Chip assembly and electronic equipment

Abstract

The utility model discloses a chip assembly and electronic equipment, the chip assembly comprises a chip and a heat dissipation component, the chip comprises a substrate and a convex part, the convex part is arranged on one side of the substrate and is connected with the substrate, and part of the substrate is arranged on the outer side of the convex part in a surrounding manner; the heat dissipation part is arranged on the side, away from the substrate, of the convex part and provided with a first groove, and the first groove is formed in the side, facing the convex part, of the heat dissipation part; the protruding part is arranged in the first groove and connected with the heat dissipation component, and the heat dissipation component is connected with the substrate. The first groove is formed in the heat dissipation part, the convex part is contained, the height of the convex part is absorbed, at the moment, the heat dissipation part can be in contact connection with the convex part and the substrate at the same time, heat dissipation and cooling can be conducted on the convex part, heat dissipation and cooling can be conducted on the substrate synchronously, and the service life of the substrate is prolonged. According to the chip assembly, the large heat dissipation area and the good heat dissipation effect on the non-planar chip are achieved, and in the use process of the chip assembly, it is effectively guaranteed that the chip has the good function performance.

Description

Technical Field

[0001] The present application belongs to the field of chip technology, and specifically relates to a chip component and an electronic device. Background Art

[0002] As the functional integration of chips increases, the computing speed and computing power of chips improve, which causes the heat generated by chips to increase, thus affecting the functional performance of chips. Utility Model Content

[0003] Purpose of the utility model: An embodiment of the present application provides a chip component, which aims to solve the problem that the heat generated by existing chips is increasing and affects the functional performance of the chips; another purpose of the embodiment of the present application is to provide an electronic device.

[0004] Technical solution: A chip assembly described in an embodiment of the present application includes a chip and a heat dissipation component, the chip includes a substrate and a protrusion, the protrusion is arranged on one side of the substrate and connected to the substrate, and a portion of the substrate is arranged around the outside of the protrusion; the heat dissipation component is arranged on the side of the protrusion away from the substrate, the heat dissipation component has a first groove, and the first groove is arranged on the side of the heat dissipation component facing the protrusion; the protrusion is arranged in the first groove and connected to the heat dissipation component, and the heat dissipation component is connected to the substrate.

[0005] Accordingly, an electronic device described in an embodiment of the present application includes the aforementioned chip assembly.

[0006] Beneficial effect: Compared with the prior art, a chip assembly according to an embodiment of the present application includes a chip and a heat dissipation component. The chip includes a substrate and a protrusion. The protrusion is arranged on one side of the substrate and connected to the substrate, and a portion of the substrate is arranged around the outside of the protrusion. The heat dissipation component is arranged on the side of the protrusion away from the substrate. The heat dissipation component has a first groove, and the first groove is arranged on the side of the heat dissipation component facing the protrusion. The protrusion is arranged in the first groove and connected to the heat dissipation component, and the heat dissipation component is connected to the substrate. The present application provides a first groove in the heat dissipation component to accommodate the protrusion and absorb the height of the protrusion. At this time, the heat dissipation component can be simultaneously connected to the protrusion and the substrate, which can not only dissipate heat and cool the protrusion, but also dissipate heat and cool the substrate simultaneously, thereby achieving a larger heat dissipation area and better heat dissipation effect for non-planar chips. During the use of the chip assembly, it is effectively guaranteed that the chip has better functional performance.

[0007] Compared with the prior art, an electronic device according to an embodiment of the present application includes the aforementioned chip assembly. It is understood that the electronic device includes all the technical features and technical effects of the aforementioned chip assembly, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 This is a schematic diagram of the overall structure of a chip assembly according to an embodiment of the present application;

[0010] Figure 2 is a side view of a chip assembly according to an embodiment of the present application;

[0011] Figure 3 is an exploded view of a chip component according to an embodiment of the present application;

[0012] Figure 4 This is a schematic structural diagram of a chip according to an embodiment of the present application;

[0013] Figure 5 This is a schematic structural diagram of a radiator according to an embodiment of the present application;

[0014] Figure 6 is an exploded view of another chip component according to an embodiment of the present application;

[0015] Figure 7 is a structural schematic diagram of another radiator according to an embodiment of the present application;

[0016] Figure 8 It is a structural schematic diagram of a flexible heat-conducting member according to an embodiment of the present application.

