Laser processing optical system

Abstract

The utility model provides a laser processing optical system which comprises a rotary table and four adsorption platforms which are evenly distributed on the peripheral side of the rotary table at intervals and used for adsorbing target substrates. The feeding and discharging device, the visual positioning device, the first laser machining device and the second laser machining device are sequentially arranged around the rotary table at intervals in a surrounding mode. The driving device is used for driving the turntable to rotate; the loading and unloading device is used for loading and unloading target substrates to the adsorption platform; the visual positioning device is used for performing visual positioning on the target substrate; the first laser processing device is used for forming a first processing light spot and processing a first grid line on the target substrate along a first linear processing direction by using the first processing light spot; and the second laser processing device is used for forming a second processing light spot and processing a second grid line on the target substrate by using the second processing light spot along a second linear processing direction perpendicular to the first linear processing direction. According to the laser processing optical system, the substrate grid line processing efficiency is improved, and the line splicing frequency can be reduced when wide grid lines are processed.

Description

Technical Field

[0001] The utility model relates to the technical field of XBC battery manufacturing, in particular to a laser processing optical system. Background Art

[0002] Existing XBC solar cell laser mold opening equipment usually includes two laser processing devices located on the same side of a conveyor line. A wafer transport device and a discharge line are equipped between the two laser processing devices and the conveyor line. The laser processing steps are as follows: first, the robot of the wafer transport device equipped with the first laser processing device moves the two substrates from the conveyor line to the processing platform of the first laser processing device, and the first laser processing device processes the main grids on the first two substrates. After the processing is completed, the robot moves the first two substrates to the discharge line and moves the second two substrates to the processing platform, and the cycle is repeated; the first two substrates move along the conveyor line to the vicinity of the second laser processing device, and the robot of the wafer transport device equipped with the second laser processing device moves the first two substrates from the conveyor line to the processing platform of the second laser processing device, and the second laser processing device processes the fine grids on the first two substrates. After the processing is completed, the robot moves the first two substrates to the discharge line and moves the second two substrates to the processing platform, and the cycle is repeated.

[0003] Therefore, the existing XBC battery laser mold opening equipment uses two linearly distributed laser processing devices to complete the main grid and auxiliary grid processing of the battery cell in succession. Between the main grid and auxiliary grid processing links, the battery cell needs to be moved between the two laser processing devices and the conveyor line, and the battery cell needs to be transferred between the two laser processing devices through the conveyor line. This makes the laser mold opening production process cumbersome, the cycle is extended, and the battery cell production efficiency is reduced.

[0004] Furthermore, existing XBC cell laser mold-opening equipment typically uses a square processing spot to create the grid lines. However, when the required fine grid width is greater than 300μm (generally around 500μm) and the main grid width is greater than 850μm (generally around 1000μm), using a square processing spot with a size typically controlled at 150×150 to 180×180μm, achieving a specific maximum grid line width requires splicing the same grid line. This involves multiple back-and-forth filling cycles to achieve a high grid line width, which increases laser processing time and affects cell production efficiency. Furthermore, when splicing is repeated frequently, defects such as gaps in some areas of the grid line or multiple splicing and stacking of some areas are likely to occur, posing a risk to the stability of the cell processing process. Utility Model Content

[0005] The utility model proposes a laser processing optical system to solve the technical problems in the prior art of XBC battery laser mold opening equipment, such as complicated laser mold opening production process and low grid line processing efficiency.

[0006] In order to solve the above problems, the technical solution adopted by the present invention is:

[0007] The utility model provides a laser processing optical system, comprising:

[0008] Turntable, four adsorption platforms, evenly spaced around the turntable, for adsorbing target substrates;

[0009] The loading and unloading device, the visual positioning device, the first laser processing device and the second laser processing device are sequentially arranged at intervals around the four sides of the turntable;

[0010] A driving device, used for driving the turntable to rotate;

[0011] The loading and unloading device is used to load and unload the target substrate onto the adsorption platform;

[0012] The visual positioning device is used to visually position the target substrate;

[0013] The first laser processing device is used to form a first processing spot and process a first grid line on the target substrate along a first linear processing direction using the first processing spot;

[0014] The second laser processing device is used to form a second processing spot, and use the second processing spot to process a second grid line on the target substrate along a second linear processing direction perpendicular to the first linear processing direction.

