Target material polishing device and magnetron sputtering equipment

Abstract

The utility model discloses a target material polishing device and magnetron sputtering equipment, the target material polishing device comprises a driving assembly and a polishing piece, the driving assembly is configured on the target material side of the magnetron sputtering equipment; the polishing part is rotatably arranged and is in driving connection with the driving assembly, and the driving assembly drives the polishing part to move in at least two intersecting directions and polish the surface of the target material. According to the technical scheme, the target material polishing device can improve efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum coating, in particular to a target material grinding device and magnetron sputtering equipment. Background Art

[0002] Transparent conductive oxide (TCO) films are a key component of optoelectronic and photovoltaic thin-film devices and are widely used in large-area flat-panel displays and thin-film solar cells. Currently, when using physical vapor deposition (PVD) techniques, such as magnetron sputtering, to deposit TCO films, nodules gradually form in certain areas of the PVD target after a period of discharge, affecting the coating. Therefore, these nodules must be polished away.

[0003] However, the existing method of grinding planar targets requires shutting down the magnetron sputtering equipment and removing the planar targets, and the grinding method is basically manual grinding, which has problems such as long time consumption and low grinding efficiency, seriously affecting the production capacity of the magnetron sputtering equipment. Utility Model Content

[0004] The main purpose of the utility model is to provide a target material grinding device, aiming to solve the problem of low grinding efficiency caused by the need to stop the machine and remove the planar target before grinding.

[0005] To achieve the above-mentioned purpose, the target grinding device proposed in the present invention includes:

[0006] a drive assembly disposed on a target side of the magnetron sputtering apparatus; and

[0007] A grinding piece is rotatably arranged and is drivingly connected to the driving assembly. The driving assembly drives the grinding piece to move along at least two intersecting directions and grind the surface of the target material.

[0008] The grinding part of the target material grinding device can be rotatably set and can be used to grind flat target materials. The driving component is arranged in the magnetron sputtering equipment. There is no need to open the cavity of the magnetron sputtering equipment, and there is no need to remove the target material. The target material surface can be directly ground in the magnetron sputtering equipment, thereby saving the disassembly and assembly process and improving the grinding efficiency.

[0009] In one embodiment of the present invention, the target grinding device further comprises a guide rail assembly, wherein the guide rail assembly comprises a transverse guide rail, a longitudinal guide rail and a depth guide rail which are perpendicular to each other and movably connected to each other;

[0010] The grinding piece can be movably connected to one of the transverse guide rail, the longitudinal guide rail and the depth guide rail, and the driving assembly drives the grinding piece to move along the transverse guide rail, the longitudinal guide rail and the depth guide rail.

[0011] By setting the guide rail assembly, the driving assembly can drive the grinding piece more directional, the movement of the grinding piece is more stable, and the grinding effect is improved.

[0012] In one embodiment of the present invention, there are two transverse guide rails and two depth guide rails. The two transverse guide rails are arranged on opposite sides of the target material. One end of each depth guide rail is slidably connected to the transverse guide rail, and the other end is connected to one end of the longitudinal guide rail. The grinding piece is slidably connected to the longitudinal guide rail.

[0013] Here, the provision of the transverse guide rail and the depth guide rail can improve the connection stability of the guide rail assembly and further improve the stability of the movement of the grinding part.

[0014] In one embodiment of the present invention, the target material grinding device further includes a control component and a detection component, and the control component is electrically connected to the drive component and the detection component;

[0015] The detection component is arranged on one side of the grinding piece, and is used to detect and feedback the surface condition of the target material. The control component adjusts the driving logic of the driving component according to the surface condition, thereby controlling the grinding trajectory of the grinding piece.

[0016] By setting up detection components and control components and electrically connecting them to the drive components, real-time feedback of the grinding situation can be achieved and the grinding trajectory can be automatically changed, further improving the grinding effect.

[0017] In one embodiment of the present invention, the detection component is a three-dimensional profilometer.

[0018] Here, the three-dimensional profilometer is an instrument used to measure the three-dimensional morphology of an object's surface. It can non-destructively monitor roughness and microscopic morphology, has nanometer-level resolution, and is compatible with various 2D and 3D standards. It has high detection accuracy and can accurately measure the surface morphology and characteristics of the target material.

[0019] In one embodiment of the present invention, the target material grinding device also includes a dust suction component, the grinding piece is provided with a dust suction hole running through its axial direction, the dust suction component has a dust suction channel, one end of the dust suction channel is connected to the dust suction hole, and the other end is connected to an external suction device.

[0020] The setting of the dust collection component can allow the dust and dirt generated during the grinding process to be sucked to the outside through the dust collection holes and dust collection channels of the grinding workpiece, thereby reducing the dust or dirt in the magnetron sputtering equipment and improving the operating stability of the equipment.

