High-efficiency exposure machine

Abstract

The utility model relates to the technical field of exposure machines, and provides a high-efficiency exposure machine which comprises a base; the workbench is mounted on the base and is used for bearing a to-be-exposed part; the laser module is used for emitting optical signals; the DMD component is used for receiving the optical signal, processing the optical signal and reflecting the optical signal to the lens device; the lens device is used for projecting the optical signal; the cooling liquid cooling assembly is mounted on the DMD assembly and is used for cooling the DMD assembly; according to the utility model, the cooling liquid cooling assembly is installed on the DMD assembly and is in direct contact with the micromirror chip module; and the flow rate and / or temperature of the cooling liquid in the cooling liquid cooling assembly is controlled by the cooling liquid control assembly, so that the temperature of the micro-mirror chip module does not exceed 30 DEG C. The micro-mirror chip module is rapidly cooled under the direct action of the cooling liquid, so that the micro-mirror chip module is prevented from being damaged due to too high temperature, and the service life of the micro-mirror chip module is prolonged. And meanwhile, the DMD module can bear the laser irradiation power of 100W-180W due to the reduction of the temperature, so that the exposure effect is better.

Description

Technical Field

[0001] The utility model relates to the technical field of exposure machines, in particular to a high-efficiency exposure machine. Background Art

[0002] The exposure principle of digital DMD exposure machine is to receive high-intensity laser irradiation through DMD (Digital Micromirror Device), and then process it to form a high-definition exposure pattern, which is why it is widely used.

[0003] In order to ensure the exposure effect, the laser irradiation needs to reach a certain intensity. While part of the light is reflected by the DMD and enters the optical imaging system, the other part of the high-intensity light will be converted into heat energy, causing the DMD to heat up. It needs to be cooled in time. The existing conventional solution is: through a metal heat sink in contact with the back of the DMD digital micromirror, and then pass cold air or cold water into the metal heat sink to take away the heat. When the metal heat sink contacts the DMD shell, there will be problems such as unevenness or gaps in the metal heat sink, which makes it impossible for the metal heat sink to completely fuse with the DMD shell, resulting in the heat not being absorbed by the metal heat sink in time. At the same time, the effect of air cooling or water cooling is limited, which will cause the temperature of the DMD digital micromirror to be high. In severe cases, it will cause the DMD to burn out and cannot be used anymore.

[0004] To ensure that the temperature of the DMD module is controlled below 30 degrees, the existing conventional heat dissipation solution is used, and the laser irradiation power that the DMD module can withstand is below 40W; the existing heat dissipation method is through water cooling, and the laser irradiation power that the DMD module can withstand is below 80W; neither cooling method can enable the DMD to withstand higher laser power. Summary of the Invention

[0005] In view of the shortcomings of the prior art in terms of poor heat dissipation effect, the purpose of the present invention is to provide a high-efficiency exposure machine and a high-efficiency exposure machine with good heat dissipation and cooling effect on the DMD module.

[0006] In order to solve the above problems, the present invention provides the following technical solutions:

[0007] A high-efficiency exposure machine, comprising:

[0008] base;

[0009] A workbench, which is mounted on the base and is used to carry the workpiece to be exposed;

[0010] A laser module, used for emitting optical signals;

[0011] The DMD component is used to receive the optical signal, process it, and then reflect it to the lens device;

[0012] A lens device, used for projecting the light signal onto the workpiece to be exposed;

[0013] The coolant cooling component is installed on the DMD component and is used to cool the DMD component.

[0014] In some embodiments, the high-efficiency exposure machine also includes a coolant control component, which is connected to the coolant cooling component. The coolant control component controls the flow rate and / or temperature of the coolant in the coolant cooling component, thereby controlling the temperature of the DMD component within a preset temperature range.

[0015] In some embodiments, the laser module has a power of 100W-180W when in use.

[0016] In some embodiments, the preset temperature range does not exceed 30 degrees.

[0017] In some embodiments, the DMD component includes a micromirror chip module;

[0018] The coolant cooling assembly includes a cavity for receiving coolant and a liquid inlet pipe and a liquid outlet pipe connected to the cavity; the cavity includes an outer wall and an opening formed by the outer wall;

[0019] The liquid in the coolant cooling assembly directly contacts the micromirror chip module through the opening to cool the micromirror chip module.

