Semiconductor device packaging detection device

Abstract

The utility model discloses a semiconductor device packaging detection device, and relates to the technical field of semiconductor device packaging detection. The utility model provides a semiconductor device packaging detection device which comprises a base, a frame fixedly connected to the top end of the base, a cover plate rotatably connected to the frame, a rodless cylinder fixedly connected to the top end in the frame, an ultrasonic scanner slidably connected to the rodless cylinder, and a display fixedly connected to the top end of the base. A water tank is fixedly connected in the frame. The semiconductor device is placed on the placing plate, the ultrasonic scanner carries out scanning detection, after detection, the semiconductor device is driven by the placing plate to move forwards, the gear and the rack are meshed to control the placing plate to rotate upwards to turn the semiconductor device forwards onto the placing platform, the semiconductor device is turned forwards to take out the separation film, and separation and protection are carried out through the separation film. Therefore, the detected semiconductor device can be automatically conveyed out, the use is more convenient, and meanwhile, the packaging detection efficiency of the semiconductor device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device packaging detection, in particular to a semiconductor device packaging detection device. Background Art

[0002] Semiconductor device packaging inspection equipment is a device used to inspect the quality of semiconductor device packaging. It typically integrates high-precision optical, electrical, and mechanical inspection technologies to perform underwater inspections of semiconductor device packaging quality, assessing the device's waterproofness, corrosion resistance, reliability, and environmental adaptability, ensuring the functionality and reliability of the assembled semiconductor device. However, underwater inspection requires personnel to remove the device from the water, which is inconvenient and affects the efficiency of semiconductor device packaging inspection.

[0003] In order to solve the above problems, we propose a semiconductor device packaging inspection device that can automatically transport the inspected semiconductor devices, making it more convenient to use and improving the efficiency of semiconductor device packaging inspection. Utility Model Content

[0004] In order to overcome the disadvantage that the semiconductor device needs to be fished out after underwater detection, which is inconvenient and affects the detection efficiency, the utility model provides a semiconductor device packaging detection device.

[0005] A semiconductor device packaging detection device includes a base, a frame fixedly connected to the top of the base, a cover plate rotatably connected to the frame, a rodless cylinder fixedly connected to the top of the frame, an ultrasonic scanner slidably connected to the rodless cylinder, a display fixedly connected to the top of the base, a water tank fixedly connected to the frame, and a placement platform fixedly connected to the water tank, an electric guide rail fixedly connected to the frame, a vertical guide rail slidably connected to the electric guide rail, a square block slidably connected to the vertical guide rail, a placement plate rotatably connected to the square block, and a rotational connection between the placement plate and the square block. A protrusion is provided for contacting the square block to limit the placement plate, a gear is fixedly connected to the placement plate, and guide support plates are fixedly connected on both sides of the water tank. The square block contacts the adjacent guide support plate, and the placement plate contacts the adjacent guide support plate. A rack is fixedly connected to the guide support plate close to the gear side, and the gear moves to engage with the rack. The placement platform is fixedly connected to a laterally symmetrical fixing frame, and an electric winding roller is installed between the laterally symmetrical fixing frames. A fixing component for fixing the semiconductor device is provided on the placement plate, and a cutting component for cutting the separator film is provided between the fixing frames.

[0006] Furthermore, the electric winding roller consists of a motor and a winding roller. The winding roller is rotatably connected between the top ends of the two fixed frames. The motor is fixedly connected to the fixed frame on one side. The output shaft of the motor is connected to the winding roller, and the separator film is wound on the winding roller.

[0007] Furthermore, the fixing assembly includes a splint, which is rotatably connected to the placement plate, and a contact block is fixedly connected to the splint. An extrusion block is fixedly connected to the upper part of the fixing frame on one side, and the contact block and the extrusion block are extruded and matched. A torsion spring is connected between the splint and the placement plate.

[0008] Furthermore, the cutting assembly includes a pad, which is fixedly connected between the fixed frames, a cutter is slidably connected to the pad, a first transversely symmetrical spring is connected between the cutter and the pad, a cross bar is fixedly connected to the cutter, and an extrusion frame is fixedly connected to the side of the electric winding roller close to the cross bar, and the extrusion frame rotates to cooperate with the cross bar.

[0009] Furthermore, the length of the blade of the cutter is shorter than that of the separation film.

[0010] Furthermore, it also includes an electric push rod, which is fixedly connected to the frame. The telescopic end of the electric push rod is slidably connected to a marking plate, and a second spring is connected between the marking plate and the telescopic end of the electric push rod.

