Computer CPU heat dissipation device
By designing filters and high thermal conductivity materials that are easy to disassemble in the computer CPU heat dissipation device, the problem of lack of filters and difficulty in disassembly of the heat dissipation device is solved, the heat dissipation efficiency and maintenance efficiency are improved, and the service life of the CPU is extended.
Patent Information
- Application Number
- CN202422513766.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-17
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-10-17
AI Technical Summary
The existing computer CPU cooling device lacks a filter structure and is difficult to disassemble and clean, resulting in reduced heat dissipation effect and inconvenient maintenance, affecting the stability and life of the CPU.
A heat dissipation device including a filter and easy to disassemble is designed, and the filter screen is replaced and the device is quickly disassembled by manually operating the wrench and knob. It adopts highly thermally conductive materials and precision structures to improve heat dissipation and maintenance efficiency.
It realizes rapid replacement of the filter and convenient disassembly of the device, improves heat dissipation and maintenance efficiency, ensures stable operation of the CPU and extends service life.
Smart Images

Figure CN223245067U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer CPU heat dissipation, in particular to a computer CPU heat dissipation device. Background Art
[0002] With the rapid development of computer technology, the performance of CPUs has been continuously improved, and the heat generated has also been increasing. In order to ensure the stable operation of the CPU, an efficient heat dissipation device is essential. The main function of a computer CPU heat dissipation device is to quickly dissipate the heat generated by the CPU to prevent the CPU from being damaged due to excessive temperature. In various computer application scenarios, whether it is a high-performance gaming computer or a commercial computer for office and data processing, a reliable heat dissipation device is required to maintain the stable operation of the system. With the advancement of technology, people's requirements for computer heat dissipation devices are getting higher and higher. Not only do they require good heat dissipation performance, but they also expect them to be easy to maintain and easy to clean.
[0003] Currently, common computer CPU cooling devices are mainly divided into two types: air cooling and water cooling. Air cooling devices usually consist of heat sinks, fans, and heat pipes. Their working principle is to transfer heat generated by the CPU to the heat sink through the heat pipes. The fan then blows air through the heat sink to remove the heat. Water cooling devices consist of a water cooling head, water pipes, water pumps, water tanks, and radiators. Their working principle is that the water cooling head contacts the CPU, transferring heat to the coolant. The coolant is then driven by the water pump to flow through the water pipes to the radiator. The radiator exchanges heat with the air, and the cooled coolant flows back to the water cooling head, and the cycle repeats.
[0004] Existing computer CPU cooling devices have a significant problem during actual use: they lack an effective filter structure and are difficult to disassemble and clean. This results in a gradual decrease in cooling performance over time. Due to the lack of a filter, dust and other impurities in the air easily enter the cooling device and come into contact with components such as the heat sink and fan. Over time, this accumulation can affect air circulation and reduce cooling efficiency. Furthermore, traditional cooling devices are often complex in structure and design, and the disassembly process is cumbersome, requiring specialized tools. This significantly inconveniences users' daily maintenance. When dust accumulates inside the cooling device, it becomes difficult for users to effectively clean it, further impacting the cooling device's performance and potentially shortening the CPU's lifespan, affecting the overall stability of the computer. Therefore, a computer CPU cooling device is proposed to address this issue. Utility Model Content
[0005] In order to make up for the above shortcomings, the present invention provides a computer CPU heat dissipation device, which aims to improve the problem in the prior art that there is no filter and the entire device is difficult to disassemble and clean, resulting in poor heat dissipation.
[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0007] 12. The heat dissipation device as described in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, the wires being collected by the bridge. The bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, so that the bridge can get to the side of the receptacle smoothly.
