Liquid-cooled chip detection mechanism

Abstract

The utility model relates to the technical field of chip detection equipment, in particular to a liquid-cooled chip detection mechanism, which comprises a TEC (Thermoelectric Cooler), a TEC upper plate, a TEC lower plate, a cooler, a temperature sensor and a partition plate, the temperature sensor is arranged on the TEC upper plate; an adsorption hole is formed in the top end of the TEC upper plate; the top end of the partition plate is connected with the TEC upper plate, and the bottom end of the partition plate is connected with the TEC lower plate; the TEC lower plate is connected with the cooler; a cavity is formed in the TEC lower plate, and the cooler is communicated with the cavity; and the TEC upper plate and the TEC lower plate are correspondingly and electrically connected with the TEC. The cooling speed of the TEC is higher than that of liquid cooling, and cooling of the chip can be completed in a shorter time. According to the technical scheme, high-precision adjustment is carried out on the TEC according to electrical performance parameters such as current or voltage, and compared with an existing liquid cooling mode, temperature control is easier, so that high-precision adjustment of the temperature of the upper plate of the TEC is achieved, high-precision adjustment of the detection temperature of the chip is further achieved, and the detection temperature of the chip is adjusted to be within the optimal detection temperature range of the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection equipment, in particular to a liquid-cooled chip detection mechanism. Background Art

[0002] When power is applied to test the electrical performance of the chip, the chip will quickly generate heat, and high temperature will affect the electrical performance of the chip. If the heat is not dissipated in time, the accuracy of the test data will be low. Therefore, cooling equipment can be configured on the chip detection mechanism to improve the test accuracy.

[0003] Chips with different performance levels have different optimal test temperature ranges, so they must be cooled to the appropriate temperature using cooling equipment before testing. Liquid cooling is a common cooling method, where liquid flowing through the test bench removes heat generated by the chip. However, liquid cooling is slow and makes it difficult to precisely adjust the chip's test temperature, resulting in lower accuracy in chip electrical performance testing. Utility Model Content

[0004] (1) Technical issues to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a liquid-cooled chip detection mechanism, which solves the technical problems of slow cooling speed and low temperature adjustment accuracy of the existing liquid-cooled chip detection mechanism.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned object, the liquid-cooled chip detection mechanism of the present invention includes a TEC, a TEC upper plate, a TEC lower plate, a cooler and a partition plate;

[0008] The top of the TEC upper plate is provided with an adsorption hole;

[0009] The top end of the partition plate is connected to the TEC upper plate, and the bottom end is connected to the TEC lower plate;

[0010] The TEC lower plate is connected to the cooler; a cavity is defined inside the TEC lower plate, and the cooler is connected to the cavity;

[0011] The TEC upper plate and the TEC lower plate are electrically connected to the TEC respectively.

[0012] Optionally, the cooler is a liquid cooler;

[0013] The inlet pipe and the outlet pipe of the cooler are correspondingly communicated with the cavity.

[0014] Optionally, the partition plate is a thermal insulation pad.

[0015] Optionally, a heat-insulating bottom plate is provided at the bottom end of the TEC lower plate.

[0016] Optionally, the chip detection mechanism further includes a transfer plate and a clamping cylinder;

[0017] The clamping claw cylinder is installed on the transfer plate;

[0018] The clamping cylinder is provided with a pair of clamping jaws that can move closer to or away from each other;

[0019] The transfer plate can drive the pair of clamping claws to move to just above the adsorption hole.

[0020] Optionally, a temperature sensor is provided on the TEC upper plate.

[0021] Optionally, a negative pressure channel is provided inside the TEC upper plate; and an air pipe joint is connected to the TEC upper plate;

[0022] The trachea joint, the negative pressure channel and the adsorption hole are connected in sequence.

[0023] (3) Beneficial effects

[0024] The beneficial effects of the utility model are:

[0025] The chip's heat is transferred to the TEC top plate through the TEC, which in turn cools the TEC, thereby cooling the chip. TEC's cooling rate is faster than liquid cooling, allowing the chip to be cooled in a shorter time. Furthermore, TEC uses high-precision regulation based on electrical performance parameters such as current or voltage, making temperature control easier than existing liquid cooling methods. This allows for highly precise regulation of the TEC top plate's temperature, and in turn, highly precise regulation of the chip's detection temperature. This allows the chip's detection temperature to be adjusted to within its optimal detection temperature range, thereby measuring the chip's optimal electrical performance parameters.

