Compressor heat dissipation structure of air conditioner outdoor unit

Abstract

The utility model discloses an air conditioner outdoor unit compressor heat dissipation structure which comprises a heat dissipation frame installed on a compressor body in an air conditioner outdoor unit A. Comprising a heat conduction attaching plate attached to the outer surface of a compressor body, a mounting plate integrally cast and formed with the heat conduction attaching plate, elastic plates with one ends installed on the mounting plate, a heat dissipation plate installed between the elastic plates on the same side, a supporting plate perpendicular to the side face of the top end of the mounting plate, and an exhaust fan installed on the supporting plate. The semiconductor chilling plate is mounted on the mounting plate; the compressor is provided with a heat dissipation design, the semiconductor chilling plate and the exhaust fan can achieve the refrigeration and cooling effects on the mounting plate, the semiconductor chilling plate can reduce the surface temperature of the mounting plate, the temperature difference is formed between the mounting plate and the compressor body, the heat dissipation effect is achieved after heat conduction, and the exhaust fan operates to increase airflow flowing and take away heat. And cooling is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of air-conditioning outdoor units, and in particular relates to a heat dissipation structure of a compressor of an air-conditioning outdoor unit. Background Art

[0002] The outdoor unit of the air conditioner is an important component of the air conditioning system. The outdoor unit of the air conditioner is also called the air conditioner outdoor unit. Its main function is to discharge the high-temperature gas in the room to the outside, so as to achieve the effect of cooling and heat dissipation. After the hot gas condenses in the chassis, it is sent to the indoor unit through the pipe. After repeated circulation, the indoor temperature is reduced. The compressor in the outdoor unit is an important component. The air conditioner mainly uses the compressor to compress the refrigerant into high-temperature and high-pressure gas to achieve heat exchange.

[0003] At present, the heat dissipation of the compressor inside the air-conditioning outdoor unit is mainly determined by the outdoor unit fan and the installation environment. When the outdoor unit fan fails, it is easy to cause the compressor to over-temperature protection, so that the air conditioner cannot operate normally and even damage the compressor. When the air-conditioning outdoor unit is in use, there is a problem that there is no heat dissipation design on the compressor. For this reason, this application proposes a heat dissipation structure for the compressor of the air-conditioning outdoor unit. Utility Model Content

[0004] The purpose of the utility model is to provide a heat dissipation structure for a compressor of an air-conditioning outdoor unit, so as to solve the problem in the above background technology that the air-conditioning outdoor unit has no heat dissipation design on the compressor when in use.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: a heat dissipation structure of an outdoor unit compressor of an air conditioner, comprising

[0006] The heat dissipation frame installed on the compressor body inside the air conditioner outdoor unit A includes a heat-conducting plate attached to the outer surface of the compressor body, a mounting plate integrally cast with the heat-conducting plate, a spring plate mounted on one end of the mounting plate, a heat dissipation plate mounted between the spring plates on the same side, a support plate perpendicular to the top side of the mounting plate, and an exhaust fan mounted on the support plate;

[0007] The semiconductor cooling chip is installed on the mounting plate.

[0008] Preferably, the heat-conducting plate is curved, and the inner diameter of the heat-conducting plate is the same as the outer diameter of the compressor body.

[0009] Preferably, the spring plate is in a curved shape that matches the outer surface of the compressor body, and one end of the spring plate close to the mounting plate is bent and extended to have a vertical end a, and the mounting plate is in contact with the vertical end a.

[0010] Preferably, a pinching rod is provided between the ends of the spring plates on the same side in the vertical direction and away from the mounting plate, and the top and bottom ends of the pinching rod are bent at 90 degrees.

[0011] Preferably, the semiconductor refrigeration plate is a quadrilateral with a frame-shaped ring structure.

[0012] Preferably, a shunt assembly is provided at the center position of the side of the mounting plate, and the shunt assembly includes a heat-conducting copper column connected to the mounting plate and a guide block connected to the other end of the heat-conducting copper column, and the guide block is semi-ellipsoidal in shape.

[0013] Preferably, a connecting rod is provided on the bottom end of the side of the mounting plate, and a collecting box is provided at the other end of the connecting rod. The collecting box is hollow inside and has a sealed bottom end. The sealed bottom surface of the collecting box is provided with flow guide air ducts connected side by side, and the collecting box is wide at the top and narrow at the bottom.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] In the present utility model, the compressor is designed to dissipate heat, and the semiconductor refrigeration plate can achieve a cooling and cooling effect on the mounting plate. The cold surface B of the semiconductor refrigeration plate contacts the mounting plate, which can reduce the surface temperature of the mounting plate, so that a temperature difference is formed between the mounting plate and the compressor body, which is conducive to heat conduction and achieves a heat dissipation effect. The operation of the exhaust fan can increase the airflow on the hot surface C of the semiconductor refrigeration plate, take away heat, and achieve cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the top view of the mounting plate of the present invention;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the guide block of the present invention;

