Optical network equipment

Abstract

The utility model provides optical network equipment, and belongs to the technical field of communication. The optical network equipment is applied to an FTTH or FTTR system and comprises a shell, an optical network device and a first radiator. The optical network device is located in the shell and comprises a photoelectric converter, and the shell wall, opposite to the photoelectric converter, of the shell comprises a first hole. The first radiator comprises a first plate body and a first boss, the first plate body is located outside the shell, and the first boss penetrates through the first opening and is in heat conduction connection with the photoelectric converter. Thus, the photoelectric converter can dissipate heat through the independent radiator, the influence of heat dissipated by other heating devices in the optical network device on the photoelectric converter is reduced, and the heat dissipation efficiency of the photoelectric converter is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to an optical network device. Background Art

[0002] Optical network equipment, such as optical network units (ONUs) or optical network terminals (ONTs), includes photoelectric converters for photoelectric conversion. These converters are heat-sensitive components, so improving their heat dissipation efficiency is a key technical issue. Utility Model Content

[0003] The present disclosure provides an optical network device. The optical network device's photoelectric converter dissipates heat via an independent heat sink, resulting in high heat dissipation efficiency. The technical solution of the optical network device is as follows.

[0004] The present disclosure provides an optical network device. The optical network device includes a housing, an optical network component, and a first heat sink. The optical network component is located within the housing and includes a photoelectric converter. The housing wall opposite the photoelectric converter includes a first opening. The first heat sink includes a first plate and a first boss. The first plate is located outside the housing. The first boss extends through the first opening and is thermally connected to the photoelectric converter.

[0005] The optical network device is used to implement the corresponding functions of the optical network equipment. The optical network device includes a circuit board and various electrical and optical components located on the circuit board. The first boss is thermally connected to the photoelectric converter. This can be achieved by the first boss abutting the photoelectric converter, or by providing a thermal pad between the first boss and the photoelectric converter, with one side of the thermal pad contacting the first boss and the other side contacting the photoelectric converter.

[0006] The technical solution provided by the present disclosure provides a first opening in the housing, and provides a first boss of a first heat sink that passes through the first opening and is thermally connected to the photoelectric converter. This enables the photoelectric converter to dissipate heat through the independent first heat sink, thereby reducing the impact of heat emitted by other heating devices in the optical network device on the photoelectric converter and improving the heat dissipation efficiency of the photoelectric converter.

[0007] In one implementation, a plurality of protrusions are provided between the shell and the first plate, one end of the protrusions abuts against the outer wall of the shell, and the other end abuts against the first plate, so that a first gap is formed between the first plate and the shell.

[0008] The technical solution provided by this disclosure reduces the thermal conductivity between the housing and the first plate by providing a first gap between the first plate and the housing. This reduces the heat transfer from other heat-generating components in the optical network device to the housing, making it less likely to be transferred from the housing to the first heat sink. This further reduces the impact of heat from other heat-generating components on the photoelectric converter and improves the reliability of the photoelectric converter.

[0009] In one implementation, the protrusion is fixed to the outer wall of the housing, wherein the protrusion can be integrally formed on the outer wall of the housing.

[0010] In one implementation, the first heat sink further includes a shielding plate that passes through the first opening and surrounds the photoelectric converter. In this way, the first heat sink can not only dissipate heat for the photoelectric converter but also provide electromagnetic shielding for the photoelectric converter.

[0011] In one implementation, the shielding plate surrounds the first boss, or the shielding plate is provided on a side of the first boss facing the photoelectric converter.

[0012] In one implementation, the optical network device further includes a heating element, which is located on the same circuit board as the optoelectronic converter. A housing wall opposite the heating element includes a second opening. The optical network device further includes a second heat sink, which includes a second plate and a second boss. The second plate is located outside the housing, and the second boss extends through the second opening and is thermally connected to the heating element.

[0013] The technical solution provided by this disclosure improves the heat dissipation efficiency of heat-generating components other than the photoelectric converter on the first circuit board by providing a second boss of the second heat sink for thermal connection. Furthermore, the heat-generating components dissipate heat through the second heat sink, rather than sharing the first heat sink with the photoelectric converter. This reduces the impact of heat dissipated by the heat-generating components on the photoelectric converter, thereby improving the reliability of the photoelectric converter.

[0014] In one implementation, a second gap is provided between the first plate and the second plate, so that the thermal conductivity between the first heat sink and the second heat sink is low, thereby reducing the influence of the heat on the second heat sink on the photoelectric converter.