[0026] The TEC's lower plate has a cavity inside, connected to a cooler that dissipates heat. Because the temperature of the TEC's lower plate isn't directly correlated with the chip's temperature, the plate can be cooled over a longer period of time, allowing conventional cooling methods to be used. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic structural diagram of the liquid-cooled chip detection mechanism of the present invention;

[0028] Figure 2 This is an exploded schematic diagram of the liquid-cooled chip detection mechanism of the present invention.

[0029] [Description of Reference Numerals]

[0030] 1: Transfer plate; 2: Gripper cylinder; 3: Gripper; 4: Inlet pipe; 5: TEC; 6: Temperature sensor; 7: Partition plate; 8: Insulation base plate; 9: TEC lower plate; 10: Outlet pipe; 11: TEC upper plate; 12: Air pipe connector. DETAILED DESCRIPTION

[0031] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation methods in conjunction with the accompanying drawings.

[0032] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0034] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can refer to fixed connection, detachable connection, or integration; "connection" can refer to mechanical connection or electrical connection; it can refer to direct connection or indirect connection through an intermediate medium; it can refer to internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0035] See also Figure 1 and Figure 2 The utility model provides a liquid-cooled chip detection mechanism, which includes a TEC5, a TEC upper plate 11, a TEC lower plate 9, a cooler and a partition plate 7; an adsorption hole is provided at the top of the TEC upper plate 11, and the adsorption hole is used to adsorb the chip; the top of the partition plate 7 is connected to the TEC upper plate 11, and the bottom end is connected to the TEC lower plate 9; the TEC lower plate 9 is connected to the cooler; a cavity is provided inside the TEC lower plate 9, and the cooler is connected to the cavity; the TEC upper plate 11 and the TEC lower plate 9 are electrically connected to the TEC5 accordingly.

[0036] A TEC, or semiconductor cooler, is a device that generates cooling energy using the thermoelectric effect of semiconductors. It's also called a thermoelectric cooler. When a conductor connects two dissimilar metals and applies direct current, the temperature at one junction decreases while the temperature at the other increases. Based on this, the present invention uses the TEC upper plate 11 and the TEC lower plate 9 as the two metal plates of the TEC 5. When the TEC 5 is connected to direct current, the temperature of the TEC upper plate 11 decreases while the temperature of the TEC lower plate 9 increases, achieving heat transfer from the TEC upper plate 11.

[0037] When testing a chip, the temperature of the chip will rise rapidly, and existing liquid cooling methods make it difficult to achieve high-precision cooling of the chip in a short period of time. The utility model transfers the heat of the chip to the TEC upper plate 11 through TEC5, and the TEC upper plate 11 is cooled by TEC5, thereby achieving chip cooling. The cooling speed of the TEC system is faster than liquid cooling, and the chip can be cooled in a shorter period of time. In addition, TEC5 is adjusted with high precision by electrical performance parameters such as current or voltage, which is easier to control temperature than existing liquid cooling methods, thereby achieving high-precision adjustment of the temperature of the TEC upper plate 11, and then achieving high-precision adjustment of the chip detection temperature, adjusting the chip detection temperature to the optimal detection temperature range of the chip to measure the optimal electrical performance parameters of the chip.

[0038] The TEC lower plate 9 has a cavity internally connected to a cooler, which cools the heat generated by the TEC lower plate 9. This embodiment uses liquid cooling, but air cooling or other cooling methods can also be used. Because the temperature of the TEC lower plate 9 is not directly correlated with the chip temperature (it is directly correlated with the temperature of the TEC upper plate 11), the cooling period of the TEC lower plate 9 can be relatively long, and conventional cooling methods can be used.

[0039] Furthermore, the cooler is a gas cooler or a liquid cooler; the cooler's inlet pipe 4 and outlet pipe 10 are connected to the cavity. This embodiment utilizes water cooling, with water flowing from the inlet pipe 4 into the cavity and out through the outlet pipe 10, thereby removing heat from the TEC lower plate 9 and cooling the TEC lower plate 9, ensuring the proper operation of the TEC system and thus ensuring that the TEC upper plate 11 is cooled to the set temperature. The water flows directly through the cavity, i.e., the interior of the TEC lower plate 9, effectively improving heat exchange efficiency, reducing the cooling time of the TEC lower plate 9, and saving testing costs.

