Mask and exposure device

Abstract

The utility model discloses a mask plate and an exposure device, and relates to the technical field of exposure. The mask comprises a substrate, a shading layer, a conductive coating and a protective coating. The light shielding layer, the conductive plating layer and the protective plating layer are sequentially arranged on the substrate, the light shielding layer comprises a pattern area and a frame area, the frame area is arranged outside the pattern area in a surrounding mode, the conductive plating layer and the protective plating layer are transparent, and the protective plating layer is used for protecting the conductive plating layer and the light shielding layer; and the conductive plating layer is conducted with the pattern area and / or the frame area at the same time so as to prevent the shading layer from being damaged by static electricity. Compared with the prior art, the mask plate provided by the utility model adopts the conductive plating layer arranged outside the light shielding layer and the protective plating layer arranged outside the conductive plating layer, so that the mask plate has good wear resistance and electrostatic shock resistance, can effectively avoid wear and damage of the light shielding layer caused by electrostatic shock, and prolongs the service life.

Description

Technical Field

[0001] The utility model relates to the technical field of exposure, in particular to a mask and an exposure device. Background Art

[0002] Reticles, also known as masks, photomasks, and photolithography reticles, are widely used to expose objects to light, transferring the pattern on the reticle to the object. During contact exposure, the reticle constantly comes into contact with and separates from the object. This can affect the reticle's lifespan due to wear and tear. Furthermore, friction between the reticle and the object can generate static electricity, which can damage the shading layer on the reticle, leading to damage or loss of the shading layer and ultimately damage the reticle.

[0003] In view of this, it is particularly important to design and manufacture a mask and exposure device with good wear resistance and strong anti-static damage ability, especially in exposure production. Utility Model Content

[0004] The purpose of the utility model is to provide a mask with good wear resistance and anti-static damage capabilities, which can effectively prevent wear and the occurrence of static damage to the light-shielding layer, thereby extending the service life.

[0005] Another object of the present invention is to provide an exposure device, wherein the mask has good wear resistance and anti-static damage capabilities, which can effectively avoid wear and electrostatic damage to the light-shielding layer, thereby extending the service life.

[0006] The present invention is achieved by adopting the following technical solutions.

[0007] A mask plate includes a substrate, a light-shielding layer, a conductive coating and a protective coating. The light-shielding layer, the conductive coating and the protective coating are sequentially arranged on the substrate. The light-shielding layer includes a pattern area and a frame area. The frame area is arranged outside the pattern area. The conductive coating and the protective coating are both transparent. The protective coating is used to protect the conductive coating and the light-shielding layer. The conductive coating is electrically connected to the pattern area and / or the frame area to prevent the light-shielding layer from being damaged by static electricity.

[0008] Optionally, the protective plating layer includes a first sub-plating layer and a second sub-plating layer, the first sub-plating layer is arranged between the conductive plating layer and the second sub-plating layer, wherein the first sub-plating layer is a wear-resistant layer and the second sub-plating layer is an anti-adhesion layer.

[0009] Optionally, the first sub-plating layer is a silicon oxide layer or a silicon nitride layer; and / or the second sub-plating layer is a perfluoropolyether polymer layer.

[0010] Optionally, the thickness of the first sub-plating layer is 5 nm-30 nm; and / or the thickness of the second sub-plating layer is 5 nm-20 nm.

[0011] Optionally, the conductive coating is an indium tin oxide layer, and / or the thickness of the conductive coating is 10 nm-20 nm.

[0012] Optionally, the conductive plating layer covers the pattern area and the frame area.

[0013] Optionally, the pattern area includes a plurality of light-shielding blocks, adjacent light-shielding blocks are separated by light-transmitting grooves, and the conductive coating is connected to the plurality of light-shielding blocks to prevent the light-transmitting grooves from being damaged by static electricity.

[0014] Optionally, the mask further includes a reinforcement coating, which is disposed between the light-shielding layer and the conductive coating and covers the pattern area. The reinforcement coating is used to improve the connection strength between the light-shielding layer and the conductive coating.

[0015] Optionally, the reinforcement coating is a silicon oxide layer or a silicon nitride layer; and / or the thickness of the reinforcement coating is 5 nm-15 nm.

[0016] An exposure device includes the above-mentioned mask, which includes a substrate, a light-shielding layer, a conductive coating and a protective coating. The light-shielding layer, the conductive coating and the protective coating are arranged on the substrate in sequence. The light-shielding layer includes a pattern area and a frame area. The frame area is arranged outside the pattern area. The conductive coating and the protective coating are both transparent. The protective coating is used to protect the conductive coating and the light-shielding layer; the conductive coating is simultaneously connected to the pattern area and / or the frame area to prevent the light-shielding layer from being damaged by static electricity.

