Adsorption device and chip mounter

Abstract

The embodiment of the utility model discloses an adsorption device and a chip mounter, and the adsorption device comprises an adsorption platform and a plurality of adsorption pipes. A plurality of adsorption channels which are arranged at intervals are formed in the adsorption platform to form a plurality of adsorption areas, and at least one adsorption channel comprises a plurality of air channels which communicate with one another; the circuit board is arranged on the top wall of the adsorption platform, and a plurality of adsorption holes arranged at intervals are formed in the top wall of the adsorption platform corresponding to the adsorption channels; any adsorption channel is communicated with at least one adsorption pipe, and the end, away from the adsorption channel, of each adsorption pipe is connected with an air pump. According to the adsorption device disclosed by the utility model, the plurality of independent adsorption areas are formed through the plurality of adsorption channels arranged at intervals, so that the problem of non-uniform adsorption force caused by an existing single air pump adsorption mode can be effectively avoided, and particularly when a circuit board with a larger area or a complicated shape is treated, the balanced distribution of the adsorption force of each area can be ensured; and the fixing effect of the circuit board is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of adsorption devices, and in particular to an adsorption device and a placement machine. Background Art

[0002] Chip placement machines are used to automatically and accurately place surface mount components onto printed circuit boards (PCBs) during the electronics manufacturing process. During the placement process, surface mount components are typically attached to the PCB using reflow soldering, which heats the solder paste to its melting point, causing it to melt and form solder joints, thus firmly securing the components to the PCB. However, during the heating process, the PCB can easily deform and move, causing the solder paste to flow, resulting in inaccurate placement and increased defective rates.

[0003] To solve the problem of deformation and movement of circuit boards, an adsorption device is usually used to fix the circuit boards through vacuum adsorption. However, the existing technology usually uses an air pump to adsorb the circuit boards, which may cause uneven adsorption. Especially for circuit boards with large areas and complex shapes, the adsorption force is stronger in the area close to the air pump, and weaker in the area far from the air pump, and the circuit boards cannot be independently partitioned and managed for adsorption.

[0004] The above content is only used to assist in understanding the technical solution of the utility model and does not constitute an admission that the above content is prior art. Utility Model Content

[0005] In view of the above problems, the present invention proposes an adsorption device, which aims to solve the technical problem that partitioned adsorption cannot be performed when there is only one air pump and adsorption tube.

[0006] In order to achieve the above-mentioned purpose, the adsorption device proposed in the present invention includes an adsorption platform and a plurality of adsorption tubes; wherein,

[0007] The adsorption platform is provided with a plurality of adsorption channels arranged at intervals to form a plurality of adsorption zones, and at least one of the adsorption channels includes a plurality of air passages interconnected with each other;

[0008] The circuit board is arranged on the top wall of the adsorption platform, and the top wall of the adsorption platform is provided with a plurality of adsorption holes arranged at intervals corresponding to the adsorption channels;

[0009] Any of the adsorption channels is connected to at least one of the adsorption tubes, and one end of each of the adsorption tubes away from the adsorption channel is connected to an air pump.

[0010] In one embodiment, the plurality of adsorption channels include a first channel and a second channel that are spaced apart, and the second channel is disposed around the first channel;

[0011] The plurality of adsorption tubes include a first tube and a second tube, the first tube is connected to the first channel to form a first adsorption area, and the second tube is connected to the second channel to form a second adsorption area.

[0012] In one embodiment, the plurality of adsorption tubes further include a third tube connected to the second channel, and the second tube and the third tube are respectively located on opposite sides of the first tube.

[0013] In one embodiment, the second channel includes a first section, a second section, and a connecting section respectively connecting the first section and the second section. The second tube is connected to the first section, and the third tube is connected to the second section.

[0014] In one embodiment, the adsorption platform is in the shape of an elongated strip, the second tube and the third tube are respectively arranged on both sides of the first tube in the first direction, the connecting section extends along the first direction, and the first section and the second section are symmetrically arranged along the second direction passing through the first tube.

[0015] The first direction is the length direction of the adsorption platform, and the second direction is the width direction of the adsorption platform.

[0016] In one embodiment, the first channel includes a plurality of the air channels arranged at intervals and connecting channels respectively communicating with the air channels, and the first tube is connected to the connecting channels.