[0020] In some embodiments, the outer wall of the cavity is connected to the micromirror chip module, and the coolant cooling assembly further includes a seal, which is used to seal the connection between the outer wall of the cavity and the micromirror chip module.

[0021] In some embodiments, the coolant cooling assembly further comprises a pressure device; the pressure device comprises a fastening bolt, a compression spring, and an extrusion plate mounted outside the coolant cooling assembly;

[0022] The fastening bolt passes through the extrusion plate and is installed and fixed to the DMD assembly;

[0023] The compression spring is sleeved on the fastening bolt; the compression spring creates an extrusion force between the coolant cooling assembly and the micromirror chip through the extrusion plate, and the extrusion force causes the seal to tightly seal the connection between the outer wall of the cavity and the micromirror chip module.

[0024] In some embodiments, the DMD assembly further comprises a DMD data carrier board, a DMD integrated circuit board, a DMD data card connector, and a fixed pressure plate;

[0025] The DMD data card connector is installed on the DMD data carrier board;

[0026] The DMD data carrier, the DMD integrated circuit board and the fixed pressure plate are located on the same side of the micromirror chip module as the coolant cooling assembly; a first clearance hole is provided on the fixed pressure plate, a second clearance hole is provided on the DMD data carrier, and a third clearance hole is provided on the DMD integrated circuit board. The coolant cooling assembly passes through the first clearance hole, the second clearance hole and the third clearance hole in sequence and is in direct contact with the micromirror chip module.

[0027] In some embodiments, the high-efficiency exposure machine further includes an adjustment component for adjusting the position of the DMD component; the adjustment component includes a fixing plate, an adjustment plate, and a mounting plate;

[0028] The fixing plate is mounted on the lens device;

[0029] The adjusting plate can rotate horizontally relative to the fixing plate;

[0030] The mounting plate can move up and down relative to the fixing plate, and the DMD assembly is mounted on the mounting plate.

[0031] In some embodiments, the adjusting plate is provided with a concentric arc groove, the fixing plate is fixed with a limiting member corresponding to the arc groove one by one, and the adjusting plate rotates horizontally via the limiting member;

[0032] A plurality of adjusting bolts that move up and down are installed on the upper side of the mounting plate. The number of the adjusting bolts is greater than or equal to 3. The plurality of adjusting bolts are axially parallel and not in the same plane. The up and down movement of the adjusting bolts drives the corresponding position of the mounting plate to move up and down.

[0033] The beneficial effects of the present invention are as follows: a coolant cooling assembly is installed on the DMD assembly and is in direct contact with the micromirror chip module; the flow rate and / or temperature of the coolant in the coolant cooling assembly is controlled by the coolant control assembly, so that the temperature of the micromirror chip module does not exceed 30 degrees. By allowing the micromirror chip module to be quickly cooled under the direct action of the coolant, it is ensured that the micromirror chip module will not be damaged due to excessive temperature. At the same time, the temperature reduction can also enable the DMD module to withstand a laser irradiation power of 100W-180W, thereby achieving a better exposure effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a perspective view of one embodiment of a projection lens system for an exposure machine according to the present invention;

[0035] Figure 2 This is a perspective view of another embodiment of a projection lens system for an exposure machine according to the present invention;

[0036] Figure 3 This is a three-dimensional diagram of one of the laser emission sources and lens devices of the present invention;

[0037] Figure 4 This is a front cross-sectional view of one embodiment of a projection lens system for an exposure machine according to the present invention;

[0038] Figure 5 For this utility model Figure 2 A magnified view of point A;

[0039] Figure 6 This is an exploded view of one embodiment of a projection lens system for an exposure machine of the present utility model;

[0040] Figure 7 This is a three-dimensional diagram of another laser emission source and lens device of the utility model;

[0041] Figure 8 This is a schematic structural diagram of another embodiment of the coolant cooling assembly of the present invention;

[0042] Figure 9 This is a schematic diagram of the internal structure of another embodiment of the coolant cooling assembly of the present invention;

[0043] Figure 10 A schematic diagram of a condenser tube of another embodiment of a coolant cooling assembly of the present invention;

[0044] Figure 11 This is a schematic diagram of a cooling unit in another embodiment of the coolant cooling assembly of the present invention;

[0045] Figure 12 This is another embodiment of the exhaust pipe in the coolant cooling assembly of the utility model;

[0046] Figure 13 This is a schematic diagram of an exposure machine of the present invention.