[0040] Secondly, the partition plate 7 is a thermal insulation pad that further isolates the heat transfer between the TEC lower plate 9 and the TEC upper plate 11, preventing the heat from flowing back from the TEC lower plate 9, ensuring the cooling effect of the TEC upper plate 11 and improving the cooling accuracy of the chip.

[0041] In addition, a thermal insulation base plate 8 is provided at the bottom end of the TEC lower plate 9. The thermal insulation base plate 8 is used to isolate the heat transfer between the TEC lower plate 9 and the external components arranged below it, thereby preventing the liquid-cooled chip detection mechanism from affecting the temperature of the external components and improving the reliability of the liquid-cooled chip detection mechanism during use.

[0042] Furthermore, the chip inspection mechanism also includes a transfer plate 1 and a gripper cylinder 2; the gripper cylinder 2 is mounted on the transfer plate 1; the gripper cylinder 2 is provided with a pair of grippers 3 that can move toward or away from each other; the transfer plate 1 is capable of driving the pair of grippers 3 to move directly above the suction holes. In one embodiment, the transfer plate 1 is connected to an external robot, which drives the transfer plate 1 to move between the chip loading, inspection, and unloading stations, cooperating with the gripper cylinder 2 for loading and unloading, and improving the placement accuracy of the chip relative to the suction holes, thereby improving the chip inspection accuracy.

[0043] Secondly, temperature sensor 6 is a thermistor. The thermistor can directly detect the chip temperature and accurately monitor the chip temperature. During the chip testing process, if the chip temperature is too high, TEC 5 is turned on, lowering the temperature of TEC upper plate 11 to cool the chip. The chip's real-time temperature is then fed back via the thermistor to ensure that the chip temperature remains within the optimal performance temperature range throughout the entire chip testing process, enabling high-precision measurement of chip performance. By cooling the chip through TEC 5 and monitoring the chip's real-time temperature through temperature sensor 6, the TEC system is compatible with a variety of chip models, adjusting the temperature of the corresponding chip to the optimal testing temperature, and improving the compatibility of liquid-cooled chip testing mechanisms.

[0044] Furthermore, a negative pressure channel is defined within the TEC upper plate 11. A gas pipe connector 12 is connected to the TEC upper plate 11. The gas pipe connector 12, the negative pressure channel, and the adsorption holes are sequentially connected. Compared to embedding a gas pipe within the TEC upper plate 11, directly defining the negative pressure channel within the TEC upper plate 11 effectively prevents cooling loss through the pipe, thereby improving the cooling efficiency of the TEC upper plate 11.

[0045] It should be understood that the above description of the specific embodiments of the present invention is merely for the purpose of illustrating the technical approach and features of the present invention. Its purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. However, the present invention is not limited to the above-described specific embodiments. Any changes or modifications made within the scope of the claims of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A liquid-cooled chip detection mechanism, characterized in that: The chip detection mechanism includes a TEC (5), a TEC upper plate (11), a TEC lower plate (9), a cooler and a partition plate (7); The top of the TEC upper plate (11) is provided with an adsorption hole; The top end of the partition plate (7) is connected to the TEC upper plate (11), and the bottom end is connected to the TEC lower plate (9); The TEC lower plate (9) is connected to the cooler; a cavity is provided inside the TEC lower plate (9), and the cooler is communicated with the cavity; The TEC upper plate (11) and the TEC lower plate (9) are electrically connected to the TEC (5) accordingly.

2. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: The cooler is a liquid cooler; The inlet pipe (4) and the outlet pipe (10) of the cooler are correspondingly connected to the cavity.

3. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: The partition plate (7) is a heat-insulating pad.

4. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: A heat-insulating bottom plate (8) is provided at the bottom end of the TEC lower plate (9).

5. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: The chip detection mechanism further comprises a transfer plate (1) and a clamping claw cylinder (2); The clamping claw cylinder (2) is installed on the transfer plate (1); The clamping cylinder (2) is provided with a pair of clamping claws (3) that can move closer to or farther away from each other; The transfer plate (1) can drive a pair of the clamping claws (3) to move to just above the adsorption hole.

6. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: A temperature sensor (6) is provided on the TEC upper plate (11).

7. The liquid-cooled chip detection mechanism according to claim 1, characterized in that: A negative pressure channel is provided inside the TEC upper plate (11); and an air pipe joint (12) is connected to the TEC upper plate (11); The trachea joint (12), the negative pressure channel and the adsorption hole are connected in sequence.

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