[0015] Preferably, the first processing spot and the second processing spot are both rectangular, and when the first processing spot processes the first grating line along the first linear processing direction, the long side direction of the rectangle of the first processing spot remains perpendicular to the first linear processing direction; when the second processing spot processes the second grating line along the second linear processing direction, the long side direction of the rectangle of the second processing spot remains perpendicular to the second linear processing direction.

[0016] Preferably, the first laser processing device includes:

[0017] a laser for emitting a laser beam;

[0018] A first reflector and a second reflector, wherein the reflective surfaces of the first reflector and the second reflector are both arranged at a 45-degree angle to the laser beam, and the first reflector and the second reflector are mirror images of each other to form a full-reflection mirror group, which is used to reflect the laser beam in a direction opposite to the incident direction;

[0019] The beam expander, the diffraction optical element and the galvanometer are sequentially arranged at intervals on the optical path of the laser beam reflected by the full return mirror group. The diffraction optical element is used to convert the incident laser beam diffused by the beam expander into a shaped laser beam with a rectangular projection, and project the shaped laser beam onto the surface of the target substrate to form a rectangular first processing spot.

[0020] Preferably, the lengths of the long sides of the rectangles of the first processing light spot and the second processing light spot are both 400-500 μm, and the lengths of the short sides of the rectangles of the first processing light spot and the second processing light spot are both 80-120 μm.

[0021] Preferably, when the turntable rotates, it drives the adsorption platform to rotate in the horizontal plane and keeps the adsorption platform horizontally set, so that the adsorption platform sequentially reaches the loading and unloading stations, substrate positioning stations, first processing stations and second processing stations with an angle interval of 90 degrees corresponding to the loading and unloading device, the visual positioning device, the first laser processing device and the second laser processing device respectively.

[0022] Furthermore, the laser processing optical system also includes:

[0023] The scribing device is used to drive the adsorption platform to move along the first linear processing direction and the second linear processing direction respectively when the adsorption platform rotates to reach the first processing station and the second processing station, so as to respectively make the first processing spot and the second processing spot process the first grid line and the second grid line on the target substrate.

[0024] Preferably, the first gate line is a fine gate provided on one side of the target substrate, and the second gate line is a main gate provided on the same side of the target substrate as the first gate line.

[0025] Preferably, the target substrate is an XBC cell, and the first gate line and the second gate line are both arranged on the back side of the target substrate.

[0026] Furthermore, the laser processing optical system also includes a material conveying device, and the loading and unloading device includes: a material moving robot for picking up the target substrate and transferring the target substrate between the material conveying device and the adsorption platform.

[0027] Preferably, the material conveying device comprises:

[0028] A feeding and conveying device is used to convey the target substrate for the material transfer robot to take;

[0029] The discharge conveying device is used to receive the target substrate taken from the adsorption platform by the material transfer robot and convey the target substrate to the downstream equipment.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The laser processing optical system provided by the utility model has a loading and unloading device, a visual positioning device, a first laser processing device and a second laser processing device centrally distributed around a turntable. The directions of the first grid line and the second grid line processed by the first laser processing device and the second laser processing device are perpendicular to each other to adapt to the change of the direction of the second grid line after the turntable rotates, omitting the steps of transferring the battery cell between the two laser processing devices and the conveyor line and between the two laser processing devices through the conveyor line, thereby improving the production efficiency of laser mold opening; the first laser processing device and the second laser processing device use rectangular processing spots, and keep the long sides of the rectangular processing spots perpendicular to the directions of the first grid line and the second grid line processed by the two, reducing the number of line splicing times when processing wider grid lines to improve efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solution proposed by the present invention, the present invention is described in detail below with reference to the embodiments and drawings. It should be understood that the embodiments and drawings described in the following specific embodiments and the drawings in the specification are merely some embodiments of the present invention, and those skilled in the art can modify these drawings under the concept of the present invention.

[0033] Figure 1 A schematic top view of the structure of an embodiment of the laser processing optical system provided by the utility model;

[0034] Figure 2 This is a schematic structural diagram of a first laser processing device of the laser processing optical system of the present invention;

[0035] Figure 3 Schematic diagram of processing wider grating lines with a traditional square processing spot;

[0036] Figure 4 This is a schematic diagram of the laser processing optical system of the present invention processing a wider grating line with a first processing spot.

