Headset shell injection mold
By using multiple thimble pins and return spring structures in the injection mold of the headset housing, the problem of incomplete ejection of plastic products is solved, and the ejection efficiency and position accuracy are improved.
Patent Information
- Application Number
- CN202422102755.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-29
AI Technical Summary
When the existing injection molds eject the plastic products, some products cannot be ejected smoothly and completely ejected, and the thimble resumption position is deviated from the original position, which affects the subsequent ejection operation.
The head-mounted headphone housing injection mold design is adopted, including a combination structure of multiple first thimbles, several second thimbles, ejection guide rods and return springs to improve the balance of plastic products when ejecting, and return the thimble to its original position through the return spring to reduce position deviation.
It achieves a smoother and complete ejection of plastic products, reducing the impact of position deviation after the thimble resumption on subsequent ejection operations.
Smart Images

Figure CN223236885U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of injection molds, in particular to an injection mold for a headphone shell. Background Art
[0002] Plastic products are typically produced using injection molding machines. During production, the machine heats plastic pellets until they are molten, then injects the molten plastic into the mold. Once the plastic cools, it is molded into the desired plastic product. Currently, injection molds typically feature ejectors for ejecting plastic products, but there is typically only one ejector pin. After ejecting the plastic product, the ejector pin must be driven back to its original position by an ejection force. This can cause some parts to not be ejected smoothly and completely, and the returned position of the ejector pin after the ejection operation is complete often deviates from its original position, impacting subsequent ejection operations. Utility Model Content
[0003] The main purpose of the present utility model is to provide an injection mold for a headphone shell, aiming to solve the technical problem that, when ejecting plastic products from existing injection molds, some plastic products cannot be ejected smoothly and completely, and the position to which the ejector pin returns after the ejection operation is completed is usually deviated from the original position, thus affecting the subsequent ejection operation.
[0004] To achieve the above-mentioned purpose, the headphone housing injection mold proposed in the present invention comprises a front bottom plate, a front mold frame, a rear mold frame, a mounting plate and a rear bottom plate which are arranged in sequence;
[0005] The front mold frame includes a front mold core, the front bottom plate is arranged on the upper end surface of the front mold frame, and the front mold core is arranged on the lower part of the front mold frame;
[0006] The rear mold frame includes a rear mold core, the rear bottom plate is arranged below the rear mold frame, the rear mold core is arranged on the upper part of the rear mold frame, and the mounting plate is arranged between the rear mold frame and the rear bottom plate;
[0007] It also includes a first ejector pin, a second ejector pin, an ejection guide rod and a return spring. The ejection guide rod and the return spring are matched in four groups. The four groups of ejection guide rods and return springs are respectively arranged at the four corners of the mounting plate. The first ejector pin and the second ejector pin are both installed on the mounting plate, and the number of the first ejector pins is multiple, and the number of the second ejector pins is several.
[0008] Optionally, a supporting plate is further included, which is arranged between the mounting plate and the rear bottom plate. The lower ends of the first ejector pin, the second ejector pin and the ejection guide rod all pass through the mounting plate and abut against the upper end surface of the supporting plate.
[0009] Optionally, the front mold frame further includes a front mounting groove, the front mold core is installed in the front mounting groove, and the lower end surface of the front mold core is coplanar with the lower end surface of the front mold frame.
[0010] Optionally, the rear mold frame further includes a rear installation groove, the rear mold core is installed in the rear installation groove, and the upper end surface of the rear mold core is coplanar with the upper end surface of the rear mold frame.
[0011] Optionally, the mounting plate includes a first area, a second area and a third area, and the first area, the second area and the third area are arranged in sequence. The first area and the third area are each provided with 2*4 first ejector pins, and the second area is provided with 2*3 first ejector pins and 2*1 second ejector pins.
[0012] Optionally, the number of the first zone, the second zone and the third zone is two.
[0013] Optionally, it further includes two square irons, and the two square irons are respectively arranged on both sides of the rear bottom plate, and the mounting plate, the first ejector pin, the second ejector pin and the ejection guide rod are all arranged between the two square irons.
