Panelized display module packaging equipment

Abstract

The utility model discloses a panel display module packaging device, which belongs to the technical field of LED packaging and comprises a release film feeding assembly, a vacuum pressing module and an edge folding assembly, wherein the vacuum pressing module comprises a release film feeding platform, and the edge folding assembly is arranged on the release film feeding platform; the panel feeding assembly comprises a lower die jig, a second transmission line and a first grabbing mechanism. And the glue injection assembly comprises a glue injection manipulator and a glue injection shaft. By adopting the full-automatic double-station design, the utilization rate of the equipment rack is optimized, and the equipment investment and the operation cost are reduced. Meanwhile, through the innovative layout of the upper and lower backflow packaging lines, the waiting time in the production process is reduced, and the overall throughput of the production line is improved. In addition, due to the introduction of the secondary feeding and glue mixing system, the glue mixing uniformity and stability are ensured, the material waste is reduced, and the production cost is further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to a panel display module packaging device. Background Art

[0002] In the field of semiconductor LED devices, especially the packaging process of Mini LED and Micro LED panel display modules, the existing technology mainly uses compression molding or injection molding for packaging. These processes usually rely on mold heating curing to ensure the fluidity of the packaging material and the final curing effect. However, with the continuous growth of market demand, the existing production efficiency has been unable to meet the growing market demand. In addition, due to differences in PCB ink color and external dimensions, the packaged display modules often face the problem of uneven packaging glue thickness, which directly affects the product's ink color consistency and display effect. In order to solve this problem, companies have to adopt secondary lamination process or inkjet technology, which not only increases costs but also reduces production efficiency. At the same time, the existing packaging process has limitations when processing large-size products, which limits the expansion of product size and the diversification of application scenarios.

[0003] Although the existing technology has met the packaging requirements of Mini LED and Micro LED panel display modules to a certain extent, its defects are also obvious. First, the process difficulty of the existing process is relatively high, resulting in a low first-time pass rate, which not only increases production costs, but also affects the market competitiveness of the product. Secondly, due to the uneven thickness of the encapsulation glue, it is difficult for the existing technology to ensure the ink color consistency of the module, which requires additional process steps to adjust, further increasing the production cost and complexity. In addition, the existing process has extremely high requirements for the die bonding process. Any offset or tilt of the chip may seriously affect the consistency of light emission, which to a certain extent limits the quality and reliability of the product. Finally, due to the limitations of mold design, the existing process is difficult to adapt to the packaging requirements of large-size products, which limits product innovation and market expansion. Therefore, the existing technology has obvious deficiencies in production efficiency, cost control, product quality and flexibility of product size.

[0004] Therefore, we propose a panel display module packaging device to solve the above problems.

[0005] The above information disclosed in this background technology is only used to increase the understanding of the background technology of the present invention. Therefore, it may include information that does not constitute the prior art known to ordinary technicians in this field. Summary of the Invention

[0006] The purpose of the present invention is to provide a panel display module packaging device to solve the problems in the current market raised by the above background technology.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A panel display module packaging device, comprising:

[0009] A release film feeding assembly, comprising a release film feeding platform vacuum pressing module and a folding assembly provided on the release film feeding platform;

[0010] Panel loading assembly, including lower die fixture, transmission line 2 and gripping mechanism 1;

[0011] Glue injection components, including glue injection manipulator and glue injection shaft;

[0012] a blanking assembly, comprising a fourth transmission line and a second gripping mechanism;

[0013] The packaging station includes a base plate and a transmission line 1 provided on the base plate, wherein the transmission line 1 is provided with two groups;

[0014] The panel loading assembly and the panel unloading assembly are respectively arranged on both sides of the bottom plate, and the glue injection assembly and the release film loading assembly are arranged between the loading assembly and the unloading assembly;

[0015] The lower die fixture is arranged on the transmission line 1;

[0016] The second transmission line is arranged above the first transmission line, and the first grabbing mechanism is passed through the second transmission line;

[0017] The glue injection shaft is arranged on the bottom plate and is located above the upper transmission line 1, and the glue injection robot is arranged on the glue injection shaft;

[0018] The vacuum pressing module is arranged on the transmission line 1, the vacuum pressing module is provided with an inner cavity, and the release film feeding platform is inserted into the vacuum pressing module;

[0019] The transmission line four is arranged on the bottom plate and is located above the transmission line one, and the grabbing mechanism two is passed through the transmission line four.

[0020] Preferably, it also includes a drying component connected to the transmission line.

[0021] Preferably, the vacuum pressing module includes an outer shell, an upper mold arranged in the outer shell, and a transmission assembly;

[0022] The transmission assembly is fixed to the inner wall of the outer shell, and the output end thereof is fixed to the upper die.

[0023] Preferably, the second transmission line is arranged in parallel with the first transmission line;

[0024] The grabbing mechanism 1 includes a moving platform 1 and a grabber 1;

[0025] The first moving platform is arranged on the second transmission line;

[0026] The gripper 1 is in transmission connection with the moving platform 1, and the moving direction is perpendicular to the transmission line 2.

[0027] Preferably, the transmission line 4 is arranged in parallel with the transmission line 1;

[0028] The second gripping mechanism includes a second moving platform and a second gripper;

[0029] The second moving platform is arranged on the fourth transmission line;

[0030] The second gripper is connected to the second moving platform in a transmission manner, and its moving direction is perpendicular to the fourth transmission line.

[0031] Preferably, the upper mold includes a template, a connecting plate and an ejector pin;

[0032] The connecting plate is connected to the template via a spring;

[0033] The ejector pin is fixed on the template and extends out of the connecting plate;

[0034] It also includes magnetic fixtures, which are installed on the connecting plate and the display panel to be packaged.