[0037] Among them, the main marks of the drawings are as follows:

[0038] 1. Turntable; 2. Adsorption platform; 3. Loading and unloading device; 4. Visual positioning device; 5. First laser processing device; 51. Laser; 52. First reflector; 53. Second reflector; 54. Beam expander; 55. Diffraction optical element; 56. Galvanometer; 6. Second laser processing device; 7. Target substrate; 8. First grid line; 9. Second grid line; 10. Material conveying device; 101. Feed conveying device; 102. Discharge conveying device.

[0039] Among them, other marks in the figure are as follows:

[0040] A, first straight edge direction; B, rectangle long side direction; C, fixed axis rotation direction; D, first processing spot; E, second processing spot; F, laser beam; G, square processing spot; H, loading and unloading station; I, substrate positioning station; J, first processing station; K, second processing station; X, first linear processing direction; Y, second linear processing direction. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear, the following is a summary of the technical problems, technical solutions and beneficial effects to be solved by the present invention. Figure 1-4 And embodiments, the utility model is further described in detail.

[0042] See also Figure 1 、 2 The laser processing optical system provided by the present invention includes:

[0043] A turntable 1; at least four adsorption platforms 2 are evenly spaced around the turntable 1, such that a line connecting each adsorption platform 2 and the rotation centerline of the turntable 1 forms a 90-degree angle with a line connecting an adjacent adsorption platform 2 and the rotation centerline of the turntable 1; the adsorption platforms 2 are used to adsorb a target substrate 7 so that when the turntable 1 rotates, the target substrate 7 rotates along with the turntable 1 and the adsorption platforms 2 about a fixed axis of rotation; the rotation centerline is preferably arranged vertically (i.e., perpendicular to a horizontal plane);

[0044] The loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, and the second laser processing device 6 are sequentially arranged in a counterclockwise or clockwise direction around the turntable 1, and the lines connecting the loading and unloading device, the visual positioning device 4, the first laser processing device 5, and the second laser processing device 6 with the rotation centerline of the turntable 1 form a 90-degree angle with the lines connecting the adjacent devices with the rotation centerline of the turntable 1. The driving device is used to drive the turntable 1 to rotate counterclockwise or clockwise around the rotation centerline, thereby driving the adsorption platform 2 and the target substrate 7 to move between the various workstations corresponding to the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, and the second laser processing device 6;

[0045] The central control device is used to control the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, the second laser processing device 6 and the driving device to perform corresponding mechanical actions.

[0046] See also Figure 1Specifically, in a counterclockwise direction (this embodiment takes the counterclockwise direction as an example) or clockwise direction, the loading and unloading stations H, substrate positioning station I, first processing station J, and second processing station K are sequentially arranged around the turntable 1, and correspond to the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, and the second laser processing device 6. That is, when the turntable 1 drives the adsorption platform 2 to rotate counterclockwise, it can sequentially reach the four stations, namely the loading and unloading station H, the substrate positioning station I, the first processing station J, and the second processing station K, which are spaced at an angle of 90 degrees. The specific positions of the above-mentioned stations around the turntable 1 correspond to the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, and the second laser processing device 6 in sequence. Each time the adsorption platform 2 rotates 90 degrees counterclockwise, it can move from the previous station to the next station to enter the next process.

[0047] Among them, the loading and unloading device 3 is used to load and unload the target substrate 7 onto the adsorption platform 2 that rotates to the loading and unloading station H; the visual positioning device 4 is used to visually position the target substrate 7 that rotates to the substrate positioning station I, and transmit the position information of the target substrate 7 to the central control device, so that when the adsorption platform 2 and the target substrate 7 subsequently rotate to the first processing station J and the second processing station K, the central control device controls the adsorption platform 2 according to the position information of the target substrate 7 to perform position correction on the target substrate 7 relative to the first laser processing device 5 and the second laser processing device 6;

[0048] The first laser processing device 5 is used to form a first processing spot D, and uses the first processing spot D to process the first grid line 8 on the target substrate 7 along the first linear processing direction X; the second laser processing device 6 is used to form a second processing spot E, and uses the second processing spot E to process the second grid line 9 on the target substrate 7 along the second linear processing direction Y perpendicular to the first linear processing direction X.

