Horizontal copper deposition production line

Abstract

The utility model relates to the technical field of circuit board production equipment, and discloses a horizontal copper deposition production line, the horizontal copper deposition production line comprises a reaction tank, a spraying assembly and a controller, the spraying assembly comprises a fixed seat, a driving motor and at least two spraying pipes, the fixed seat is fixed on the reaction tank, the middle part of the fixed seat is provided with a motor bracket, and the motor bracket is connected with the controller; the two sides of the motor frame are respectively provided with at least one bearing seat, the driving motor is installed on the motor support, an output shaft of the motor is connected with an eccentric rotating shaft, the eccentric rotating shaft is connected with a telescopic rod, the other end of the telescopic rod is provided with a transmission shaft, and the upper end of the motor support is provided with a horizontal sliding groove. The input end of the spraying pipe is arranged on the bearing seat and communicated with the input pipe, the input pipe is provided with a flow control valve, the outer wall of the spraying pipe is connected with a connecting rod, the other end of the connecting rod is hinged to the transmission shaft, the spraying pipe is provided with two first spraying openings, and the controller driving motor and the flow control valve are electrically connected to the controller.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a horizontal copper deposition production line. Background Art

[0002] Circuit boards are important electronic components, supporting electronic components and acting as the carrier for their electrical connections. Electroless copper plating, short for chemical copper plating, involves a redox reaction in a copper plating tank on a drilled circuit board, forming a copper layer that metallizes the holes. This deposits copper on the surface of the previously insulating substrate, achieving electrical connectivity between layers. Electroless copper plating is widely used in the production of printed circuit boards with through-holes.

[0003] Existing copper deposition equipment generally includes a frame, a trough, a spray mechanism, and a transmission mechanism. The circuit board is placed horizontally on a roller for transmission, and a chemical liquid is sprayed onto the circuit board through a spray device arranged above the roller. The chemical liquid reacts with the copper deposition holes on the circuit board and deposits copper in the holes. However, the existing copper deposition equipment has the following problems: the spray device is only provided with a single liquid outlet, and the contact time and amount of chemical liquid of the circuit board transported on the roller are relatively small, resulting in a prolonged reaction copper deposition time, and there are differences in the copper deposition of each hole, and even defective products may be produced. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a horizontal copper deposition production line that, through structural improvements, enhances the spraying effect, helps to speed up the reaction, and improves the consistency of copper deposition in each hole.

[0005] According to the horizontal copper deposition production line of the embodiment of the first aspect of the present invention, it includes a reaction tank, a spray assembly and a controller, the reaction tank is provided with an inner cavity, and a conveying assembly is arranged in the inner cavity to convey the circuit board; the spray assembly is connected to the reaction tank, and the spray assembly includes a fixed seat, a drive motor and at least two spray pipes, the fixed seat is fixed on the reaction tank, a motor bracket is provided in the middle of the fixed seat, at least one bearing seat is arranged on both sides of the motor bracket, the drive motor is installed on the motor bracket, the output shaft of the motor is connected to an eccentric shaft, the eccentric shaft is connected to a telescopic rod, the other end of the telescopic rod is provided with a transmission shaft, and the upper end of the motor bracket is provided There is a horizontal sliding groove, the transmission shaft is passed through the sliding groove, the input end of the spray pipe is installed on the bearing seat, the bearing seat is provided with an input pipe, the input pipe is sealed and connected to the spray pipe, the input pipe is provided with a flow control valve, the outer wall of the spray pipe is connected with a connecting rod, the other end of the connecting rod is hinged to the transmission shaft, the spray pipe is provided with two first spray ports arranged opposite to each other, the first spray ports are in a straight line shape and extend along the axial direction of the spray pipe, when the transmission shaft is located at the center of the sliding groove, the two first spray ports of the spray pipe are located in the same horizontal plane; the driving motor and the flow control valve of the controller are electrically connected to the controller.