[0011] The utility model has the following advantages: 1. The semiconductor device is placed on the placement plate, and the ultrasonic scanner moves to perform scanning and detection. The detection data is displayed on the display. After the detection is completed, the vertical guide rail is driven forward by the electric guide rail, and then the semiconductor device is driven forward by the placement plate. The gear and the rack are engaged, and the placement plate can be controlled to rotate upward to flip the semiconductor device forward onto the placement platform. When the semiconductor device flips forward, it will contact the separation membrane, and then the separation membrane will be torn off. The separation membrane is then padded under the semiconductor device to prevent the semiconductor device from being scratched and worn. In this way, the detected semiconductor device can be automatically transported out, which is more convenient to use and improves the efficiency of semiconductor device packaging detection.

[0012] 2. The semiconductor device is placed on the placement plate, and the clamp rotates downward to clamp the semiconductor device so that the placement plate drives the semiconductor device to move. When the placement plate needs to flip the semiconductor device out to the placement platform, the contact block and the extrusion block squeeze and cooperate to control the clamp to rotate open, so that the semiconductor device is separated from the placement plate and falls onto the placement platform.

[0013] 3. The extrusion frame rotates with the electric winding roller and cooperates with the cross bar to control the cutter to move forward and cooperate with the pad to cut the middle of the released separator film. The left and right sides of the separator film are in a connected state so that when the semiconductor device is turned forward, it can contact the separator film and tear it off.

[0014] 4. When the ultrasonic scanner detects unqualified results, the electric push rod will extend and drive the marking plate to move downward to mark the unqualified semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.

[0016] Figure 2 It is a cross-sectional structural diagram of the frame, cover plate, placement platform and other components of the utility model.

[0017] Figure 3 This is a schematic cross-sectional view of the water tank, electric guide rails, placement plate and other components of the utility model.

[0018] Figure 4 It is a partial three-dimensional structural diagram of the square block and the placement plate of the utility model.

[0019] Figure 5 This is a partial cross-sectional structural diagram of the components of the utility model, including the splint, contact block and extrusion block.

[0020] Figure 6 This is a partial cross-sectional structural diagram of the utility model's backing plate, cutter, extrusion frame and other components.

[0021] Figure 7 It is a schematic diagram of the three-dimensional structure of the cutter of the utility model.

[0022] Figure 8 It is a three-dimensional structural diagram of the components such as the frame, electric push rod and marking plate of the utility model.

[0023] In the accompanying drawings: 1_base, 2_frame, 3_cover, 4_rodless cylinder, 5_ultrasonic scanner, 51_display, 6_water tank, 61_placement platform, 7_electric guide rail, 8_vertical guide rail, 9_square block, 10_placement plate, 11_gear, 111_guide support plate, 12_rack, 13_fixing frame, 14_electric winding roller, 15_clamping plate, 16_contact block, 17_extrusion block, 18_torsion spring, 19_pad, 20_cutter, 21_first spring, 22_cross bar, 23_extrusion frame, 24_electric push rod, 25_marking plate, 26_second spring. DETAILED DESCRIPTION

[0024] The technical solution of the present utility model will be further described below with reference to the accompanying drawings.

[0025] Embodiment 1: A semiconductor device packaging detection device, such as Figures 1-8As shown, it includes a base 1, a frame 2, a cover 3, a rodless cylinder 4, an ultrasonic scanner 5, a display 51, a water tank 6, a placement platform 61, an electric guide rail 7, a vertical guide rail 8, a square block 9, a placement plate 10, a gear 11, a guide support plate 111, a rack 12, a fixing frame 13, an electric winding roller 14, a fixing component and a cutting component. The upper side of the base 1 is fixedly connected to the frame 2, the upper left side of the frame 2 is rotatably connected to the cover 3, and the upper inner side of the frame 2 is fixedly connected to the rodless cylinder 4. The rodless cylinder 4 is slidably connected to an ultrasonic scanner 5. The upper right part of the base 1 is fixedly connected to a display 51. The lower part of the frame 2 is fixedly connected to a water tank 6. The front side of the water tank 6 is fixedly connected to a placement platform 61. The lower right part of the frame 2 is fixedly connected to an electric guide rail 7. The electric guide rail 7 is slidably connected to a vertical guide rail 8. The vertical guide rail 8 is slidably connected to a square block 9. The square block 9 is rotatably connected to a placement plate 10. The rotation connection between the placement plate 10 and the square block 9 is provided with a bump. , used to contact with the square block 9 to limit the placement plate 10, the left front part of the placement plate 10 is fixedly connected to a gear 11, and the left and right sides of the water tank 6 are fixedly connected to a guide support plate 111, the square block 9 contacts the guide support plate 111 on the right, and the left front part of the placement plate 10 contacts the guide support plate 111 on the left. The front of the guide support plate 111 on the left is fixedly connected to a rack 12, and the gear 11 moves forward and engages with the rack 12. The left and right parts of the placement platform 61 are fixedly connected to a fixed frame 13, and an electric winding roller 14 is installed between the upper parts of the left and right fixed frames 13. The electric winding roller 14 consists of a motor and a winding roller, and a winding roller is rotatably connected between the upper parts of the left and right fixed frames 13. The upper part of the left fixed frame 13 is fixedly connected to a motor, and the output shaft of the motor is connected to the winding roller. The separating film is wound on the winding roller, and a fixing component for fixing the semiconductor device is provided on the placement plate 10, and a cutting component for cutting the separating film is provided between the left and right fixed frames 13.

