High-heat-dissipation integrated solar controller

Abstract

The utility model relates to the technical field of lamp controllers, in particular to a high-heat-dissipation integrated solar controller, which is characterized in that a driving circuit board and a control circuit board are respectively arranged in a shell; the driving circuit board is fixed on the heat dissipation bottom plate; the control circuit board is fixed to the side, away from the heat dissipation bottom plate, of the shell. A wire outlet hole is formed in the side wall of the shell; a glue pouring frame communicated with the wire outlet hole is arranged in the shell; the end face, away from the wire outlet hole, of the glue pouring frame abuts against the drive circuit board. The glue pouring frame is sleeved outside a wire outlet of the driving circuit board; the base material of the driving circuit board is an aluminum substrate. The LED lamp has the advantages that the use amount of glue is reduced to the maximum extent, the driving circuit board mainly generating heat is directly attached to the heat dissipation bottom plate for heat dissipation, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp controllers, in particular to a high-heat dissipation integrated solar controller. Background Art

[0002] The structure of a solar street light primarily consists of a lamp body and a controller. In existing lamp designs, the driver board and controller are integrated onto a single circuit board and then mounted inside the housing. The entire housing cavity is then sealed with thermally conductive adhesive to provide a waterproof and moisture-proof seal. Heat generated by the circuit board is then transferred to the housing via the adhesive for dissipation. While this controller design simplifies the circuit board structure and assembly by integrating the driver board and controller onto the same board, using thermally conductive adhesive to dissipate heat from the circuit board is inefficient and requires a large amount of adhesive. Furthermore, since the circuit board is coated in thermally conductive adhesive, damage to the circuit board is impossible to repair. Utility Model Content

[0003] The purpose of the utility model is to provide a high heat dissipation integrated solar controller to address the defects and shortcomings of the existing technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] The utility model describes a high-heat dissipation integrated solar controller, comprising a shell with an opening on one end face, a heat dissipation base plate detachably connected to the open end face of the shell, and a sensor arranged on the surface of the shell; a driving circuit board and a control circuit board are respectively arranged inside the shell; the driving circuit board is fixed on the heat dissipation base plate; the control circuit board is fixed on a side of the shell away from the heat dissipation base plate; a wire outlet hole is provided on the side wall of the shell; a glue potting frame connected to the wire outlet hole is provided inside the shell; an end face of the glue potting frame away from the wire outlet hole is pressed against the driving circuit board; the glue potting frame is sleeved outside the wire outlet of the driving circuit board; the base material of the driving circuit board is an aluminum base plate.

[0006] Furthermore, a plurality of supporting platforms are provided on the inner bottom wall of the shell; a clamping block is provided on both the left and right inner side walls of the shell; and the driving circuit board is clamped between the clamping block and the supporting platform.

[0007] Furthermore, the housing is provided with a countersunk hole; the heat dissipation base plate is provided with a threaded hole; and the bolt passes through the countersunk hole and is threadedly connected in the threaded hole.

[0008] Furthermore, a plurality of heat dissipation fins are evenly distributed on a surface of the heat dissipation base plate away from the driving circuit board.

[0009] Furthermore, a second positioning hole is provided on the surface of the housing away from the heat dissipation base plate; an outer wall of the sensor is provided with an external thread; and a retaining ring is provided on the sensor;

[0010] A retaining ring is provided on the sensor; one end of the sensor passes through the second positioning hole; the retaining ring is pressed against the inner wall of the shell; the end of the sensor extending out of the shell is covered with a pressure ring and a sealing ring; the inner wall of the pressure ring is provided with an internal thread matching the external thread; after the internal thread is threadedly connected to the external thread, the pressure ring presses the sealing ring against the outer wall of the shell.

[0011] Furthermore, a switch hole is provided on the sensor; a power switch is provided in the switch hole.

[0012] Furthermore, the sensor is any one of an infrared sensor or a photoelectric sensor.

[0013] Furthermore, a first positioning through hole is provided on the control circuit board; after the sensor passes through the first positioning through hole and the second positioning hole in sequence, the retaining ring presses the control circuit board against the inner wall of the shell.