[0047] Reference numerals:

[0048] 110. An exposure machine projection lens system; 120. Laser module; 130. DMD assembly; 140. Lens assembly; 150. Coolant cooling assembly; 160. Coolant control assembly; 170. Adjustment assembly; 180. Base; 190. Workbench; 200. Workpiece to be exposed; 210. Exposure machine;

[0049] 131. Micromirror chip module; 132. DMD data carrier board; 133. DMD integrated circuit board; 134. DMD data card connector; 135. Fixed pressure plate; 13a. First clearance hole; 13b. Second clearance hole; 13c. Third clearance hole; 136. Frame member; 137. Gasket; 138. Bolt;

[0050] 151, cavity; 152, liquid inlet pipe; 153, liquid outlet pipe; 154, opening; 155, sealing member; 156, pressure device; 15a, fastening bolt; 15b, compression spring; 15c, extrusion plate;

[0051] 251. Cooling chamber; 252. Exhaust pipe; 253. Insulation cotton; 254. Condenser tube; 255. Opening; 256. Liquid inlet pipe; 257. Liquid outlet pipe;

[0052] 161. Temperature sensor;

[0053] 171, fixing plate; 172, adjusting plate; 173, mounting plate; 17a, arc-shaped groove; 17b, limiting member;

[0054] 17c, adjusting bolt; 17d, fourth clearance hole; 17e, fifth clearance hole; 17f, sixth clearance hole;

[0055] 271. First support block; 272. Second support block; 273. Giving groove; 274. Rotating rod; 275. Stop block. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0058] For the convenience of describing the first, second, and third directions in the embodiments of this application, the first direction is the left-right direction in the drawings, the second direction is the front-back direction in the drawings, and the third direction is the up-down direction in the drawings. The x-axis arrow direction is referred to as the "right" direction, the y-axis arrow direction is referred to as the "up" direction, and the z-axis arrow direction is referred to as the "back" direction in the following text. However, in the actual application of this application, this is not limiting.

[0059] Example 1: Figure 7 As shown, this embodiment provides a high-efficiency exposure machine 210, which includes a laser module 120, a lens assembly 140, and a DMD assembly 130. The laser module 120 and the DMD assembly 130 are respectively mounted on the lens assembly 140. The laser module 120 emits a high-intensity optical signal via laser light. The DMD assembly 130 includes a micromirror chip module 131, which processes the optical signal to form the pattern to be exposed. The micromirror chip module 131 receives the optical signal emitted by the laser module 120 and processes it to form an optical pattern. A portion of the optical signal is reflected into the lens assembly 140, while the remaining portion is absorbed, generating heat energy.

[0060] Reference Figure 1-4 As shown, the high-efficiency exposure machine 210 includes a coolant cooling assembly 150 and a coolant control assembly 160. The coolant cooling assembly 150 is mounted on the DMD assembly 130 and is in direct contact with the micromirror chip module 131 on the DMD assembly 130. Direct contact between the coolant and the micromirror chip module 131 allows for more thorough heat exchange, more direct cooling, and higher efficiency.

[0061] The coolant control component 160 controls the flow rate and / or temperature of the coolant so that the temperature of the DMD component 130 is controlled within a preset temperature range. That is, when the micromirror chip module 131 is working, the micromirror chip module 131 heats up, and the coolant can quickly cool the DMD component 130 and keep the temperature below 30 degrees.

[0062] During exposure, as the power of the laser module 120 increases, the exposure energy also increases, thereby improving exposure efficiency. By using a coolant cooling assembly 150 in direct contact with the micromirror chip module 131, the temperature is kept below 30 degrees Celsius, allowing the micromirror chip module 131 to withstand laser irradiation with a power of 100W-180W.

[0063] like Figure 4-5As shown, in this embodiment, the coolant cooling assembly 150 includes a cavity 151 for storing coolant, as well as a liquid inlet pipe 152 and a liquid outlet pipe 153 communicating with the cavity 151. The cavity 151 includes an outer wall and an opening 154 formed by the outer wall. The coolant cooling assembly 150 also includes a seal 155. The seal 155 is used to seal the connection between the outer wall of the cavity 151 and the micromirror chip module 131. The coolant can flow through the liquid inlet pipe 152 into the opening 154 formed by the outer wall of the cavity 151, where it directly contacts the micromirror chip module 131, rapidly cooling the micromirror chip module 131. The coolant then flows out through the liquid outlet pipe 153, achieving a continuous cooling effect. The use of the seal 155 for sealing ensures that the coolant does not leak out of the cavity 151. This structural design of the DMD assembly facilitates direct contact between the coolant and the micromirror chip module, facilitating heat dissipation.