[0049] See also Figure 1 In this embodiment, the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5 and the second laser processing device 6 are arranged in sequence around the turntable 1 in a counterclockwise direction. The driving device drives the turntable 1 to rotate horizontally 90 degrees counterclockwise around its vertical rotation center line along the fixed axis rotation direction C each time, so that when the turntable 1 rotates once, the adsorption platform 2 is driven to rotate 90 degrees counterclockwise in the horizontal plane perpendicular to the rotation center line, and the adsorption platform 2 is kept horizontally set, so that each adsorption platform 2 and the target substrate 7 arrives at the loading and unloading station H, substrate positioning station I, first processing station J and second processing station K with an angle interval of 90 degrees and corresponding to the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5 and the second laser processing device 6 respectively with each rotation of the turntable 1.

[0050] See also Figure 3When a traditional laser processing optical system uses a square processing spot G to process a wider grid line, it needs to splice the lines three times, that is, it is necessary to drive the adsorption platform 2 to drive the target substrate 7 to move linearly three times relative to the square processing spot G, so that the square processing spot G can draw lines on the surface of the target substrate 7 three times, two of which are separated by intervals, and the third line overlaps with one of the previous two lines, or overlaps with the previous two lines at the same time; for a wider grid line, if a smaller square processing spot G is used to draw the lines only twice, it is impossible to meet the requirement of two lines to completely cover the grid line to form a full width.

[0051] See also Figure 1 In this embodiment, the target substrate 7 is rectangular, and the first grid lines 8 are parallel to the first straight side direction A of the target substrate 7, that is, the first linear processing direction X is parallel to both the first grid lines 8 and the first straight side direction A; the second grid lines 9 are parallel to the first straight side direction A of the target substrate 7, that is, the second grid lines 9 are parallel to both the first grid lines 8 and the first straight side direction A. The first processing spot D and the second processing spot E are both rectangular, and the long side direction B of the first processing spot D is perpendicular to the long side direction B of the second processing spot E, that is, the short side direction of the first processing spot D is perpendicular to the short side direction of the second processing spot E.

[0052] See also Figure 4 When the rectangular first processing spot D processes the first grating line 8 on the target substrate 7 arriving at the first processing station J along the first linear processing direction X, since the rectangular long side direction B of the first processing spot D remains perpendicular to the first linear processing direction X (and perpendicular to the first straight side direction A), the first grating line 8 is processed with the wider rectangular long side of the first processing spot D, which can reduce the number of times the first laser processing device 5 uses the first processing spot D to splice the first grating line 8, so that the laser processing optical system does not need to splice the first processing spot D three times when using the rectangular first processing spot D to process the wider grating line. It only needs to drive the adsorption platform 2 to drive the target substrate 7 to move linearly twice relative to the rectangular first processing spot D, so that the rectangular first processing spot D can draw lines on the surface of the target substrate 7 twice, and the two overlapping lines can be completely covered by the two lines to form a grating line of full width.

[0053] See also Figure 1When the second processing light spot E processes the second grid line 9 along the second linear processing direction Y, the rectangular long side direction B of the second processing light spot E remains perpendicular to the second linear processing direction Y (and also perpendicular to the second straight-side direction). Specifically, when the turntable 1 rotates once (90 degrees) to drive the adsorption platform 2 and the target substrate 7 from the first processing station J to the second processing station K, the target substrate 7 rotates horizontally 90 degrees on the horizontal plane, so that when arriving at the second processing station K, the first straight-side direction A of the target substrate 7 rotates horizontally 90 degrees on the horizontal plane. At this time, in order to process the second grid line 9 parallel to the first straight-side direction A, the second linear processing direction Y and the first linear processing direction X need to form an angle of 90 degrees, that is, the second processing light spot E processes the second grid line 9 on the target substrate 7 along the second linear processing direction Y perpendicular to the first linear processing direction X, and the second linear processing direction Y is parallel to the second grid line 9 and the first straight-side direction A after rotating 90 degrees.

[0054] Therefore, when the rectangular second processing spot E processes the second grid line 9 on the target substrate 7 arriving at the second processing station K along the second linear processing direction Y perpendicular to the first linear processing direction X, since the rectangular long side direction B of the second processing spot E remains perpendicular to the second linear processing direction Y, the second grid line 9 is processed with the wider rectangular long side of the second processing spot E, which can also reduce the number of times the second processing spot E is used to splice the second grid line 9 when the second laser processing device 6 processes the second grid line 9.