[0006] The horizontal copper deposition production line according to the embodiment of the first aspect of the present utility model has at least the following beneficial effects:

[0007] The circuit board is transported by the conveying assembly, and the liquid medicine enters the spray pipe through the bearing seat and then flows out from the two first spray ports of the spray pipe. The controller controls the operation of the drive motor of the spray assembly, and the drive motor drives the connecting rod through the telescopic rod, thereby driving the spray pipe to rotate, so that the liquid medicine flowing out of the first spray port swings. The spray assembly outputs multiple liquid medicines, and the liquid medicines are in a swinging state, which increases the contact time between the liquid medicine and the circuit board, and quickly covers the circuit board, speeding up the reaction of copper deposition, making the copper deposition effect of each hole of the circuit board close, and improving product quality.

[0008] According to some embodiments of the present invention, a turntable is fixed to the output shaft of the motor, and the eccentric shaft is fixed to a side of the turntable, and the eccentric shaft deviates from the output shaft.

[0009] According to some embodiments of the present invention, a turntable is fixed to the output shaft of the motor, a cam groove is provided on the periphery of the turntable, and the eccentric rotating shaft is passed through the cam groove.

[0010] According to some embodiments of the present invention, the outer wall of the spray pipe is provided with two support ears, which are distributed on opposite sides of the spray pipe. The support ears are connected with pins, and the connecting rod is provided with a through hole that matches the pins.

[0011] According to some embodiments of the present invention, the spray pipe is further provided with a second spray port, which is located between the two first spray ports, and the width of the second spray port is smaller than that of the first spray port.

[0012] According to some embodiments of the present invention, the reaction tank is connected to two spray assemblies, the two spray assemblies are arranged opposite to each other on two opposite side walls of the inner cavity, and the spray pipes of the two spray assemblies are staggered.

[0013] According to some embodiments of the present invention, one end of the spray pipe away from the bearing seat is an opening, and a plug is installed in the opening.

[0014] According to some embodiments of the present invention, a diversion net is provided on the back of the spray pipe, and the diversion net covers the first spray port.

[0015] According to some embodiments of the present invention, the reaction tank is connected to a filtering device, the inner cavity includes a spray chamber and an immersion chamber, the spray assembly is located in the spray chamber, the liquid outlet of the filtering device is connected to the spray assembly through a pipe, and the liquid return port of the filtering device is connected to the lower end of the immersion chamber through a pipe. A plurality of guide plates are arranged in the immersion chamber, the guide plates are arranged at an angle and the end close to the spray assembly is the high end, and the two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber.

[0016] According to some embodiments of the present invention, a partition is provided between the spray chamber and the immersion chamber, a liquid hole is provided at the lower end of the partition, the guide plate is arranged in the liquid hole, and a detachable filter is connected to the lower end of the guide plate, and the filter closes the channel formed by the guide plate and the reaction tank.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0019] Figure 1 This is a cross-sectional view of the reaction tank in the embodiment of the first aspect of the present utility model;

[0020] Figure 2 for Figure 1 A local enlarged view of point A;

[0021] Figure 3This is a front view of the spray assembly in the embodiment of the first aspect of the present utility model;

[0022] Figure 4 This is an exploded schematic diagram of the spray assembly in the embodiment of the first aspect of the present utility model;

[0023] Figure 5 This is a schematic diagram of the arrangement of two spray assemblies in an embodiment of the first aspect of the present utility model.

[0024] The accompanying figures are as follows:

[0025] Reaction tank 100, spray chamber 101, immersion chamber 102, guide plate 110, partition 120, liquid hole 121, filter screen 130;

[0026] Spray assembly 200, fixed base 210, drive motor 220, eccentric rotating shaft 221, telescopic rod 222, transmission shaft 223, turntable 224, spray pipe 230, first spray port 231, support ear 232, pin 233, motor bracket 240, horizontal sliding groove 241, connecting rod 242, bearing seat 250, plug 260. DETAILED DESCRIPTION

[0027] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0028] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0029] In the description of this utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0031] It is understandable that, referring to Figures 1 to 4The embodiment of the first aspect of the present invention proposes a horizontal copper deposition production line, which is used to perform copper deposition processing on circuit boards. After drilling, the circuit boards undergo an oxidation-reduction reaction in the horizontal copper deposition production line to form a copper layer, thereby metallizing the holes, so that copper is deposited on the surface of the originally insulating substrate to achieve electrical connectivity between layers.