[0021] In one embodiment of the present invention, the dust collection assembly includes a connecting bracket and a dust collection pipe, one end of the connecting bracket is connected to the polishing piece and communicates with the dust collection hole, and the other end is slidably connected to the guide rail assembly;

[0022] One end of the dust suction pipe is connected to the peripheral side of the connecting bracket and communicated with the inside of the connecting bracket, and the other end is connected to an external suction device. The interior of the connecting bracket and the dust suction pipe are enclosed to form the dust suction channel.

[0023] Here, the connecting bracket can not only play the role of installing and supporting the polishing piece, but also connect the interior of the polishing piece and the dust suction pipe, thereby simplifying the structure.

[0024] In one embodiment of the present invention, there are multiple dust suction holes, and the multiple dust suction holes are distributed at intervals on the grinding piece. A folding cover is provided on the side of the grinding piece facing the connecting bracket. One end of the folding cover is provided on the multiple dust suction holes, and the other end is connected to one end of the dust suction channel.

[0025] The provision of multiple dust suction holes can increase the dust suction capacity, and the provision of a retractable cover can simplify the structure of the connecting bracket and improve the dust suction effect.

[0026] In one embodiment of the present invention, the dust collection assembly further includes a first dust cover, which is arranged around the circumference of the grinding piece, and a side cover is connected to one end of the dust collection assembly.

[0027] Here, the provision of the first dust cover can collect dust overflowing from the end face of the polishing piece, further improving the dust collection effect.

[0028] In one embodiment of the present invention, the portion of the first dust cover arranged around the circumference of the grinding piece is an elastic portion, and the elastic portion is retractable in the axial direction of the grinding piece.

[0029] Here, the setting of the elastic part can elastically abut and cover the grinding area of the grinding piece, reduce dust scattering, and at the same time reduce damage to the target material, thereby improving protection.

[0030] In one embodiment of the present invention, the dust suction assembly also includes a second dust cover, which is arranged around the circumference of the first dust cover, and a side cover is connected to the side of the grinding part facing the guide rail assembly, and the interior of the second dust cover is connected to the dust suction channel.

[0031] The second dust cover combined with the first dust cover can form a double-layer dust collection structure, further reducing the risk of dust overflowing into the interior of the magnetron sputtering equipment.

[0032] In one embodiment of the present invention, the second dust cover is made of rubber.

[0033] The second dust cover made of this material can reduce damage to the target material and improve protection.

[0034] The present invention also proposes a magnetron sputtering device, comprising a target material grinding device and a magnetron sputtering device as described above, wherein the magnetron sputtering device comprises a shell and a target material, wherein the shell forms a closed cavity, the target material is arranged in the closed cavity, and the target material grinding device is arranged in the closed cavity and is located on one side of the target material.

[0035] The magnetron sputtering equipment equipped with the target grinding device can improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0037] Figure 1 This is a schematic structural diagram of an embodiment of the target grinding device of the present invention installed on the target side;

[0038] Figure 2 for Figure 1 A front view of the target grinding device shown installed on the target side;

[0039] Figure 3 for Figure 2 Sectional view along line AA;

[0040] Figure 4 for Figure 3 Enlarged view of point B in the middle;

[0041] Figure 5 for Figure 1 The target grinding device is shown as a left side view mounted on the target side;

[0042] Figure 6 for Figure 5 An exploded view of the target grinding device shown is installed on the target side;

[0043] Figure 7 for Figure 1 The target grinding device is shown as a top view installed on the target side.

[0044] Description of Figure Numbers:

[0045] 100. Magnetron sputtering equipment; 10. Target grinding device; 13. Detection assembly; 14. Dust collection assembly; 11. Grinding piece; 141. Connecting bracket; 111. Dust collection hole; 142. Dust collection tube; 112. Retracting cover; 143. First dust cover; 12. Guide rail assembly; 1431. Elastic part; 121. Horizontal guide rail; 144. Second dust cover; 122. Longitudinal guide rail; 20. Housing; 123. Depth guide rail; 30. Target.

[0046] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0049] In this utility model, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0050] In addition, the descriptions of "first", "second", etc. in the present utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that meet both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0051] Transparent conductive oxide (TCO) films are a key component of optoelectronic and photovoltaic thin-film devices and are widely used in large-area flat-panel displays, thin-film solar cells, and other applications. Among the methods used to produce TCO films, magnetron sputtering is the most widely used industrial process for preparing TCO films due to its excellent operability and high film formation rate. The basic principle of magnetron sputtering is to utilize a glow discharge phenomenon controlled by a magnetic field to accelerate gas particles to bombard the target surface, causing atoms or molecules on the target surface to be sputtered and deposited on the substrate surface.