[0014] With the above structure, the present invention has the following beneficial effects: The driver circuit board is connected to the control circuit board via wires; the wires of the control circuit board are led out through the glue potting frame and the wire outlet hole; the glue potting frame is filled with glue, thus ensuring the sealing effect of the wire outlet hole; the glue potting of the side surface of the glue potting frame only needs to seal the cross section of the glue potting frame, greatly reducing the amount of glue used. The driver circuit board, which mainly generates heat, is directly attached to the heat dissipation base plate to dissipate heat, thereby improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural diagram of the utility model;

[0016] Figure 2 It is a three-dimensional diagram of the shell;

[0017] Figure 3 It is the structural diagram of the sensor;

[0018] Description of reference numerals:

[0019] 1. Heat dissipation base plate; 101. Heat dissipation fins; 102. Threaded holes; 2. Driver circuit board;

[0020] 202, wire outlet; 3, control circuit board; 301, first positioning through hole; 4, housing;

[0021] 401, outlet hole; 402, countersunk hole; 403, support platform; 404, glue filling frame;

[0022] 405, second positioning hole; 406, clamping block; 5, sensor; 501, switch hole; 502, external thread;

[0023] 503, retaining ring; 6, pressure ring; 601, internal thread; 7, sealing ring. DETAILED DESCRIPTION

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] like Figures 1 to 3 As shown, the high heat dissipation integrated solar controller described in the present invention includes a shell 4 with an opening on one end face, a heat dissipation base plate 1 detachably connected to the open end face of the shell 4, and a sensor 5 arranged on the surface of the shell 4; a driving circuit board 2 and a control circuit board 3 are respectively arranged inside the shell 4; the driving circuit board 2 is fixed on the heat dissipation base plate 1; the control circuit board 3 is fixed on the side of the shell 4 away from the heat dissipation base plate 1; a wire outlet hole 401 is provided on the side wall of the shell 4; a glue potting frame 404 connected to the wire outlet hole 401 is provided inside the shell 4; an end face of the glue potting frame 404 away from the wire outlet hole 401 is pressed against the driving circuit board 2; the glue potting frame 404 is sleeved outside the wire outlet 202 of the driving circuit board 2; the base material of the driving circuit board 2 is an aluminum base plate;

[0026] The sensor 5 is essentially the same as that of the prior art, so it is not described in detail here. The sensor 5 is used to sense external signals and generate signals to turn on the lamp. The outlet 202 is used to connect wires. The driver circuit board 2 and the control circuit board 3 are essentially the same as those of the prior art, so it is not described here in detail here. The only difference is that the driver circuit and the control circuit are separated on different boards and processed separately.

[0027] The driver circuit board 2 is connected to the control circuit board 3 via wires. The wires of the control circuit board 3 are led out through the glue potting frame 404 and the wire outlet hole 401. Because the glue potting frame 404 is filled with glue, the wire outlet hole 401 is sealed effectively. The glue potting of the side surface of the glue potting frame 404 only needs to seal the cross-section of the glue potting frame 404, greatly reducing the amount of glue used. The driver circuit board 2, which mainly generates heat, is directly attached to the heat dissipation base plate 1 to dissipate heat, improving heat dissipation efficiency.

[0028] As a preferred embodiment of the present invention, a plurality of support platforms 403 are provided on the inner bottom wall of the housing 4; a clamping block 406 is provided on both the left and right inner side walls of the housing 4; the driving circuit board 2 is clamped between the clamping block 406 and the support platform 403;

[0029] When the driver circuit board 2 is inserted from the open end face of the housing 4, after the driver circuit board 2 squeezes the wedge-shaped surface of the clamping block 406, the plastic deformation of the housing 4 allows the driver circuit board 2 to pass through the clamping block 406 smoothly. Finally, the driver circuit board 2 is clamped on the supporting platform 403 by the clamping block 406, preventing the driver circuit board 2 from shaking inside the housing 4.

[0030] As a preferred embodiment of the present invention, a countersunk hole 402 is provided on the shell 4; a threaded hole 102 is provided on the heat dissipation base plate 1; a bolt passes through the countersunk hole 402 and is threadedly connected in the threaded hole 102; the shell 4 is connected to the heat dissipation base plate 1 by the bolt, thereby realizing a detachable connection of the heat dissipation base plate 1 on the shell 4.

[0031] As a preferred embodiment of the present invention, a plurality of heat dissipation fins 101 are evenly distributed on a surface of the heat dissipation base plate 1 away from the driver circuit board 2; the heat dissipation fins 101 can increase the heat dissipation area of the heat dissipation base plate 1 and improve the heat dissipation efficiency of the driver circuit board 2.

[0032] As a preferred embodiment of the present invention, a second positioning hole 405 is provided on the surface of the housing 4 away from the heat dissipation base plate 1; an external thread 502 is provided on the outer wall of the sensor 5; and a retaining ring 503 is provided on the sensor 5;

[0033] The sensor 5 is provided with a retaining ring 503; one end of the sensor 5 passes through the second positioning hole 405; the retaining ring 503 is pressed against the inner wall of the housing 4; the end of the sensor 5 extending from the housing 4 is covered with a pressure ring 6 and a sealing ring 7; the inner wall of the pressure ring 6 is provided with an internal thread 601 that matches the external thread 502; after the internal thread 601 is threadedly connected to the external thread 502, the pressure ring 6 presses the sealing ring 7 against the outer wall of the housing 4;

[0034] The sensor 5 and the pressure ring 6 are fixed by a threaded connection and the sealing ring 7 is compressed, which can improve the waterproof effect and realize the detachable connection between the sensor 5 and the housing 4.