[0017] Figure numerals: 1. chip; 11. substrate; 12. protrusion; 2. heat dissipation component; 21. first groove; 211. bottom wall; 212. side wall; 22. heat sink; 221. second groove; 222. first connection surface; 223. third groove; 23. flexible heat conductor; 231. second connection surface; 232. third connection surface; 3. circuit board. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0019] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "multiple" means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined. In the description of this application, "vertical" means completely vertical at 90° or almost completely vertical, for example, an angle within the range of 80° to 100° is considered vertical. Similarly, "parallel" means completely parallel or almost completely parallel, for example, an angle within 10° of completely parallel is considered parallel.

[0020] Please refer to Figures 1-8 An embodiment of the present application provides a chip assembly, including a chip 1 and a heat dissipation component 2, the chip 1 including a substrate 11 and a protrusion 12, the protrusion 12 is arranged on one side of the substrate 11 and connected to the substrate 11, and a portion of the substrate 11 is arranged around the outside of the protrusion 12; the heat dissipation component 2 is arranged on the side of the protrusion 12 away from the substrate 11, the heat dissipation component 2 has a first groove 21, and the first groove 21 is arranged on the side of the heat dissipation component 2 facing the protrusion 12; the protrusion 12 is arranged in the first groove 21 and connected to the heat dissipation component 2, and the heat dissipation component 2 is connected to the substrate 11.

[0021] In the embodiment of the present application, by providing a first groove 21 on the heat dissipation component 2 to accommodate the protrusion 12 and absorb the height of the protrusion 12, the heat dissipation component 2 can be simultaneously in contact and connected with the protrusion 12 and the substrate 11, which can not only dissipate heat and cool the protrusion 12, but also dissipate heat and cool the substrate 11 simultaneously, thereby achieving a larger heat dissipation area and better heat dissipation effect for the non-planar chip 1, and effectively ensuring that the chip 1 has better functional performance during the use of the chip assembly.

[0022] Specifically, the heat dissipation component 2 can have a larger heat dissipation surface and heat dissipation fins to achieve rapid heat dissipation. At the same time, the heat dissipation component 2 uses the inner wall of the first groove 21 to contact the protrusion 12, and promptly dissipates the heat of the protrusion 12 to achieve heat dissipation of the protrusion 12; in addition, the heat dissipation component 2 is also connected to the substrate 11, and at this time, the heat of the substrate 11 can also be promptly dissipated to achieve heat dissipation of the substrate 11, thereby achieving all-round heat dissipation of the chip 1 and achieving better heat dissipation effect.

[0023] It should be noted that the present application absorbs the height difference caused by the convex portion 12 of the non-planar chip 1 by setting a first groove 21 to accommodate the convex portion 12, thereby achieving a larger contact area between the chip 1 and the heat dissipation component 2. Compared with the conventional method of only dissipating heat from the convex portion 12 of the non-planar chip 1, the heat of the entire chip 1 can be timely discharged, thereby ensuring that the working environment temperature of the chip 1 is maintained within a reasonable range, thereby ensuring that the chip 1 has better functional performance.

[0024] Please refer to Figure 3-Figure 5 In some embodiments, the heat dissipation component 2 includes a heat sink 22 and a flexible thermal conductor 23. The heat sink 22 is arranged on the side of the protrusion 12 away from the substrate 11. The first groove 21 is arranged on the side of the heat sink 22 facing the protrusion 12. The flexible thermal conductor 23 is arranged between the chip 1 and the heat sink 22. The side of the flexible thermal conductor 23 facing the chip 1 is respectively connected to the substrate 11 and the protrusion 12. Part of the flexible thermal conductor 23 is filled in the first groove 21 and connected to the heat sink 22.

[0025] In the embodiment of the present application, by providing a flexible thermally conductive member 23 connected to the substrate 11 and the protrusion 12, respectively, the flexible thermally conductive member 23 can be used to efficiently and evenly dissipate the heat of the chip 1. At the same time, the flexible thermally conductive member 23 is connected to the heat sink 22, and the flexible thermally conductive member 23 can transfer the heat to the heat sink 22, and dissipate the heat through the heat sink 22, thereby achieving effective heat dissipation of the chip 1.

[0026] It should be noted that the flexible thermal conductor 23 has good deformability and can initially be in the shape of a flat plate. The flexible thermal conductor 23 is placed between the chip 1 and the heat sink 22. The heat sink 22 is pushed toward the chip 1, so that the protrusion 12 and part of the flexible thermal conductor 23 are embedded in the first groove 21. At this time, the flexible thermal conductor 23 can be effectively connected to the heat sink 22 and the protrusion 12, thereby achieving rapid heat dissipation from the protrusion 12. At the same time, the flexible thermal conductor 23 is also connected to the substrate 11, and can quickly transfer the heat from the substrate 11 to the heat sink 22, thereby achieving rapid heat dissipation from the protrusion 12 and the substrate 11, achieving better heat dissipation effect.