[0019] Figure 4 This is a schematic diagram of the top view of the collecting box of the present invention;

[0020] In the figure: 1. Compressor body; 3. Semiconductor refrigeration plate; 6. Support plate; 7. Exhaust fan; 21. Mounting plate; 22. Thermal conductive contact plate; 23. Spring plate; 24. Heat dissipation plate; 41. Guide block; 42. Thermal conductive copper column; 51. Connecting rod; 52. Collecting box; 53. Guide air pipe; 231. Holding rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example

[0023] See also Figures 1 to 4 The present invention provides a technical solution: a heat dissipation structure of an outdoor unit compressor of an air conditioner, comprising a heat dissipation frame of a compressor body 1 installed inside the outdoor unit A of the air conditioner. The operating principle of the outdoor unit A of the air conditioner and the compressor body 1 is a conventional technical means, which will not be described in detail in this application. The heat dissipation frame comprises a heat conductive pressing plate 22 attached to the outer surface of the compressor body 1, a mounting plate 21 integrally cast with the heat conductive pressing plate 22, a spring plate 23 installed at one end on the mounting plate 21, a heat dissipation plate 24 installed between the spring plates 23 on the same side, a support plate 6 on the top side of the vertical mounting plate 21, and an exhaust fan 7 installed on the support plate 6. The heat conductive pressing plate 22 and the mounting plate 21 are made of copper heat conductive material, and the spring plate 23 and the heat dissipation plate 24 are made of copper-aluminum alloy heat dissipation material. Under the principle of heat conduction, that is, when there is a temperature difference, heat energy is transferred from high temperature to low temperature, and the high temperature on the shell of the compressor body 1 is conducted to the low-temperature heat-conducting plate 22, the mounting plate 21, the spring plate 23 and the heat dissipation plate 24 to achieve heat dissipation. In addition, when the exhaust fan 7 is running, the airflow on the surface of the mounting plate 21 can be increased to take away the heat and achieve cooling; the semiconductor refrigeration plate 3 installed on the mounting plate 21, the semiconductor refrigeration plate 3 is a refrigeration device composed of semiconductors that uses conventional thermoelectric effect for cooling, the semiconductor refrigeration plate 3 can achieve a cooling and cooling effect on the mounting plate 21, the cold surface B of the semiconductor refrigeration plate 3 is in contact with the mounting plate 21, and the exhaust fan 7 can increase the airflow on the hot surface C of the semiconductor refrigeration plate 3 when it is running, so as to take away the heat and achieve cooling.

[0024] In this embodiment, the heat conductive plate 22 is curved, and the inner diameter of the heat conductive plate 22 is the same as the outer diameter of the compressor body 1 . The heat conductive plate 22 and the compressor body 1 are stably attached.

[0025] In this embodiment, the spring plate 23 is a curved shape that matches the outer surface of the compressor body 1. The spring plate 23 is bent and extended at one end close to the mounting plate 21 to have a vertical end a. The mounting plate 21 is in contact with the vertical end a. A pinching rod 231 is provided between the ends of the spring plate 23 on the same side in the vertical direction and away from the mounting plate 21. The top and bottom ends of the pinching rod 231 are bent at 90 degrees. By opening the pinching rod 231, the spring plate 23 can be opened, which facilitates the installation of the heat sink on the compressor body 1. The mounting plate 21 and the compressor body 1 are combined by conventional methods.

[0026] In this embodiment, the semiconductor refrigeration plate 3 is a quadrilateral and frame-shaped ring structure, and the semiconductor refrigeration plate 3 plays the role of cooling and cooling.

[0027] In this embodiment, a diversion component is provided at the center position of the side of the mounting plate 21. The diversion component includes a heat-conducting copper column 42 connected to the mounting plate 21 and a guide block 41 connected to the other end of the heat-conducting copper column 42. The guide block 41 is in the shape of a semi-ellipsoidal sphere, and the cross-section of the guide block 41 is in the shape of an airfoil. When the exhaust fan 7 exhausts, it is beneficial for the flow to rise around the guide block 41, thereby accelerating the airflow on the hot surface C of the semiconductor refrigeration plate 3. A connecting rod 51 is provided on the bottom end of the side of the mounting plate 21. The other end of the connecting rod 51 A collecting box 52 is provided, which is a hollow structure with a sealed bottom end. The sealed bottom surface of the collecting box 52 is provided with a guide air duct 53 connected side by side. The collecting box 52 is wide at the top and narrow at the bottom. The guide air duct 53 is connected to the chamber where the cooling fan is installed inside the air-conditioning outdoor unit A. When the flow circulates in the collecting box 52, one side of the collecting box 52 is wide and the diameter of one side of the guide air duct 53 is narrow. When the exhaust fan 7 exhausts, the hot air flow in the chamber where the cooling fan is installed can be prevented from flowing back into the collecting box 52.

