Novel power supply device protection structure
By designing a new power supply device protection structure with layered wiring of rubber blocking boxes and circuit boards, the problems of capacitor leakage and high-temperature heat dissipation glue are solved, and the protection and insulation of capacitors are improved, and the integrity and impact resistance of capacitors are enhanced.
Patent Information
- Application Number
- CN202421628366.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-07-10
AI Technical Summary
The capacitor is prone to leakage during long-term work, causing short circuit and ignition damage, and its life is affected in high-temperature environments. The heat dissipation glue transfers the heat from the severely heated device to the capacitor that does not severely heated, resulting in the power supply not working normally.
A new type of power supply device protection structure is designed, using rubber blocking box to enclose capacitors, and the circuit board is layered. The capacitor pins and negative electrodes are respectively set on the inner and outer layers, and the epoxy resin colloid is potted at the bottom and the root of the capacitance to avoid contact with the capacitors of heat dissipation glue, and perform regional glue removal protection and layered wiring.
Effectively prevent the capacitance from failing to generate heat, avoid damage from short circuit leakage, improve the insulation between the capacitance and circuit board circuit, enhance the integrity of the capacitance and anti-impact and vibration capabilities, and improve waterproof, dustproof and moisture-proof performance.
Smart Images
Figure CN223230230U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power supply device protection, in particular to a novel power supply device protection structure. Background Art
[0002] Capacitors are essential energy storage and filtering devices in power supplies. They use the characteristics of energy storage, filtering, and rectification to rectify the input AC voltage into a relatively smooth and stable DC voltage, thereby providing a stable DC voltage for the operation of the subsequent circuits.
[0003] Capacitors are prone to attenuation and leakage during long-term operation, which can easily lead to short circuit and spark damage, and their lifespan can be easily affected when working in a high-temperature environment for a long time. In some fully covered glue-filled heat dissipation products, the heat dissipation glue covers all power components and flows through the openings in the circuit board to the bottom of the power shell. The heat of the power components is transferred to the power shell by the heat dissipation glue, and then the heat is transferred to the outside by the power shell. In the process, due to the thermal conductivity of the glue, the heat of other components with serious heat generation will be transferred to the capacitor with less serious heat generation. Once the capacitor is damaged, the subsequent circuit will not be able to work normally, making the power supply unable to work normally. Utility Model Content
[0004] In view of this, a new power supply device protection structure is provided which can prevent failure due to heating, prevent damage due to sparking after leakage, and improve the insulation between capacitors and circuit board circuits.
[0005] A new power supply device protection structure is used to protect a capacitor. The capacitor is installed on a circuit board. The new power supply device protection structure includes a glue blocking box. The glue blocking box includes four surrounding panels and a bottom plate. The four surrounding panels surround the capacitor to isolate the capacitor from external glue potting. The bottom of the bottom plate abuts the circuit board. The bottom plate is provided with pin holes for passing the pins of the capacitor. The circuit board includes at least two inner and outer layers. The bottom of the main body of the capacitor is sealed with insulating glue.
[0006] Furthermore, the novel power supply device protection structure includes a plurality of the aforementioned plastic blocking boxes, each of the aforementioned plastic blocking boxes can accommodate a plurality of the aforementioned capacitors, and the plurality of aforementioned capacitors are arranged side by side.
[0007] Furthermore, each of the plastic blocking boxes has at least one avoidance portion on its exterior, which is formed to avoid peripheral components of the capacitor, and the avoidance portion includes an oblique angle or a recess.
[0008] Furthermore, the height of the glue blocking box is higher than the height of the external glue potting to prevent the external glue potting from contacting the capacitor.
[0009] Furthermore, the positive and negative pins of the capacitor are respectively arranged on the inner and outer layers of the circuit board to avoid short circuit and spark damage of the capacitor when the capacitor fails due to leakage.
[0010] Furthermore, the insulating glue does not protrude from the bottom of the capacitor body.
[0011] Furthermore, the insulating glue is epoxy resin colloid.
[0012] Furthermore, the gap between the pin hole and the pin of the capacitor is sealed by fixing glue.
[0013] Furthermore, the bottom plate is also provided with a through hole to be compatible with another power supply device.
[0014] Furthermore, the base of the capacitor pins is potted with insulating glue.