[0032] The core component of the horizontal copper deposition line is the reaction tank 100, which forms an inner cavity within which a conveyor assembly is located. The conveyor assembly is used to transport the circuit board, allowing the circuit board to move horizontally within the inner cavity. The conveyor assembly can be a series of chains, conveyor belts, rollers, or other conveying devices, ensuring that the circuit board moves smoothly and horizontally within the reaction tank 100 so that it can come into contact with the chemical solution in the tank.

[0033] Another key component of the horizontal copper plating line is the spray assembly 200, which is connected to the reaction tank 100 and is used to spray the chemical solution onto the circuit board during the copper plating process. The spray assembly 200 includes a fixed base 210, a drive motor 220, at least two spray pipes 230, a motor bracket 240, a bearing base 250, an eccentric shaft 221, a telescopic rod 222, a transmission shaft 223, a sliding groove 241, a flow control valve, and a connecting rod 242.

[0034] The fixed base 210 is fixed to the reaction tank 100. A motor bracket 240 is disposed in the middle of the fixed base 210. At least one bearing block 250 is disposed on each side of the motor bracket 240. The bearing blocks 250 are used to connect to the spray pipe 230, allowing the liquid medicine to enter the spray pipe 230 and maintaining a seal when the spray pipe 230 rotates. The drive motor 220 is mounted on the motor bracket 240. The output shaft of the drive motor 220 is connected to an eccentric shaft 221, which is connected to a telescopic rod 222. The other end of the telescopic rod 222 is provided with a transmission shaft 223, which is inserted into a horizontal sliding slot 241 at the upper end of the motor bracket 240. The input end of the spray pipe 230 is mounted on the bearing seat 250. The spray pipe 230 is supported by the bearing in the bearing seat 250 to achieve rotation. The bearing seat 250 has an input pipe, which is sealed with the spray pipe 230. Two sealing rings can be installed on the outer wall of the spray pipe 230 to achieve a seal. A flow control valve is provided on the input pipe to control the flow of liquid medicine entering the spray pipe 230. It can be understood that the liquid medicine is delivered by an infusion pump, which is connected to the bearing seat 250 through a pipeline to input the liquid medicine into the spray pipe 230. The outer wall of the spray pipe 230 is connected to a connecting rod 242, and the other end of the connecting rod 242 is hinged to the transmission shaft 223. The spray pipe 230 is equipped with two first spray ports 231 arranged opposite each other. The first spray ports 231 are straight-line shaped and extend along the axial direction of the spray pipe 230. The liquid medicine flowing from the first spray ports 231 is waterfall-like. The length of the first spray ports 231 is set according to the width of the circuit board so that the sprayed liquid medicine can cover the entire circuit board. It is understood that the telescopic rod 222 can be adjusted in length to adapt to different spraying conditions. The telescopic rod 222 can adopt a bolt and sleeve structure, and the length can be adjusted by relative rotation, which is convenient and easy to use. Other structures, such as snap-on connection, pin positioning, etc., can also be adopted.

[0035] Reference Figure 3 When the transmission shaft 223 is located at the center of the sliding groove 241, the two first spray ports 231 of the spray pipe 230 are located at the same horizontal plane, ensuring uniform spraying. When the drive motor 220 is running, the eccentric rotating shaft 221 drives the telescopic rod 222 to move, and the telescopic rod 222 drives the connecting rod 242 through the transmission shaft 223. The connecting rod 242 drives the spray pipe 230 to rotate, so that the liquid flowing out of the first spray ports 231 swings. The liquid flowing out of the two first spray ports 231 contacts the circuit board during the swing, which can increase the contact time and liquid volume.

[0036] The controller is the control center of the horizontal copper plating line. The drive motor 220 and flow control valve are electrically connected to the controller. The controller can be a PLC (Programmable Logic Controller) or similar industrial control device. It receives operating instructions and controls the start, stop, and speed of the drive motor 220, as well as the opening, closing, and adjustment of the flow control valve. The controller can be connected to an operating interface (such as a touch screen or control panel) to enable operators to monitor the operating status of the line and make necessary adjustments.

