Sample refrigeration transfer box using semiconductor for refrigeration

Abstract

The utility model relates to the technical field of environmental sample detection, in particular to a sample refrigeration transfer box using a semiconductor for refrigeration. Comprising a box body and a box cover detachably connected with the box body, a space for containing sample bottles is formed in the box body, a temperature control device is arranged in the box cover and comprises a semiconductor refrigeration module, the semiconductor refrigeration module is laid in the longitudinal middle of the box cover, and the cold end of the semiconductor refrigeration module faces the interior of the box body; the side, facing the interior of the box body, of the cold end of the semiconductor refrigeration module is further provided with an air circulation fan, a cooling fan is arranged between the hot end of the semiconductor refrigeration module and the top of the box cover and communicated with outside air, and the power module is connected with the semiconductor refrigeration module and located at one corner of the box cover. The bottom end of the temperature detector extends into the box body, the temperature detector is connected with the input end of a temperature controller, and the output end of the temperature controller is connected with the semiconductor refrigeration module. The utility model has the advantage that the semiconductor refrigeration scheme is used for replacing the original ice bag cooling scheme.

Description

Technical Field

[0001] The utility model relates to the technical field of environmental sample detection, in particular to a sample refrigeration transfer box using semiconductor refrigeration. Background Art

[0002] Currently, in the environmental monitoring process, a considerable number of monitoring samples need to be collected and refrigerated before being transported back to the laboratory for analysis and testing. However, most environmental samples are water or liquid absorbents. Water and other absorbents have a large specific heat capacity. Existing refrigerated transfer boxes are generally made using an injection molding process, with the inner and outer surfaces made of PP plastic and the middle filled with PU for insulation. This solution has no active refrigeration function and only relies on ice boxes and ice bags to provide insulation. Especially in the summer, it is difficult to cool down through ice bags and the like. In addition, thermal printed labels are currently used in many occasions. When the temperature is too high, the labels often become completely black and invalid. If the temperature of the refrigerated box does not meet the requirements, the sample temperature will rise, affecting the test results. Existing refrigerated boxes cannot provide a suitable temperature to meet the needs of sample transportation. Utility Model Content

[0003] The problem to be solved is to solve the problem of effective low-temperature preservation during sample transfer, and to improve the refrigerator so that the refrigerator has active refrigeration and controllable temperature.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a sample refrigeration transfer box using semiconductor refrigeration, comprising a box body and a box cover detachably connected to the box body, wherein there is space for accommodating sample bottles in the box body, and a temperature control device is provided in the box cover, the temperature control device comprises a semiconductor refrigeration module, the semiconductor refrigeration module is laid in the longitudinal middle part of the box cover and the cold end of the semiconductor refrigeration module faces the interior of the box body, an air circulation fan is also provided on the side of the cold end of the semiconductor refrigeration module facing the interior of the box body, a cooling fan is provided between the hot end of the semiconductor refrigeration module and the top of the box cover, the cooling fan is connected to the outside air, a power module is connected to the semiconductor refrigeration module and is located at a corner of the box cover, a temperature detector is provided at the corner opposite to the power module, the bottom end of the temperature detector extends into the box body, the temperature detector is connected to the input end of the temperature controller, and the output end of the temperature controller is connected to the semiconductor refrigeration module.

[0005] Preferably, the temperature controller is arranged at a corner of the box cover adjacent to the temperature detector, and the cooling fan is arranged in the middle of the box cover.

[0006] Preferably, an inner basket is provided in the box body, the inner basket comprises a plurality of compartments, and each surface of the plurality of compartments is a hollow plate.

[0007] Preferably, the sizes of the plurality of grids are not completely the same.

[0008] Preferably, the temperature detector is close to the bottom wall of the box.

[0009] Compared with the prior art, the present invention provides a sample refrigeration transfer box using semiconductor refrigeration, which has the following beneficial effects: The advantage of the present invention is that it uses a semiconductor refrigeration solution instead of the original ice bag cooling solution. The semiconductor refrigeration solution occupies a small volume, is light in weight, and is easy to carry. The power module it comes with can be powered by a 12V vehicle power supply or has its own battery, making it flexible and diverse in usage scenarios. The temperature controller sets the required temperature to make the temperature control more stable. Moreover, in this solution, no ice box or ice bag is placed in the box to save space inside the box; in addition, an inner basket is embedded in the box part, which can be divided into compartments of different sizes as needed, and can meet the storage and fixation of sample bottles, absorption tubes, etc. of different sizes. The present invention is used for the transfer and delivery of samples with refrigeration requirements, and can also be used in other suitable scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a structural diagram of the lid of the utility model;

[0011] Figure 2 This is a box structure diagram of the utility model;

[0012] Explanation of the accompanying reference numerals: 1. Box body; 11. Inner basket; 12. Compartment; 13. Hollow plate; 2. Box cover; 21. Power module; 22. Semiconductor refrigeration module; 23. Cooling fan; 24. Air circulation fan; 25. Temperature controller; 26. Temperature detector. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention:

[0014] Refrigeration methods are generally categorized into three main types: compression refrigeration, absorption refrigeration, and semiconductor refrigeration. Compared to compression and absorption refrigeration, semiconductor refrigeration is smaller, lighter, and more portable, making it more suitable for outdoor use. Therefore, this utility model considers incorporating semiconductor refrigeration into the refrigerator's modification.