[0052] The magnetron sputtering coating equipment described in the embodiments of the present invention can be used to manufacture liquid crystal panels, solar panels, fuel cell electrodes, and the like, thereby improving the quality and performance of the thin films and, in turn, the performance and efficiency of the entire new energy device. Furthermore, by enhancing the catalytic activity and stability of the electrodes, the performance and lifespan of the fuel cell can be enhanced. Of course, the magnetron sputtering coating equipment of the embodiments of the present invention can also be used in other thin film production applications.

[0053] However, when using magnetron sputtering equipment to produce TCO thin films, nodules gradually form on certain areas of the PVD target after a period of discharge, affecting the coating. These nodules therefore require regular polishing. Existing polishing of flat targets requires shutting down the magnetron sputtering equipment and removing the target for additional fixturing. This polishing process is typically manual, resulting in time-consuming and inefficient polishing, which significantly impacts the production capacity of the magnetron sputtering equipment.

[0054] Based on the above background, the utility model proposes a target material grinding device. By arranging the target material grinding device on the target material side in the magnetron sputtering equipment, when the target material is not working, the grinding part is driven by the driving component to automatically grind the surface of the target material. There is no need to open the magnetron sputtering equipment or disassemble and assemble the equipment, which effectively improves the grinding efficiency and coating efficiency.

[0055] Please refer to Figure 1 and Figure 2 In one embodiment of the present invention, the target material grinding device 10 includes a driving component and a grinding piece 11, and the driving component is arranged on the target material 30 side of the magnetron sputtering equipment 100; the grinding piece 11 can be rotatably arranged and driven to be connected to the driving component, and the driving component drives the grinding piece 11 to move along at least two intersecting directions and grind the surface of the target material 30.

[0056] The driving assembly in this embodiment is a mechanism that drives the grinding piece 11 to move on the surface of the target material 30. The driving assembly can be a driving piece, or a driving piece combined with a transmission piece, which is not limited here. The driving piece can be a cylinder, an electric cylinder, or a motor, etc., which is not limited here. The transmission piece can be a screw nut assembly, a gear rack, etc., which is not limited here. The driving assembly is used to be arranged on the target material 30 side of the magnetron sputtering equipment 100, which means that the driving assembly is installed in the magnetron sputtering equipment 100 in a detachable or non-detachable manner when in use, and is located on the side of the target material 30. For example, it can be connected to the closed cavity wall in the magnetron sputtering equipment 100, so that the grinding piece 11 can be driven to move along the surface of the target material 30. The target material 30 is a planar target material 30, and the cross-sectional shape can be rectangular or circular, which is not limited here.

[0057] The grinding member 11 is a structure that contacts the surface of the target material 30 and rotatably rubs the surface of the target material 30, thereby smoothing, brightening, or improving the surface quality of the target material 30. The grinding member 11 can be a grinding wheel, a sanding disc, a polishing rod, etc., and is not limited here. The grinding member 11 can be rotatably driven by an external power source, such as a motor, or it can have a rotatable rotor and stator internally, and the magnetic field generated by supplying electricity to the stator drives the rotor to rotate the grinding member 11.

[0058] The movement in at least two intersecting directions here means that the grinding piece 11 can move in at least two intersecting directions along the surface of the target material 30, so as to realize grinding in an area of the target material. For example, it can be mutually perpendicular directions, horizontal and vertical directions; it can also be movement in three mutually perpendicular directions; or it can be movement in two mutually perpendicular directions and a third direction inclined to both of them, which is not limited here.

[0059] The grinding member 11 of the target grinding device 10 of this embodiment is rotatable and can be used to grind a planar target 30. Furthermore, the drive assembly is disposed within the magnetron sputtering apparatus 100, directly driving the grinding member 11 within the magnetron sputtering apparatus 100 to automatically grind the entire surface of the planar target 30. This eliminates the need to open the chamber of the magnetron sputtering apparatus 100, remove the target 30, or reassemble it, thereby reducing the need for disassembly and assembly steps and improving grinding efficiency.

[0060] Please refer to Figure 2 and Figure 3 In one embodiment of the present invention, the target grinding device 10 further includes a guide rail assembly 12, wherein the guide rail assembly 12 includes a transverse guide rail 121, a longitudinal guide rail 122 and a depth guide rail 123 which are perpendicular to each other and movably connected to each other;

[0061] The grinding member 11 can be movably connected to one of the transverse guide rail 121 , the longitudinal guide rail 122 , and the depth guide rail 123 , and the driving assembly drives the grinding member 11 to move along the transverse guide rail 121 , the longitudinal guide rail 122 , and the depth guide rail 123 .