[0017] In one embodiment, the adsorption platform is in an elongated shape, the air channel extends along a first direction, and the connecting channel extends along a second direction; the first direction is the length direction of the adsorption platform, and the second direction is the width direction of the adsorption platform;

[0018] And / or, the airways are of the same length.

[0019] In one embodiment, the top wall of the adsorption platform includes a through-hole area and a closed area, the adsorption holes are opened in the through-hole area, and the first tube is arranged corresponding to the closed area.

[0020] In one embodiment, the adsorption platform is provided with a plurality of connection holes respectively connected to the plurality of adsorption tubes, any one of the adsorption channels is connected to at least one of the connection holes, and an inner diameter of the connection hole is greater than a width of the adsorption channel.

[0021] The present invention further provides a chip placement machine, comprising a driving device and the above-mentioned adsorption device, wherein the output end of the driving device is connected to the adsorption device.

[0022] This new adsorption device creates multiple independent adsorption zones through multiple, spaced-apart adsorption channels. Each adsorption channel corresponds to a specific range of adsorption holes and is connected to an air pump via an adsorption tube. This design effectively avoids the uneven adsorption force problem associated with existing single-air pump adsorption methods. This ensures even distribution of adsorption force across all zones, particularly when handling large or complex-shaped circuit boards, further enhancing the board's securement.

[0023] At the same time, each adsorption channel is connected to an independent adsorption tube, which can independently control different adsorption areas, so that the adsorption system can flexibly adjust the adsorption intensity according to the shape, size and specific needs of the circuit board, thereby realizing zoned adsorption management. It can adapt to circuit boards of various sizes and shapes, especially on circuit boards with large areas or complex structures, with more flexible and efficient adsorption capabilities.

[0024] Secondly, at least one adsorption channel includes multiple interconnected air channels, which divert the gas in the adsorption channel into each air channel and then extract it through the adsorption tube, thereby clarifying the gas flow path and uniforming the adsorption area. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 Shows a structural schematic diagram of an embodiment of the adsorption device of the utility model;

[0027] Figure 2 for Figure 1 Exploded diagram of the adsorption device;

[0028] Figure 3 for Figure 1 a cross-sectional view of the adsorption device;

[0029] Figure 4 for Figure 1 Schematic diagram of the structure of the adsorption platform;

[0030] Figure 5 for Figure 1 Cross-sectional view of the adsorption platform;

[0031] Description of Figure Numbers:

[0032] 100, adsorption device; 200, adsorption platform; 210, adsorption channel; 211, air channel; 212, connecting channel; 213, first channel; 214, second channel; 215, first section; 216, second section; 217, connecting section; 218, through-hole area; 219, closed area; 220, adsorption hole; 230, first adsorption area; 240, second adsorption area; 250, connecting hole; 300, adsorption tube; 310, first tube; 320, second tube; 330, third tube;

[0033] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that meet both A and B.

[0037] The present invention provides an adsorption device 100 for a chip placement machine.

[0038] In the embodiment of this utility model, please refer to Figures 1 to 5The adsorption device 100 includes an adsorption platform 200 and multiple adsorption tubes 300; wherein, the adsorption platform 200 is provided with multiple adsorption channels 210 spaced apart to form multiple adsorption areas, and at least one adsorption channel 210 includes multiple connected air channels 211; the circuit board is arranged on the top wall of the adsorption platform 200, and the top wall of the adsorption platform 200 is provided with multiple adsorption holes 220 spaced apart corresponding to the adsorption channels 210; any adsorption channel 210 is connected to at least one adsorption tube 300, and each adsorption tube 300 is connected to an air pump at one end away from the adsorption channel 210.

[0039] In this embodiment, a placement machine is used to accurately place surface mount components, such as resistors, capacitors, and integrated circuits, onto printed circuit boards (PCBs) during the electronics manufacturing process. The adsorption platform 200 is used to secure the circuit board through vacuum adsorption, preventing it from moving or deforming during the placement process. The adsorption platform 200 can be shaped as a cube, a cylinder, or any other three-dimensional shape with a flat top wall. The adsorption tube 300 is used to connect the adsorption channel 210 and the air pump to form a vacuum channel. The vacuum suction generated by the air pump secures the circuit board to the adsorption platform 200. The number of adsorption tubes 300 may or may not correspond to the number of adsorption channels 210, and this is not a limitation. The adsorption holes 220 are small holes formed on the top wall of the adsorption platform 200, connected to the adsorption tubes 300 through the adsorption channel 210, allowing the vacuum adsorption force to act directly on the circuit board.