[0017] The mask and exposure device provided by the utility model have the following beneficial effects:

[0018] The reticle provided by the present invention comprises a light-shielding layer, a conductive coating, and a protective coating, which are sequentially disposed on a substrate. The light-shielding layer includes a pattern area and a frame area, with the frame area surrounding the pattern area. Both the conductive coating and the protective coating are transparent, and the protective coating is used to protect the conductive coating and the light-shielding layer. The conductive coating is also electrically conductive to the pattern area and / or the frame area to prevent the light-shielding layer from being damaged by static electricity. Compared to the prior art, the reticle provided by the present invention, due to the use of a conductive coating disposed outside the light-shielding layer and a protective coating disposed outside the conductive coating, has excellent wear resistance and anti-static damage capabilities, effectively preventing wear and static damage to the light-shielding layer, and extending its service life.

[0019] The exposure device provided by the utility model has a mask with good wear resistance and anti-static damage capabilities, which can effectively prevent wear and electrostatic damage to the light shielding layer, thereby extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic structural diagram of a mask provided in the first embodiment of the present invention;

[0022] Figure 2 A schematic structural diagram of a light-shielding layer in a mask provided in a first embodiment of the present utility model;

[0023] Figure 3 A schematic structural diagram of a mask provided in accordance with a second embodiment of the present invention;

[0024] Figure 4 This is a schematic structural diagram of the connection between the conductive coating and the reinforcement coating in the mask provided by the second embodiment of the present invention.

[0025] Icon: 100-mask; 110-substrate; 120-light-shielding layer; 121-light-shielding block; 122-light-transmitting groove; 123-pattern area; 124-frame area; 130-conductive coating; 140-protective coating; 141-first sub-coating; 142-second sub-coating; 150-reinforcement coating. DETAILED DESCRIPTION

[0026] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0029] In the description of this utility model, it should be noted that the terms "inner," "outer," "upper," "lower," and "horizontal" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely for distinction and description and should not be construed as indicating or implying relative importance.

[0030] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "connected," "installed," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the absence of conflict, the features of the following embodiments can be combined with each other.

[0032] First embodiment

[0033] Please refer to Figure 1 and Figure 2 The present invention provides a mask 100 for performing exposure operations. The mask 100 has good wear resistance and anti-static damage capabilities, effectively preventing wear and electrostatic damage to the light shielding layer 120, thereby extending its service life.

[0034] The mask 100 includes a substrate 110, a light-shielding layer 120, a conductive coating 130, and a protective coating 140. The light-shielding layer 120, the conductive coating 130, and the protective coating 140 are sequentially arranged on the substrate 110, that is, the protective coating 140, the conductive coating 130, the light-shielding layer 120, and the substrate 110 are sequentially arranged. Specifically, the light-shielding layer 120 includes a pattern area 123 and a frame area 124. The frame area 124 is arranged outside the pattern area 123, and the conductive coating 130 covers both the pattern area 123 and the frame area 124. The pattern area 123 includes a plurality of light-shielding blocks 121. Adjacent light-shielding blocks 121 are separated by light-transmitting grooves 122. The light-shielding blocks 121 are used for light shielding, and the light-transmitting grooves 122 are used for light transmission, so that the light passing through the light-shielding layer 120 forms a preset pattern as a whole, thereby facilitating the transfer of the preset pattern to the object to be exposed. Among them, each shading block 121 is set independently of each other, or a part of the shading blocks 121 and another part of the shading blocks 121 are set independently of each other. Correspondingly, the light-transmitting grooves 122 are continuous as a whole or partially continuous. Taking the metal grid as an example, the exposure pattern corresponding to the metal grid can be a continuous grid or a continuous grid with breakpoints. In this way, one or more isolated shading blocks 121 are prone to the problem of surrounding light-transmitting grooves 122 being damaged by static electricity.

[0035] Furthermore, both the conductive coating 130 and the protective coating 140 are transparent to facilitate light transmission and avoid affecting the exposure operation. The conductive coating 130 is simultaneously conductive with the pattern area 123 and the frame area 124. The conductive coating 130 is also disposed on the surfaces of multiple light shielding blocks 121. The conductive coating 130 is simultaneously conductive with the multiple light shielding blocks 121, forming a shielding protection structure that absorbs static electricity, significantly improving the anti-static damage capability of the light shielding layer 120, preventing the light-transmitting groove 122 from being damaged by static electricity, and avoiding damage or loss of the light shielding layer 120. The protective coating 140 is disposed on the side of the conductive coating 130 away from the light shielding layer 120. The protective coating 140 is used to shield and protect the conductive coating 130, the light shielding layer 120 and the substrate 110 located therein, to prevent the conductive coating 130 from being worn during the contact exposure process. In this way, the conductive coating 130 and the protective coating 140 work together to greatly improve the wear resistance and anti-static damage ability of the mask 100, effectively avoiding wear and electrostatic damage to the light shielding layer 120, and extending the service life of the mask 100.