[0062] The guide rail assembly 12 is a structure used to guide the movement of the grinding member 11. The transverse guide rail 121, longitudinal guide rail 122, and depth guide rail 123 refer to the following: when the surface of the target 30 is parallel to the vertical plane, the guide rail structure extending in the horizontal direction is the transverse guide rail 121, the guide rail structure extending in the vertical direction is the longitudinal guide rail 122, and the guide rail extending perpendicular to the surface of the target 30 is the depth guide rail 123. The transverse guide rail 121, the longitudinal guide rail 122, and the depth guide rail 123 are perpendicular to each other and movably connected to each other, which means that the extension directions of the three are perpendicular to each other, the transverse guide rail 121 is movably connected to the longitudinal guide rail 122, and the depth guide rail 123 is movably connected to the longitudinal guide rail 122, or the transverse guide rail 121 is movably connected to the depth guide rail 123, and the depth guide rail 123 is movably connected to the longitudinal guide rail 122, or the longitudinal guide rail 122 is connected to the transverse guide rail 121, and the transverse guide rail 121 is movably connected to the depth guide rail 123. Here, the movable connection can be a sliding connection, a rolling connection, etc. In other examples, the target grinding device 10 can also be provided with a slide groove structure so that the grinding piece 11 slides in the slide groove. Based on the guide rail assembly 12, the driving assembly can be set to three linear motors, namely, a horizontal linear motor, a longitudinal linear motor and a depth linear motor, so that they can be tightly integrated with the guide rail assembly 12, thereby improving the driving performance and efficiency, and having low maintenance costs, and reducing the space occupied inside the magnetron sputtering equipment 100.

[0063] According to the connection relationship of the three guide rail structures mentioned above, the grinding member 11 can be movably connected to one of the transverse guide rail 121, the longitudinal guide rail 122 and the depth guide rail 123. For example, when the transverse guide rail 121 is movably connected to the longitudinal guide rail 122 and the depth guide rail 123 is movably connected to the longitudinal guide rail 122, the grinding member 11 can be movably connected to the depth guide rail 123, and the transverse guide rail 121 is connected to the inside of the magnetron sputtering equipment 100, so that the longitudinal guide rail 122 can move laterally relative to the transverse guide rail 121, the depth guide rail 123 can move longitudinally relative to the longitudinal guide rail 122, and the grinding member 11 can move perpendicular to the surface of the target material 30 relative to the depth guide rail 123. In other examples, the grinding member 11 can also be movably connected to the transverse guide rail 121 or the longitudinal guide rail 122 to achieve its movement in three directions. The movable connection here can be a sliding connection or a rolling connection.

[0064] In this embodiment, the provision of the guide rail assembly 12 allows the drive assembly to drive the polishing member 11 with greater guidance, resulting in more stable movement of the polishing member 11 and improved polishing performance. Furthermore, the three mutually perpendicular guide rail structures enable the polishing member 11 to move in three mutually perpendicular directions, reducing the movement path of the polishing member 11 and improving efficiency. Furthermore, the machine can be used for targets 30 with rectangular cross-sections, thereby enabling better polishing of the entire surface of the target 30.

[0065] Please refer to Figure 2 and Figure 3 as well as Figure 7 In one embodiment of the present invention, there are two transverse guide rails 121 and two depth guide rails 123. The two transverse guide rails 121 are respectively located on opposite sides of the target material 30. One end of each depth guide rail 123 is slidably connected to the transverse guide rail 121, and the other end is connected to one end of the longitudinal guide rail 122. The grinding piece 11 is slidably connected to the longitudinal guide rail 122.

[0066] The fact that there are two transverse guide rails 121 means that there are two transverse guide rails 121, and the fact that there are two depth guide rails 123 means that there are two transverse guide rails 121. The two transverse guide rails 121 are respectively arranged on opposite sides of the planar target 30, that is, they can be respectively located on two opposite sides of the planar target 30, and their fixing methods can be welding or threaded connection, etc. One end of each depth guide rail 123 slides on the transverse guide rail 121 through a slider driven by a transverse linear motor, and the other end is connected to one end of the longitudinal guide rail 122. Here, the two ends of the longitudinal guide rail 122 can be provided with sliders, and can move in the depth direction under the drive of the depth linear motor. One end of the grinding member 11 is connected to a slider, and moves in the longitudinal direction under the drive of the longitudinal linear motor. The other end of the grinding member 11 can be rotatably set to grind the surface of the target 30.

[0067] Thus, when polishing is required, the polishing member 11 can be moved horizontally to one side of the target 30, driven by the depth linear motor to abut the surface of the target 30, and then polished along the horizontal direction. When it reaches the other side of the target 30, it is then moved downward longitudinally, and then polished along the horizontal direction, and so on, thereby polishing the entire surface of the target 30. In other embodiments, only one transverse guide rail 121, one depth guide rail 123, and one longitudinal guide rail 122 can be provided. Alternatively, two longitudinal guide rails 122, two depth guide rails 123, and one transverse guide rail 121 can be provided.

[0068] The provision of the transverse guide rail 121 and the depth guide rail 123 can improve the connection stability of the guide rail assembly 12 and further improve the stability of the movement of the grinding piece 11.