[0040] The adsorption channel 210 is a groove-shaped structure opened on the adsorption platform 200, which is equivalent to the flow channel structure within the adsorption platform 200. It is internally connected to the adsorption hole 220 and the adsorption tube 300, and can evenly distribute the vacuum adsorption force to ensure that the circuit board is firmly adsorbed. Its cross-sectional shape can be circular or square. The airway 211 refers to the gas flow channel within the adsorption channel 210. Multiple connected airways 211 can be a complete connected airway 211, or multiple airways 211 can be set at intervals. The gas in the multiple spaced airways 211 is then gathered together through the connecting channel 212, and finally flows to the adsorption tube 300 and is pumped out by the air pump.

[0041] In this embodiment, multiple independent adsorption areas are formed through a plurality of spaced-apart adsorption channels 210. Each adsorption channel 210 corresponds to a specific range of adsorption holes 220 and is connected to an air pump via an adsorption tube 300. This design effectively avoids the uneven adsorption force problem associated with existing single-air pump adsorption methods. This ensures a balanced distribution of adsorption force across all areas, particularly when processing large or complex-shaped circuit boards, further enhancing the board's securement.

[0042] At the same time, each adsorption channel 210 is connected to an independent adsorption tube 300, and different adsorption areas can be independently controlled, so that the adsorption system can flexibly adjust the adsorption strength according to the shape, size and specific needs of the circuit board, thereby realizing the partitioned adsorption tube 300 system, which can adapt to circuit boards of various sizes and shapes, especially on circuit boards with larger areas or complex structures, and has more flexible and efficient adsorption capabilities.

[0043] Secondly, at least one adsorption channel 210 includes multiple interconnected air channels 211. This divides the gas within the adsorption channel 210 into individual air channels 211 before being extracted through the adsorption tube 300, thus defining a clear gas flow path. If multiple air channels 211 are spaced apart and then converged through the connecting channel 212, this allows for a more uniform adsorption area, preventing uneven adsorption caused by excessive localized adsorption force, which could lead to circuit board deformation or warping.

[0044] Specifically, the multiple adsorption channels 210 include a first channel 213 and a second channel 214 that are spaced apart, and the second channel 214 is surrounded by the first channel 213; the multiple adsorption tubes 300 include a first tube 310 and a second tube 320, the first tube 310 is connected to the first channel 213 to form a first adsorption area 230, and the second tube 320 is connected to the second channel 214 to form a second adsorption area 240.

[0045] In this embodiment, the first channel 213 and the second channel 214 can be a single channel or a combination of multiple channels, without limitation. By disposing the second channel 214 peripherally of the first channel 213 and forming a corresponding second adsorption zone 240, the adsorption coverage area is effectively expanded. Especially for larger circuit boards, the peripheral second adsorption zone 240 further enhances the overall adsorption capacity, ensuring that the circuit board is evenly and stably fixed to the adsorption platform 200 over a large area, thus avoiding the warping or deformation of the board caused by insufficient adsorption area in the prior art.

[0046] In one embodiment, the plurality of adsorption tubes 300 further include a third tube 330 connected to the second channel 214 . The second tube 320 and the third tube 330 are respectively located on opposite sides of the first tube 310 .

[0047] In this embodiment, the first tube 310, the second tube 320, and the third tube 330 are located on the same side. Because the second channel 214 is enclosed within the first channel 213, the second channel 214 is relatively long. If only one adsorption tube 300 were connected to an air pump to provide adsorption force, the adsorption effect would be poor in areas away from the adsorption tube 300, resulting in uneven adsorption force. In this embodiment, the second channel 214 distributes the adsorption force by connecting the second adsorption tube 300 and the third adsorption tube 300 to the air pump, respectively. This balances the adsorption force across the entire second adsorption zone 240, ensuring sufficient adsorption force even in areas away from the adsorption tubes 300. This effectively resolves the issues of circuit board deformation and inaccurate placement caused by uneven adsorption force.

