Condensation part, semiconductor refrigeration module and semiconductor dehumidifier

Abstract

The utility model belongs to the technical field of refrigeration and dehumidification, and particularly relates to a condensation piece, a semiconductor refrigeration module and a semiconductor dehumidifier. Comprising a base plate and a plurality of condensation fins arranged on the base plate, the condensation fins are arranged on the same side face of the base plate at intervals, and each condensation fin is provided with a notch penetrating through the left side, the right side and the front side of the condensation fin, so that each condensation fin is provided with a plurality of secondary fins extending forwards. The structure of a whole-piece type condensation fin is improved, a plurality of secondary fins are formed on a single condensation fin, and the base plate is in contact with the semiconductor condensation piece and transmits low temperature to the secondary fins, so that cooling capacity is more concentrated, formation of condensed water can be accelerated, and dehumidification efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of refrigeration and dehumidification, and in particular relates to a condensing element, a semiconductor refrigeration module and a semiconductor dehumidifier. Background Art

[0002] Semiconductor cooling modules utilize the Peltier effect between P-type and N-type semiconductors to achieve cooling and dehumidification. When current passes through the two semiconductor materials, heat and cold are generated. When the temperature difference between the cooling end and the ambient temperature is large, water molecules in the air are condensed into water, achieving the dehumidification effect.

[0003] In order to improve the condensation effect, a condensation element is currently installed at the cold end of the semiconductor refrigeration plate. The condensation element absorbs the low temperature of the cold end of the semiconductor refrigeration plate and comes into contact with the air flow so that the moisture in the air flow is cooled and liquefied. However, the existing condensation plates are all in the form of a whole plate, and their condensation effect is limited. In addition, within the limited space, the condensation effect cannot be improved by increasing the number of condensation plates. Utility Model Content

[0004] The purpose of the utility model is to provide a condensing element, which greatly improves the condensing effect by optimizing the structural design of a single condensing fin.

[0005] Based on this, the utility model provides a condensation component, including a substrate and a plurality of condensation fins arranged on the substrate. The plurality of condensation fins are arranged at intervals on the same side of the substrate. A single condensation fin is provided with a notch running through its left and right sides and front side, so that a single condensation fin has multiple secondary fins extending forward.

[0006] In the condensing element as described above, a single condensing fin is provided with a plurality of the notches spaced apart from top to bottom.

[0007] In the condensing element as described above, the notches on the plurality of condensing fins are positioned relative to each other, and the secondary fins on the plurality of condensing fins are positioned relative to each other.

[0008] In the condensing element as described above, the number of notches in a single condensing fin is N, and the number of the secondary fins is N+1.

[0009] In the condensing element as described above, the notch and the upper and lower sides of the secondary fins are inclined from top to bottom.

[0010] In the condensing element as described above, the width of a single secondary fin is 8 mm to 13 mm, and the width of a single notch is 8 mm to 13 mm.

[0011] In the condensing element as described above, the thickness B of a single condensing fin is 0.8 mm to 2 mm.

[0012] In the condensing element as described above, the front side of the secondary fin is an arc end surface.

[0013] The utility model also provides a semiconductor refrigeration module, comprising a semiconductor refrigeration plate, a heat sink arranged on the hot end of the semiconductor refrigeration plate, and the above-mentioned condensing element arranged on the cold end of the semiconductor refrigeration plate.

[0014] The utility model also provides a semiconductor dehumidifier, comprising a dehumidifier body, wherein the semiconductor refrigeration module is arranged in the dehumidifier body.

[0015] The implementation of the present invention has the following beneficial effects:

[0016] The utility model provides a condensing element, which improves the structure of the whole-piece condensing fin, forms multiple secondary fins on a single condensing fin, and uses a substrate as a contact with the semiconductor condensing sheet to transfer the low temperature to the multiple secondary fins, so that the cooling capacity is more concentrated, the formation of condensed water can be accelerated, and the dehumidification efficiency is improved. Moreover, compared with the traditional whole-piece condensing fin, after the condensed water droplets are generated on the secondary fins, they do not need to slide across the entire condensing fin to drip into the water tank, that is, the water droplets can drip from the notch after sliding across the secondary fins, which reduces the time that the water droplets stay on the condensing fins and reduces the consumption of cooling capacity, so as to collect moisture in the air faster and improve the condensation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A schematic diagram of a condensing element provided in an embodiment of the present utility model;

[0019] Figure 2 for Figure 1 Side view of;