[0026] When using the device, the staff winds the separation film on the electric winding roller 14, and then releases a certain length of separation film through the electric winding roller 14. When the electric winding roller 14 rotates, the cutting assembly is controlled to cut the middle of the released separation film, and the left and right sides of the separation film are in a connected state. Then the staff controls the cover plate 3 to rotate upward and open, and then places the semiconductor device to be tested into the water tank 6, so that the semiconductor device is placed on the placement plate 10 and fixed by the fixing assembly. After the semiconductor device is placed, the staff drives the ultrasonic scanner 5 back and forth for scanning and testing through the rodless cylinder 4, and the test data is displayed on the display 51. After the test is completed, the staff drives the vertical guide rail 8 forward through the electric guide rail 7. The vertical guide rail 8 moves forward and drives the placement plate 10 forward through the square block 9. When the placement plate 10 and the square block 9 move forward, they are supported by the guide support plate 111. When the placement plate 10 and the square block 9 move forward to the inclined surface of the guide support plate 111, the placement plate 10 and the square block 9 continue to move forward and will be squeezed by the guide support plate 111 When the gear 11 moves forward and engages with the rack 12, the gear 11 continues to move forward and drives the placement plate 10 to rotate upward. The placement plate 10 rotates upward and drives the semiconductor device to rotate upward. At this time, the fixing component is loosened, and the placement plate 10 can flip the semiconductor device forward onto the placement platform 61. When the semiconductor device flips forward, it will contact the separation membrane and tear the separation membrane. After the semiconductor device is placed on the placement plate 10, the separation membrane is placed under the semiconductor device to prevent the semiconductor device from being scratched and worn. After the semiconductor device is placed on the placement platform 61, the staff drives the vertical guide rail 8 backward through the electric guide rail 7. The vertical guide rail 8 moves backward and drives the square block 9, the placement plate 10 and the gear 11 to move backward. The gear 11 reverses while moving backward, and then drives the placement plate 10 to rotate downward and reset. In this way, the inspected semiconductor devices can be automatically transported out, which is more convenient to use and improves the efficiency of semiconductor device packaging inspection.

[0027] like Figure 5 As shown, the fixing assembly includes a splint 15, a contact block 16, an extrusion block 17 and a torsion spring 18. The rear portion of the placement plate 10 is rotatably connected to the splint 15, the left portion of the splint 15 is fixedly connected to the contact block 16, the upper portion of the left fixing frame 13 is fixedly connected to the extrusion block 17, the contact block 16 rotates upward to be extruded and fitted with the extrusion block 17, and a torsion spring 18 is connected between the splint 15 and the placement plate 10.

[0028] When using this device, the control clamp 15 is rotated upward and opened, the torsion spring 18 is deformed, and then the semiconductor device is placed on the placement plate 10. After placement, the clamp 15 is released. Under the action of the torsion spring 18 resetting, the clamp 15 is rotated downward to clamp the semiconductor device. When the placement plate 10 moves forward, the clamp 15 and the contact block 16 also move forward with the placement plate 10. When the placement plate 10 rotates upward and drives the contact block 16 to rotate upward until it contacts the extrusion block 17, the contact block 16 will be squeezed by the extrusion block 17 to rotate, thereby driving the clamp 15 to rotate open, so that the semiconductor device is separated from the placement plate 10 and falls onto the placement platform 61.

[0029] like Figure 6 and Figure 7 As shown, the cutting assembly includes a pad 19, a cutter 20, a first spring 21, a cross bar 22 and an extrusion frame 23. The pad 19 is fixedly connected between the upper parts of the left and right fixed frames 13. The cutter 20 is slidably connected to the pad 19. The blade length of the cutter 20 is shorter than the separating film. A left-right symmetrical first spring 21 is connected between the cutter 20 and the pad 19. The cross bar 22 is fixedly connected to the right side of the cutter 20. The extrusion frame 23 is fixedly connected to the right side of the electric winding roller 14. The extrusion frame 23 rotates to squeeze and cooperate with the cross bar 22.