[0015] Compared with the prior art, the present invention has at least the following beneficial effects:
[0016] First, by setting up a glue blocking box, regional glue removal protection is performed. The capacitor is enclosed by the glue blocking box, and the external heat dissipation glue does not contact the capacitor, and will not transfer the heat of the seriously heating device to the capacitor, effectively solving the problem of capacitor failure caused by heating.
[0017] Second, perform layered routing protection on the circuit board. The circuit board should be designed with at least two layers, inner and outer. The copper covering of the positive and negative poles of the capacitor should be layered to avoid short-circuit and spark damage due to insufficient safety distance or capacitor leakage.
[0018] Third, epoxy resin colloid is encapsulated at the bottom of the capacitor body and the root of the pin for protection, which strengthens the integrity of the capacitor, improves its resistance to external impact and vibration, improves the insulation between the capacitor and the circuit board circuit, and improves its waterproof, dustproof and moisture-proof performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is an overall three-dimensional schematic diagram of a new power supply device protection structure according to an embodiment of the present utility model.
[0020] Figure 2 It is a three-dimensional schematic diagram of a glue blocking box of a new power supply device protection structure in an embodiment of the present utility model.
[0021] in,
[0022] 1. Capacitor; 2. Circuit board; 3. Glue block box; 31. Pin hole; 32. Through hole; 33. Avoidance area. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0024] See also Figures 1 to 2 , showing a new power supply device protection structure provided by an embodiment of the present utility model, which is used to protect a capacitor 1. The capacitor 1 is installed on a circuit board 2. The new power supply device protection structure includes a glue blocking box 3. The glue blocking box 3 includes four surrounding panels and a bottom plate. The four surrounding panels surround the periphery of the capacitor 1 to isolate the capacitor 1 from external glue potting. The bottom of the bottom plate abuts against the circuit board 2. The bottom plate is provided with a pin hole 31 for passing the pin of the capacitor 1. The circuit board 2 includes at least two inner and outer layers. The bottom of the main body of the capacitor 1 is sealed with insulating glue.
[0025] In some specific embodiments, first, a glue blocking box 3 is made according to the number and volume of the selected capacitors 1, the size of the capacitor pins and the position where each capacitor 1 is installed on the circuit board 2, and the size of the pin holes 31 in the glue blocking box 3 is consistent with the size of the capacitor 1 pins; secondly, before the capacitors 1 are received, the bottom of the capacitor 1 body and the root of the pins are encapsulated with epoxy resin colloid, and the circuit board 2 is made into at least two layers, inside and outside, and the copper clad traces of the positive and negative poles of the capacitor 1 are layered; finally, the capacitors 1 encapsulated with epoxy resin colloid are installed into the glue blocking box 3, and the gaps between the pins of the capacitor 1 and the pin holes 31 of the glue blocking box 3 are sealed with fixing glue, and then the glue blocking box 3 with the capacitors 1 installed is inserted into the circuit board 2 and soldered in the furnace.
[0026] Specifically, the novel power supply device protection structure includes a plurality of the plastic blocking boxes 3 , each of the plastic blocking boxes 3 can accommodate a plurality of the capacitors 1 , and the plurality of capacitors 1 are arranged side by side.
[0027] More specifically, the outside of each of the plastic blocking boxes 3 has at least one avoidance portion 33, which is formed to avoid the peripheral components of the capacitor 1. The avoidance portion 33 includes an angle or a recess. More specifically, the plastic blocking boxes 3 at different positions have different shape contours and avoidance portions 33 of different shapes according to the gap between the capacitor 1 and the peripheral components.
[0028] Specifically, when the power supply device is heat-dissipating, heat-dissipating glue will be poured into the power supply box. The heat-dissipating glue will usually cover all the power supply devices on the circuit board 2. In some specific embodiments, after multiple glue blocking boxes 3 and the circuit board 2 are installed, the glue is poured. The height of all glue blocking boxes 3 is higher than the height of the glue poured outside the box to avoid the external heat-dissipating glue from contacting the capacitor 1 in the box, and to avoid the heat of the components with serious heat generation being transferred to the capacitor 1 with less heat generation.
[0029] Specifically, the positive and negative pins of the capacitor 1 are respectively arranged on the inner and outer layers of the circuit board 2 to prevent the capacitor 1 from short-circuiting and igniting when it fails due to leakage.