[0027] like Figure 5As shown, in some embodiments, the first groove 21 has a bottom wall 211 and a side wall 212, and the side wall 212 is arranged around the bottom wall 211 and connected to the bottom wall 211; the heat sink 22 also has a plurality of second grooves 221, and the second grooves 221 are spaced apart and arranged on the side wall 212 of the first groove 21, and are recessed into the heat sink 22, and the second grooves 221 are connected to the first groove 21; the flexible heat conductive member 23 is in contact with the bottom wall 211 and the side wall 212, and part of the flexible heat conductive member 23 is filled in the second groove 221.

[0028] In the embodiment of the present application, a second groove 221 is provided on the side wall 212 of the first groove 21 so that the second groove 221 is connected to the first groove 21. At this time, the overall accommodating space of the radiator 22 can be increased. When the flexible heat-conducting member 23 is squeezed into the first groove 21, the excess portion of the flexible heat-conducting member 23 can be squeezed into the second groove 221, so that one side of the flexible heat-conducting member 23 covers the protrusion 12 and the substrate 11, and the other side can smoothly fit with the bottom wall 211 and the side wall 212 of the first groove 21, thereby achieving better heat transfer and heat dissipation effects.

[0029] It should be noted that the radiator 22 in the embodiment of the present application can be made of materials with good heat dissipation performance such as aluminum or aluminum alloy, and the flexible thermal conductive member 23 can be a carbon fiber thermal pad or a silicone thermal pad.

[0030] It should also be noted that when the first groove 21 is located on the heat sink 22 , the flexible heat conductive member 23 is a planar heat conductive pad, which is squeezed and deformed by the inner sidewall 212 of the first groove 21 of the heat sink 22 , so that the chip 1 has a larger contact area.

[0031] like Figure 5 As shown, in some embodiments, the heat sink 22 includes a first connecting surface 222, the first connecting surface 222 is arranged on the side of the heat sink 22 facing the chip 1, and the first groove 21 and the second groove 221 pass through the first connecting surface 222 along the direction of the heat sink 22 toward the chip 1; a portion of the flexible thermal conductor 23 is arranged between the first connecting surface 222 and the substrate 11, and is respectively connected to the first connecting surface 222 and the substrate 11.

[0032] In the embodiment of the present application, the first connecting surface 222 of the heat sink 22 is used to squeeze the portion of the flexible thermal conductive member 23 located outside the first groove 21 toward the substrate 11, so that the flexible thermal conductive member 23 fits the substrate 11 and the first connecting surface 222, thereby achieving effective heat dissipation and cooling of the substrate 11.

[0033] like Figure 5 As shown, in some embodiments, the sidewall 212 is inclined toward the center of the first groove 21 in a direction away from the protrusion 12 .

[0034] In the embodiment of the present application, the side wall 212 is arranged to be inclined toward the center of the groove. At this time, the side wall 212 is an inclined surface, which can reduce the deformation of the flexible heat-conducting member 23, thereby making it easier for the flexible heat-conducting member 23 to be squeezed and deformed, and respectively fit with the side wall 212, the bottom wall 211, the first connecting surface 222, the protrusion 12 and the substrate 11 to achieve a square root heat dissipation and cooling effect.

[0035] In some embodiments, the orthographic projection of the protrusion 12 on the heat sink 22 is located in the first groove 21 , and the orthographic projection of the substrate 11 on the heat sink 22 is located on the first connecting surface 222 .

[0036] In the embodiment of the present application, this structural limitation enables the protrusion 12 to exchange heat with the flexible heat-conducting member 23 in the first groove 21. The first groove 21 absorbs the height of the protrusion 12, and the first connecting surface 222 and the substrate 11 are squeezed against each other in the thickness direction until they are in contact with the flexible heat-conducting member 23, thereby achieving rapid heat dissipation of the entire chip 1.

[0037] Please refer to Figure 6-Figure 8 In some embodiments, the heat dissipation component 2 includes a heat sink 22 and a flexible thermal conductor 23. The heat sink 22 is arranged on the side of the protrusion 12 away from the substrate 11. The flexible thermal conductor 23 is arranged between the heat sink 22 and the chip 1, and is respectively connected to the heat sink 22 and the chip 1; the first groove 21 is arranged on the side of the flexible thermal conductor 23 facing the protrusion 12, the protrusion 12 is arranged in the first groove 21, and is connected to the flexible thermal conductor 23, and the flexible thermal conductor 23 is connected to the substrate 11.