[0008] As a further description of the above technical solution:
[0009] The heat dissipation assembly includes a heat dissipation fan, and the heat dissipation fan is fixedly connected to the side wall of the side plate;
[0010] As a further description of the above technical solution:
[0011] The connecting assembly includes a heat dissipation pipe, the top of the heat dissipation pipe is fixedly connected to the bottom of the heat dissipation fin, and the bottom of the heat dissipation pipe is fixedly connected to the base;
[0012] As a further description of the above technical solution:
[0013] The bottom of the base is fixedly connected to a bottom plate, a contact piece is fixedly connected inside the bottom plate, and a main board is provided at the bottom of the bottom plate;
[0014] As a further description of the above technical solution:
[0015] A fixing ring is fixedly connected to the interior of the bottom plate, and a sliding column is slidably connected to the inner wall of the fixing ring;
[0016] As a further description of the above technical solution:
[0017] The top of the sliding column is fixedly connected to a knob, and the side wall of the sliding column is fixedly connected to a limit column;
[0018] As a further description of the above technical solution:
[0019] A fixing column is fixedly connected to the inside of the mainboard, and an L-shaped groove is opened on the side wall of the fixing column;
[0020] As a further description of the above technical solution:
[0021] A second spring is provided inside the fixing column, one side of the second spring is fixedly connected to the inner wall of the fixing column, and the other end of the second spring is fixedly connected to a partition.
[0022] The utility model has the following beneficial effects:
[0023] 1. In the utility model, the user can manually turn the wrench to drive the movable column in the protective cover to move, and the displacement of the movable column causes the baffle to move synchronously, thereby compressing the spring 1 and allowing the movable column to move out of the frame range to release the lock on the filter. At this time, the user can lift the handle, and the handle drives the connecting column to move, and the displacement of the connecting column causes the filter to move, thereby achieving the effect of quickly removing the filter. This solves the problem that the traditional heat dissipation device has no filter and the entire device is difficult to disassemble and clean, resulting in poor heat dissipation, and improves the service life and heat dissipation efficiency of the heat dissipation device.
[0024] 2. In the present invention, when the CPU needs to be supplemented with silicone grease during maintenance, the user turns the knob, and the rotation of the knob drives the sliding column to rotate accordingly, and the rotation of the sliding column causes the limit column to move. When the limit column rotates to a specific angle, the spring in the fixed column rebounds, pushing the partition to move, and the displacement of the partition in turn pushes the sliding column to move, so that the entire device is separated from the bottom, achieving the effect of quickly disassembling the heat dissipation device, solving the problem of inconvenience in maintenance caused by the difficulty of disassembling traditional heat dissipation devices, improving the maintenance efficiency of the heat dissipation device, and ensuring stable operation of the CPU. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a three-dimensional schematic diagram of a computer CPU heat dissipation device proposed by the utility model;
[0026] Figure 2 This is an exploded schematic diagram of the base structure of a computer CPU cooling device proposed by the present invention;
[0027] Figure 3 This is a schematic diagram of the filter structure of a computer CPU heat dissipation device proposed by the utility model;
[0028] Figure 4 for Figure 3 A magnified schematic diagram of point A;
[0029] Figure 5 for Figure 3 Enlarged schematic diagram of point B.