[0064] In this embodiment, the DMD assembly 130 further includes a DMD data carrier board 132, a DMD integrated circuit board 133, a fixed pressure plate 135, and a DMD data card connector 134. The DMD data card connector 134 is mounted on the DMD data carrier board 132. The DMD data carrier board 132 and the DMD integrated circuit board 133 control the micromirror chip module 131 to process optical signals. The fixed pressure plate 135 facilitates the installation of the DMD data carrier board 132, the DMD integrated circuit board 133, the micromirror chip module 131, and the lens assembly 140.

[0065] like Figure 4 As shown, in this embodiment, the DMD data carrier board 132, the DMD integrated circuit board 133, and the fixed pressure plate 135 are located on the same side of the micromirror chip module 131 as the coolant cooling assembly 150. The fixed pressure plate 135 is provided with a first clearance hole 13a, the DMD data carrier board 132 is provided with a second clearance hole 13b, and the DMD integrated circuit board 133 is provided with a third clearance hole 13c. The coolant cooling assembly 150 passes through the first clearance hole 13a, the second clearance hole 13b, and the third clearance hole 13c in sequence, directly contacting the micromirror chip module 131, ensuring rapid cooling of the micromirror chip module 131.

[0066] like Figure 6As shown, in this embodiment, the coolant cooling assembly 150 further includes a pressure device 156. The pressure device 156 comprises a fastening bolt 15a, a compression spring 15b, and an extrusion plate 15c mounted on the exterior of the coolant cooling assembly 150. The fastening bolt 15a passes through the extrusion plate 15c and is secured to the coolant cooling assembly 150. The compression spring 15b is sleeved over the fastening bolt 15a to exert a compressive force between the coolant cooling assembly 150 and the micromirror chip. This ensures that the seal 155 between the outer wall of the cavity 151 and the micromirror chip module 131 is always subjected to the compressive force, thereby ensuring a seal between the outer wall and the micromirror chip module 131 and preventing coolant overflow due to insufficient compressive force.

[0067] like Figure 4 、 Figure 6 As shown, in another embodiment, the high-efficiency exposure machine 210 further includes an adjustment assembly 170 for adjusting the position of the DMD assembly 130. The adjustment assembly 170 includes a fixing plate 171, an adjustment plate 172, and a mounting plate 173. The fixing plate 171 is fixedly mounted to the lens assembly 140. A concentric arcuate groove 17a is formed on the adjustment plate 172, and a stopper 17b corresponding to each arcuate groove 17a is fixed to the fixing plate 171. During installation, the adjustment plate 172 is placed on the fixing plate 171, and each stopper 17b is placed in a corresponding arcuate groove 17a. The stopper 17b can be a bolt. When adjusting the adjustment plate 172, the bolt is loosened upward, and the adjustment plate 172 is rotated horizontally relative to the fixing plate 171. Then, the bolt is rotated to fix the adjustment plate 172 to the fixing plate 171, thereby ensuring the projection angle of the optical signal.

[0068] like Figure 1 、 Figure 6 As shown, in another embodiment, a first support block 271 is installed at a corner of the fixed plate 171, and a second support block 272 is installed at a corresponding corner of the adjustment plate 172. The first support block 271 is provided with a horizontally arranged clearance groove 273, and a rotating rod 274 is inserted into the clearance groove 273. The rotating rod 274 is provided with a stopper 275 on both sides of the clearance groove 273. The other end of the rotating rod 274 is inserted into the second support block 272 and is connected by a thread. When the rotating rod 274 is rotated, the rotating rod 274 drives the adjustment plate 172 to rotate horizontally through the second support block 272, making the rotation of the adjustment plate 172 more stable.

[0069] like Figure 6As shown, in another embodiment, a plurality of adjustment bolts 17c are mounted on the mounting plate 173. Furthermore, the number of adjustment bolts 17c is greater than or equal to three, and the axes of the adjustment bolts 17c are parallel and not coplanar. When the adjustment bolts 17c are rotated, the corresponding position of the mounting plate 173 moves upward or downward. The bottom of the adjustment bolts 17c is hemispherical, and the adjustment bolts 17c contact the adjustment plate 172 through the hemispherical shape. Rotating the adjustment bolts 17c adjusts the height of the mounting plate 173, ensuring a consistent projection height of the optical signal.