[0028] The working principle and use process of this utility model:

[0029] When the compressor body 1 is in use, the heat-conducting plate 22 and the mounting plate 21 are made of copper heat-conducting material, and the spring plate 23 and the heat sink 24 are made of copper-aluminum alloy heat-dissipating material. Under the principle of heat conduction, that is, when there is a temperature difference, heat energy is transferred from high temperature to low temperature. The high temperature on the shell of the compressor body 1 is conducted to the heat-conducting plate 22, the mounting plate 21, the spring plate 23 and the heat sink 24 at low temperature, thereby achieving heat dissipation.

[0030] The semiconductor refrigeration sheet 3 can achieve a cooling effect on the mounting plate 21. The cold surface B of the semiconductor refrigeration sheet 3 contacts the mounting plate 21, which can reduce the surface temperature of the mounting plate 21, so that a temperature difference is formed between the mounting plate 21 and the compressor body 1, which is beneficial to heat conduction.

[0031] The exhaust fan 7 is running to increase the airflow on the surface of the mounting plate 21, taking away the heat and achieving cooling;

[0032] The operation of the exhaust fan 7 can increase the airflow on the hot surface C of the semiconductor cooling plate 3, take away the heat and achieve cooling;

[0033] The guide block 41 is in the shape of a semi-ellipsoid, and the cross section of the guide block 41 is in the shape of an airfoil. When the exhaust fan 7 exhausts air, it is beneficial for the flow around the guide block 41 to accelerate the airflow on the hot surface C of the semiconductor cooling plate 3.

[0034] The operation of the exhaust fan 7 can increase the airflow on the hot surface C of the semiconductor cooling plate 3, take away the heat and achieve cooling;

[0035] To sum up: the compressor is designed to dissipate heat, and the semiconductor refrigeration plate 3 can achieve a cooling and cooling effect on the mounting plate 21. The cold surface B of the semiconductor refrigeration plate 3 is in contact with the mounting plate 21, which can reduce the surface temperature of the mounting plate 21, so that a temperature difference is formed between the mounting plate 21 and the compressor body 1, which is conducive to heat conduction and then achieves a heat dissipation effect. The operation of the exhaust fan 7 can increase the airflow on the hot surface C of the semiconductor refrigeration plate 3, take away heat, and achieve cooling.

[0036] Although embodiments of the present invention have been shown and described (see the detailed description above for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for a compressor of an air conditioner outdoor unit, characterized in that: include A heat dissipation frame mounted on a compressor body (1) inside an air conditioner outdoor unit A comprises a heat-conducting plate (22) bonded to the outer surface of the compressor body (1), a mounting plate (21) integrally cast with the heat-conducting plate (22), a spring plate (23) mounted on one end of the mounting plate (21), a heat dissipation plate (24) mounted between the spring plates (23) on the same side, a support plate (6) perpendicular to the top side of the mounting plate (21), and an exhaust fan (7) mounted on the support plate (6); A semiconductor refrigeration plate (3) is mounted on a mounting plate (21).

2. The heat dissipation structure of the compressor of the air conditioner outdoor unit according to claim 1, characterized in that: The heat-conducting plate (22) is in a curved shape, and the inner diameter of the heat-conducting plate (22) is the same as the outer diameter of the compressor body (1).

3. The heat dissipation structure of the compressor of the air conditioner outdoor unit according to claim 1, characterized in that: The spring plate (23) is in a curved shape that matches the outer surface of the compressor body (1); one end of the spring plate (23) close to the mounting plate (21) is bent and extended to have a vertical end a, and the mounting plate (21) is in contact with the vertical end a.

4. The heat dissipation structure of the compressor of the air conditioner outdoor unit according to claim 1, characterized in that: A pinching rod (231) is provided between the ends of the spring plate (23) on the same side in the vertical direction and away from the mounting plate (21), and the top and bottom ends of the pinching rod (231) are bent at 90 degrees.

5. The heat dissipation structure of the compressor of the air conditioner outdoor unit according to claim 1, characterized in that: The semiconductor refrigeration plate (3) is a quadrilateral and frame-shaped ring structure.

6. The heat dissipation structure of the compressor of the air conditioner outdoor unit according to claim 1, characterized in that: A shunt assembly is provided at the center of the side of the mounting plate (21), the shunt assembly comprising a heat-conducting copper column (42) connected to the mounting plate (21) and a guide block (41) connected to the other end of the heat-conducting copper column (42), wherein the guide block (41) is in the shape of a semi-ellipsoid.

7. The heat dissipation structure of an air conditioner outdoor unit compressor according to claim 1, characterized in that: A connecting rod (51) is provided on the bottom end of the side of the mounting plate (21), and a collecting box (52) is provided at the other end of the connecting rod (51). The collecting box (52) is a hollow structure with a sealed bottom end. The sealed bottom surface of the collecting box (52) is provided with a flow guide air pipe (53) connected in parallel. The collecting box (52) is in a shape with a wide top end and a narrow bottom end.

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