[0014] The technical solution of the present invention has the following beneficial effects:
[0015] By providing a first ejector pin, a second ejector pin, an ejection guide rod, and a return spring, the force applied to the plastic product during ejection can be balanced, allowing the plastic product to be ejected more smoothly and completely. After the ejection operation is completed, the return spring forces the mounting plate to drive the first and second ejector pins back to their original positions. The four sets of ejection guide rods and return springs can reduce the deviation between the current and original positions of the first and second ejector pins after their return, thereby minimizing the impact on subsequent ejection operations. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0017] Figure 1 This is a schematic diagram of the overall structure of an injection mold for a headphone housing according to one embodiment of the present invention;
[0018] Figure 2 This is a schematic diagram of the exploded structure of an injection mold for a headphone housing according to an embodiment of the present invention. Figure 1 ;
[0019] Figure 3 This is a schematic diagram of the exploded structure of an injection mold for a headphone housing according to an embodiment of the present invention. Figure 2 ;
[0020] Figure 4 This is a schematic diagram of the structure of the rear mold core of a headphone shell injection mold according to an embodiment of the present invention. Figure 1 ;
[0021] Figure 5 This is a schematic diagram of the structure of the rear mold core of a headphone shell injection mold according to an embodiment of the present invention. Figure 2 ;
[0022] Figure 6 This is a schematic diagram of the structure of a plastic product of an injection mold for a headset shell according to an embodiment of the present invention. Figure 2 .
[0023] Explanation of the accompanying drawings: front base plate 100, main channel 110, front mold frame 200, injection port 210, front mold core 220, rear mold frame 300, rear mold core 310, first through hole 3101, second through hole 3102, support plate 400, mounting plate 500, first ejector pin 510, second ejector pin 520, rear base plate 600, square iron 610, ejector guide rod 700, return spring 710, plastic product 800.
[0024] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0027] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.
[0028] The utility model provides an injection mold for a headphone shell.
[0029] like Figures 1 to 6 As shown, in one embodiment of the present invention, the headphone housing injection mold includes a front base plate 100, a front mold frame 200, a rear mold frame 300, a mounting plate 500, a support plate 400, a square iron 610, and a rear base plate 600, which are arranged in sequence. In this embodiment, the front mold frame 200 includes a front mold core 220, the front base plate 100 is disposed on the upper end surface of the front mold frame 200, and the front mold core 220 is disposed at the lower portion of the front mold frame 200. In addition, the front mold frame 200 also includes a front mounting groove, and the front mold core 220 is installed in the front mounting groove, and the lower end surface of the front mold core 220 is coplanar with the lower end surface of the front mold frame 200. It is worth noting that a main channel 110 is provided on the front bottom plate 100 and an injection port 210 is provided on the front mold frame 200. After the plastic particles are heated to a molten state by the injection molding machine, they are injected into the injection mold through the main channel 110 and the injection port 210 by the injection molding machine.
[0030] like Figure 4 and 5 As shown, in this embodiment, the rear mold frame 300 includes a rear mold core 310, a rear bottom plate 600 disposed below the rear mold frame 300, the rear mold core 310 disposed above the rear mold frame 300, a mounting plate 500 disposed between the rear mold frame 300 and the rear bottom plate 600, and a support plate 400 disposed between the mounting plate 500 and the rear bottom plate 600. Furthermore, the rear mold frame 300 also includes a rear mounting groove, in which the rear mold core 310 is mounted, and the upper end surface of the rear mold core 310 is coplanar with the upper end surface of the rear mold frame 300. It is worth noting that a plurality of first through holes 3101 and a plurality of second through holes 3102 are provided on both the rear mold frame 300 and the rear mold core 310. The first ejector pins 510 pass through the first through holes 3101 to eject the plastic product 800, and the second ejector pins 520 pass through the second through holes 3102 to eject the plastic product 800.
[0031] like Figure 1 and 3 As shown, the mold assembly further includes a first ejector pin 510, a second ejector pin 520, an ejection guide rod 700, and a return spring 710. The ejector guide rod 700 and the return spring 710 form four matching sets, which are respectively disposed at the four corners of the mounting plate 500. Both the first ejector pin 510 and the second ejector pin 520 are mounted on the mounting plate 500, with multiple first ejector pins 510 and several second ejector pins 520. The lower end of the return spring 710 abuts against the upper end surface of the mounting plate 500, while the upper end of the return spring 710 abuts against the lower end surface of the rear mold frame 300.