[0048] In one embodiment, the second channel 214 includes a first section 215 , a second section 216 and a connecting section 217 respectively connecting the first section 215 and the second section 216 . The second tube 320 is connected to the first section 215 , and the third tube 330 is connected to the second section 216 .

[0049] In this embodiment, by connecting the second tube 320 and the third tube 330 to different sections of the second channel 214, the adsorption force is evenly distributed throughout the second adsorption area 240, avoiding the problem of uneven adsorption caused by the adsorption force being concentrated in a certain area. The separated second tube 320 and the third tube 330 can effectively enhance the distribution breadth and strength of the adsorption force by controlling the adsorption force in different areas respectively. In particular, for circuit boards with large areas or complex shapes, it can avoid uneven adsorption and other mechanical stress phenomena caused by excessive local adsorption force, further optimizing the adsorption effect. In one embodiment, the adsorption platform 200 is long and narrow, and the second tube 320 and the third tube 330 are respectively arranged on both sides of the first tube 310 in a first direction. The connecting section 217 extends along the first direction, and the first section 215 and the second section 216 are symmetrically arranged along the second direction passing through the first tube 310; the first direction is the length direction of the adsorption platform 200, and the second direction is the width direction of the adsorption platform 200.

[0050] In this embodiment, the first section 215 and the second section 216 are both rectangular. The ends of the first section 215 and the second section 216, distal from the connecting section 217, are spaced apart from the first channel 213. The second tube 320 and the third tube 330 are located on either side of the first tube 310 in the first direction. This means that the first tube 310, the second tube 320, and the third tube 330 are spaced apart along the length of the adsorption platform 200, making the airflow distribution throughout the adsorption channel 210 more compact and reducing unnecessary pipe bends and excessively long paths. For example, if the first tube 310, the second tube 320, and the third tube 330 are spaced apart along the width of the adsorption platform 200, the adsorption force in the width direction will be too large, while the adsorption force in the length direction will be too small, resulting in an uneven adsorption force distribution. In one embodiment, the first channel 213 includes a plurality of spaced-apart air channels 211 and connecting channels 212 that connect each of the air channels 211. The first tube 310 is connected to the connecting channel 212.

[0051] In this embodiment, the combination of multiple air channels 211 and connecting channels 212 enables uniform distribution of airflow within the first channel 213. When the vacuum pump extracts gas through the first tube 310, air flows from each air channel 211 to the connecting channel 212, ensuring uniform gas extraction and effectively reducing uneven adsorption caused by uneven airflow. By extracting gas from the first channel 213, a uniform negative pressure is formed between the circuit board and the adsorption platform 200. This negative pressure ensures that the circuit board is firmly adsorbed on the platform, thereby preventing displacement or deformation of the circuit board during the patch process and improving placement accuracy. In one embodiment, the adsorption platform 200 is elongated, with the air channels 211 extending along a first direction and the connecting channels 212 extending along a second direction; the first direction is the length of the adsorption platform 200, and the second direction is the width of the adsorption platform 200; and / or, each air channel 211 has the same length.

[0052] In this embodiment, the air channel 211 extends along the length of the adsorption platform 200, ensuring uniform airflow distribution along the length of the platform. The connecting channel 212 extends along the width of the platform, reducing airflow bends and resistance during transmission. This allows airflow to flow more directly to the vacuum pump, reducing pressure loss and thus improving adsorption efficiency.

[0053] Secondly, the lengths of the air channels 211 are the same, so that each air channel 211 can provide a relatively consistent amount of airflow. This helps to form a uniform negative pressure on the adsorption platform 200, ensuring that the circuit board is evenly adsorbed on the platform, and reducing displacement or deformation of the circuit board caused by uneven adsorption force.

[0054] In one embodiment, the top wall of the adsorption platform 200 includes a through-hole area 218 and a closed area 219 . The adsorption holes 220 are opened in the through-hole area 218 , and the first tube 310 is disposed corresponding to the closed area 219 .

[0055] In this embodiment, by setting the first tube 310 in the closed area 219, the first tube 310 is prevented from being directly connected to the adsorption hole 220, thereby preventing the local adsorption force from being too strong. This helps to avoid the situation where the local adsorption force is too strong during the adsorption process and ensures that the adsorption force on the entire adsorption platform 200 is evenly distributed.