[0030] Specifically, the insulating adhesive does not protrude from the bottom of the capacitor 1. That is, the bottom of the capacitor 1 can be in close contact with the upper surface of the circuit board 2, thereby strengthening the integrity of the capacitor 1 and improving its resistance to external impact and vibration. More preferably, the insulating adhesive is an epoxy resin.
[0031] Specifically, the gap between the pin hole 31 and the pin of the capacitor 1 is sealed by fixing glue. The sealing treatment at the pin can effectively improve the waterproof, dustproof and moisture-proof performance of the capacitor 1, and at the same time, it can also prevent the heat dissipation glue outside the glue blocking box 3 from seeping into the box through the pin hole 31.
[0032] Specifically, the bottom plate is also provided with a through hole 32 to be compatible with another power supply device. The through hole 32 is used to avoid other power supply devices with low heat dissipation requirements in the plastic blocking box 3 except the capacitor 1. In some specific embodiments, such as PFC inductors and resonant inductors, a plastic blocking box 3 can be set around these devices. The size of the plastic blocking box 3 is set according to the size of the power supply device, and the size of the pin hole 31 is set according to the pin size of the power supply device.
[0033] Specifically, the base of the pins of the capacitor 1 is filled with insulating glue.
[0034] To sum up, by setting up the glue blocking box 3, regional glue removal protection is performed, the capacitor 1 is enclosed by the glue blocking box 3, and the external heat dissipation glue does not contact the capacitor 1, and will not transfer the heat of the seriously heating device to the capacitor 1, effectively solving the problem of the thermal failure of the capacitor 1; the circuit board 2 is protected by layered routing, and the circuit board 2 is designed with at least two layers, inner and outer, and the copper cladding of the positive and negative wiring of the capacitor 1 is layered, which can avoid short-circuit and spark damage caused by insufficient safety distance or leakage failure of the capacitor 1; epoxy resin colloid is encapsulated at the bottom of the capacitor 1 body and the root of the pin for protection, thereby strengthening the integrity of the capacitor 1, improving resistance to external impact and vibration, improving the insulation between the capacitor 1 and the circuit board 2 lines, and improving its waterproof, dustproof and moisture-proof properties.
[0035] It should be noted that the present invention is not limited to the above-mentioned embodiments. According to the creative spirit of the present invention, those skilled in the art can also make other changes. These changes made according to the creative spirit of the present invention should be included in the scope of protection required by the present invention.
Claims
1. A novel power supply device protection structure for protecting a capacitor mounted on a circuit board, characterized in that: The new power supply device protection structure includes a glue blocking box, which includes four surrounding panels and a bottom plate. The four surrounding panels surround the capacitor to isolate the capacitor from external glue potting. The bottom of the bottom plate abuts against the circuit board. The bottom plate is provided with pin holes for passing the pins of the capacitor. The circuit board includes at least two inner and outer layers. The bottom of the main body of the capacitor is sealed with insulating glue.
2. A novel power device protection structure according to claim 1, characterized in that: The novel power supply device protection structure includes a plurality of the aforementioned plastic blocking boxes, each of which can accommodate a plurality of the aforementioned capacitors, and the plurality of the aforementioned capacitors are arranged side by side.
3. A novel power supply device protection structure as claimed in claim 2, characterized in that: The outside of each of the plastic blocking boxes has at least one avoidance portion formed to avoid peripheral components of the capacitor, and the avoidance portion includes an oblique angle or a recess.
4. A novel power device protection structure according to claim 1, characterized in that: The height of the glue blocking box is higher than the height of the external glue potting to prevent the external glue potting from contacting the capacitor.
5. A novel power device protection structure as claimed in claim 1, characterized in that: The positive and negative pins of the capacitor are respectively arranged on the inner and outer layers of the circuit board to avoid short circuit and spark damage of the capacitor when the capacitor fails due to leakage.
6. A novel power device protection structure according to claim 1, characterized in that: The insulating glue does not protrude from the bottom of the capacitor body.
7. A novel power device protection structure as claimed in claim 6, characterized in that: The insulating glue is epoxy resin colloid.
8. A novel power device protection structure as claimed in claim 1, characterized in that: The gap between the pin hole and the pin of the capacitor is sealed by fixing glue.
9. A novel power device protection structure according to claim 1, characterized in that: The bottom plate is also provided with a through hole to be compatible with another power supply device.
10. The novel power device protection structure according to claim 1, characterized in that: The base of the capacitor pins is filled with insulating glue.