[0020] Figure 3 Schematic diagram of a semiconductor refrigeration module. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] like Figure 1 、 Figure 2 As shown, an embodiment of the present invention provides a condensing element, comprising a substrate 1 and a plurality of condensing fins 11 disposed on the substrate 1. The plurality of condensing fins 11 are spaced apart and disposed on the same side of the substrate 1. A single condensing fin 11 is provided with a notch 101 extending through its left and right sides and front side, so that a single condensing fin 11 has a plurality of secondary fins 12 extending forward. This solution improves the structure of the integral condensing fin, forming a plurality of secondary fins 12 on a single condensing fin 11. The substrate 1 acts as a contact with the semiconductor condensing sheet and transfers the low temperature to the plurality of secondary fins 12, thereby concentrating the cooling capacity, accelerating the formation of condensed water, and improving the dehumidification efficiency.

[0023] During the condensation process, water droplets will be produced and slide down on the condensing fins. In the traditional whole-piece condensing fin structure, the water droplets slide down along a longer path and leave water marks on the fin surface or stay on the fin surface, and continue to absorb the cooling energy of the fin. At this time, the air flow will take away some water and more cooling energy. This process is actually a loss of cooling energy. Compared with the traditional whole-piece condensing fin, after the condensed water droplets are generated on the secondary fin 12, they can drip down without sliding across the entire condensing fin. That is, the water droplets can drip down from the notch 101 after sliding across a single secondary fin 12, reducing the time the water droplets stay on the condensing fin and the sliding path, reducing the consumption of cooling energy, so as to collect moisture in the air faster and improve the condensation efficiency.

[0024] In the embodiment of the present invention, a single condensing fin 11 is provided with a plurality of notches 101 spaced apart from top to bottom. That is, the intervals between the plurality of secondary fins 12 are the notches 101, which ensures that the paths for water droplets to fall are reduced while also ensuring that a plurality of forward-extending secondary fins 12 are in contact with the airflow.

[0025] In order to allow water droplets to drip directly into the water tank below after sliding down the secondary fins 12, the condensing fins 11 of this scheme can be designed as a structure in which multiple secondary fins 12 are staggered in the vertical direction, that is, a single condensing fin 11 is a non-planar sheet, so that the lower side of each secondary fin 12 is opposite to the water tank, so that the condensed water can drip into the water tank more directly.

[0026] Of course, in order to make the structure simpler, this solution preferably uses a flat sheet-like condensing fin 11. Since a single condensing fin 11 in this solution has multiple secondary fins 12, and the multiple secondary fins 12 are opposite to each other in the vertical direction, the water droplets emphasized above can slide over a single secondary fin 12 and drip from the notch 101, and may also drip onto the secondary fin 12 below, but compared with the whole-piece sliding path, the sliding path is greatly reduced, and it also makes it possible for some water droplets to drip directly into the water tray.

[0027] In the embodiment of the present invention, the notches 101 on the plurality of condensing fins 11 are positioned opposite to each other, and the secondary fins 12 on the plurality of condensing fins 11 are positioned opposite to each other. Such a structural layout is relatively regular, making the manufacturing easier.

[0028] In addition, the number of secondary fins 12 and notches 101 in this solution satisfies the following conditions: the number of notches 101 in a single condensing fin 11 is N, and the number of secondary fins 12 is N+1. This layout ensures that the upper and lower sides of a single condensing fin 11 are both equipped with secondary fins 12. In this embodiment, a single condensing fin 11 has three notches 101 and four secondary fins 12.

[0029] In the embodiment of the present invention, in order to facilitate the water droplets to fall after being attached to the secondary fin 12, the notch 101 and the upper and lower sides of the secondary fin 12 are inclined from top to bottom. The formation of the upward and downward inclination is conducive to the water droplets to converge along the inclined surface at the inclined tip, thereby condensing into larger water droplets and dripping.

[0030] In addition, in the embodiment of the present invention, in order to facilitate the manufacture of the product, the thickness B of the single-piece condensing fin 11 is 0.8mm to 2mm. This thickness will affect the efficiency of temperature transfer and the difficulty of manufacturing. When the thickness B of a single-piece condensing fin 11 is less than 0.8mm, it will be difficult to ensure the quality of multiple condensing fins 11 per unit length, and the yield rate will be low. Moreover, if it is too thin, it will be easily damaged during the installation process. When the thickness exceeds 2mm, the excessive thickness will lead to a decrease in the efficiency of cold-end temperature transfer and increase the overall weight and cost. Preferably, in the embodiment of the present invention, the thickness B of the single-piece condensing fin 11 is 1.5mm.