[0056] In one embodiment, the adsorption platform 200 is provided with a plurality of connection holes 250 respectively connected to the plurality of adsorption tubes 300 . Any adsorption channel 210 is connected to at least one connection hole 250 . The inner diameter of the connection hole 250 is greater than the width of the adsorption channel 210 .

[0057] In this embodiment, the second channel 214 is connected to two connection holes 250, and the first channel is connected to one connection hole 250. In other embodiments, both channels may be connected to one connection hole 250. The cross-section of the adsorption channel 210 can be square or circular. When the cross-section is circular, the width of the adsorption channel 210 is the inner diameter of the circle. When the cross-section is square, the width of the adsorption channel 210 is the length of the side of the square near the top wall of the adsorption platform 200.

[0058] The inner diameter of the connection hole 250 is larger than the width of the adsorption channel 210. This design significantly reduces the resistance of the airflow as it flows through the connection hole 250. The airflow flows from the adsorption channel 210 to the larger connection hole 250, allowing for a smoother transition to the adsorption tube 300, preventing airflow from accumulating in the connection hole 250 and improving adsorption efficiency.

[0059] The present invention also provides a chip placement machine, which includes a drive device and a suction device 100. The specific structure of the suction device 100 is similar to the above-mentioned embodiment. Since the present chip placement machine adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, and will not be described in detail here. The output end of the drive device is connected to the suction device 100.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An adsorption device for a chip mounter, characterized in that: It includes an adsorption platform and multiple adsorption tubes; wherein, The adsorption platform is provided with a plurality of adsorption channels arranged at intervals to form a plurality of adsorption zones, and at least one of the adsorption channels includes a plurality of air passages interconnected with each other; The circuit board is arranged on the top wall of the adsorption platform, and the top wall of the adsorption platform is provided with a plurality of adsorption holes arranged at intervals corresponding to the adsorption channels; Any of the adsorption channels is connected to at least one of the adsorption tubes, and one end of each of the adsorption tubes away from the adsorption channel is connected to an air pump.

2. The adsorption device according to claim 1, characterized in that The plurality of adsorption channels include a first channel and a second channel that are spaced apart, and the second channel is arranged around the first channel; The plurality of adsorption tubes include a first tube and a second tube. The first tube is connected to the first channel to form a first adsorption area. The second tube is connected to the second channel to form a second adsorption area.

3. The adsorption device according to claim 2, characterized in that The plurality of adsorption tubes further include a third tube connected to the second channel, and the second tube and the third tube are respectively located on two opposite sides of the first tube.

4. The adsorption device according to claim 3, characterized in that The second channel includes a first section, a second section, and a connecting section respectively communicating with the first section and the second section. The second tube is connected to the first section, and the third tube is connected to the second section.

5. The adsorption device according to claim 4, characterized in that The adsorption platform is in the shape of an elongated strip, the second tube and the third tube are respectively arranged on both sides of the first tube in the first direction, the connecting section extends along the first direction, and the first section and the second section are symmetrically arranged along the second direction passing through the first tube; The first direction is the length direction of the adsorption platform, and the second direction is the width direction of the adsorption platform.

6. The adsorption device according to claim 2, characterized in that The first channel includes a plurality of air channels arranged at intervals and connecting channels respectively communicating with the air channels, and the first tube is connected to the connecting channels.

7. The adsorption device according to claim 6, characterized in that The adsorption platform is in an elongated shape, the air channel extends along a first direction, and the connecting channel extends along a second direction; the first direction is the length direction of the adsorption platform, and the second direction is the width direction of the adsorption platform; And / or, the airways are of the same length.

8. The adsorption device according to claim 6, wherein: The top wall of the adsorption platform includes a through-hole area and a closed area. The adsorption holes are opened in the through-hole area, and the first tube is arranged corresponding to the closed area.

9. The adsorption device according to any one of claims 1 to 8, characterized in that: The adsorption platform is provided with a plurality of connection holes respectively connected to the plurality of adsorption tubes. Any of the adsorption channels is connected to at least one of the connection holes. The inner diameter of the connection hole is greater than the width of the adsorption channel.

10. A chip mounter, characterized in that: It comprises a driving device and the adsorption device according to any one of claims 1 to 9, wherein the output end of the driving device is connected to the adsorption device.

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