[0015] In one implementation, there is a gap between the first plate and the shell, the second plate is in contact with the shell, and the thickness of the second plate is greater than that of the first plate, so that the bottom walls of the first plate and the second plate are flush or approximately flush.

[0016] In one implementation, the optoelectronic converter includes a bidirectional optical subassembly (BOSA), which is mounted on a circuit board in a BOSA-on-board (BOB) configuration. This makes the BOSA easier to dissipate heat than using a complete optical module as the optoelectronic converter.

[0017] In one implementation, the housing includes a bottom shell and a panel, wherein a cavity for accommodating the optical network device is formed between the bottom shell and the panel. The bottom shell includes a bottom wall, which is arranged opposite to the panel and includes a first opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the FTTH system architecture;

[0019] Figure 2 It is a schematic diagram of a home network system;

[0020] Figure 3 It is a diagram of another type of home network system;

[0021] Figure 4 is a schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0022] Figure 5 is a schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0023] Figure 6 is an exploded diagram of an optical network device provided by an embodiment of the present disclosure;

[0024] Figure 7 is a schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0025] Figure 8 is a schematic diagram of the bottom of an optical network device provided by an embodiment of the present disclosure;

[0026] Figure 9 is a schematic diagram of a housing, a first heat sink, and a photoelectric converter provided by an embodiment of the present disclosure;

[0027] Figure 10 is a schematic diagram of a first radiator provided by an embodiment of the present disclosure;

[0028] Figure 11 is a schematic diagram of a first heat sink and a photoelectric converter provided by an embodiment of the present disclosure;

[0029] Figure 12 is a partial schematic diagram of an optical network device provided by an embodiment of the present disclosure;

[0030] Figure 13 is a schematic diagram of another first radiator provided by an embodiment of the present disclosure;

[0031] Figure 14 is a schematic diagram of another first heat sink and photoelectric converter provided by an embodiment of the present disclosure;

[0032] Figure 15 is a schematic diagram of a first circuit board and related components provided by an embodiment of the present disclosure;

[0033] Figure 16 is a schematic diagram of a housing, a first radiator, and a second radiator provided in an embodiment of the present disclosure;

[0034] Figure 17 It is a schematic diagram of a second radiator provided in an embodiment of the present disclosure.

[0035] Legend

[0036] 1. Housing, 11. Bottom housing, 110. Bump, 111. First opening, 112. Second opening, 12. Panel;

[0037] 2. Optical network device, 201. First circuit board, 202. Second circuit board, 203. Third circuit board, 204. Fourth circuit board, 21. Optical port connector, 22. Photoelectric converter, 23. Main chip, 24. First network port connector, 25. Power interface connector, 26. Transformer, 27. Ethernet physical layer chip, 28. Second network port connector;

[0038] 3. First heat sink, 30. First gap, 31. First plate, 32. First boss, 33. Shielding plate, 331. Opening;

[0039] 4. Second heat sink, 40. Second gap, 41. Second plate, 42. Second boss;

[0040] 5. Thermal pad. DETAILED DESCRIPTION

[0041] Fiber to the home (FTTH) means that the operator's network directly enters the home through the optical distribution network (ODN) and is connected to the optical network unit (ONU) installed in the home. Figure 1 A schematic diagram of the FTTH system architecture is shown. Figure 1As shown in the figure, the FTTH system includes an optical line terminal (OLT), an optical network device (ODN), and optical network units (ONUs). The OLT is located in the central computer room and is connected to the switch. The OLT connects to the indoor ONUs through the ODN. The ODN includes an optical splitter, a trunk fiber connecting the optical splitter and the OLT, and branch fibers connecting the optical splitter and the ONUs. The OLT, ONUs, and the ODN located between the OLT and the ONUs form a passive optical network (PON). The ONU can also be replaced by an optical network terminal (ONT).

[0042] After fiber optic access to the home, there are two technical solutions to solve the problem of signal coverage in each room. Figure 2 As shown, the first technical solution is that the ONU includes multiple network port connectors, and the multiple network port connectors are connected to terminal devices in each room through multiple network cables. The terminal devices can be computers, cameras or wireless access points (APs), etc.

[0043] like Figure 3 As shown, the second technical solution is to Figure 1 The ONU in the room serves as the master ONU, and slave ONUs are installed in each room. The master ONU is connected to the slave ONUs in each room via multiple optical fibers. The slave ONUs include network connectors, which are connected to terminal devices in the room via network cables. These terminal devices can be computers, cameras, or access points. This technology is called fiber to the room (FTTR).