[0037] During the actual production process, the circuit board is first transported into the inner cavity of the reaction tank 100 by the conveying assembly. The liquid medicine enters the spray pipe 230 through the bearing seat 250 and then flows out from the two first spray ports 231 of the spray pipe 230. The controller controls the operation of the drive motor 220 of the spray assembly 200. The drive motor 220 drives the connecting rod 242 through the telescopic rod 222, thereby driving the spray pipe 230 to rotate, causing the liquid medicine flowing out of the first spray port 231 to swing. The spray assembly 200 has at least two spray pipes 230, outputting at least four channels of liquid medicine, and the liquid medicine is in a swinging state, which increases the contact time between the liquid medicine and the circuit board, and the liquid medicine quickly covers the circuit board, accelerating the reaction of copper deposition, making the copper deposition effect of each hole of the circuit board close, and improving product quality. The horizontal copper deposition production line realizes automated and efficient copper deposition processing, improving the production quality and consistency of circuit boards. In addition, the spray assembly 200 is assembled into an integral component and can be used in existing horizontal copper deposition production lines. According to the layout of the horizontal copper deposition production lines, a suitable number of horizontal copper deposition production lines can be selected and installed, making it suitable for circuit board manufacturing companies of various sizes.

[0038] Reference Figure 4 In some embodiments of the present invention, the connection method of the drive motor 220 and the telescopic rod 222 in the horizontal copper plating production line is specifically defined. The output shaft of the drive motor 220 is fixed with a turntable 224. The turntable 224 is a key component connecting the drive motor 220 and the eccentric shaft 221. The turntable 224 is usually made of a strong material, such as steel or aluminum alloy, to ensure stability and durability during high-speed rotation. The eccentric shaft 221 is fixed to the side of the turntable 224 and deviates from the center line of the output shaft of the drive motor 220. The eccentric design allows the eccentric shaft 221 to reciprocate with a fixed eccentricity when the turntable 224 rotates. The eccentricity is transmitted to the transmission shaft 223 through the telescopic rod 222, so that the transmission shaft 223 reciprocates in the horizontal sliding groove 241, thereby driving the spray pipe 230 to reciprocate. The eccentricity of the eccentric shaft 221 can be adjusted as needed, such as replacing the turntable 224 of different sizes to control the amplitude and speed of rotation of the spray pipe 230.

[0039] During the operation of the horizontal copper plating production line, after the motor is started, the output shaft drives the turntable 224 to rotate. The rotation of the turntable 224 drives the telescopic rod 222 to produce reciprocating motion through the eccentric shaft 221. The telescopic rod 222 is transmitted to the connecting rod 242 through the transmission shaft 223, so that the spray pipe 230 rotates back and forth within a certain angle range, thereby causing the liquid flowing out of the first spray port 231 to swing, which can cover a wider area, thereby spraying the circuit board more evenly and efficiently.

[0040] It is understandable that in order to achieve precise spray control, the controller can adjust the speed of the drive motor 220, thereby controlling the rotation speed of the turntable 224 and the reciprocating speed of the eccentric shaft 221. The operator can adjust the spray speed and range according to the type of circuit board and the characteristics of the copper plating liquid to achieve the best copper plating effect.

[0041] In other embodiments of the present invention, the turntable of the output shaft of the drive motor 220 in the horizontal copper plating production line is of another design, and a cam groove is provided on the periphery of the turntable. The cam groove is a through groove, and the shape and size of the cam groove are designed to be adapted to the eccentric shaft 221. The eccentric shaft 221 is inserted into the cam groove, and the center line of the eccentric shaft 221 deviates from the center line of the turntable. The eccentric design enables the eccentric shaft 221 to generate reciprocating displacement motion along the cam groove when the turntable is driven by the motor to rotate, and transmits the motion to the transmission shaft 223 through the telescopic rod 222, so that the transmission shaft 223 reciprocates in the horizontal sliding groove 241, thereby driving the spray pipe 230 to rotate back and forth, thereby achieving uniform spraying of the circuit board.

[0042] In actual applications, the rotation speed of the turntable and the eccentricity of the eccentric shaft 221 can be precisely controlled to adjust the rotation speed and amplitude of the spray pipe 230. The operator can adjust the operating parameters of the spray assembly 200 according to different copper deposition requirements and circuit board sizes to achieve the best copper deposition effect.