[0055] At the same time, the laser processing optical system provided by the present invention has a loading and unloading device 3, a visual positioning device 4, a first laser processing device 5 and a second laser processing device 6 centrally distributed around a turntable 1. The first linear processing direction X and the second linear processing direction Y of the first laser processing device 5 and the second laser processing device 6 for processing the first grid line 8 and the second grid line 9 are perpendicular to each other to adapt to the change in the direction of the second grid line 9 of the target substrate 7 after the turntable 1 rotates, thereby omitting the steps of transporting the battery cell between the two laser processing devices and the conveyor line and between the two laser processing devices through the conveyor line.

[0056] In addition, four adsorption platforms 2 are evenly spaced around the turntable 1. Each time the turntable 1 rotates (90 degrees counterclockwise), each adsorption platform 2 rotates with the turntable 1 from the previous station to the next station, and the batch and continuous non-transfer first grid line and second grid line processing operations of multiple target substrates 7 are realized in a cycle.

[0057] In summary, the laser processing optical system of the present invention effectively improves the production efficiency of laser mold opening.

[0058] As a preferred implementation of this embodiment, the lengths of the long sides of the rectangles of the first processing light spot D and the second processing light spot E are both 400-500 μm, preferably 450 μm, and the lengths of the short sides of the rectangles of the first processing light spot D and the second processing light spot E are both 80-120 μm, preferably 100 μm.

[0059] See also Figure 2 In this embodiment, the first laser processing device 5 includes:

[0060] A laser 51 is used to emit a laser beam F; a first reflector 52 and a second reflector 53, wherein the reflective surfaces of the first reflector 52 and the second reflector 53 are both at an angle of 45 degrees to the laser beam F, and the first reflector 52 and the second reflector 53 are mirror images of each other to form a full-reflection mirror group, which is used to reflect the laser beam F in a direction opposite to the incident direction; the laser beam F emitted from the laser 51 first enters the reflective surface of the first reflector 52 at an incident angle of 45 degrees, and then enters the second reflector 53 at an exit angle of 45 degrees, until the laser beam F enters the reflective surface of the second reflector 53 at an incident angle of 45 degrees and then exits at an exit angle of 45 degrees. At this time, the incident laser beam emitted by the laser 51 is twice reflected by the full-reflection mirror group formed by the first reflector 52 and the second reflector 53, so that the reflected laser beam emitted from the full-reflection mirror group is emitted to the beam expander in an optical path opposite to the incident laser beam;

[0061] The beam expander 54, the diffraction optical element 55 (DOE optical element) and the galvanometer 56 are sequentially arranged at intervals on the optical path of the laser beam F reflected by the full return mirror group, wherein the diffraction optical element 55 is used to convert the incident laser beam diffused by the beam expander 54 into a shaped laser beam with a rectangular projection, and project the shaped laser beam onto the surface of the target substrate to form a first processing spot D with a rectangular shape (rectangular flat top) and uniform energy density.

[0062] In this embodiment, the second laser processing device 6 has the same structure and function as the first laser processing device 5, and also includes the above-mentioned laser 51, the first reflector 52, the second reflector 53, the beam expander 54, the diffraction optical element 55 and the galvanometer 56, wherein the diffraction optical element 55 is used to convert the incident laser beam diffused by the beam expander 54 into a shaped laser beam projected in a rectangular shape, and project the shaped laser beam onto the surface of the target substrate to form a second processing spot E that is rectangular (rectangular flat top) and has uniform energy density.

[0063] In this embodiment, the laser processing optical system further includes:

[0064] The scribing device (not shown in the figure) is used to drive the adsorption platform 2 to reciprocate along the first linear processing direction X and the second linear processing direction Y respectively when the adsorption platform 2 rotates to reach the first processing station J and the second processing station K, so as to respectively make the first processing spot D and the second processing spot E process the first grid line 8 and the second grid line 9 on the target substrate 7.

[0065] See also Figure 1 In this embodiment, the first gate line 8 is a fine gate provided on one side of the target substrate 7 , and the second gate line 9 is a main gate provided on the same side of the target substrate 7 as the first gate line 8 .