[0032] Specifically, the lower ends of the first ejector pin 510, the second ejector pin 520, and the ejection guide rod 700 all pass through the mounting plate 500 and abut against the upper end surface of the support plate 400. Both the first ejector pin 510 and the second ejector pin 520 include a mounting section and an ejection section. The mounting section is located between the support plate 400 and the mounting plate 500, while the ejection section extends upward through the mounting plate 500. Furthermore, the mounting plate 500 includes a first zone, a second zone, and a third zone. The first, second, and third zones are arranged sequentially. Each of the first and third zones is provided with 2*4 first ejector pins 510, while the second zone is provided with 2*3 first ejector pins 510 and 2*1 second ejector pin 520. Furthermore, the number of first, second, and third zones is two. Furthermore, there are two square irons 610, one on each side of the rear base plate 600. The mounting plate 500, the first ejector pin 510, the second ejector pin 520, and the ejection guide rod 700 are all disposed between the two square irons 610. In this embodiment, four first guide rods are also included. The front mold frame 200 and the rear mold frame 300 are both mounted via the first guide rods. During mold closing and demolding, the front mold frame 200 and the front mold core 300 move along the first guide rods.
[0033] Specifically, the working principle and process of the utility model are as follows:
[0034] By providing a first ejector pin, a second ejector pin, an ejection guide rod, and a return spring, the force applied to the plastic product during ejection can be balanced, allowing the plastic product to be ejected more smoothly and completely. After the ejection operation is completed, the return spring forces the mounting plate to drive the first and second ejector pins back to their original positions. The four sets of ejection guide rods and return springs can reduce the deviation between the current and original positions of the first and second ejector pins after their return, thereby minimizing the impact on subsequent ejection operations.
[0035] Specifically, plastic heated to a molten state by the injection molding machine is injected into the space between the front and rear molds through the main channel and injection port. At this point, a first ejector pin and a second ejector pin, respectively, pass through the first and second through-holes and become coplanar with the upper end surface of the rear mold, preventing the molten plastic from escaping through the first and second through-holes. Furthermore, in this embodiment, the molten plastic is molded into two identical plastic products in the space between the front and rear molds. Once the plastic product meets the requirements, the front mold moves upward with the front mold frame, exposing the plastic product. At this point, the first and second ejector pins move upward to eject the plastic product.
[0036] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A headphone housing injection mold, characterized in that: It includes a front base plate, a front mold frame, a rear mold frame, a mounting plate and a rear base plate which are arranged in sequence; The front mold frame includes a front mold core, the front bottom plate is arranged on the upper end surface of the front mold frame, and the front mold core is arranged on the lower part of the front mold frame; The rear mold frame includes a rear mold core, the rear bottom plate is arranged below the rear mold frame, the rear mold core is arranged on the upper part of the rear mold frame, and the mounting plate is arranged between the rear mold frame and the rear bottom plate; It also includes a first ejector pin, a second ejector pin, an ejection guide rod and a return spring. The ejection guide rod and the return spring are matched in four groups. The four groups of ejection guide rods and return springs are respectively arranged at the four corners of the mounting plate. The first ejector pin and the second ejector pin are both installed on the mounting plate, and the number of the first ejector pins is multiple, and the number of the second ejector pins is several.
2. The headphone housing injection mold according to claim 1, characterized in that: It also includes a supporting plate, which is arranged between the mounting plate and the rear bottom plate. The lower ends of the first ejector pin, the second ejector pin and the ejection guide rod all pass through the mounting plate and abut against the upper end surface of the supporting plate.
3. The headphone housing injection mold according to claim 1, wherein: The front mold frame also includes a front mounting groove, the front mold core is installed in the front mounting groove, and the lower end surface of the front mold core is coplanar with the lower end surface of the front mold frame.
4. The headphone housing injection mold according to claim 1, wherein: The rear mold frame further includes a rear installation groove, the rear mold core is installed in the rear installation groove, and the upper end surface of the rear mold core is coplanar with the upper end surface of the rear mold frame.
5. The headphone housing injection mold according to claim 1, wherein: The mounting plate includes a first area, a second area and a third area, which are arranged in sequence. The first area and the third area are each provided with 2*4 first ejectors, and the second area is provided with 2*3 first ejectors and 2*1 second ejectors.
6. The headphone housing injection mold according to claim 5, characterized in that: The number of the first zone, the second zone and the third zone are all two.
7. The headphone housing injection mold according to claim 1, wherein: It also includes two square irons, and the two square irons are respectively arranged on both sides of the rear bottom plate. The mounting plate, the first ejector pin, the second ejector pin and the ejection guide rod are all arranged between the two square irons.