[0030] Legend:
[0031] 1. Heat sink fins; 2. Cooling fan; 3. Bottom plate; 4. Main board; 5. Filter; 6. Handle; 7. Connecting column; 8. Guard plate; 9. Side panel; 10. Block; 11. Base; 12. Protective cover; 13. Movable column; 14. Wrench; 15. Spring; 16. Baffle; 17. Frame; 18. Knob; 19. Fixing ring; 20. Sliding column; 21. Limiting column; 22. Fixing column; 23. L-shaped groove; 24. Spring; 25. Partition; 26. Heat pipe; 27. Base; 28. Contact piece. DETAILED DESCRIPTION
[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0033] Reference Figure 1 、 Figure 2 and Figure 4, the utility model provides an embodiment: a computer CPU heat dissipation device, including heat dissipation fins 1, the heat dissipation fins 1 are made of high thermal conductivity aluminum alloy material, and have good heat dissipation performance and durability after precise processing and surface treatment. At the same time, a multi-piece combination is adopted to increase the heat dissipation area. A connecting component is provided at the bottom of the heat dissipation fin 1, and the connecting component is used to connect the heat dissipation device to the CPU board. Side panels 9 are provided on the left and right sides of the heat dissipation fin 1. The side panels 9 are made of a solid plastic material with good insulation and stability. The left and right side walls of the side panels 9 are fixedly connected with a card block 10. The card block 10 is also made of plastic material, which itself has a certain elasticity to ensure that the connection between the side panels 9 and the heat dissipation fins 1 is firm and stable. The block 10 is slidably connected to the side wall of the heat dissipation fin 1, and the left and right side walls of the side panel 9 are fixedly connected with a guard plate 8. The guard plate 8 is made of a transparent plastic material, which can not only play a protective role, but also facilitate observation of the internal situation. A filter 5 is slidably connected between the guard plates 8. The filter 5 is made of a fine metal wire mesh, which can effectively prevent dust and debris from entering the heat dissipation device and ensure the heat dissipation effect. The top of the filter 5 is fixedly connected with a connecting column 7 and a frame 17. The connecting column 7 is made of a solid aluminum alloy material with high strength and stability. The top of the connecting column 7 is fixedly connected with a handle 6. The handle 6 is made of rubber material and has a non-slip texture on the surface, which is convenient for users to operate. A base 11 is provided on the top of the side panel 9. The base 11 is made of cast iron material and has high strength and stability. The base 11 is fixedly connected to the inside of the side plate 9, and the base 11 is rotatably connected to a wrench 14. The wrench 14 is made of high-strength plastic material with good toughness and wear resistance. A protective cover 12 is fixedly connected to the upper surface of the base 11, and a movable column 13 is slidably connected to the inner wall of the protective cover 12. The protective cover 12 and the movable column 13 are both made of plastic material, which can effectively reduce the weight of the setting. The wrench 14 is rotatably connected to the inside of the movable column 13. Through the precise rotation structure, it is ensured that the wrench 14 can drive the movable column 13 to accurately move the protective cover 12. A spring 15 is provided on the inner wall of the protective cover 12. One end of the spring 15 is fixedly connected to the inner wall of the protective cover 12, and the other end is fixedly connected to a baffle 16. The baffle 16 is slidably connected to the inner wall of the protective cover 12. The side of the heat dissipation fin 1 is provided A heat dissipation component is provided, which is used to dissipate the heat of the device. The heat dissipation component includes a heat dissipation fan 2, which is composed of a combination of high-quality plastic and metal materials. The fan blades are made of high-strength engineering plastics, have good toughness and wear resistance, and can maintain stable performance during long-term operation. The shell of the heat dissipation fan 2 is made of aluminum alloy, has good heat dissipation performance and corrosion resistance, and can effectively protect the internal motor and fan. The heat dissipation fan 2 is fixedly connected to the side wall of the side plate 9. The connection component includes a heat dissipation pipe 26, which is made of a copper material with high thermal conductivity and has good heat dissipation performance and durability. The top of the heat dissipation pipe 26 is fixedly connected to the bottom of the heat dissipation fin 1, and the bottom of the heat dissipation pipe 26 is fixedly connected to a base 27, which is made of an aluminum alloy material.With good heat dissipation performance and stability, the base 27 is connected to the CPU board by screws or other fixing methods to ensure that the heat dissipation device can effectively transfer the heat generated by the CPU;
[0034] Specifically, in the daily maintenance of the computer CPU cooling device, the user can manually bend the wrench 14 to rotate it. The high-strength plastic material of the wrench 14 has good toughness and wear resistance, and can withstand the user's operating force without being easily damaged. The rotation of the wrench 14 drives the movable column 13 located inside the protective cover 12 to move, and the displacement of the movable column 13 drives the baffle 16 to move together. The baffle 16 has a certain wear resistance and can maintain good contact with the inner wall of the protective cover 12 during the displacement process. The displacement of the baffle 16 causes the spring 15 to be compressed. At the same time, the movable column 13 is displaced outside the range of the frame 17, thereby releasing the lock of the filter 5. At this time, the user can lift the handle 6 upward to move it, and the handle 6 drives the connecting column 7 to move upward. The displacement of the connecting column 7 promotes the displacement of the filter 5, thereby achieving the effect of quickly removing the filter 5, making it convenient for the user to clean or replace the filter 5, and ensuring the heat dissipation effect and service life of the heat dissipation device.