[0070] In another embodiment, the fixing plate 171 is provided with a fourth clearance hole 17d, the adjustment plate 172 is provided with a fifth clearance hole 17e, and the mounting plate 173 is provided with a sixth clearance hole 17f. When a light signal is irradiated toward the micromirror chip module 131, the light signal sequentially passes through the fourth clearance hole 17d, the fifth clearance hole 17e, and the sixth clearance hole 17f and irradiates the micromirror chip module 131. When the micromirror chip module 131 reflects the light signal, the light signal is then reflected sequentially through the sixth clearance hole 17f, the fifth clearance hole 17e, and the fourth clearance hole 17d.

[0071] like Figure 6 As shown, the high-efficiency exposure unit 210 further includes a frame 136 and a gasket 137. The micromirror chip module 131 is mounted within the frame 136, which is then mounted to the mounting plate 173 via the frame 136. Bolts 138 are inserted into the fixed pressure plate 135. The bolts 138 pass through the gasket 137, the DMD data carrier board 132, and the DMD integrated circuit board 133 to secure the fixed pressure plate 135 to the mounting plate 173. The gasket 137 causes the fixed pressure plate 135 to directly contact the DMD data carrier board 132, causing damage to the board.

[0072] The coolant used in the coolant cooling assembly 150 of the present invention is a fluorinated liquid, silicone oil, or the like, which has good thermal conductivity and chemical inertness. This prevents corrosion of the micromirror chip module 131 and quickly conducts away the generated heat, achieving a good cooling effect and resolving the problem of poor cooling performance between water cooling and air cooling.

[0073] like Figure 4As shown, in this embodiment, the coolant control component 160 is used to control the flow rate and / or temperature of the coolant to ensure that the micromirror chip module 131 is controlled within a preset temperature range. When the micromirror chip module 131 has been operating for a period of time, it absorbs more heat and its temperature rises faster. The coolant control component 160 can then control the temperature of the coolant to lower it or increase the flow rate of the coolant, thereby increasing the heat exchange between the coolant and the micromirror chip module 131, causing the micromirror chip module 131 to cool down faster and maintain the temperature of the micromirror chip module 131 within the preset temperature range during operation. In this embodiment, the preset temperature range is no more than 30 degrees, or 0-30 degrees.

[0074] Furthermore, to ensure that the temperature of the micromirror chip module 131 is controlled within a precise range, this embodiment further includes a temperature sensor 161. The temperature sensor 161 is used to detect the temperature of the micromirror chip module 131. Specifically, the temperature sensor 161 is disposed on the side of the micromirror chip module 131 and is used to detect the temperature of the micromirror chip module 131. The temperature sensor 161 detects the temperature of the micromirror chip module 131 and immediately feeds the temperature data back to the coolant control component 160. The coolant control component 160 controls the flow rate and / or temperature of the coolant based on the immediate temperature change. Specifically, the temperature sensor 161 monitors the temperature change of the micromirror chip module 131 over a period of time and calculates the temperature change a, where a = C1 - C2 / T. C1 and C2 are two temperature values separated by a period of time, where T is a period of time. Specifically, T can be 10 seconds, 20 seconds, or 1 second. When the temperature variation a increases, the coolant control assembly 160 controls the coolant's temperature variation to also increase (i.e., cools the coolant), or controls the coolant's flow rate variation to also increase. Alternatively, the coolant control assembly 160 can simultaneously increase both the coolant's temperature variation and the flow rate variation. When the temperature variation a is small, the coolant control assembly 160 controls the coolant's flow rate to slow down. The temperature of the micromirror chip module 131 is monitored in real time by the temperature sensor 161, controlling the heat exchange between the micromirror chip module 131 and the coolant, thereby maintaining a relatively stable constant temperature during operation. This advantageously extends the service life of the micromirror chip module 131 and improves operating efficiency.

[0075] Because the present invention effectively dissipates heat and controls the temperature of the micromirror chip module 131 through the coolant cooling component 150 and the coolant control component 160, the micromirror chip module 131 can withstand more efficient laser irradiation. In this example, the power of the laser module 120 when in use can be above 100W, and can even reach 180W.

[0076] The laser module 120 is more efficient and has a higher light utilization rate, which is beneficial to the exposure efficiency. At the same time, the number of lens devices 140 can be reduced, and similarly, the cost of the exposure machine is reduced.

