Laser cutting device for wafer

Abstract

The utility model relates to the technical field of wafer processing equipment, and discloses a wafer laser cutting device which comprises a processing machine table, a base is arranged in the processing machine table, a placing table is arranged on one side of the base, a wafer is arranged on one side of the placing table, and the wafer is arranged on the other side of the placing table. A laser cutter used for cutting the wafer is further arranged in the machining machine table, and a positioning assembly capable of cutting and positioning the wafers of different sizes is arranged on the placing table. By arranging the positioning assembly and the fixing assembly, when wafers of different sizes need to be subjected to laser cutting, all extrusion columns can be pushed by pulling a pushing plate upwards, so that all limiting plates can be pushed away by the extrusion columns, the fixing effect on adjacent fixing pipes is lost, and after the fixing assembly loses the fixing effect, the positioning assembly and the fixing assembly are fixed. And the positioning assembly can be taken down from the placing table together with the fixing assembly for adaptive replacement.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a laser cutting device for wafers. Background Art

[0002] Currently, wafers are made by purifying, melting, and distilling silicon dioxide into silicon crystal rods. Foundries then grind, polish, and slice these silicon crystal rods into wafers. Wafers can then be processed into various circuit component structures, becoming IC products with specific electrical functions. Existing processing methods involve either manual labor combined with cutting machines or vacuum ceramic suction cups combined with moving mechanisms.

[0003] An LED packaging device is disclosed in the Chinese utility model patent with the announcement number CN204045622U. Although the above-mentioned prior art makes the positioning of the laser cutter more accurate by shooting the positioning mechanism, there are many sizes of wafers, and the price of wafer laser cutting machines is expensive. Therefore, it is impossible for a laser cutting machine to cut only one size of wafers. Therefore, when laser cutting wafers of different sizes, it is necessary to remove and replace the components that limit the wafers. The limiting components are generally fixed with a large number of screws. During the disassembly and installation process, not only the surface of the components is easily scratched, but also the different installation angles of the screws will cause the replacement of the limiting components to be slow, affecting efficiency. Therefore, it is necessary to design a laser cutting device for wafers. Utility Model Content

[0004] In order to solve the current technical problem that when laser cutting wafers of different sizes, it is necessary to first replace the wafer fixing and limiting components, which leads to reduced processing efficiency, the utility model provides a laser cutting device for wafers.

[0005] The utility model is implemented by the following technical scheme: a laser cutting device for wafers, including a processing machine, a base is provided inside the processing machine, a display table is provided on one side of the base, a wafer is provided on one side of the display table, a laser cutter for cutting the wafer is also provided inside the processing machine, a positioning component capable of cutting and positioning wafers of different sizes is provided on the display table, a plurality of fixing components capable of completely fixing the positioning component on the display table are provided on one side of the positioning component, a replacement groove is provided on one side of the display table, the positioning component includes a positioning plate arranged inside the replacement groove and a wafer groove provided on one side of the positioning plate, and the wafer is arranged inside the wafer groove.

[0006] Through the above technical solution, when the wafer and positioning assembly need to be replaced, it is only necessary to release the fixing effect of the limit plate on the fixed assembly, and the positioning assembly can be directly removed from the display table for replacement, which makes the replacement faster.

[0007] As a further improvement of the above solution, the fixing assembly includes a fixing tube fixedly mounted on one side of the positioning plate and having one end passing through the placement table, and an extrusion column slidably arranged inside the fixing tube.

[0008] Through the above technical solution, multiple fixing tubes passing through the placement table can limit the position of the positioning plate.

[0009] As a further improvement of the above solution, a limiting groove is provided on one side of each of the extrusion columns.

[0010] Through the above technical solution, the limiting groove can be fixed to prevent the extrusion column from moving.

[0011] As a further improvement of the above scheme, one side of each of the fixed tubes is provided with a fixed plate fixedly installed with one side of the display table, one side of each of the fixed plates is provided with a limit plate, one side of each of the limit plates passes through the adjacent fixed plate and the adjacent fixed tube and extends to the inside of the adjacent limit groove, one side of each of the fixed plates is fixedly installed with a limit plate arranged in an "L" shape, and the other side of each of the limit plates is fixedly installed with two limit rods, one end of each limit rod passes through the adjacent limit plate, and each of the limit rods is provided with a push spring, one end of each push spring is fixedly installed with the adjacent limit plate, and the other end is fixedly installed with the adjacent limit plate.