[0044] The optical network device provided by the embodiment of the present disclosure can be Figure 2 ONU in Figure 3 The master or slave ONU in the ONU. The ONU includes a photoelectric converter, which performs photoelectric conversion. Since the photoelectric converter is a heat-sensitive component, improving its heat dissipation efficiency is a key technical issue. This is particularly important in ONUs with small size, high heat density, and limited installation space. For example, in ONUs that comply with the international M45 standard, the panel dimensions are 45 mm x N mm, where N is an integer multiple of 45, such as 45 or 90.

[0045] In view of the above technical problems, an embodiment of the present disclosure provides an optical network device, which can be any of the above-mentioned ONUs or ONTs. Figure 4 and Figure 5 Shows the appearance of the optical network equipment. Figure 6 shows an exploded view of an optical network device, such as Figure 6 As shown, the optical network device includes a housing 1 (including a bottom housing 11 and a panel 12) and an optical network device 2. The optical network device 2 is used to implement the relevant functions of the optical network device and includes a circuit board and components located on the circuit board. The optical network device 2 includes at least an optical-to-electrical converter 22.

[0046] Figure 7 Schematic diagram of an optical network device 2 is shown. In some examples, such as Figure 7 As shown, the optical network device includes a first circuit board 201, a second circuit board 202, a third circuit board 203, and a fourth circuit board 204. The first circuit board 201 is provided with an optical port connector 21 and an optical-to-electrical converter 22. The second circuit board 202 is provided with a power interface connector 25 and corresponding power management circuitry. The third circuit board 203 is provided with a main chip 23. The fourth circuit board 204 is provided with a first network port connector 24.

[0047] The optical port connector 21 is optically connected to the photoelectric converter 22, and the main chip 23 is electrically connected to the photoelectric converter 22 and the first network port connector 24, respectively. When transmitting a downlink signal, the photoelectric converter 22 receives the downlink optical signal through the optical port connector 21, converts the downlink optical signal into a downlink electrical signal, and sends the downlink electrical signal to the main chip 23. The main chip 23 processes the downlink electrical signal and sends it through the first network port connector 24. When transmitting an uplink signal, the main chip 23 receives the uplink electrical signal through the first network port connector 24, processes the uplink electrical signal, and sends it to the photoelectric converter 22. The photoelectric converter 22 converts the uplink electrical signal into an uplink optical signal and sends it to the outside through the optical port connector 21. The main chip 23 can also be called a system-on-chip (SOC).

[0048] It should be noted that Figure 7 The optical network device 2 shown belongs to Figure 2 ONU or Figure 3 In other examples, the first network port connector 24 in the optical network device 2 can be replaced by an optical port connector, and a photoelectric converter is added between the optical port connector and the main chip 23, then the optical network device 2 belongs to Figure 3 Of course, Figure 7 The optical network device 2 shown is only an example, and the optical network device 2 can be in any form.

[0049] Next, the heat dissipation method of the photoelectric converter 22 is exemplified.

[0050] In some examples, such as Figure 8 and Figure 9 As shown, the optical network device further includes a first heat sink 3, and the wall of the housing 1 opposite to the photoelectric converter 22 includes a first opening 111. Figure 10 As shown, the first heat sink 3 includes a first plate 31 and a first boss 32. The first plate 31 is located outside the housing 1. The first boss 32 passes through the first opening 111 and is thermally connected to the photoelectric converter 22 (as shown in FIG. Figure 11 As shown). The first boss 32 is thermally connected to the photoelectric converter 22. The first boss 32 and the photoelectric converter 22 may be in contact with each other, or a thermal pad 5 may be provided between the first boss 32 and the photoelectric converter 22, with one side of the thermal pad 5 being in contact with the first boss 32 and the other side being in contact with the photoelectric converter 22 (as shown). Figure 11 shown).

[0051] The technical solution provided by the embodiment of the present disclosure is to set a first opening 111 in the shell 1, and set a first boss 32 of the first heat sink 3 to pass through the first opening 111 and be thermally connected to the photoelectric converter 22, so that the photoelectric converter 22 can dissipate heat through an independent heat sink, thereby reducing the influence of heat emitted by other heating devices (such as the main chip 23) on the photoelectric converter 22, and improving the heat dissipation efficiency and reliability of the photoelectric converter 22.