[0036] It should be noted that the substrate 110 can be a resin substrate (film, etc.) or a glass substrate (quartz glass, borosilicate glass, soda-lime glass, etc.); the shading layer 120 can be a latex shading film (dry plate, etc.) or a hard shading film (chromium, silicon, molybdenum silicide, iron oxide, etc.).

[0037] The protective coating 140 includes a first sub-coating 141 and a second sub-coating 142. The first sub-coating 141 is arranged between the conductive coating 130 and the second sub-coating 142, wherein the first sub-coating 141 is a wear-resistant layer and the second sub-coating 142 is an anti-adhesion layer. The first sub-coating 141 is used to improve wear resistance, and the second sub-coating 142 is used to prevent adhesion. The first sub-coating 141 and the second sub-coating 142 work together to shield and protect the conductive coating 130. Specifically, the second sub-coating 142 is arranged at the outermost side of the entire mask 100. The second sub-coating 142 is used to directly contact the object to be exposed during the contact exposure process. Even if part of the second sub-coating 142 is worn, the first sub-coating 141 can shield and protect the conductive coating 130 to prevent the conductive coating 130 from being worn during the contact exposure process.

[0038] Preferably, the first sub-plating layer 141 is made of silicon oxide or silicon nitride. The first sub-plating layer 141 has good wear resistance and can effectively avoid wear during contact with the object to be exposed, thereby reliably protecting the conductive plating layer 130.

[0039] Preferably, the second sub-coating 142 is made of a perfluoropolyether polymer material. First, the second sub-coating 142 prevents adhesion, ensuring effective exposure. Second, the second sub-coating 142 prevents adhesion between the mask 100 and the object to be exposed (especially adhesion between the photoresist and the mask 100). Third, the second sub-coating 142 reduces friction generated during contact and separation between the mask 100 and the object to be exposed, making the contact and separation process smoother. Fourth, the second sub-coating 142 helps reduce static electricity and improves wear resistance, thereby extending the service life of the mask 100.

[0040] Preferably, the thickness of the first sub-plating layer 141 is 5nm-30nm. In this embodiment, the thickness of the first sub-plating layer 141 is 20nm, but it is not limited to this. In other embodiments, the thickness of the first sub-plating layer 141 can be 5nm or 30nm. There is no specific limitation on the thickness of the first sub-plating layer 141.

[0041] Preferably, the thickness of the second sub-plating layer 142 is 5nm-20nm. In this embodiment, the thickness of the second sub-plating layer 142 is 10nm, but it is not limited to this. In other embodiments, the thickness of the second sub-plating layer 142 can be 5nm or 20nm. There is no specific limitation on the thickness of the second sub-plating layer 142.

[0042] Preferably, the conductive coating 130 is made of indium tin oxide and has a thickness of 10 nm to 20 nm. In this embodiment, the thickness of the conductive coating 130 is 15 nm, but is not limited thereto. In other embodiments, the thickness of the conductive coating 130 may be 10 nm or 20 nm. The thickness of the conductive coating 130 is not specifically limited.

[0043] Furthermore, the conductive coating 130, the first sub-coating 141 and the second sub-coating 142 are all formed by PVD (physical vapor deposition) coating. The conductive coating 130, the first sub-coating 141 and the second sub-coating 142 formed in this way have better wear resistance and can effectively extend the service life of the mask 100.

[0044] An embodiment of the present invention further provides an exposure device, which includes the above-mentioned mask 100, so that the exposure device can be more durable, the exposure pattern can be more stable, and the yield of the produced product can be higher.

[0045] The mask 100 provided by the present invention comprises a light-shielding layer 120, a conductive coating 130, and a protective coating 140, which are sequentially disposed on a substrate 110. The light-shielding layer 120 includes a pattern area 123 and a frame area 124, with the frame area 124 surrounding the pattern area 123. The conductive coating 130 and the protective coating 140 are both transparent, and the protective coating 140 is used to protect the conductive coating 130 and the light-shielding layer 120. The conductive coating 130 is also electrically conductive to the pattern area 123 and / or the frame area 124 to prevent the light-shielding layer 120 from being damaged by static electricity. Compared to the prior art, the mask 100 provided by the present invention has excellent wear resistance and anti-static damage capabilities due to the use of the conductive coating 130 disposed outside the light-shielding layer 120 and the protective coating 140 disposed outside the conductive coating 130. This effectively prevents wear and electrostatic damage to the light-shielding layer 120, thereby extending its service life. The exposure device is durable and has a good exposure effect.