[0066] In this embodiment, the target substrate 7 is an XBC cell, and the first gate lines 8 and the second gate lines 9 are both disposed on the back side of the target substrate 7 .

[0067] In other embodiments, the first gate lines 8 may also be main gates provided on one side of the target substrate 7 , and the second gate lines 9 may be fine gates provided on the same side of the target substrate 7 as the first gate lines 8 .

[0068] In this embodiment, the laser processing optical system further includes a material conveying device 10, which is provided on a side of the loading and unloading device 3 away from the adsorption platform 2 and the turntable 1. The loading and unloading device 3 includes:

[0069] The material transfer robot (not shown in the figure) is used to pick up the target substrate 7 to transfer the target substrate 7 between the material conveying device 10 and the adsorption platform 2 that rotates to reach the loading and unloading station H.

[0070] In this embodiment, the material conveying device 10 includes:

[0071] The feeding and conveying device 101 is used to convey the target substrate 7 for the material transfer robot to take;

[0072] The discharge conveying device 102 is used to receive the target substrate 7 taken from the adsorption platform 2 by the material transfer robot and convey the target substrate 7 to the downstream equipment.

[0073] As a preferred implementation of this embodiment, the feed conveying device 101 and the discharge conveying device 102 use synchronous belts or chain plate conveyor belt devices, and the material transfer robot uses a vacuum suction cup or pneumatic clamp robot.

[0074] In other embodiments, the material conveying device 10 may not be divided into the above-mentioned feeding conveying device 101 and discharging conveying device 102, but may adopt an integrated synchronous belt or chain plate conveyor belt device.

[0075] In another embodiment (not shown), five adsorption platforms 2 are evenly spaced around the turntable 1, that is, the line connecting each adsorption platform 2 and the rotation centerline of the turntable 1 forms an angle of 72 degrees with the line connecting the adjacent adsorption platform 2 and the rotation centerline of the turntable 1; the laser processing optical system further includes:

[0076] The pad and mark point processing device, the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, the second laser processing device 6, and the pad and mark point processing device (not shown in the figure) are arranged in a counterclockwise or clockwise direction in sequence around the circumference of the turntable 1. The loading and unloading station H, the substrate positioning station I, the first processing station J, the second processing station K, and the pad and mark point processing device are arranged in a counterclockwise or clockwise direction in sequence around the turntable 1 in a one-to-one correspondence with the loading and unloading device 3, the visual positioning device 4, the first laser processing device 5, the second laser processing device 6, and the pad and mark point processing device. The pad and mark point processing device is used to perform pad and mark point processing on the target substrate 7 that rotates and reaches the pad and mark point processing device.

[0077] In other embodiments (not shown in the figures), the number of adsorption platforms 2 can also be six or more, and the corresponding number of processing devices and their corresponding processing stations can also be increased accordingly to adapt to the change in the spacing angle of the adsorption platforms 2, so that the laser processing optical system can add one or more process flows, which will not be repeated here.

[0078] See also Figure 1 The working steps of the laser processing optical system provided by the present invention are as follows:

[0079] The feed conveyor 101 of the material conveying device 10 conveys multiple target substrates 7 one by one to the vicinity of the loading and unloading station H; the loading and unloading device 3 transfers the first target substrate 7 from the feed conveyor 101 to the first adsorption platform 2 that rotates to reach the loading and unloading station H, and the adsorption platform 2 adsorbs the first target substrate 7;

[0080] The driving device drives the turntable 1 to rotate counterclockwise 90 degrees along the fixed axis rotation direction C, so that the first target substrate 7 adsorbed on the first adsorption platform 2 rotates to the substrate positioning station I. The visual positioning device 4 visually locates the first target substrate 7 that has rotated to the substrate positioning station I; at the same time, the loading and unloading device 3 transfers the second target substrate 7 from the feeding and conveying device 101 to the second adsorption platform 2 that has rotated to the loading and unloading station H, and the second target substrate 7 is adsorbed by the second adsorption platform 2;