[0035] Reference Figure 3 and Figure 5, the bottom of the base 27 is fixedly connected to the bottom of the base 3. The bottom plate 3 is made of high-strength aluminum alloy material, has been precisely processed, and has a smooth surface with good thermal conductivity and stability. The bottom of the base 3 is fixedly connected with a contact piece 28. The contact piece 28 is made of a copper alloy material with high thermal conductivity, has good flexibility and wear resistance, can ensure good contact with the motherboard 4, and effectively transfer heat. The bottom of the base 3 is provided with a motherboard 4. The motherboard 4 is composed of a multi-layer printed circuit board, which adopts high-quality insulating materials and conductive lines and has good electrical performance and stability. Various electronic components and circuits are distributed on the motherboard 4 to support the normal operation of the computer. The inside of the base 3 is fixedly connected with a fixing ring 19. The fixing ring 19 is made of a solid stainless steel material with high strength and corrosion resistance. The inner wall of the fixing ring 19 is finely processed and has a smooth surface, which can ensure that the sliding column 20 slides smoothly therein. The inner wall of the fixing ring 19 is slidably connected with a sliding column 20. The sliding column 20 is made of a high-strength alloy steel material with good rigidity and wear resistance. The surface of the sliding column 20 The surface has been specially treated to have a low friction coefficient and can slide easily in the fixed ring 19. The top of the sliding column 20 is fixedly connected with a knob 18. The knob 18 is made of plastic material and has a non-slip texture on the surface, which is convenient for users to operate. The design of the knob 18 conforms to the principles of ergonomics and can provide a comfortable grip and operating experience. The side wall of the sliding column 20 is fixedly connected to the limit column 21. The limit column 21 is made of high-strength alloy steel material and is firmly connected to the sliding column 20. The size and shape of the limit column 21 are precisely designed. , can cooperate with the L-shaped groove 23 on the fixed column 22 to achieve the limitation and fixation of the sliding column 20. The main board 4 is fixedly connected to the fixed column 22. The fixed column 22 is made of a solid aluminum alloy material with high strength and stability. The surface of the fixed column 22 is finely processed to ensure the matching accuracy with the sliding column 20. The side wall of the fixed column 22 is provided with an L-shaped groove 23. A spring 24 is provided inside the fixed column 22. One side of the spring 24 is fixedly connected to the inner wall of the fixed column 22, and the other end of the spring 24 is fixedly connected to the partition 25;
[0036] When the CPU needs to be replenished with silicone grease during maintenance, the user first turns the knob 18. At this time, the rotation of the knob 18 drives the sliding post 20 to rotate as well. As the sliding post 20 rotates, the limiting post 21 is also driven to move. The limiting post 21 is firmly connected to the sliding post 20 and can accurately follow the rotation of the sliding post 20. When the limiting post 21 rotates to a certain angle, the positional relationship with the L-shaped groove 23 on the fixing post 22 changes, and the lock of the sliding post 20 is released. At this time, the spring 24 inside the fixing post 22 begins to rebound, and the spring 24 pushes the partition 25 to move. The displacement of the partition 25 pushes the displacement of the sliding post 20, causing the sliding post 20 to move upward, so that the entire device can be separated from the bottom, thereby achieving the effect of quickly disassembling the entire heat sink. This design makes it easy to disassemble the heat sink when maintaining the CPU, provides convenience for operations such as replenishing silicone grease, and improves maintenance efficiency.