[0046] Second embodiment

[0047] Please refer to Figure 3 and Figure 4 The embodiment of the present invention provides a mask 100 . Compared with the first embodiment, the difference of this embodiment is that the mask 100 further includes a reinforcement coating 150 .

[0048] In this embodiment, the thickness of the conductive coating 130 is greater than the thickness of the reinforcement coating 150, and the area of the conductive coating 130 is greater than the area of the reinforcement coating 150. The reinforcement coating 150 is disposed between the light-shielding layer 120 and the conductive coating 130, and covers the pattern area 123. That is, the reinforcement coating 150 is disposed on the light-shielding layer 120, and the conductive coating 130 is disposed outside the reinforcement coating 150 and connected to the light-shielding layer 120. The reinforcement coating 150 is located in the middle of the conductive coating 130. On the one hand, the reinforcement coating 150 can improve the adhesion between the conductive coating 130 and the light-shielding layer 120, thereby increasing the connection strength between the light-shielding layer 120 and the conductive coating 130; on the other hand, the reinforcement coating 150 can eliminate the height difference between the metal film surface of the mask 100 and the substrate, ensuring the uniformity of the conductive coating 130.

[0049] Furthermore, the reinforcement coating 150 and the conductive coating 130 are both formed by PVD (physical vapor deposition) coating. The conductive coating 130 is simultaneously plated on the reinforcement coating 150 and the border area 124 of the light-shielding layer 120 (covering the pattern area 123 and the border area 124 at the same time). Since the reinforcement coating 150 is not conductive, the conductive coating 130 is only connected to the border area 124 at this time, and can also play a protective role on the outside of the light-shielding layer 120, absorbing the static electricity generated during the contact exposure process, preventing the light-shielding layer 120 from being damaged by static electricity, and extending the service life of the mask 100.

[0050] Preferably, the reinforcement coating 150 is made of silicon oxide or silicon nitride, and has a thickness of 5 nm to 15 nm. In this embodiment, the thickness of the reinforcement coating 150 is 8 nm, but the present invention is not limited thereto. In other embodiments, the thickness of the reinforcement coating 150 may be 5 nm or 15 nm. The thickness of the reinforcement coating 150 is not specifically limited.

[0051] The beneficial effects of the mask 100 provided by the embodiment of the present invention are the same as those of the first embodiment, and are not described in detail here.

[0052] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A mask, characterized in that: The invention comprises a substrate, a light-shielding layer, a conductive coating, and a protective coating, wherein the light-shielding layer, the conductive coating, and the protective coating are sequentially arranged on the substrate, the light-shielding layer comprises a pattern area and a frame area, the frame area is arranged outside the pattern area, the conductive coating and the protective coating are both transparent, and the protective coating is used to protect the conductive coating and the light-shielding layer; The conductive plating layer is connected to the pattern area and / or the frame area to prevent the light shielding layer from being damaged by static electricity.

2. The mask according to claim 1, wherein The protective plating layer includes a first sub-plating layer and a second sub-plating layer, wherein the first sub-plating layer is arranged between the conductive plating layer and the second sub-plating layer, wherein the first sub-plating layer is a wear-resistant layer, and the second sub-plating layer is an anti-adhesion layer.

3. The mask according to claim 2, wherein: The first sub-plating layer is a silicon oxide layer or a silicon nitride layer; and / or the second sub-plating layer is a perfluoropolyether polymer layer.

4. The mask according to claim 2, wherein: The thickness of the first sub-plating layer is 5nm-30nm; and / or the thickness of the second sub-plating layer is 5nm-20nm.

5. The mask according to claim 1, wherein: The conductive coating is an indium tin oxide layer, and / or the thickness of the conductive coating is 10 nm to 20 nm.

6. The mask according to claim 1, wherein: The conductive plating layer covers the pattern area and the frame area.

7. The mask according to any one of claims 1 to 6, wherein: The pattern area includes a plurality of light-shielding blocks, and adjacent light-shielding blocks are separated by light-transmitting grooves. The conductive coating is connected to the plurality of light-shielding blocks to prevent the light-transmitting grooves from being damaged by static electricity.

8. The mask according to any one of claims 1 to 6, wherein: The mask further includes a reinforcement plating layer, which is arranged between the light-shielding layer and the conductive plating layer and covers the pattern area. The reinforcement plating layer is used to improve the connection strength between the light-shielding layer and the conductive plating layer.

9. The mask according to claim 8, wherein: The reinforcement coating is a silicon oxide layer or a silicon nitride layer; and / or the thickness of the reinforcement coating is 5 nm to 15 nm.

10. An exposure device, characterized in that: The method comprises the mask according to any one of claims 1 to 9.

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