[0081] The driving device drives the turntable 1 to rotate counterclockwise by 90 degrees along the fixed-axis rotation direction C, so that the first target substrate 7 adsorbed on the first adsorption platform 2 rotates to the first processing station J. The scribing device drives the first adsorption platform 2 to reciprocate along the first linear processing direction X (for scribing) and the second linear processing direction Y (for parallel switching of the scribing path), and cooperates with the first processing spot D formed by the first laser processing device 6 to process the first grid line 8 (fine grid) on the first target substrate 7 along the first linear processing direction X (the target substrate 7 moves linearly relative to the first processing spot E); at the same time, the second target substrate 7 adsorbed on the second adsorption platform 2 rotates to the substrate positioning station I, and the visual positioning device 4 visually locates the second target substrate 7 that rotates to the substrate positioning station I; the loading and unloading device 3 transfers the third target substrate 7 from the feeding and conveying device 101 to the third adsorption platform 2 that rotates to the loading and unloading station H, and the third target substrate 7 is adsorbed by the third adsorption platform 2;

[0082] The driving device drives the turntable 1 to rotate counterclockwise 90 degrees along the fixed axis rotation direction C, so that the first target substrate 7 adsorbed on the first adsorption platform 2 rotates to the second processing station K, and the scribing device drives the first adsorption platform 2 to reciprocate along the second linear processing direction Y and the first linear processing direction X, and cooperates with the second processing spot E formed by the second laser processing device 5 to process the second grid line 9 (main grid) on the second target substrate 7 along the second linear processing direction Y; at the same time, the second target substrate 7 adsorbed on the second adsorption platform 2 rotates to the first processing station J, and the scribing device drives the second adsorption platform 2 to reciprocate along the first linear processing direction X. It reciprocates in the X and second linear processing directions Y, and cooperates with the first processing spot D formed by the first laser processing device 6 to process the first grid line 8 (fine grid) on the second target substrate 7 along the first linear processing direction X with the first processing spot D; at the same time, the third target substrate 7 adsorbed on the third adsorption platform 2 rotates to the substrate positioning station I, and the visual positioning device 4 visually positions the third target substrate 7 that has rotated to the substrate positioning station I; at the same time, the loading and unloading device 3 transfers the fourth target substrate 7 from the feeding and conveying device 101 to the fourth adsorption platform 2 that has rotated to the loading and unloading station H, and the fourth target substrate 7 is adsorbed by the fourth adsorption platform 2;

[0083] The driving device drives the turntable 1 to rotate counterclockwise 90 degrees along the fixed-axis rotation direction C, so that the first target substrate 7 adsorbed on the first adsorption platform 2 rotates back to the loading and unloading station H, the adsorption platform 2 turns off the vacuum and stops adsorbing the first target substrate 7, and the loading and unloading device 3 transfers the first target substrate 7 from the first adsorption platform 2 that rotates to the loading and unloading station H to the unloading conveyor device 102; the second to fourth adsorption platforms 2 and the second to fourth target substrates 7 adsorbed thereon repeat the above steps performed by the first adsorption platform 2 and the first target substrate 7 adsorbed thereon, thereby completing the grid line processing operations of the second to fourth target substrates 7;

[0084] The driving device drives the turntable 1 to rotate 4×90 degrees counterclockwise along the fixed axis rotation direction C to complete the entire process flow of an adsorption platform 2 and its adsorbed target substrate 7. In this cycle, the four adsorption platforms 2 can batch complete the grid line processing operations of the fifth to Nth target substrates 7.

[0085] In summary, the laser processing optical system of the present invention can realize the grooving or molding of the main grid (first grid line 8) and fine grid (second grid line 9) of the target substrate, and greatly improves the production efficiency of laser molding / grooving.

[0086] In this embodiment, different wafer materials, surface processes and laser process parameters can be flexibly selected according to the number, length and shape of the gate lines required to be processed in actual production. For example, the laser processing speed, laser power, number of processing times, etc. can be adjusted as needed to adaptively adjust the production efficiency of the laser processing optical system.

[0087] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art should understand that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser processing optical system, characterized in that: include: A turntable (1), at least four adsorption platforms (2), evenly spaced and distributed around the turntable (1), for adsorbing a target substrate (7); The loading and unloading device (3), the visual positioning device (4), the first laser processing device (5) and the second laser processing device (6) are sequentially arranged at intervals around the four sides of the turntable (1); A driving device for driving the turntable (1) to rotate; The loading and unloading device (3) is used for loading and unloading the target substrate (7) onto the adsorption platform (2); The visual positioning device (4) is used to perform visual positioning on the target substrate (7); The first laser processing device (5) is used to form a first processing light spot (D), and to process a first grid line (8) on a target substrate (7) along a first linear processing direction (X) using the first processing light spot (D); The second laser processing device (6) is used to form a second processing spot (E), and to process a second grid line (9) on a target substrate (7) along a second linear processing direction (Y) perpendicular to the first linear processing direction (X) using the second processing spot (E).