[0037] Working principle: During routine maintenance of the computer CPU cooling device, the user can manually turn the wrench 14 to rotate it. The rotation of the wrench 14 drives the movable column 13 located inside the protective cover 12 to move. The displacement of the movable column 13 drives the baffle 16 to move as well, thereby compressing the spring 15 and causing the movable column 13 to move out of the range of the frame 17, thereby releasing the lock on the filter 5. The user can then move the handle 6 by hand, which drives the connecting column 7 to move. The displacement of the connecting column 7 promotes the displacement of the filter 5, thereby achieving In order to achieve the effect of quickly removing the filter 5, when the CPU needs to be supplemented with silicone grease during maintenance, the user first turns the knob 18. At this time, the rotation of the knob 18 drives the sliding column 20 to rotate, and the rotation of the sliding column 20 also drives the displacement of the limiting column 21. When the limiting column 21 rotates to a certain angle, the spring 24 inside the fixed column 22 begins to rebound, pushing the partition 25 to move. The displacement of the partition 25 drives the displacement of the sliding column 20, so that the entire device can be separated from the bottom, thereby achieving the effect of quickly disassembling the entire heat dissipation device.
[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A computer CPU heat dissipation device, comprising a heat dissipation fin (1), characterized in that: The bottom of the heat dissipation fin (1) is provided with a connecting assembly, and the connecting assembly is used to connect the heat dissipation device with the CPU board. The left and right sides of the heat dissipation fin (1) are provided with side panels (9), and the left and right side walls of the side panels (9) are fixedly connected with a clamping block (10), and the clamping block (10) is slidably connected to the side wall of the heat dissipation fin (1). The left and right side walls of the side panels (9) are fixedly connected with a guard plate (8), and a filter (5) is slidably connected between the guard plates (8). The top of the filter (5) is fixedly connected with a connecting column (7) and a frame (17), and the top of the connecting column (7) is fixedly connected with a handle (6). The top of the side panels (9) is provided with a base (11), and the base (11) is fixedly connected to the side wall. The utility model is connected to the inside of the side plate (9), the inside of the base (11) is rotatably connected to a wrench (14), the upper surface of the base (11) is fixedly connected to a protective cover (12), the inner wall of the protective cover (12) is slidably connected to a movable column (13), the wrench (14) is rotatably connected to the inside of the movable column (13), the inner wall of the protective cover (12) is provided with a spring (15), one end of the spring (15) is fixedly connected to the inner wall of the protective cover (12), and the other end is fixedly connected to a baffle (16), the baffle (16) is slidably connected to the inner wall of the protective cover (12), and a heat dissipation component is provided on the side of the heat dissipation fin (1), and the heat dissipation component is used to dissipate the heat of the device.
2. A computer CPU cooling device according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation fan (2), and the heat dissipation fan (2) is fixedly connected to the side wall of the side plate (9).
3. A computer CPU cooling device according to claim 1, characterized in that: The connection assembly comprises a heat dissipation pipe (26), the top of the heat dissipation pipe (26) is fixedly connected to the bottom of the heat dissipation fin (1), and the bottom of the heat dissipation pipe (26) is fixedly connected to a base (27).
4. A computer CPU cooling device according to claim 3, characterized in that: The bottom of the base (27) is fixedly connected to a bottom plate (3), a contact piece (28) is fixedly connected inside the bottom plate (3), and a main board (4) is provided at the bottom of the bottom plate (3).
5. A computer CPU cooling device according to claim 4, characterized in that: A fixing ring (19) is fixedly connected inside the bottom plate (3), and a sliding column (20) is slidably connected to the inner wall of the fixing ring (19).
6. A computer CPU cooling device according to claim 5, characterized in that: The top of the sliding column (20) is fixedly connected to a knob (18), and the side wall of the sliding column (20) is fixedly connected to a limiting column (21).
7. A computer CPU cooling device according to claim 6, characterized in that: A fixing column (22) is fixedly connected to the interior of the main board (4), and an L-shaped groove (23) is provided on the side wall of the fixing column (22).
8. A computer CPU cooling device according to claim 7, characterized in that: A second spring (24) is provided inside the fixed column (22), one side of the second spring (24) is fixedly connected to the inner wall of the fixed column (22), and the other end of the second spring (24) is fixedly connected to a partition (25).