[0012] Through the above technical solution, the limiting plate will always limit the extrusion column, so that the extrusion column cannot move, thereby making the fixing tube unable to move, and the positioning plate can be completely fixed.

[0013] As a further improvement of the above solution, one side of each of the limiting plates is arranged in an inclined shape.

[0014] Through the above technical solution, the movement of the extrusion column will push the limit plate, thereby allowing the limit plate to release the fixing effect on the fixed pipe.

[0015] As a further improvement of the above solution, a plurality of sliding grooves are provided on the circumferential surface of the base, a sliding block is slidably installed inside each sliding groove, a push plate is slidably sleeved on the base, and the push plate is fixedly installed with the plurality of sliding blocks.

[0016] With the above technical solution, when the push plate moves upward, all the extrusion columns will be pushed, thereby allowing all the limit plates to release the fixing effect on the adjacent fixed tubes.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model provides a positioning component and a fixing component. When it is necessary to laser cut wafers of different sizes, all the extrusion columns can be pushed by pulling the pushing plate upwards, so that all the limit plates will be pushed away by the extrusion columns, thereby losing the fixing effect on the adjacent fixing tubes. After the fixing component loses its fixing effect, the positioning component can be removed from the display table together with the fixing component for adaptation and replacement. This arrangement can not only limit the cutting of wafers of different sizes, but also quickly replace the components for limiting the wafers, thereby improving production and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the utility model with a push plate;

[0021] Figure 3 This is a schematic diagram of the structure of the utility model having a positioning component and a fixing component;

[0022] Figure 4 For this utility model Figure 2 A magnified view of the structure of part A;

[0023] Figure 5 This is a structural diagram of the utility model with a limiting plate.

[0024] Description of main symbols:

[0025] 1. Processing machine; 2. Base; 3. Display table; 4. Wafer; 5. Laser cutter; 601. Positioning plate; 602. Wafer slot; 701. Fixing tube; 702. Extrusion column; 8. Fixing plate; 9. Limiting plate; 10. Limiting plate; 11. Limiting rod; 12. Push spring; 13. Pushing plate. DETAILED DESCRIPTION

[0026] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0027] Please combine Figure 1-Figure 5, a laser cutting device for wafers in this embodiment includes a processing machine 1, a base 2 is provided inside the processing machine 1, a placing table 3 is provided on one side of the base 2, a wafer 4 is provided on one side of the placing table 3, and a laser cutter 5 for cutting the wafer 4 is also provided inside the processing machine 1, and a positioning component that can cut and position wafers 4 of different sizes is provided on the placing table 3, and a plurality of fixing components that can completely fix the positioning component on the placing table 3 are provided on one side of the positioning component, and a replacement groove is provided on one side of the placing table 3, and the positioning component includes a positioning plate 601 arranged inside the replacement groove and a wafer groove 602 opened on one side of the positioning plate 601, and the wafer 4 is arranged inside the wafer groove 602. When the wafer 4 and the positioning component need to be replaced, it is only necessary to release the fixing effect of the limit plate on the fixing component, and the positioning component can be directly removed from the placing table 3 for replacement, so that the replacement speed is faster.

[0028] Combine Figure 2-Figure 5 The fixing assembly includes a fixing tube 701 fixedly mounted on one side of the positioning plate 601 and one end of which passes through the placing table 3, and an extrusion column 702 slidably arranged inside the fixing tube 701. A limiting groove is provided on one side of each extrusion column 702. A fixing plate 8 fixedly mounted on one side of the placing table 3 is provided on one side of each fixing tube 701. A limiting plate 9 is provided on one side of each fixing plate 8. One side of each limiting plate 9 passes through the adjacent fixing plate 8 and the adjacent fixing tube 701 and extends to the inside of the adjacent limiting groove. A limiting plate 8 arranged in an "L" shape is fixedly installed on one side of each fixing plate 8. The limiting plate 10 has two limiting rods 11 fixedly installed on the other side of each limiting plate 9, one end of each limiting rod 11 passes through the adjacent limiting plate 10, and each limiting rod 11 is provided with a push spring 12, one end of each push spring 12 is fixedly installed with the adjacent limiting plate 9 and the other end is fixedly installed with the adjacent limiting plate 10. One side of each limiting plate 9 is set in an inclined shape, and the limiting plate 9 will always limit the extrusion column 702, so that the extrusion column 702 cannot move, thereby making the fixing tube 701 unable to move, so that the positioning plate 601 can be completely fixed.