[0043] It is understood that there are other solutions for the connection structure between the connecting rod 242 and the spray pipe 230. For example, a cable can be provided around the outer wall of the spray pipe 230, with one end of the cable fixed to the spray pipe 230 and the other end fixed to the connecting rod 242. When the connecting rod 242 moves with the transmission shaft 223, the cable can pull the spray pipe 230 to rotate. In addition, a torsion spring is provided between the spray pipe 230 and the fixed seat 210, and the force provided by the torsion spring is used to drive the spray pipe 230 to reset, thereby also achieving rotation of the spray pipe 230. Alternatively, the connecting rod 242 can be configured as a cable, which is wrapped around the spray pipe 230 and fixed. The cable moves with the transmission shaft 223 to pull the spray pipe 230 to rotate. In addition, a torsion spring is provided between the spray pipe 230 and the fixed seat 210, and the force provided by the torsion spring is used to drive the spray pipe 230 to reset.

[0044] Reference Figure 4 In some embodiments of the present invention, the structure of the spray pipe 230 is specifically defined. The outer wall of the spray pipe 230 is provided with two lugs 232. The two lugs 232 are distributed on opposite sides of the spray pipe 230. Each lug 232 is connected to a pin 233, and the pin 233 is connected to the connecting rod 242. It can be understood that the provision of two lugs 232 for the spray pipe 230 can improve versatility. When the spray pipe 230 is installed on the left or right bearing seat 250, there are lugs 232 in corresponding positions that can be used, which improves assembly speed and can also reduce specifications and production costs when producing the spray pipe 230. The connecting rod 242 is provided with a through hole that cooperates with the pin 233. The pin 233 passes through the through hole and is installed on the lug 232. The connecting rod 242 can rotate relative to the pin 233. The pin 233 can be a screw, one section of which is a smooth section without threads, and the smooth section is inserted into the through hole of the connecting rod 242 to meet the requirement of free rotation of the connecting rod 242; or, the pin 233 can also be a rivet, which itself is a smooth cylindrical shape and cooperates with the through hole of the connecting rod 242 to meet the requirement of free rotation of the connecting rod 242.

[0045] It is understood that in some embodiments of the present invention, in addition to being provided with two first spray ports 231 arranged opposite to each other, the spray pipe 230 is also provided with a second spray port, which is located in the middle of the two first spray ports 231. This layout helps to provide more uniform and comprehensive spray coverage. The width of the second spray port is designed to be smaller than the width of the first spray port 231. This is mainly due to the fact that the second spray port is located on the lower side of the spray pipe 230. Under the influence of gravity, the second spray port outputs the liquid the fastest. Therefore, the width of the second spray port is set to be smaller to balance the amount of liquid output, thereby optimizing the distribution of liquid output from each spray port, so that the liquid falls more evenly on the circuit board, thereby improving the efficiency and quality of the copper plating process. By adding a second spray port, the amount of liquid output can be further increased. When the spray pipe 230 rotates back and forth, the three liquids swing and fall on the circuit board, accelerating the speed of contact between the liquid and the circuit board and increasing the contact area. Of course, the number of second spray ports can also be two, three, or more, depending on the size of the circuit board, the number of openings and the operating speed of the horizontal copper deposition production line. It can be adjusted. Since the spray pipe 230 is detachable, it can be achieved by replacing the spray pipe 230 of different specifications, which is simple and easy to use.

[0046] In addition, by adjusting the position and width of the second spray nozzle, it can be optimized according to the size and shape of different circuit boards to meet different production needs. The flexibility of the structure enables the horizontal copper deposition production line to adapt to changing production scenarios and improve the versatility and practicality of the production line.

[0047] It is understood that a diverter mesh can also be provided inside the spray pipe 230, covering the first spray port 231 and / or the second spray port. The diverter mesh can disperse the liquid medicine, making the sprayed liquid more uniform, reducing turbulence, and achieving a smoother output. The diverter mesh can be made of stainless steel or corrosion-resistant plastic mesh, and is cylindrical and matches the inner diameter of the spray pipe to achieve positioning.

[0048] It will be appreciated that in some embodiments of the present invention, the end of the spray pipe 230 facing away from the bearing housing 250 is open. This design facilitates maintenance and inspection of the spray pipe 230. To ensure the spray pipe 230 remains sealed during use, a plug 260 is installed in the opening. The plug 260 is typically made of corrosion-resistant materials, such as stainless steel or engineering plastics, to withstand potentially aggressive chemical environments. The plug 260 is designed to fit snugly into the opening of the spray pipe 230, preventing leakage of the chemical solution or the entry of external contaminants into the spray pipe 230. When maintenance or inspection is required, the plug 260 can be easily removed. It can be threaded and fitted with a sealing ring to prevent leaks. The opening of the spray pipe 230 and the plug 260 help reduce maintenance time and improve production line efficiency. When the spray pipe 230 requires inspection or cleaning, the plug 260 can be quickly removed and then reinstalled to restore the spray pipe 230 to its working state.