[0038] In the embodiment of the present application, the heat dissipation component 2 may include a heat sink 22 and a flexible heat conductive member 23, wherein the first groove 21 is provided on the side of the flexible heat conductive member 23 facing the chip 1. In this case, it can be understood as directly contouring the flexible heat conductive member 23. At this time, the flexible heat conductive member 23 is directly bonded to the protrusion 12 of the chip 1 and the substrate 11. Then, the heat sink 22 is bonded to the side of the flexible heat conductive member 23 away from the chip 1, thereby achieving rapid heat conduction and heat dissipation of the entire chip 1. This direct method of directly setting the first groove 21 on the flexible heat conductive member 23 makes it more convenient to assemble the entire chip assembly, and has a good bonding effect, which can achieve rapid heat dissipation of the chip 1, thereby ensuring that the chip 1 has good functional performance.

[0039] It should be noted that, in the embodiment of the present application, the heat sink 22 and the flexible heat-conducting member 23 can be integrally formed, and the molding structure is simple, which is convenient for implementation.

[0040] Please refer to Figure 6 and Figure 8In some embodiments, the flexible thermal conductor 23 includes a second connection surface 231 and a third connection surface 232. The second connection surface 231 is in contact with the side of the heat sink 22 facing the protrusion 12; the third connection surface 232 is arranged opposite to the second connection surface 231 along the arrangement direction of the flexible thermal conductor 23 and the chip 1, and the first groove 21 passes through the third connection surface 232 along the direction of the flexible thermal conductor 23 toward the chip 1, and the third connection surface 232 is in contact with the substrate 11.

[0041] In the embodiment of the present application, the second connection surface 231 is bonded to the heat sink 22, the third connection surface 232 is bonded to the substrate 11, the protrusion 12 is disposed within the first groove 21, and the protrusion 12 is bonded to the inner sidewall 212 and bottom wall 211 of the first groove 21, thereby achieving a good heat dissipation and cooling effect. In this case, the non-planar chip 1 can be completely cooled without the heat sink 22 squeezing the flexible thermally conductive member 23.

[0042] like Figure 7 As shown, in some embodiments, the heat sink 22 has a third groove 223 , and at least a portion of the flexible heat conductive member 23 is disposed in the third groove 223 .

[0043] In the embodiment of the present application, by providing a third groove 223 in the heat sink 22, the flexible heat conductive member 23 can be accommodated as a whole. At this time, the protrusion 12 is used to position and limit the flexible heat conductive member 23, and the flexible heat conductive member 23 is further used to position and limit the heat sink 22, thereby further facilitating the overall assembly of the chip component.

[0044] It should be noted that, by providing the third groove 223 , a larger contact area between the heat sink 22 and the flexible heat conductive member 23 can be achieved, thereby achieving faster heat dissipation and temperature reduction.

[0045] In some embodiments, the orthographic projection of the chip 1 on the flexible heat conductive member 23 is completely located on the flexible heat conductive member 23 , and the orthographic projection of the flexible heat conductive member 23 on the heat sink 22 is located in the third groove 223 .

[0046] In the embodiment of the present application, the orthographic projection of the chip 1 on the flexible thermal conductive member 23 is completely located on the flexible thermal conductive member 23, so that both the protrusion 12 and the substrate 11 can be in contact with the flexible thermal conductive member 23, thereby achieving all-round heat conduction; the orthographic projection of the flexible thermal conductive member 23 on the heat sink 22 is located in the third groove 223. At this time, the second connecting surface 231 of the flexible thermal conductive member 23 can be completely fitted with the bottom wall 211 of the third groove 223, thereby achieving better heat dissipation effect.

[0047] Correspondingly, an embodiment of the present application also provides an electronic device, comprising the chip assembly as described in the aforementioned embodiment.

[0048] It can be understood that the electronic device of the embodiment of the present application includes all the technical features and technical effects of the aforementioned chip components, which will not be repeated here.

[0049] Of course, the chip components of the embodiments of the present application are very easy to operate, whether they are mass-produced or small-batch produced. The electronic devices of the embodiments of the present application can be large or small, and are particularly friendly to ADAS products in the automotive industry, such as front-view cameras, radars, and domain controllers, which require small size, have high chip power consumption and heat generation, and cannot use air cooling, water cooling, or other heat dissipation methods.