[0030] When using this device, when the electric winding roller 14 rotates to release a certain length of separating film, the squeezing frame 23 will also rotate together. When the squeezing frame 23 rotates to contact the cross bar 22, the squeezing frame 23 continues to rotate to squeeze the cross bar 22 to move forward. The forward movement of the cross bar 22 drives the cutter 20 to slide forward. The first spring 21 is deformed. When the cutter 20 moves forward, it cooperates with the pad 19 to cut off the middle part of the released separating film. The left and right sides of the separating film are in a connected state so that the semiconductor device can contact the separating film and tear it apart when it flips forward. When the squeezing frame 23 rotates to disengage from the cross bar 22, the cutter 20 slides backward and resets under the action of the first spring 21.

[0031] Example 2: Based on Example 1, Figure 1 and Figure 8 As shown, it also includes an electric push rod 24, a marking plate 25 and a second spring 26. The electric push rod 24 is fixedly connected to the front side of the frame 2, the telescopic end of the electric push rod 24 is slidably connected to the marking plate 25, and the second spring 26 is connected between the marking plate 25 and the telescopic end of the electric push rod 24.

[0032] When using this device, when the semiconductor device flips forward and falls onto the placement platform 61, the ultrasonic scanner 5 will control the electric push rod 24 to extend and then shorten if the detection result is unqualified. The extension of the electric push rod 24 drives the marking plate 25 to move downward to mark the unqualified semiconductor device. Under the action of the second spring 26, the marking plate 25 can slide up and down at the telescopic end of the electric push rod 24, thereby adapting to the changing height of the semiconductor device after stacking.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor device packaging detection device, comprising a base (1), a frame (2) fixedly connected to the top of the base (1), a cover (3) rotatably connected to the frame (2), a rodless cylinder (4) fixedly connected to the top of the frame (2), an ultrasonic scanner (5) slidably connected to the rodless cylinder (4), a display (51) fixedly connected to the top of the base (1), and a water tank (6) fixedly connected to the frame (2), wherein: The utility model also includes a placement platform (61), the placement platform (61) is fixedly connected to the water tank (6), an electric guide rail (7) is fixedly connected in the frame (2), a vertical guide rail (8) is slidably connected to the electric guide rail (7), a square block (9) is slidably connected to the vertical guide rail (8), a placement plate (10) is rotatably connected to the square block (9), a convex block is provided at the rotation connection between the placement plate (10) and the square block (9), and is used to contact the square block (9) to limit the placement plate (10), a gear (11) is fixedly connected to the placement plate (10), and guide support plates (11) are fixedly connected on both sides of the water tank (6). 1), the square block (9) contacts the adjacent guide support plate (111), the placement plate (10) contacts the adjacent guide support plate (111), a rack (12) is fixedly connected to the guide support plate (111) on the side close to the gear (11), the gear (11) moves to engage with the rack (12), the placement platform (61) is fixedly connected to a transversely symmetrical fixing frame (13), an electric winding roller (14) is installed between the transversely symmetrical fixing frames (13), a fixing component for fixing the semiconductor device is provided on the placement plate (10), and a cutting component for cutting the separation film is provided between the fixing frames (13).

2. A semiconductor device packaging detection device according to claim 1, characterized in that: The electric winding roller (14) is composed of a motor and a winding roller. The winding roller is rotatably connected between the top ends of the two fixed frames (13). The motor is fixedly connected to the fixed frame (13) on one side. The output shaft of the motor is connected to the winding roller, and the separator film is wound on the winding roller.

3. A semiconductor device packaging detection device according to claim 2, characterized in that: The fixing assembly includes a clamping plate (15), the clamping plate (15) is rotatably connected to the placement plate (10), a contact block (16) is fixedly connected to the clamping plate (15), an extrusion block (17) is fixedly connected to the upper part of the fixing frame (13) on one side, the contact block (16) and the extrusion block (17) are extruded and matched, and a torsion spring (18) is connected between the clamping plate (15) and the placement plate (10).

4. A semiconductor device packaging detection device according to claim 3, characterized in that: The cutting assembly includes a pad (19), the pad (19) is fixedly connected between the fixing frame (13), a cutter (20) is slidably connected to the pad (19), a transversely symmetrical first spring (21) is connected between the cutter (20) and the pad (19), a cross bar (22) is fixedly connected to the cutter (20), and an extrusion frame (23) is fixedly connected to the side of the electric winding roller (14) close to the cross bar (22), and the extrusion frame (23) rotates to be extruded and matched with the cross bar (22).

5. A semiconductor device packaging detection device according to claim 4, characterized in that: The blade length of the cutter (20) is shorter than the separation membrane.

6. A semiconductor device packaging detection device according to claim 5, characterized in that: The electric push rod (24) is fixedly connected to the frame (2), the telescopic end of the electric push rod (24) is slidably connected to a marking plate (25), and a second spring (26) is connected between the marking plate (25) and the telescopic end of the electric push rod (24).

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