[0077] Example 2: Based on Example 1, this example provides a high-efficiency exposure machine 210, which includes: a coolant cooling assembly 150 installed on the DMD assembly 130 and in direct contact with the micromirror chip module 131. The coolant cooling assembly 150 includes a cooling chamber 251 for the coolant, an exhaust pipe 252 housed in the cooling chamber 251, thermal insulation cotton 253, and multiple groups of condensing tubes 254 pointing to the micromirror chip module 131. The cooling chamber 251 includes an outer wall and an opening 255 formed by the outer wall. The multiple groups of condensing tubes 254 are evenly arranged on the micromirror chip module 131. The condensing tubes 254 are U-shaped tubes, and the bottom of the condensing tubes 254 is in contact with the micromirror chip module 131; there is a gap fit between two adjacent condensing tubes 254. By evenly arranging the condensing tubes 254 on the micromirror chip module 131 and matching the gaps between the two adjacent condensing tubes, any position on the micromirror chip module 131 can be simultaneously cooled by the cooling tubes while absorbing heat, thereby ensuring that the overall temperature of the micromirror chip module 131 is consistent, and there will be no problem of high temperature on one side and low temperature on the other side, thereby ensuring the stability of exposure during exposure.

[0078] The outer side of the liquid inlet tube 256 of each condenser 254 is wrapped with thermal insulation 253. The thermal insulation 253 isolates heat from the outer side of the liquid inlet tube 256. This prevents the coolant in the liquid inlet tube 256 from absorbing external heat when liquid enters the condenser 254. This prevents the coolant from heating before it contacts the micromirror chip module 131 through the cooling tube, ensuring that the coolant effectively absorbs heat from the micromirror chip module 131. The liquid inlet ends of each liquid inlet tube 256 are connected, ensuring that the liquid temperature remains consistent during inlet.

[0079] Each condenser 254's liquid outlet pipe 257 is fitted with an exhaust pipe 252. The exhaust pipe 252 promptly extracts heat from the liquid outlet pipe 257, preventing the temperature within the cooling chamber 251 from rising due to heat dissipation from the liquid outlet pipe 257. This further ensures that the temperature on the micromirror chip module 131 does not exceed 30°C. The liquid outlet ends of each liquid outlet pipe 257 are connected; the upper ends of each exhaust pipe 252, which is fitted around the liquid outlet pipe 257, are connected, thus simplifying the outflow path and ensuring a consistent flow rate.

[0080] Please refer to Figure 10-11 The portion of the condenser 254 that contacts the micromirror chip module 131 is disc-shaped, which increases the contact surface between the condenser 254 and the micromirror chip module 131 and improves the effect of the condenser 254 absorbing heat from the micromirror chip module 131.

[0081] As in Example 1, the condensate in the condenser tube 254 is fluorinated liquid, silicone oil, etc., which will not be described in detail here.

[0082] Similar to Example 1, in order to precisely control the temperature of the DMD assembly 130, the coolant control assembly 160 of this embodiment further includes a temperature sensor 161. The temperature sensor 161 is used to detect the temperature of the micromirror chip module 131. Specifically, the temperature sensor 161 is disposed on the surface of the micromirror chip module 131 and is used to detect the surface temperature of the micromirror chip module 131. The temperature sensor 161 detects the surface temperature of the micromirror chip module 131 and immediately feeds the temperature data back to the coolant control assembly 160. The coolant control assembly 160 controls the flow rate and / or temperature of the coolant in the liquid inlet pipe 256 based on the immediate temperature change. This is the same as Example 1 and will not be further described here.

[0083] like Figure 13 As shown, this embodiment provides a high-efficiency exposure machine 210, comprising a base 180 mounted with a worktable 190. The worktable 190 is mounted on the base 180 and is used to support a workpiece 200 to be exposed. The exposure machine projection lens system 110 is mounted on the worktable 190. The exposure machine projection lens system 110 projects a light signal onto the workpiece 200 to be exposed on the worktable 190 via a lens assembly 140. When the laser irradiation power reaches 100W-180W, the exposure efficiency is increased, that is, the exposure time can be shortened; the number of lens assemblies 140 can also be appropriately reduced.

[0084] The workpiece 200 to be exposed on the high-efficiency exposure machine 210 is a PCB board or other microelectronic devices and optical elements.