[0052] In some examples, such as Figure 9 and Figure 12 As shown, a plurality of protrusions 110 are provided between the shell 1 and the first plate 31 , one end of the protrusion 110 abuts against the outer wall of the shell 1 , and the other end abuts against the first plate 31 , so that a first gap 30 is formed between the shell 1 and the first plate 31 .

[0053] The technical solution provided by the embodiments of the present disclosure reduces the thermal conductivity between the housing 1 and the first plate 31 by providing a first gap 30 between the first plate 31 and the housing 1. This reduces the heat transfer from other heat-generating components (such as the main chip 23) in the optical network device to the housing 1 and is less likely to be transferred from the housing 1 to the first heat sink 3. This further reduces the impact of heat dissipated by other heat-generating components on the photoelectric converter 22, thereby improving the heat dissipation efficiency and reliability of the photoelectric converter 22.

[0054] In some examples, such as Figure 9 As shown, the protrusions 110 are provided on the housing 1. For example, the protrusions 110 are integrally formed on the outer wall of the bottom housing 11.

[0055] In some examples, such as Figure 13 As shown, the first heat sink 3 further includes a shielding plate 33, which passes through the first opening 111 and surrounds the photoelectric converter 22 (as shown in FIG. Figure 14As shown). In this way, the first radiator 3 can not only achieve heat dissipation of the photoelectric converter 22, but also achieve electromagnetic shielding of the photoelectric converter 22. Figure 13 and Figure 14 As shown, the shielding enclosure 33 includes an opening 331 , through which light from the optical connector 21 or the optoelectronic converter 22 partially passes.

[0056] In some examples, such as Figure 13 As shown, the shielding plate 33 surrounds the first boss 32. Alternatively, the shielding plate 33 is provided on a side of the first boss 32 facing the photoelectric converter 22.

[0057] In some examples, such as Figure 7 As shown, the photoelectric converter 22 includes a bidirectional optical subassembly (BOSA), which is mounted on a circuit board in a BOSA-on-board (BOB) configuration. This allows for easier heat dissipation compared to using a complete optical module as the photoelectric converter 22. The BOSA is thermally connected to the first boss 32 and surrounded by a shielding panel 33.

[0058] In some examples, the optoelectronic network device further includes other heating components, which are located on the same circuit board as the optoelectronic converter 22. Figure 15 As shown, the first circuit board 21 is provided with an optical port connector 21, an optical-to-electrical converter 22, a transformer 26, an Ethernet physical layer chip 27, and a second network port connector 28. The transformer 26 and the Ethernet physical layer chip 27 are heat-generating devices. The input end of the transformer 26 is connected to the power board (second circuit board 202), and the output end of the transformer 26 is connected to the optical-to-electrical converter 22 and the main chip 23, respectively. The transformer 26 is used to reduce the voltage of the power output from the power board and then supply power to the optical-to-electrical converter 22 and the main chip 23. The transformer 26 can be a 56V to 12V transformer. The Ethernet physical layer chip 27 is electrically connected to the main chip 23 and the second network port connector 28, respectively. The second network port connector 28 and the first network port connector 24 have different speeds. In some examples, the speed of the first network port connector 24 is GE, and the speed of the second network port connector 28 is 10GE. The Ethernet physical layer chip can also be called a PHY (physical layer chip).

[0059] like Figure 16 As shown, the housing 1 further includes a second opening 112 on the wall opposite to the heating device, and the second opening 112 is arranged opposite to the heating device. The optical network device further includes a second radiator 4, such as Figure 17As shown, the second heat sink 4 includes a second plate body 41 and a second boss 42 . The second plate body 41 is located outside the bottom shell 11 . The second boss 42 passes through the second opening 112 and is thermally connected to the heating device.

[0060] The technical solution provided by the disclosed embodiment improves the heat dissipation efficiency of heat-generating components other than the photoelectric converter 22 on the first circuit board 201 by providing a second boss 42 for thermal connection. Furthermore, the heat-generating components dissipate heat through the second heat sink 4, rather than sharing the first heat sink 3 with the photoelectric converter 22. This reduces the impact of heat dissipated by these components on the photoelectric converter 22 and improves the reliability of the photoelectric converter 22.

[0061] In some examples, such as Figure 17 As shown, the second heat sink 4 includes three second bosses 42: one second boss 42 is used to support the second network port connector 28, one second boss 42 is used for thermal connection to the Ethernet physical layer chip 27, and another second boss 42 is used for thermal connection to the transformer 26. The second boss 42 is thermally connected to the Ethernet physical layer chip 27 by either affixing the second boss 42 to the Ethernet physical layer chip 27 or by providing a thermal pad 5 between the second boss 42 and the Ethernet physical layer chip 27. The second boss 42 is thermally connected to the transformer 26 by either affixing the second boss 42 to the transformer 26 or by providing a thermal pad 5 between the second boss 42 and the transformer 26.