2. The laser processing optical system according to claim 1, wherein: The first processing light spot (D) and the second processing light spot (E) are both rectangular, and when the first processing light spot (D) processes the first grid line (8) along the first linear processing direction (X), the long side direction (B) of the rectangle of the first processing light spot (D) remains perpendicular to the first linear processing direction (X); when the second processing light spot (E) processes the second grid line (9) along the second linear processing direction (Y), the long side direction (B) of the rectangle of the second processing light spot (E) remains perpendicular to the second linear processing direction (Y).

3. The laser processing optical system according to claim 2, wherein: The first laser processing device (5) comprises: a laser (51) for emitting a laser beam (F); a first reflecting mirror (52) and a second reflecting mirror (53), wherein the reflecting mirror surfaces of the first reflecting mirror (52) and the second reflecting mirror (53) are both arranged at an angle of 45 degrees to the laser beam (F), and the first reflecting mirror (52) and the second reflecting mirror (53) are mirror images of each other to form a full-reflection mirror group, and are used to reflect the laser beam (F) in a direction opposite to the incident direction; A beam expander (54), a diffraction optical element (55) and a galvanometer (56) are sequentially arranged at intervals on the optical path of the laser beam (F) reflected by the full return mirror group. The diffraction optical element (55) is used to convert the incident laser beam diffused by the beam expander (54) into a shaped laser beam projected in a rectangular shape, and project the shaped laser beam onto the surface of the target substrate to form the first rectangular processing light spot (D).

4. The laser processing optical system according to claim 2, wherein: The lengths of the long sides of the rectangles of the first processing light spot (D) and the second processing light spot (E) are both 400-500 μm, and the lengths of the short sides of the rectangles of the first processing light spot (D) and the second processing light spot (E) are both 80-120 μm.

5. The laser processing optical system according to any one of claims 1 to 4, characterized in that: When the turntable (1) rotates, it drives the adsorption platform (2) to rotate in a horizontal plane and keeps the adsorption platform (2) horizontally arranged, so that the adsorption platform (2) sequentially reaches the loading and unloading stations (H), substrate positioning stations (I), first processing stations (J) and second processing stations (K) with an angular interval of 90 degrees and corresponding to the loading and unloading device (3), the visual positioning device (4), the first laser processing device (5) and the second laser processing device (6), respectively.

6. The laser processing optical system according to claim 5, wherein: Also includes: A scribing device is used for driving the adsorption platform (2) to move along the first linear processing direction (X) and the second linear processing direction (Y) respectively when the adsorption platform (2) rotates to reach the first processing station (J) and the second processing station (K), so as to respectively cause the first processing light spot (D) and the second processing light spot (E) to process the first grid line (8) and the second grid line (9) on the target substrate (7).

7. The laser processing optical system according to any one of claims 1 to 4, characterized in that: The first grid line (8) is a fine grid provided on one side of the target substrate (7), and the second grid line (9) is a main grid provided on the same side of the target substrate (7) as the first grid line (8).

8. The laser processing optical system according to claim 7, wherein: The target substrate (7) is an XBC cell, and the first grid line (8) and the second grid line (9) are both arranged on the back side of the target substrate (7).

9. The laser processing optical system according to any one of claims 1 to 4, wherein: It also includes a material conveying device (10) arranged on one side of the loading and unloading device (3), and the loading and unloading device (3) includes: The material transfer robot is used to take the target substrate (7) and transfer the target substrate (7) between the material conveying device (10) and the adsorption platform (2).

10. The laser processing optical system according to claim 9, wherein: The material conveying device (10) comprises: A material feeding and conveying device (101) for conveying the target substrate (7) for the material transfer robot to take; The discharge conveying device (102) is used to receive the target substrate (7) taken from the adsorption platform (2) by the material transfer robot and convey the target substrate (7) to the downstream equipment.

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