[0069] Please refer to Figure 4 In one embodiment of the present invention, the target grinding device 10 further includes a control component and a detection component 13, and the control component is electrically connected to the drive component and the detection component 13;

[0070] The detection component 13 is provided on one side of the grinding piece 11 for detecting and feeding back the surface condition of the target material 30 . The control component adjusts the driving logic of the driving component according to the surface condition, thereby controlling the grinding trajectory of the grinding piece 11 .

[0071] The control component is one of the core components of the computer system, which is mainly responsible for coordinating and directing the operation of the entire computer system. It is a main command device that changes the wiring of the main circuit or control circuit in a predetermined order, and changes the resistance value in the circuit to control the start, speed regulation, braking and reversal of the motor. The control component can be a CPU (central processing unit), an MPU (microcontroller) or a combinational logic controller, etc. Since the structure of the control component and other components are components that can realize electrical control that are well known to those skilled in the art, they will not be described in detail. The control component is electrically connected to the drive component and the detection component 13, so as to realize data analysis and process coordination control of the drive component and the detection component 13. For example, the control component can control the start and drive stroke of the drive component, thereby controlling the grinding trajectory of the grinding piece 11. The control component can receive the detection signal of the detection component 13, and perform data analysis on it to obtain the corresponding data results.

[0072] The detection component 13 is a device that can measure and record the surface morphology of the target material 30. The detection component 13 can be a visual acquisition device, a contour measurement device, or a surface morphology measurement device, etc., which is not limited here. The detection component 13 is arranged on one side of the polishing part 11, and can detect the surface condition of the target material 30 after polishing in real time, and can send the detection result to the control part. The control part can determine whether the polishing of the position is qualified based on the detection result. If it is unqualified, it will adjust the driving logic of the driving component to change the polishing trajectory of the polishing part 11 so that it can polish the surface of the position to be qualified. In one example, the detection component 13 can be installed on the support structure that fixes the polishing part 11, so that it can move with the polishing part 11, so as to facilitate the real-time acquisition of the surface morphology of the target material 30 after polishing.

[0073] In this embodiment, by setting the detection component 13 to be electrically connected to the control component, and the control component to be electrically connected to the drive component, real-time feedback of the polishing condition of the target material 30 surface can be achieved and the polishing trajectory can be automatically changed, thereby further improving the polishing effect.

[0074] In one embodiment of the present invention, the detection component 13 is a three-dimensional profilometer.

[0075] A 3D profilometer is an instrument used to measure the three-dimensional morphology of an object's surface. It can non-destructively monitor roughness and microscopic topography, achieve nanometer-level resolution, and is compatible with various 2D and 3D standards. This instrument is a physical property testing instrument, and its structure is well known to those skilled in the art, so a detailed description is omitted here.

[0076] In this embodiment, the detection component 13 is configured as a 3D profilometer. This instrument boasts high accuracy and can accurately measure the surface topography and features of the target material 30. Furthermore, the instrument utilizes non-contact measurement, thus preventing damage to the surface of the object being measured. Its high speed allows for the measurement of large areas in a short period of time, improving production efficiency. Furthermore, it can measure not only flat and inclined surfaces, but also curved and complex shapes, thus offering a wide range of applications. The generated files require minimal memory, simplifying control logic and saving costs.

[0077] Please refer to Figure 4 In one embodiment of the present invention, the target material grinding device 10 also includes a dust suction component 14, the grinding piece 11 is provided with a dust suction hole 111 running through its axial direction, and the dust suction component 14 has a dust suction channel, one end of the dust suction channel is connected to the dust suction hole 111, and the other end is connected to an external suction device.

[0078] The dust collection assembly 14 is a device that collects dust or powder into a collection structure through a suction device. The suction device can be located inside the magnetron sputtering device 100 or can be led to the outside through a conduit. Its type can be a pump body or a fan, etc., which is not limited here. The dust collection assembly 14 has a dust collection channel, which is a flow channel that allows dust or powder to flow therein. The dust collection assembly 14 can be a tube structure or a structure that combines a tube body and other structures, which is not limited here.

[0079] The grinding member 11 can be a grinding wheel having a certain thickness in the axial direction. One end of the grinding member 11 abuts the surface of the target material 30 for grinding. Therefore, the grinding member 11 has a dust collection hole 111 along its axial direction. The opening shape of the dust collection hole 111 can be circular, square, or polygonal, etc., and is not limited here. The dust collection hole 111 is connected to one end of the dust collection channel, and the other end of the dust collection channel is connected to a suction device. Thus, the suction force of the suction device is used to directly suck dust out of the dust collection hole 111 through the dust collection channel.