[0049] Reference Figure 5 Taking into account the acceleration and improvement of uniformity of spraying, in some embodiments of the present invention, two spray assemblies 200 can be used in combination, that is, the reaction tank 100 is connected to two spray assemblies 200, and the two spray assemblies 200 are relatively arranged on the two opposite side walls of the inner cavity of the reaction tank 100. Taking the spray assembly 200 using two spray pipes 230 as an example, the spray pipes 230 of the two spray assemblies 200 are staggered, which means that along the conveying direction of the circuit board, there are four spray pipes 230 to spray the circuit board. The staggered arrangement of the spray pipes 230 helps to achieve more comprehensive spray coverage, ensuring that every part of the circuit board can be quickly covered by the liquid medicine, which can reduce copper deposition defects caused by uneven spraying. Of course, the spray assembly 200 using three spray pipes 230 or more spray pipes 230 can also be staggered, which also meets the use requirements. In practice, the design of the spray assembly 200 allows the operator to adjust the position and layout of the spray pipes 230 according to the size and shape of the circuit board to achieve the best spraying effect. Furthermore, each spray pipe 230 has three or more outlets. The sprayed liquid, driven by the spray pipe 230, oscillates to fully cover the circuit board and accelerate the copper deposition reaction.

[0050] Reference Figure 1In some embodiments of the present invention, the connection method between the reaction tank 100 and the filtering device is limited. The reaction tank 100 is connected to the filtering device in order to recycle and clean the liquid medicine and prevent impurities from entering the copper deposition process, thereby ensuring the product quality of the circuit board.

[0051] The inner cavity of the reaction tank 100 is divided into two parts: a spray chamber 101 and an immersion chamber 102. The spray assembly 200 is located in the spray chamber 101, and the liquid outlet of the filter device is connected to the spray assembly 200 through a pipe. An infusion pump is usually provided to transport the liquid medicine and pressurize it. The filter device is used to filter out impurities in the liquid medicine to ensure the cleanliness of the liquid medicine. The return port of the filter device is connected to the lower end of the immersion chamber 102 through a pipe, so that the liquid after the reaction can flow back to the filter device for recycling. The position of the delivery assembly in the immersion chamber 102 is relatively low, so that the circuit board can be immersed in the liquid medicine, further improving the copper deposition effect.

[0052] It is understandable that, considering that the circuit board will carry some particles after the holes are processed and the copper produced by the reaction will also fall off, there will be a certain amount of impurities in the liquid medicine. A plurality of guide plates 110 are provided in the immersion chamber 102. The guide plates 110 are arranged at an angle, and the end of the guide plate 110 close to the spray assembly 200 is the high end. When the impurities written in the liquid medicine flow, due to the difference in specific gravity, the impurities will gather at the bottom. The guide plates 110 play a guiding and blocking role, prompting the impurities to flow along the bottom surface of the immersion chamber 102 and eventually enter the filter device, where the impurities are filtered out. The two sides of the guide plate 110 are fixedly connected to the opposite side walls of the immersion chamber 102, which can prevent the impurities from moving upward and increase the stability of the structure.

[0053] The length, placement angle, number of groups, and depth of entry of the guide plates 110 all affect the diversion effect. For example, the length of the guide plates 110 can be selected to be 30m-50m, and the placement angle can be 30°-60°, which can be adjusted according to the flow rate of the liquid medicine.

[0054] Reference Figure 1 Furthermore, a partition 120 is provided between the spray chamber 101 and the immersion chamber 102. This partition 120 serves to separate the two chambers and is provided with a liquid passage 121, allowing the liquid medicine to flow between the two chambers. A guide plate 110 is also positioned within the liquid passage 121. A removable filter 130 is connected to the lower end of the guide plate 110. This filter 130 prevents the passage of solid impurities, thereby reducing the amount of impurities that enter the immersion chamber 102. The removable design of the filter 130 allows for easy removal for cleaning or replacement, facilitating maintenance and upkeep.

