. The driving module according to claim 1, wherein: The driving module further includes: The cover-opening detection module is close to the MCU module and electrically connected to the MCU module; the cover-opening detection module is used to provide an electrical signal to the MCU module.

9. The driving module according to claim 1, wherein: The driving module further includes: A cover-opening detection module, located between the IPM module and the switching power supply module; the cover-opening detection module is electrically connected to the IPM module and the switching power supply module; the cover-opening detection module is used to disconnect the power supply from the switching power supply module to the IPM module when the food processor is in the state of opening the cover.

10. The driving module according to claim 1, wherein: The driving module further includes: an energy storage capacitor, arranged on the first short side; a high-frequency filter capacitor, disposed at one end of the first short side close to the first long side; a rectifier bridge, arranged on a side of the energy storage capacitor away from the first short side; The thermistor is arranged on a side of the rectifier bridge away from the energy storage capacitor.

Images