[0080] In this embodiment, the setting of the dust suction component 14 can enable the dust and dirt generated during the grinding process to be directly sucked to the outside through the dust suction hole 111 and the dust suction channel of the grinding piece 11, thereby reducing the dust or dirt in the magnetron sputtering equipment 100 and improving the operating stability of the equipment.

[0081] Please continue to refer to Figure 4 、 Figure 5 and Figure 6 In one embodiment of the present utility model, the dust collection assembly 14 includes a connecting bracket 141 and a dust collection pipe 142. One end of the connecting bracket 141 is connected to the polishing member 11 and communicates with the dust collection hole 111, and the other end is slidably connected to the guide rail assembly 12.

[0082] One end of the dust suction pipe 142 is connected to the peripheral side of the connecting bracket 141 and communicated with the inside of the connecting bracket 141, and the other end is connected to an external suction device. The interior of the connecting bracket 141 and the dust suction pipe 142 are enclosed to form the dust suction channel.

[0083] The connecting bracket 141 provides support for the polishing member 11. One end of the bracket is connected to the polishing member 11, and the other end is slidably connected to the guide rail assembly 12 via a slider. The portion of the connecting bracket 141 that connects to the polishing member 11 is hollow and can communicate with the dust collection hole 111 of the polishing member 11. This allows the dust collection hole 111 to be located at the center of the polishing member 11.

[0084] The dust suction pipe 142 is a tube structure, one end of which is connected to the peripheral side of the connecting bracket 141 and is connected to the middle structure, and the other end is connected to the suction device. In this way, the connecting bracket 141 serves to connect the dust suction hole 111 and the dust suction pipe 142, so that the dust is discharged to the outside after passing through the dust suction hole 111, the connecting bracket 141 and the dust suction pipe 142.

[0085] Optionally, a portion of the connecting bracket 141 is a connecting tube, one end of which is plug-connected to one end of the grinding wheel, and a transfer tube is provided on the circumferential side of the connecting tube, and the dust suction tube 142 is plug-connected to the transfer tube, thereby improving the efficiency of assembly and disassembly and improving the sealing effect. The dust suction tube 142 can be a hard tube body or a hose, which is not limited here. In one example, the dust suction tube 142 is bent and extended along the longitudinal guide rail 122 and the depth guide rail 123, with a compact structure to reduce the impact on the operation of the target material 30. In other examples, the dust suction component 14 is only provided with a tube body, one end of which is inserted into the dust suction hole 111, and the other end is connected to the suction device.

[0086] In this embodiment, the connecting bracket 141 can not only serve to install and support the grinding piece 11, but also serve to connect the interior of the grinding piece 11 and the dust suction pipe 142, thereby simplifying the structure and maintaining the center position of the dust suction hole 111 to improve the dust suction effect.

[0087] Please refer to Figure 4 In one embodiment of the present invention, there are multiple dust suction holes 111, and the multiple dust suction holes 111 are distributed at intervals on the grinding piece 11. The grinding piece 11 is provided with a collection cover 112 on the side facing the connecting bracket 141. One end of the collection cover 112 is covered on the multiple dust suction holes 111, and the other end is connected to one end of the dust suction channel.

[0088] Here, the dust suction holes 111 are provided in plurality, which means that the number of dust suction holes 111 is provided in plurality, and the dust suction holes 111 are distributed in an array on the grinding piece 11. The collecting cover 112 refers to a cover body with a large opening at one end, which gradually narrows in the direction towards the other end, and its shape is like a funnel. In this way, the end of the collecting cover 112 with a larger opening covers one end of the grinding piece 11, thereby wrapping the multiple dust suction holes 111, and the other end is connected to the dust suction channel, which can collect the dust from the multiple dust suction holes 111 into the dust suction channel, thereby reducing the number or volume of the dust suction channels. In one example, when the dust suction channel is a connecting bracket 141 and a dust suction pipe 142, the other end of the collecting cover 112 is connected to a plug-in pipe, which can be directly inserted into the connecting pipe of the connecting bracket 141, thereby achieving connection and connection at the same time. In one example, the collecting cover 112 can be integrally formed with the grinding piece 11, simplifying processing and improving the stability of the connection structure of the collecting cover 112. In another example, a plurality of dust collection holes 111 are evenly distributed on the polishing piece 11 , thereby improving dust collection uniformity.

[0089] In this embodiment, the provision of multiple dust suction holes 111 can increase the dust suction amount and dust suction probability, and the provision of the retractable cover 112 can simplify the structure of the connecting bracket 141 or the dust suction channel, thereby improving the dust suction effect.

[0090] Please refer to Figure 4 In one embodiment of the present invention, the dust collection component 14 further includes a first dust cover 143 , which is arranged around the circumference of the grinding piece 11 , and a side cover is connected to one end of the dust collection component 14 .