[0035] As a preferred embodiment of the present invention, the sensor 5 is provided with a switch hole 501; a power switch is disposed within the switch hole 501. The power switch is used to control the power on and off of the entire circuit, which is essentially the same as in the prior art. When the lamp is not used for an extended period of time or is being transported, turning off the power switch can prevent the control circuit from continuously drawing power, thereby reducing battery power consumption when not in use. A waterproof cover is provided over the switch hole 501 to prevent water from seeping in through the switch hole 501.

[0036] As a preferred embodiment of the present invention, the sensor 5 is any one of an infrared sensor and a photoelectric sensor.

[0037] As a preferred embodiment of the present invention, a first positioning through hole 301 is provided on the control circuit board 3; after the sensor 5 passes through the first positioning through hole 301 and the second positioning hole 405 in sequence, the retaining ring 503 presses the control circuit board 3 against the inner wall of the housing 4;

[0038] The control circuit board 3 is tightly connected with the retaining ring 503 of the sensor 5. The control circuit board 3 is installed at the same time as the sensor 5 is assembled, thereby improving the assembly efficiency of the controller.

[0039] The above description is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, features and principles described in the scope of the present invention patent application are included in the scope of the present invention patent application.

Claims

1. A high heat dissipation integrated solar controller, characterized by: The invention comprises a housing (4) having an end face provided with an opening, a heat dissipation base plate (1) detachably connected to the end face of the opening of the housing (4), and a sensor (5) arranged on the surface of the housing (4); a driving circuit board (2) and a control circuit board (3) are respectively arranged inside the housing (4); the driving circuit board (2) is fixed on the heat dissipation base plate (1); the control circuit board (3) is fixed on a side of the housing (4) away from the heat dissipation base plate (1); a wire outlet hole (401) is provided on a side wall of the housing (4); a glue potting frame (404) connected to the wire outlet hole (401) is provided inside the housing (4); an end face of the glue potting frame (404) away from the wire outlet hole (401) is pressed against the driving circuit board (2); the glue potting frame (404) is sleeved outside the wire outlet (202) of the driving circuit board (2); the base material of the driving circuit board (2) is an aluminum base plate.

2. The high heat dissipation integrated solar controller according to claim 1, characterized in that: A plurality of support platforms (403) are provided on the inner bottom wall of the shell (4); a clamping block (406) is provided on both the left and right inner side walls of the shell (4); and the driving circuit board (2) is clamped between the clamping block (406) and the support platform (403).

3. The high heat dissipation integrated solar controller according to claim 1, characterized in that: The housing (4) is provided with a countersunk hole (402); the heat dissipation base plate (1) is provided with a threaded hole (102); the bolt passes through the countersunk hole (402) and is threadedly connected in the threaded hole (102).

4. The high heat dissipation integrated solar controller according to claim 1, characterized in that: A plurality of heat dissipation fins (101) are evenly distributed on a surface of the heat dissipation base plate (1) away from the driving circuit board (2).

5. The high heat dissipation integrated solar controller according to claim 1, characterized in that: A second positioning hole (405) is provided on the surface of the housing (4) away from the heat dissipation base plate (1); an outer wall of the sensor (5) is provided with an external thread (502); The sensor (5) is provided with a retaining ring (503); one end of the sensor (5) passes through the second positioning hole (405); the retaining ring (503) is pressed against the inner wall of the housing (4); one end of the sensor (5) extending out of the housing (4) is covered with a pressure ring (6) and a sealing ring (7); the inner wall of the pressure ring (6) is provided with an internal thread (601) matching the external thread (502); after the internal thread (601) is threadedly connected to the external thread (502), the pressure ring (6) presses the sealing ring (7) against the outer wall of the housing (4).

6. The high heat dissipation integrated solar controller according to claim 1, characterized in that: The sensor (5) is provided with a switch hole (501); a power switch is provided in the switch hole (501).

7. The high heat dissipation integrated solar controller according to claim 1, characterized in that: The sensor (5) is any one of an infrared sensor and a photoelectric sensor.

8. The high heat dissipation integrated solar controller according to claim 5, characterized in that: The control circuit board (3) is provided with a first positioning through hole (301); the sensor (5) passes through the first positioning through hole (301) and the second positioning hole (405) in sequence, and then the retaining ring (503) presses the control circuit board (3) against the inner wall of the housing (4).

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