Intelligent manufacturing industry 4.0 edge computing gateway device

Abstract

The utility model provides an intelligent manufacturing industry 4.0 edge computing gateway device, which relates to the technical field of edge computing gateways, and comprises a shell, the top of the shell is fixedly connected with a cover plate, the top of the cover plate is provided with a notch, the inner surface of the notch is provided with a heat dissipation plate, the outer surfaces of the two sides of the heat dissipation plate are provided with clamping grooves, and the clamping grooves are connected with the cover plate. Mounting grooves are formed in the inner walls of the two sides of the notch correspondingly, and clamping blocks are slidably connected to the inner surfaces of the two mounting grooves correspondingly. According to the heat dissipation device, under the action of the clamping block, the clamping groove, the mounting groove, the first spring, the connecting block, the limiting groove and the push block, the heat dissipation plate is convenient to disassemble and assemble, meanwhile, under the cooperation of the containing groove, the second spring and the elastic plate, the disassembly efficiency of the heat dissipation plate is further improved, and the heat dissipation plate is convenient to disassemble and assemble; the heat dissipation holes in the heat dissipation plate can be cleaned and maintained conveniently, and the overall heat dissipation effect is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of edge computing gateways, and in particular to an edge computing gateway device for intelligent manufacturing industry 4.0. Background Art

[0002] Smart manufacturing is one of the core concepts of Industry 4.0, which aims to improve production efficiency, flexibility and product quality through digital transformation. Industry 4.0 uses advanced technologies such as the Internet of Things (IoT), big data, and artificial intelligence to achieve intelligent production and management. Edge computing gateway devices push data processing closer to the data source, while completing data collection, processing and analysis while reducing data transmission delays and bandwidth pressure. Edge computing gateway devices play an important role in smart manufacturing and Industry 4.0 by enhancing data processing capabilities and real-time response capabilities.

[0003] In the prior art, in order to ensure the normal use of internal components during the use of edge computing gateway devices, heat dissipation holes are opened on the gateway body to dissipate heat. However, after long-term use, dust will accumulate in the heat dissipation holes, which will cause the internal air flow on the gateway body to deteriorate, thereby affecting the heat dissipation effect of the electrical components inside the casing. The heat dissipation holes are usually opened on the casing, which makes cleaning more inconvenient. Utility Model Content

[0004] The purpose of this utility model is to solve the problem in the prior art that, in order to ensure the normal use of internal components during the use of edge computing gateway equipment, heat dissipation holes are opened on the gateway body and heat is dissipated by using the heat dissipation holes. However, after long-term use, dust will accumulate in the heat dissipation holes, which will cause the internal air flow on the gateway body to deteriorate, thereby affecting the heat dissipation effect of the electrical components inside the casing. The heat dissipation holes are usually opened on the casing, which makes it inconvenient to clean. Therefore, an intelligent manufacturing industry 4.0 edge computing gateway device is proposed.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: an intelligent manufacturing industry 4.0 edge computing gateway device, comprising: a shell, a cover plate fixedly connected to the top of the shell, a slot is provided on the top of the cover plate, a heat sink is provided on the inner surface of the slot, and a card slot is provided on the outer surfaces of both sides of the heat sink, and an installation slot is provided on the inner walls of both sides of the slot, the inner surfaces of the two installation slots are slidably connected with a card block, the outer surfaces of one side of the two card blocks are symmetrically fixed with a first spring, a limiting slot is provided on the top of the cover plate, the tops of the two limiting slots are fixedly connected with a connecting block, and the tops of the two connecting blocks are fixedly connected with a push block.

[0006] Preferably, one end of each of the first springs is fixedly connected to an inner wall of one side of the two mounting grooves, and the two limiting grooves are communicated with the two mounting grooves.

[0007] Preferably, the bottoms of the two connecting blocks are fixedly connected to the bottoms of the two clamping blocks respectively, the cross sections of the two clamping blocks are inclined, and the two clamping blocks are matched with the two clamping slots respectively.

[0008] Preferably, the inner bottom of the notch is symmetrically provided with receiving grooves, and the inner surfaces of the two receiving grooves are slidably connected with spring plates.

[0009] Preferably, the bottoms of the two spring plates are symmetrically fixedly connected with telescopic rods, and the outer surfaces of the two telescopic rods are sleeved with second springs.

[0010] Preferably, the bottoms of the multiple telescopic rods are respectively fixedly connected to the inner bottoms of the two receiving slots.

[0011] Preferably, a mainboard is provided on the inner bottom of the housing, and a fan is fixedly connected to a position near the top of the inner surface of the housing.