[0091] The first dust cover 143 is a structure that is arranged on the outside of the grinding piece 11 and can prevent dust from escaping. The first dust cover 143 is an annular cover structure with two ends open. One end has a large opening and is arranged around the outer periphery of the grinding piece 11, and the other end has a small opening and is directly connected to one end of the dust collection assembly 14. In one example, when the dust collection assembly 14 includes a connecting bracket 141 and a dust collection tube 142, the other end of the first dust cover 143 is sleeved on one end of the connecting bracket 141 or the end of the grinding piece 11 facing the connecting bracket 141. The opening shape of the first dust cover 143 is the same as the cross-sectional shape of the grinding piece 11, so that the radial distance between the first dust cover 143 and the grinding piece 11 can be reduced without affecting the rotation of the grinding piece 11.

[0092] In this embodiment, the first dust cover 143 can collect dust overflowing from the end surface to the peripheral side of the grinding piece 11, thereby further improving the dust collection effect.

[0093] Please continue to refer to Figure 4 In one embodiment of the present invention, the portion of the first dust cover 143 arranged around the circumference of the grinding member 11 is an elastic portion 1431 , and the elastic portion 1431 is retractable in the axial direction of the grinding member 11 .

[0094] The elastic portion 1431 is a structure capable of elastic deformation. Here, the elastic portion 1431 is configured to be retractable in the axial direction of the grinding member 11. This means that when the grinding member 11 approaches the surface of the target 30, one end of the elastic portion 1431 can elastically abut against the surface of the target 30. Alternatively, the elastic portion 1431 can be a bellows or a spring tube, etc., which is not limited here.

[0095] In this embodiment, the provision of the elastic portion 1431 allows the first dust cover 143 to elastically abut against and cover the grinding area of the grinding piece 11, thereby reducing dust scattering and damage to the target material 30, thereby improving protection.

[0096] Please refer to Figure 4In one embodiment of the present invention, the dust suction assembly 14 also includes a second dust cover 144, which is arranged around the circumference of the first dust cover 143, and one side of the cover is connected to the side of the grinding piece 11 facing the guide rail assembly 12, and the interior of the second dust cover 144 is connected to the dust suction channel.

[0097] The second dust cover 144 is a structure that is disposed on the outside of the polishing piece 11 and is capable of preventing dust from escaping. In addition to the first dust cover 143, the second dust cover 144 is disposed around the first dust cover 143, thereby further preventing dust from escaping from the larger space around the polishing piece 11 into the magnetron sputtering apparatus 100. In one example, the second dust cover 144 is an annular cover structure with one end open, one end being disposed around the periphery of the first dust cover 143, while the other end can be closed, thereby enclosing the connection structure of the polishing piece 11 within the second dust cover 144, thereby improving sealing. When the dust collection assembly 14 includes a connecting bracket 141 and a dust collection tube 142, the other end of the second dust cover 144 is closed, and the end of the connecting bracket 141 away from the grinding piece 11 is accommodated therein. The connecting bracket 141 can pass through the second dust cover 144 through a connecting structure to connect to the slider, or can also be connected by other contactless connection methods, such as magnetic attraction, etc., which are not limited here. In another example, the other end of the second dust cover 144 can also be opened and sleeved and connected to the end of the connecting tube away from the grinding piece 11. It can be understood that the opening shape of the second dust cover 144 is the same as the cross-sectional shape of the grinding piece 11, which can provide protection while reducing its occupied space.

[0098] The interior of the second dust cover 144 is connected to the dust collection channel, which means that the dust collection assembly 14 located inside the second dust cover 144 is connected to the interior of the second dust cover 144. For example, when the dust collection assembly 14 includes a connecting bracket 141 and a dust collection pipe 142, a hole can be opened in the connecting bracket 141 or a hole can be opened in the dust collection pipe 142. Therefore, when dust overflows into the second dust cover 144, it can be sucked into the dust collection channel through the opening and discharged to the outside. In one example, a through pipe is connected to the circumference of the dust collection pipe 142, with openings at both ends, and connects the interior of the second dust cover 144 with the dust collection pipe 142.

[0099] In this embodiment, the second dust cover 144 and the first dust cover 143 can be combined to form a double-layer dust collection structure, further reducing the risk of dust overflowing into the interior of the magnetron sputtering device 100. The second dust cover 144 can also provide a certain degree of protection for the internal structure and prevent dust from leaking out through the connection between the dust collection assembly 14 and the polishing piece 11, further improving the dust collection effect.

[0100] In one embodiment of the present invention, the second dust cover 144 is made of rubber.

[0101] Rubber refers to a highly elastic polymer material with reversible deformation. It is elastic at room temperature and can produce large deformation under a very small external force, and can return to its original shape after the external force is removed.

[0102] The second dust cover 144 made of this material can reduce damage to the target material 30 and improve protection.