[0085] In summary, the utility model provides a high-efficiency exposure machine, which is installed on the DMD component through a coolant cooling component and is in direct contact with the micromirror chip module; the flow rate and / or temperature of the coolant in the coolant cooling component is controlled by the coolant control component, so that the temperature of the micromirror chip module does not exceed 30 degrees. By allowing the micromirror chip module to be quickly cooled under the direct action of the coolant, it is ensured that the micromirror chip module will not be damaged due to excessive temperature. At the same time, the temperature reduction can also enable the DMD module to withstand the laser irradiation power of 100W-180W, so that the exposure effect is better.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high-efficiency exposure machine, characterized in that: include: base; A workbench, which is mounted on the base and is used to carry the workpiece to be exposed; A laser module, used for emitting optical signals; The DMD component is used to receive the optical signal, process it, and then reflect it to the lens device; A lens device, used for projecting the light signal onto the workpiece to be exposed; The coolant cooling component is installed on the DMD component and is used to cool the DMD component.

2. The high-efficiency exposure machine according to claim 1, wherein: The high-efficiency exposure machine also includes a coolant control component, which is connected to the coolant cooling component. The coolant control component controls the flow rate and / or temperature of the coolant in the coolant cooling component, thereby controlling the temperature of the DMD component within a preset temperature range.

3. The high-efficiency exposure machine according to claim 1, wherein: The power of the laser module when in use is 100W-180W.

4. The high-efficiency exposure machine according to claim 2, wherein: The preset temperature range does not exceed 30 degrees.

5. The high-efficiency exposure machine according to any one of claims 1 to 4, characterized in that: The DMD component includes a micromirror chip module; The coolant cooling assembly includes a cavity for receiving coolant and a liquid inlet pipe and a liquid outlet pipe connected to the cavity; the cavity includes an outer wall and an opening formed by the outer wall; The liquid in the coolant cooling assembly directly contacts the micromirror chip module through the opening to cool the micromirror chip module.

6. The high-efficiency exposure machine according to claim 5, characterized in that: The outer wall of the cavity is connected to the micromirror chip module. The coolant cooling assembly further includes a seal, which is used to seal the connection between the outer wall of the cavity and the micromirror chip module.

7. The high-efficiency exposure machine according to claim 5, wherein: The coolant cooling assembly further includes a pressure device; the pressure device includes a fastening bolt, a compression spring, and an extrusion plate installed outside the coolant cooling assembly; The fastening bolt passes through the extrusion plate and is installed and fixed to the DMD assembly; The compression spring is sleeved on the fastening bolt; the compression spring creates an extrusion force between the coolant cooling assembly and the micromirror chip through the extrusion plate, and the extrusion force enables the sealing member to tightly seal the connection between the outer wall of the cavity and the micromirror chip module.

8. The high-efficiency exposure machine according to claim 5, wherein: The DMD assembly also includes a DMD data carrier board, a DMD integrated circuit board, a DMD data card connector and a fixed pressure plate; The DMD data card connector is installed on the DMD data carrier board; The DMD data carrier, the DMD integrated circuit board and the fixed pressure plate are located on the same side of the micromirror chip module as the coolant cooling assembly; a first clearance hole is provided on the fixed pressure plate, a second clearance hole is provided on the DMD data carrier, and a third clearance hole is provided on the DMD integrated circuit board. The coolant cooling assembly passes through the first clearance hole, the second clearance hole and the third clearance hole in sequence and is in direct contact with the micromirror chip module.

9. The high-efficiency exposure machine according to claim 1, wherein: The high-efficiency exposure machine further includes an adjustment component for adjusting the position of the DMD component; the adjustment component includes a fixing plate, an adjustment plate and a mounting plate; The fixing plate is mounted on the lens device; The adjusting plate can rotate horizontally relative to the fixing plate; The mounting plate can move up and down relative to the fixing plate, and the DMD assembly is mounted on the mounting plate.

10. The high-efficiency exposure machine according to claim 9, characterized in that: The adjusting plate is provided with arcuate grooves with the same center, and the fixing plate is fixed with position-limiting members corresponding to the arcuate grooves one by one, and the adjusting plate rotates horizontally via the position-limiting members; A plurality of adjusting bolts that move up and down are installed on the upper side of the mounting plate. The number of the adjusting bolts is greater than or equal to 3. The plurality of adjusting bolts are axially parallel and not in the same plane. The up and down movement of the adjusting bolts drives the corresponding position of the mounting plate to move up and down.

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