[0012] Compared with the prior art, the advantages and positive effects of the present invention are:

[0013] 1. In the utility model, the heat sink is convenient to disassemble and install through the action of the card block, the card slot, the installation slot, the first spring, the connecting block, the limit slot and the push block. At the same time, with the cooperation of the storage slot, the second spring and the spring plate, the disassembly efficiency of the heat sink is further improved, making the disassembly and assembly of the heat sink convenient, and convenient for cleaning and maintenance of the heat dissipation holes on the heat sink, thereby ensuring the overall heat dissipation effect.

[0014] 2. In the present invention, when the spring plate and the second spring are in motion, the spring plate and the second spring can be limited and guided by the telescopic rod to ensure the stability of the overall movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of the edge computing gateway device for intelligent manufacturing industry 4.0 proposed for this utility model;

[0016] Figure 2 The expanded diagram of the intelligent manufacturing industry 4.0 edge computing gateway device is proposed for this utility model;

[0017] Figure 3 This utility model proposes a schematic diagram of the heat sink structure of the intelligent manufacturing industry 4.0 edge computing gateway device;

[0018] Figure 4 This is a partial structural expansion diagram of the intelligent manufacturing industry 4.0 edge computing gateway device proposed for this utility model;

[0019] Figure 5 This is a cross-sectional view of the cover of the intelligent manufacturing industry 4.0 edge computing gateway device proposed in this utility model;

[0020] Figure 6 for Figure 5 Enlarged view of point A in the middle.

[0021] Legend: 1. Cover; 2. Housing; 3. Heat sink; 4. Push block; 5. Fan; 6. Mainboard; 7. Clamping block; 8. Notch; 9. Spring plate; 10. Clamping slot; 11. Mounting slot; 12. Storage slot; 13. First spring; 14. Second spring; 15. Connecting block; 16. Limiting slot; 17. Telescopic rod. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0024] Example 1, as Figures 1-6 As shown, the utility model provides an intelligent manufacturing industry 4.0 edge computing gateway device, including: a shell 2, a cover plate 1 is fixedly connected to the top of the shell 2, a notch 8 is opened on the top of the cover plate 1, a heat sink 3 is provided on the inner surface of the notch 8, a card slot 10 is opened on the outer surface of both sides of the heat sink 3, a mounting slot 11 is opened on the inner wall of both sides of the notch 8, a card block 7 is slidably connected to the inner surface of the two mounting slots 11, a first spring 13 is symmetrically fixedly connected to the outer surface of one side of the two card blocks 7, a limiting slot 16 is opened on the top of the cover plate 1, a connecting block 15 is fixedly connected to the top of the two limiting slots 16, and a connecting block 15 is fixedly connected to the top of the two connecting blocks 15. Push block 4, one end of multiple first springs 13 is fixedly connected to the inner wall of one side of the two mounting grooves 11, the two limit grooves 16 are connected to the two mounting grooves 11, the bottom of the two connecting blocks 15 is fixedly connected to the bottom of the two card blocks 7, the cross-sections of the two card blocks 7 are inclined, and the two card blocks 7 are matched with the two card slots 10. The inner bottom of the notch 8 is symmetrically provided with a receiving groove 12, and the inner surfaces of the two receiving grooves 12 are slidably connected with a spring plate 9. The outer surfaces of the two telescopic rods 17 are both sleeved with a second spring 14. The inner bottom of the outer shell 2 is provided with a main board 6, and the inner surface of the outer shell 2 is fixedly connected to the fan 5 near the top.

[0025] The effect achieved by the entire embodiment 1 is that the mainboard 6 includes a processing unit, a storage unit, a network interface, an input or output interface and a variety of functional modules, which are existing mature technologies and will not be described in detail here. Therefore, when data is transmitted in the intelligent manufacturing industry, the mainboard 6 inside the shell 2 can be connected via wired or wireless connection to push data processing to a device closer to the data source, while completing data collection, processing and analysis, reducing the delay and bandwidth pressure of data transmission. During use, the fan 5 can be started, and with the cooperation of the heat dissipation holes on the heat dissipation plate 3, the external air can be sucked into the interior of the shell 2, and the internal air of the shell 2 can be discharged through the air outlet to complete the circulation of the internal air of the shell 2, thereby achieving the heat dissipation effect of the mainboard 6. After long-term use, a large amount of dust will be attached to the heat dissipation plate 3. At this time, the staff can push out the push blocks 4 on both sides to drive the connecting block 15 to move along the limit slot 16, thereby driving the card block 7 to the installation slot 11 When the bottom of the heat sink 3 is in contact with the bottom of the notch 8 and the mounting groove 11 is aligned with the card slot 10, under the action of the rebound force of the first spring 13, the card block 7 is pushed out of the mounting groove 11 and engaged with the card slot 10, that is, the quick installation of the heat sink 3 is completed, making the disassembly and assembly of the heat sink 3 convenient, convenient for cleaning and maintenance, and ensuring the overall heat dissipation effect.