[0031] In the embodiment of the present invention, the width K of a single secondary fin 12 is 8 mm to 13 mm, and the width k of a single notch 101 is 8 mm to 13 mm. This width facilitates a reasonable distribution of the number of notches 101 and secondary fins 12 on a single secondary fin 12, and does not cause the size of the secondary fin 12 to be too small, thereby affecting its contact with the airflow for condensation.

[0032] Similarly, the overall size of the secondary fin 12 is determined by its width K, height H and thickness B. Preferably, in the embodiment of the present invention, the width K is generally 11 mm, the height H is 14 mm, and the thickness B is 1.5 mm.

[0033] In this embodiment, the front side of the secondary fin 12 is a circular arc end surface. Due to the structure of multiple secondary fins 12, the single condensing fin 11 is generally serrated. In this way, during installation or transportation, the end surface of a single secondary fin 12 is easily deformed due to collision. Optimizing this end surface to a circular arc end surface is conducive to reducing the damage rate.

[0034] like Figure 3 As shown, the present invention also provides a semiconductor refrigeration module, comprising a semiconductor refrigeration plate 91, a heat sink 2 disposed on the hot end of the semiconductor refrigeration plate 91, and the aforementioned condensing element disposed on the cold end of the semiconductor refrigeration plate 91. Since the semiconductor refrigeration module includes the aforementioned condensing element, it also has the same beneficial effects.

[0035] In addition, the present invention also provides a semiconductor dehumidifier, comprising a dehumidifier body, wherein the semiconductor refrigeration module is provided in the dehumidifier body.

[0036] The utility model provides a condensing element, which improves the structure of the whole-piece condensing fin, forms multiple secondary fins on a single condensing fin, and uses a substrate as a contact with the semiconductor condensing sheet to transfer the low temperature to the multiple secondary fins, so that the cooling capacity is more concentrated, the formation of condensed water can be accelerated, and the dehumidification efficiency is improved. Moreover, compared with the traditional whole-piece condensing fin, after the condensed water droplets are generated on the secondary fins, they do not need to slide across the entire condensing fin to drip into the water tank, that is, the water droplets can drip from the notch after sliding across the secondary fins, which reduces the time that the water droplets stay on the condensing fins and reduces the consumption of cooling capacity, so as to collect moisture in the air faster and improve the condensation efficiency.

[0037] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information. In addition, the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., which indicate orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0038] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A condensing element, characterized in that: The invention comprises a base plate (1) and a plurality of condensing fins (11) arranged on the base plate (1), wherein the plurality of condensing fins (11) are arranged at intervals on the same side of the base plate (1), and a single condensing fin (11) is provided with a notch (101) running through the left and right sides and the front side thereof, so that the single condensing fin (11) has a plurality of secondary fins (12) extending forward.

2. A condensation element according to claim 1, characterized in that: A single condensing fin (11) is provided with a plurality of notches (101) spaced apart from top to bottom.

3. A condensation element according to claim 2, characterized in that: The notches (101) on the plurality of condensing fins (11) are positioned relative to each other, and the secondary fins (12) on the plurality of condensing fins (11) are positioned relative to each other.

4. A condensing element according to claim 3, characterized in that: The number of notches (101) of a single condensing fin (11) is N, and the number of secondary fins (12) is N+1.

5. A condensation element according to any one of claims 1 to 4, characterized in that: The notch (101) and the upper and lower sides of the secondary fin (12) are both inclined from top to bottom.

6. A condensation element according to claim 5, characterized in that: The width of a single secondary fin (12) is 8 mm to 13 mm, and the width of a single notch (101) is 8 mm to 13 mm.

7. The condensing element according to claim 5, characterized in that: The thickness B of the single condensing fin (11) is 0.8 mm to 2 mm.

8. The condensing element according to claim 5, characterized in that: The front side of the secondary fin (12) is an arc end surface.

9. A semiconductor refrigeration module, characterized in that: The invention comprises a semiconductor refrigeration plate (91), a heat sink (2) provided on the hot end of the semiconductor refrigeration plate (91), and a condensing element according to any one of claims 1 to 8 provided on the cold end of the semiconductor refrigeration plate (91).

10. A semiconductor dehumidifier, characterized in that: It comprises a dehumidifier body, in which the semiconductor refrigeration module as claimed in claim 9 is arranged.

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