[0062] In some examples, such as Figure 8 and Figure 12 As shown, there is a second gap 40 between the first heat sink 3 and the second heat sink 4. This reduces the thermal conductivity between the first heat sink 3 and the second heat sink 4, further reducing the effect of heat emitted by other heating components on the first circuit board 201 on the photoelectric converter 22.

[0063] In some examples, such as Figure 12 As shown, a first gap 30 is defined between the first plate 31 and the bottom shell 11, and the second plate 41 fits snugly against the bottom shell 11. Furthermore, the thickness of the second plate 41 is greater than that of the first plate 31. Thus, the bottom walls of the first plate 31 and the second plate 41 are flush or nearly flush.

[0064] The embodiment of the present disclosure does not limit the specific positions of the first opening 111 and the second opening 112. In some examples, such as Figure 9 and Figure 16As shown, the housing 1 includes a bottom shell 11 and a panel 12, with a cavity formed between the bottom shell 11 and the panel 12 for accommodating the optical network device 2. The bottom shell 11 includes a bottom wall, which is arranged opposite to the panel 12, and the bottom wall 11 includes a first opening 111 and may also include a second opening 112.

[0065] It should be noted that the optical network device provided in the embodiment of the present disclosure may comply with the M45 standard, and the size of the panel 102 of the optical network device is 45 mm×90 mm.

[0066] The above descriptions are merely optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. An optical network device, characterized in that: The optical network device comprises a housing (1), an optical network device (2) and a first heat sink (3); The optical network device (2) is located inside the housing (1), the optical network device (2) includes a photoelectric converter (22), and a housing wall of the housing (1) opposite to the photoelectric converter (22) includes a first opening (111); The first heat sink (3) comprises a first plate body (31) and a first boss (32), wherein the first plate body (31) is located outside the housing (1), and the first boss (32) passes through the first opening (111) and is thermally connected to the photoelectric converter (22).

2. The optical network device according to claim 1, characterized in that A plurality of protrusions (110) are provided between the shell (1) and the first plate (31), one end of the protrusion (110) abuts against the outer wall of the shell (1), and the other end abuts against the first plate (31), so that a first gap (30) is provided between the first plate (31) and the shell (1).

3. The optical network device according to claim 2, characterized in that The protrusion (110) is fixed to the outer wall of the housing (1).

4. The optical network device according to any one of claims 1 to 3, characterized in that: The first heat sink (3) further comprises a shielding enclosure (33), wherein the shielding enclosure (33) passes through the first opening (111) and surrounds the photoelectric converter (22).

5. The optical network device according to claim 4, characterized in that The shielding enclosure (33) surrounds the first boss (32), or the shielding enclosure (33) is provided on a side of the first boss (32) facing the photoelectric converter (22).

6. The optical network device according to any one of claims 1 to 3, characterized in that: The optical network device (2) further comprises a heating device, the heating device and the photoelectric converter (22) are located on the same circuit board, and the shell wall of the shell (1) opposite to the heating device comprises a second opening (112); The optical network device further comprises a second heat sink (4), the second heat sink (4) comprising a second plate body (41) and a second boss (42), the second plate body (41) being located outside the housing (1), the second boss (42) passing through the second opening (112) and being thermally connected to the heating device.

7. The optical network device according to claim 6, characterized in that A second gap (40) is defined between the first plate (31) and the second plate (41).

8. The optical network device according to claim 6, characterized in that A first gap (30) is provided between the first plate (31) and the shell (1); the second plate (41) is fitted to the shell (1); and the thickness of the second plate (41) is greater than the thickness of the first plate (31).

9. The optical network device according to any one of claims 1 to 3, characterized in that: The photoelectric converter (22) comprises a bidirectional optical component BOSA, the BOSA being arranged on a circuit board in a plate-like manner, and the BOSA being thermally connected to the first boss (32).

10. The optical network device according to any one of claims 1 to 3, characterized in that: The housing (1) comprises a bottom shell (11) and a panel (12), wherein a receiving cavity for receiving the optical network device (2) is formed between the bottom shell (11) and the panel (12); The bottom shell (11) comprises a bottom wall, the bottom wall is arranged opposite to the panel (12), and the bottom wall comprises the first opening (111).

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