[0050] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0051] The above is a detailed introduction to a chip component and electronic device provided in the embodiments of the present application, and specific examples are used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip component, characterized in that: include: A chip (1) comprises a substrate (11) and a convex portion (12), wherein the convex portion (12) is arranged on one side of the substrate (11) and connected to the substrate (11), and a portion of the substrate (11) is arranged around the outside of the convex portion (12); A heat dissipation component (2) is arranged on a side of the convex portion (12) away from the substrate (11); the heat dissipation component (2) has a first groove (21); the first groove (21) is arranged on a side of the heat dissipation component (2) facing the convex portion (12); the convex portion (12) is arranged in the first groove (21) and connected to the heat dissipation component (2); and the heat dissipation component (2) is connected to the substrate (11).

2. The chip assembly according to claim 1, wherein: The heat dissipation component (2) comprises: A heat sink (22) is provided on a side of the convex portion (12) away from the substrate (11), and the first groove (21) is provided on a side of the heat sink (22) facing the convex portion (12); A flexible heat-conducting member (23) is arranged between the chip (1) and the heat sink (22); the side of the flexible heat-conducting member (23) facing the chip (1) is connected to the substrate (11) and the protrusion (12) respectively; a portion of the flexible heat-conducting member (23) is filled in the first groove (21) and is connected to the heat sink (22).

3. The chip assembly according to claim 2, wherein: The first groove (21) has a bottom wall (211) and a side wall (212), and the side wall (212) is arranged around the bottom wall (211) and connected to the bottom wall (211); the heat sink (22) also has a plurality of second grooves (221), and the second grooves (221) are arranged at intervals on the side wall (212) of the first groove (21) and are recessed into the heat sink (22), and the second grooves (221) are connected to the first groove (21); the flexible heat conductive member (23) is in contact with the bottom wall (211) and the side wall (212), and a portion of the flexible heat conductive member (23) is filled in the second groove (221).

4. The chip assembly according to claim 3, characterized in that: The heat sink (22) comprises a first connecting surface (222), the first connecting surface (222) being arranged on a side of the heat sink (22) facing the chip (1), the first groove (21) and the second groove (221) penetrating the first connecting surface (222) along a direction from the heat sink (22) toward the chip (1); a portion of the flexible heat conducting member (23) is arranged between the first connecting surface (222) and the substrate (11), and is connected to the first connecting surface (222) and the substrate (11), respectively.

5. The chip assembly according to claim 3, characterized in that: The side wall (212) is inclined toward the center of the first groove (21) in a direction away from the protrusion (12).

6. The chip assembly according to claim 4, characterized in that: The orthographic projection of the convex portion (12) on the heat sink (22) is located in the first groove (21), and the orthographic projection of the substrate (11) on the heat sink (22) is located on the first connecting surface (222).

7. The chip assembly according to claim 1, wherein: The heat dissipation component (2) comprises: a heat sink (22) disposed on a side of the convex portion (12) away from the substrate (11); A flexible heat-conducting member (23) is arranged between the heat sink (22) and the chip (1), and is respectively connected to the heat sink (22) and the chip (1); the first groove (21) is arranged on a side of the flexible heat-conducting member (23) facing the convex portion (12); the convex portion (12) is arranged in the first groove (21) and is connected to the flexible heat-conducting member (23); and the flexible heat-conducting member (23) is connected to the substrate (11).

8. The chip assembly according to claim 7, wherein: The flexible heat-conducting member (23) comprises: A second connecting surface (231) is in contact with a side of the heat sink (22) facing the protrusion (12); The third connecting surface (232) is arranged opposite to the second connecting surface (231) along the arrangement direction of the flexible heat-conducting member (23) and the chip (1); the first groove (21) passes through the third connecting surface (232) along the direction of the flexible heat-conducting member (23) toward the chip (1); and the third connecting surface (232) is in contact with the substrate (11).

9. The chip assembly according to claim 8, characterized in that: The heat sink (22) has a third groove (223), and at least a portion of the flexible heat-conducting member (23) is disposed in the third groove (223).

10. The chip assembly according to claim 9, characterized in that: The orthographic projection of the chip (1) on the flexible heat-conducting member (23) is completely located on the flexible heat-conducting member (23), and the orthographic projection of the flexible heat-conducting member (23) on the heat sink (22) is located in the third groove (223).

11. An electronic device, characterized in that: The chip assembly comprises the chip assembly according to any one of claims 1 to 10.

Images