[0026] Example 2, as Figures 1-6 As shown, the bottoms of the multiple telescopic rods 17 are fixedly connected to the inner bottoms of the two receiving slots 12 respectively.

[0027] The effect achieved by the entire embodiment 2 is that when the spring plate 9 and the second spring 14 are in motion, the spring plate 9 and the second spring 14 can be limited and guided by the telescopic rod 17 to ensure the stability of the overall movement.

[0028] Working principle: During use, the fan 5 can be started, and with the cooperation of the heat dissipation holes on the heat dissipation plate 3, the external air can be sucked into the interior of the shell 2, and the internal air of the shell 2 can be discharged through the air outlet, completing the internal air circulation of the shell 2, thereby achieving the heat dissipation effect on the mainboard 6. After long-term use, a lot of dust will be attached to the heat dissipation plate 3. At this time, the staff can push out the push blocks 4 on both sides to drive the connecting block 15 to move along the limiting groove 16, thereby driving the card block 7 to move into the installation groove 11, and compressing the first spring 13, so that the card block 7 is separated from the card slot 10, and then the rebound force of the second spring 14 and the assistance of the telescopic rod 17 will drive the spring plate 9 to move upward, and the heat dissipation plate 3 will be ejected from the slot 8. The heat sink 3 is removed from the cover plate 1 for easy cleaning and maintenance. When cleaning is completed, the heat sink 3 is pressed downward along the notch 8. During the pressing process, the heat sink 3 will apply an extruding force to the cross section of the card block 7, causing it to move to the mounting groove 11 and drive the first spring 13 to be compressed. At the same time, the heat sink 3 will press and push the spring plate 9 into the receiving groove 12, and compress the second spring 14. When the bottom of the heat sink 3 is in contact with the bottom of the notch 8 and the mounting groove 11 is aligned with the card slot 10, under the action of the rebound force of the first spring 13, the card block 7 is pushed out of the mounting groove 11 and engaged with the card slot 10, thus completing the quick installation of the heat sink 3, making the disassembly and assembly of the heat sink 3 convenient, and convenient for cleaning and maintenance, thereby ensuring the overall heat dissipation effect.

[0029] The wiring diagram of the mainboard 6 and the fan 5 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use, so the control method and wiring arrangement of the mainboard 6 and the fan 5 are not explained in detail.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any other form. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes for application in other fields. However, any simple modification, equivalent change and modification of the above embodiment made according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. Intelligent Manufacturing Industry 4.0 edge computing gateway device, characterized by: include: A shell (2), wherein the top of the shell (2) is fixedly connected to a cover plate (1), a notch (8) is provided on the top of the cover plate (1), a heat sink (3) is provided on the inner surface of the notch (8), a clamping groove (10) is provided on both sides of the outer surface of the heat sink (3), a mounting groove (11) is provided on both sides of the inner wall of the notch (8), the inner surfaces of the two mounting grooves (11) are slidably connected to a clamping block (7), the outer surfaces of one side of the two clamping blocks (7) are symmetrically fixedly connected to a first spring (13), a limiting groove (16) is provided on the top of the cover plate (1), the tops of the two limiting grooves (16) are fixedly connected to a connecting block (15), and the tops of the two connecting blocks (15) are fixedly connected to a push block (4).

2. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 1, characterized in that: One end of each of the first springs (13) is fixedly connected to an inner wall of one side of the two mounting grooves (11), and the two limiting grooves (16) are connected to the two mounting grooves (11).

3. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 2, characterized in that: The bottoms of the two connecting blocks (15) are fixedly connected to the bottoms of the two clamping blocks (7), the cross sections of the two clamping blocks (7) are both inclined, and the two clamping blocks (7) are matched with the two clamping slots (10).

4. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 3, characterized in that: The inner bottom of the notch (8) is symmetrically provided with receiving grooves (12), and the inner surfaces of the two receiving grooves (12) are both slidably connected to spring plates (9).

5. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 4, characterized in that: The bottoms of the two spring plates (9) are symmetrically fixedly connected to telescopic rods (17), and the outer surfaces of the two telescopic rods (17) are sleeved with second springs (14).

6. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 5, characterized in that: The bottoms of the multiple telescopic rods (17) are respectively fixedly connected to the inner bottoms of the two receiving slots (12).

7. The intelligent manufacturing industry 4.0 edge computing gateway device according to claim 6, characterized in that: A mainboard (6) is provided at the inner bottom of the housing (2), and a fan (5) is fixedly connected to a position near the top of the inner surface of the housing (2).

Images