[0015] As shown in the figure, the refrigerator of the present invention includes a box body 1 and a box cover 2 detachably connected to the box body 1. The box body 1 is made of PP plastic and is filled with a PU insulation layer in the middle. The box cover 2 is fixed to the box body 1 by a bayonet, and the box body 1 has a handle on the outside for pulling. There is space for accommodating sample bottles in the box body 1, and a temperature control device is provided in the box cover 2. The temperature control device can collect the temperature in the box body 1 on the one hand, and adjust the temperature in the box body 1 on the other hand. The specific temperature control device includes a semiconductor refrigeration module 22. The semiconductor refrigeration module 22 is laid in the longitudinal middle of the box cover 2 and the cold end of the semiconductor refrigeration module 22 faces the box body 1. The area of the semiconductor refrigeration module 22 is the same as the cross-section of the box cover 2. An air circulation fan 24 is also provided on the side of the cold end of the semiconductor refrigeration module 22 facing the box body 1. The air circulation fan 24 performs internal circulation to quickly transfer the low temperature generated by the semiconductor refrigeration module 22 to the box body 1; a heat dissipation fan is provided between the hot end of the semiconductor refrigeration module 22 and the top of the box cover 2 The hot fan 23 and the heat dissipation fan 23 are connected to the external air for external circulation. The heat dissipation fan 23 quickly transfers the heat from the hot end of the semiconductor refrigeration module 22 to the air. The semiconductor refrigeration module 22 is provided with electricity by the power module 21 to work; the power module 21 is connected to the semiconductor refrigeration module 22 and is located at a corner of the box cover 2. The power module 21 has two power supply options, namely a rechargeable battery and a 12V DC power supply capacity; a temperature detector 26 is provided at a corner opposite to the power module 21. The bottom end of the temperature detector 26 extends into the box body 1 and is close to the bottom wall of the box body 1, so that the temperature of the box body 1 farther away from the semiconductor refrigeration module 22 can be collected. The temperature detector 26 is connected to the input end of the temperature controller 25, and the output end of the temperature controller 25 is connected to the semiconductor refrigeration module 22. The temperature controller 25 displays the real-time temperature of the temperature detector 26 and can set the required temperature. The semiconductor refrigeration module 22 adjusts the working state according to the required temperature. The temperature controller 25 is arranged at a corner of the box cover 2 adjacent to the temperature detector 26 to avoid overlapping with the power module 21. The cooling fan 23 is arranged in the middle position of the box cover 2. Since the cooling fan 23 is connected to the outside, the heat in the box cover 2 can be quickly discharged.

[0016] Sample bottles are generally made of glass, which can break easily when they collide with each other. Therefore, an inner basket 11 is provided in the box body 1. The bottom of the inner basket 11 is a hollow plate 13. The inner basket 11 includes a plurality of compartments 12, and each surface of the plurality of compartments 12 also has the same structure as the hollow plate 13. Since the sample containers vary in size, the sizes of the plurality of compartments 12 are not exactly the same. The space within the compartments 12 serves as an area for accommodating sample bottles. The inner basket 11 can be made of PP or stainless steel as needed. The inner basket 11 can be divided into compartments 12 of different sizes as needed to accommodate the storage and fixation of sample bottles or absorption tubes of different specifications. The inner basket 11 is a hollow mesh structure. On the basis of reducing weight and saving materials, it also provides circulation space for air flow in the box body 1.

[0017] During use, the temperature controller 25 is pre-set to the desired temperature. The semiconductor refrigeration module 22 is powered on to cool the interior of the box 1 to the desired temperature. Feedback from the temperature detector 26 confirms that the desired temperature has been reached. The sample bottles are placed in the appropriately sized compartments 12 and the lid 2 is closed. No ice packs are required for cooling. This utility model uses semiconductor refrigeration to provide a cold source for the sample storage box, effectively preserving samples during transport. The inner basket 11 protects the sample bottles from collisions during transportation. This utility model can effectively replace existing refrigerated boxes and complete the storage and transportation of samples.

[0018] The above embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A sample refrigeration transfer box using semiconductor refrigeration, comprising a box body (1) and a box cover (2) detachably connected to the box body (1), wherein the box body (1) has a space for accommodating sample bottles, and is characterized in that: A temperature control device is provided in the box cover (2), and the temperature control device includes a semiconductor refrigeration module (22). The semiconductor refrigeration module (22) is laid in the longitudinal middle of the box cover (2) and the cold end of the semiconductor refrigeration module (22) faces the inside of the box body (1). An air circulation fan (24) is also provided on the side of the cold end of the semiconductor refrigeration module (22) facing the box body (1). A heat dissipation fan (23) is provided between the hot end of the semiconductor refrigeration module (22) and the top of the box cover (2). The heat dissipation fan (23) is communicated with the outside air. The power module (21) is connected to the semiconductor refrigeration module (22) and is located at a corner of the box cover (2). A temperature detector (26) is provided at a corner opposite to the power module (21). The bottom end of the temperature detector (26) extends into the box body (1). The temperature detector (26) is connected to the input end of the temperature controller (25), and the output end of the temperature controller (25) is connected to the semiconductor refrigeration module (22).

2. The sample refrigeration transfer box using semiconductor refrigeration as claimed in claim 1, characterized in that: The temperature controller (25) is arranged at a corner of the box cover (2) adjacent to the temperature detector (26), and the cooling fan (23) is arranged at a middle position of the box cover (2).

3. The sample refrigeration transfer box using semiconductor refrigeration as claimed in claim 2, characterized in that: An inner basket (11) is provided in the box body (1), and the inner basket (11) includes a plurality of compartments (12), and each surface of the plurality of compartments (12) is a hollow plate (13).

4. The sample refrigeration transfer box using semiconductor refrigeration as claimed in claim 3, characterized in that: The sizes of the several grids (12) are not exactly the same.

5. The sample refrigeration transfer box using semiconductor refrigeration as claimed in claim 1, characterized in that: The temperature detector (26) is close to the bottom wall of the box (1).

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