[0103] Please refer to Figure 1 and Figure 2 The present invention further provides a magnetron sputtering apparatus 100, comprising a target grinding device 10 and a magnetron sputtering apparatus as described above. The magnetron sputtering apparatus includes a housing 20 and a target 30. The housing 20 forms a sealed cavity, the target 30 is disposed within the sealed cavity, and the target grinding device 10 is disposed within the sealed cavity and located on one side of the target 30. The target grinding device 10 of the magnetron sputtering apparatus 100 adopts all the technical solutions of all the above embodiments, and therefore has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be detailed here.

[0104] The magnetron sputtering equipment 100 equipped with the target grinding device 10 can improve production efficiency and reduce personnel risks.

[0105] Please combine Figure 2 and Figure 7 In one example, two targets 30 are provided, spaced apart in a transverse direction. The grinding member 11 of the target grinding device 10 can be hidden in the gap between the two targets 30 when driven by a driving assembly. Thus, when not in operation, the grinding member 11 can be hidden between the two targets 30, thereby avoiding affecting the coating of the magnetron sputtering apparatus 100 and improving its own protection.

[0106] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A target grinding device, characterized in that: The target material grinding device comprises: a drive assembly disposed on a target side of the magnetron sputtering apparatus; and A grinding piece is rotatably arranged and is drivingly connected to the driving assembly. The driving assembly drives the grinding piece to move along at least two intersecting directions and grind the surface of the target material.

2. The target grinding device according to claim 1, wherein: The target material grinding device further includes a guide rail assembly, wherein the guide rail assembly includes a transverse guide rail, a longitudinal guide rail, and a depth guide rail that are perpendicular to each other and movably connected to each other; The grinding piece can be movably connected to one of the transverse guide rail, the longitudinal guide rail and the depth guide rail, and the driving assembly drives the grinding piece to move along the transverse guide rail, the longitudinal guide rail and the depth guide rail.

3. The target grinding device according to claim 2, wherein: There are two transverse guide rails and two depth guide rails. The two transverse guide rails are arranged on opposite sides of the target material. One end of each depth guide rail is slidably connected to the transverse guide rail, and the other end is connected to one end of the longitudinal guide rail. The grinding piece is slidably connected to the longitudinal guide rail.

4. The target grinding device according to any one of claims 1 to 3, wherein: The target material grinding device further includes a control component and a detection component, wherein the control component is electrically connected to the drive component and the detection component; The detection component is arranged on one side of the grinding piece, and is used to detect and feedback the surface condition of the target material. The control component adjusts the driving logic of the driving component according to the surface condition, thereby controlling the grinding trajectory of the grinding piece.

5. The target grinding device according to claim 4, wherein: The detection component is a three-dimensional profile measuring instrument.

6. The target grinding device according to claim 2 or 3, characterized in that: The target material grinding device also includes a dust suction component. The grinding piece is provided with a dust suction hole running through its axial direction. The dust suction component has a dust suction channel. One end of the dust suction channel is connected to the dust suction hole, and the other end is connected to an external suction device.

7. The target grinding device according to claim 6, wherein: The dust collection assembly includes a connecting bracket and a dust collection pipe, one end of the connecting bracket is connected to the polishing piece and communicates with the dust collection hole, and the other end is slidably connected to the guide rail assembly; One end of the dust suction pipe is connected to the peripheral side of the connecting bracket and communicated with the inside of the connecting bracket, and the other end is connected to an external suction device. The interior of the connecting bracket and the dust suction pipe are enclosed to form the dust suction channel.

8. The target grinding device according to claim 7, wherein: There are multiple dust suction holes, and the multiple dust suction holes are distributed at intervals on the grinding piece. A folding cover is provided on the side of the grinding piece facing the connecting bracket. One end of the folding cover is covered on the multiple dust suction holes, and the other end is connected to one end of the dust suction channel.

9. The target grinding device according to any one of claims 6 to 8, characterized in that: The dust collection assembly further includes a first dust cover, which is arranged around the circumference of the grinding piece, and a side cover is connected to one end of the dust collection assembly.

10. The target grinding device according to claim 9, wherein: The portion of the first dust cover arranged around the circumference of the polishing piece is an elastic portion, and the elastic portion is telescopically arranged in the axial direction of the polishing piece.

11. The target grinding device according to claim 9, wherein: The dust suction assembly also includes a second dust cover, which is arranged around the circumference of the first dust cover, and a side cover is connected to the side of the grinding piece facing the guide rail assembly, and the interior of the second dust cover is connected to the dust suction channel.

12. The target grinding device according to claim 11, wherein: The second dust cover is made of rubber.

13. A magnetron sputtering device, characterized in that: It comprises a target material grinding device and a magnetron sputtering device as described in any one of claims 1 to 12, wherein the magnetron sputtering device comprises a shell and a target material, the shell forms a closed cavity, the target material is arranged in the closed cavity, and the target material grinding device is arranged in the closed cavity and is located on one side of the target material.

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