[0055] It is understandable that the guide plate 110 in the immersion chamber 102 can also be equipped with a filter 130 to gradually filter out impurities. Multiple filters 130 can be set to gradually increase the mesh size so that the liquid that finally flows into the filter device does not contain particulate impurities.

[0056] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Horizontal copper deposition production line, characterized in that: include: A reaction tank, wherein the reaction tank is provided with an inner cavity, and a conveying component is arranged in the inner cavity to convey the circuit board; The spray assembly is connected to the reaction tank, and the spray assembly includes a fixed seat, a driving motor and at least two spray pipes, the fixed seat is fixed on the reaction tank, a motor bracket is provided in the middle of the fixed seat, and at least one bearing seat is arranged on both sides of the motor bracket, the driving motor is installed in the motor bracket, the output shaft of the motor is connected to the eccentric rotating shaft, the eccentric rotating shaft is connected to the telescopic rod, the other end of the telescopic rod is provided with a transmission shaft, the upper end of the motor bracket is provided with a horizontal sliding groove, the transmission shaft passes through the sliding groove, the input end of the spray pipe is installed in the bearing seat, the bearing seat is provided with an input pipe, the input pipe is sealed with the spray pipe, the input pipe is provided with a flow control valve, the outer wall of the spray pipe is connected to a connecting rod, the other end of the connecting rod is hinged to the transmission shaft, the spray pipe is provided with two first spray openings arranged oppositely, the first spray opening is in a straight line shape and extends along the axial direction of the spray pipe, when the transmission shaft is located at the center of the sliding groove, the two first spray openings of the spray pipe are located in the same horizontal plane; A controller is provided, wherein the driving motor and the flow control valve are electrically connected to the controller.

2. The horizontal copper deposition production line according to claim 1, characterized in that: A rotating disk is fixed to the output shaft of the motor, and the eccentric rotating shaft is fixed to a side of the rotating disk, and the eccentric rotating shaft deviates from the output shaft.

3. The horizontal copper deposition production line according to claim 1, characterized in that: A turntable is fixed to the output shaft of the motor, a cam groove is provided on the periphery of the turntable, and the eccentric shaft passes through the cam groove.

4. The horizontal copper deposition production line according to claim 1, characterized in that: The outer wall of the spray pipe is provided with two support ears, which are distributed on opposite sides of the spray pipe. The support ears are connected with pins, and the connecting rod is provided with a through hole that matches the pins.

5. The horizontal copper deposition production line according to claim 1, characterized in that: The spray pipe is further provided with a second spray port, which is located between the two first spray ports, and the width of the second spray port is smaller than that of the first spray ports.

6. The horizontal copper deposition production line according to claim 1, characterized in that: The reaction tank is connected to two spray assemblies, which are arranged opposite to each other on two opposite side walls of the inner cavity, and the spray pipes of the two spray assemblies are staggered.

7. The horizontal copper deposition production line according to claim 1, characterized in that: One end of the spray pipe away from the bearing seat is an opening, and a plug is installed in the opening.

8. The horizontal copper deposition production line according to claim 1, characterized in that: A diversion net is provided on the back of the spray pipe, and the diversion net covers the first spray port.

9. The horizontal copper deposition production line according to claim 1, characterized in that: The reaction tank is connected to a filtering device, the inner cavity includes a spray chamber and an immersion chamber, the spray assembly is located in the spray chamber, the liquid outlet of the filtering device is connected to the spray assembly through a pipe, and the liquid return port of the filtering device is connected to the lower end of the immersion chamber through a pipe. A plurality of guide plates are arranged in the immersion chamber, the guide plates are arranged obliquely and the end close to the spray assembly is the high end, and the two sides of the guide plates are respectively fixedly connected to the opposite side walls of the immersion chamber.

10. The horizontal copper deposition production line according to claim 9, characterized in that: A partition is provided between the spray chamber and the immersion chamber, the lower end of the partition is provided with a liquid hole, the guide plate is arranged in the liquid hole, the lower end of the guide plate is connected to a detachable filter screen, and the filter screen closes the channel formed by the guide plate and the reaction tank.

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