[0029] Combine Figure 2 A plurality of sliding grooves are provided on the circumferential surface of the base 2, and a sliding block is slidably installed inside each sliding groove. A push plate 13 is provided on the sliding sleeve of the base 2, and the push plate 13 is fixedly installed with the plurality of sliding blocks. When the push plate 13 moves upward, all the extrusion columns 702 will be pushed, so that all the limit plates 9 can release the fixing effect on the adjacent fixed tubes 701.

[0030] The implementation principle of a laser cutting device for wafers in the embodiment of the present application is as follows: when it is necessary to adapt to wafers 4 of different sizes, sliding the push plate 13 upwards can allow the push plate 13 to push the extrusion column 702, and the upward movement of the extrusion column 702 will allow the inclined surface of the limit groove to push the inclined surface of the limit plate 9, thereby pushing the limit plate 9 out of the limit groove, and because one side of the limit plate 9 is inclined, the fixed tube 701 can be directly moved upward without being stuck by the limit plate 9, so that only the upward movement of the push plate 13 is required to release the fixed effect of the fixed tube 701, so that the positioning plate 601 can be directly lifted up, and the entire positioning plate 601 will be lifted up and separated from the display table 3, and then the positioning plate 601 adapted to the current wafer 4 is reinserted into the display table 3, and the fixed tube 701 is clamped by using the limit plate 9 to complete the quick replacement. This setting can not only limit the cutting of wafers 4 of different sizes, but also quickly replace the components that limit the wafer 4, thereby improving efficiency.

[0031] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A laser cutting device for wafers, comprising a processing machine (1), wherein a base (2) is provided inside the processing machine (1), a placement table (3) is provided on one side of the base (2), a wafer (4) is provided on one side of the placement table (3), and a laser cutter (5) for cutting the wafer (4) is further provided inside the processing machine (1), characterized in that: The placing table (3) is provided with a positioning component capable of cutting and positioning wafers (4) of different sizes, and one side of the positioning component is provided with a plurality of fixing components capable of completely fixing the positioning component on the placing table (3). A replacement groove is provided on one side of the placing table (3), and the positioning component includes a positioning plate (601) arranged inside the replacement groove and a wafer groove (602) provided on one side of the positioning plate (601), and the wafer (4) is arranged inside the wafer groove (602).

2. The laser cutting device for wafers according to claim 1, wherein: The fixing assembly comprises a fixing tube (701) fixedly mounted on one side of the positioning plate (601) and having one end passing through the placing table (3), and an extrusion column (702) slidably arranged inside the fixing tube (701).

3. The laser cutting device for wafers according to claim 2, wherein: A limiting groove is provided on one side of each of the extrusion columns (702).

4. The laser cutting device for wafers according to claim 2, wherein: One side of each fixed tube (701) is provided with a fixed plate (8) fixedly mounted on one side of the placing table (3); one side of each fixed plate (8) is provided with a limiting plate (9); one side of each limiting plate (9) passes through the adjacent fixed plate (8) and the adjacent fixed tube (701) and extends to the inside of the adjacent limiting groove; one side of each fixed plate (8) is fixedly mounted with a limiting plate (10) arranged in an "L" shape; the other side of each limiting plate (9) is fixedly mounted with two limiting rods (11); one end of each limiting rod (11) passes through the adjacent limiting plate (10); each limiting rod (11) is sleeved with a pushing spring (12); one end of each pushing spring (12) is fixedly mounted on the adjacent limiting plate (9) and the other end is fixedly mounted on the adjacent limiting plate (10).

5. The laser cutting device for wafers according to claim 4, wherein: One side of each of the limiting plates (9) is arranged in an inclined shape.

6. The laser cutting device for wafers according to claim 1, wherein: A plurality of sliding grooves are provided on the circumferential surface of the base (2), a sliding block is slidably installed inside each of the sliding grooves, a push plate (13) is slidably sleeved on the base (2), and the push plate (13) is fixedly installed with the plurality of sliding blocks.

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