[0035] Preferably, the glue injection robot includes a glue mixing mechanism, a glue injection mechanism and a feeding mechanism;

[0036] The feeding mechanism is fixed on the bottom plate and communicated with the glue mixing mechanism, the glue mixing mechanism is communicated with the glue injection mechanism, and the glue mixing mechanism and the glue injection mechanism are arranged on a glue injection shaft.

[0037] Compared with the prior art, the beneficial effects of the present invention are:

[0038] (1) The present invention achieves a significant improvement in production efficiency and an effective reduction in costs through an innovative packaging process. The fully automatic double-station design optimizes the utilization of the equipment frame, reducing equipment investment and operating costs. At the same time, the innovative layout of the upper and lower reflow packaging lines reduces waiting time during the production process and improves the overall throughput of the production line. In addition, the introduction of the secondary feeding and mixing system ensures the uniformity and stability of the glue mixing, reduces material waste, and further reduces production costs.

[0039] (2) The packaging process of this utility model pays special attention to improving the consistency of ink color. By precisely controlling the thickness and distribution of the packaging glue, it effectively solves the display effect problem caused by the difference in PCB ink color and external dimensions in the existing technology. The automated glue mixing and injection system, combined with visual operation, ensures the uniform mixing of glue during the packaging process, thereby improving the ink color consistency of the display module and enhancing the display effect of the final product.

[0040] (3) The packaging process of the present invention breaks through the limitations of existing technologies in packaging large-size products. Through innovative mold design and packaging technology, the present invention can adapt to display modules of different sizes, meeting the market demand for large-size display products. This not only broadens the market application scope of the product, but also provides more possibilities for the development of display technology.

[0041] (4) The present invention significantly improves the automation level of the production process by adopting advanced automation technologies and equipment, such as an automatic loading and unloading system and a vacuum pressing system. This reduces the number of manual operations, reduces the possibility of human error, and also reduces the labor intensity of the operators. In addition, the use of magnetic fixation and ejector pin separation further improves the automation level of the mold, achieving a more efficient production process.

[0042] (5) The packaging process of the present invention provides a variety of curing options, including UV curing and room temperature curing, to adapt to different production environments and product requirements. This flexibility allows the production process to be adjusted according to specific product characteristics and market requirements, optimizing production efficiency and product quality. At the same time, the diverse curing options also provide more possibilities for product innovation and customized production.

[0043] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0045] Figure 2 This is a schematic structural diagram of the vacuum pressing module of the present invention;

[0046] Figure 3 This is a schematic structural diagram of the upper mold of the present utility model;

[0047] Figure 4 for Figure 3 Side view of

[0048] Figure 5 This is a partial structural diagram of the glue injection robot of the present utility model;

[0049] Figure 6 This is a structural diagram of the drying component of the present utility model;

[0050] Figure 7 This is a schematic diagram of the cooperation between the folding component and the release film feeding platform of the present invention.

[0051] Figure: 1. Release film loading platform; 2. Vacuum pressing module; 3. Transmission line 1; 4. Lower mold fixture; 5. Transmission line 2; 6. Grabbing mechanism 1; 7. Glue injection robot; 8. Glue injection shaft; 9. Transmission line 4; 10. Grabbing mechanism 2; 11. Bottom plate; 12. Drying assembly; 13. Folding assembly.

[0052] 201, outer shell; 202, upper mold; 203, transmission assembly;

[0053] 601, exercise platform 1; 602, grab handle 1;

[0054] 701, glue mixing mechanism; 702, glue injection mechanism; 703, feeding mechanism;

[0055] 1001, exercise platform 2; 1002, grab handle 2;

[0056] 2021. Template; 2022. Connecting plate; 2023. Ejector pin; 2024. Spring; 2025. Magnetic fastener. DETAILED DESCRIPTION

[0057] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of the embodiments. It should be noted that the drawings are schematic and not to scale. For the sake of clarity and convenience, the relative sizes and proportions of the parts shown in the drawings are exaggerated or reduced in size, and any sizes are only illustrative and not restrictive.

[0058] See also Figure 1-Figure 7 , a panel display module packaging equipment, including: a release film loading component, a panel loading component, a glue injection component, a blanking component and a packaging station;

[0059] The packaging station includes a base plate 11 and a transmission line 3 provided on the base plate 11. The panel loading assembly and the unloading assembly are respectively provided on both sides of the base plate 11. The glue injection assembly and the release film loading assembly are provided between the loading assembly and the unloading assembly. The transmission line 3 can be single-layer or double-layer. When it is double-layer, it is convenient to realize cyclic operation.

[0060] Among them, the release film feeding assembly includes a release film feeding platform 1 vacuum pressing module 2 and a folding assembly 13 provided on the release film feeding platform 1, the vacuum pressing module 2 is arranged on the transmission line 3, the vacuum pressing module 2 is provided with an inner cavity, the release film feeding platform 1 is inserted into the vacuum pressing module 2, the vacuum pressing module 2 includes an outer shell 201, an upper mold 202 provided in the outer shell 201 and a transmission assembly 203, the transmission assembly 203 is fixed to the inner wall of the outer shell 201, and its output end is fixed to the upper mold 202, the upper mold 202 includes a template 2021, a connecting plate 2022 and an ejector pin 2023, the connecting plate 2022 is connected to the template 2021 by a spring 2024, the ejector pin 2023 is fixed on the template 2021, and extends out of the connecting plate 2022, and also includes a magnetic attraction fixture 2025, which is installed on the connecting plate 2022 and the display panel to be packaged;

[0061] Among them, the panel loading assembly includes a lower mold fixture 4, a transmission line 2 5 and a grabbing mechanism 1 6. The lower mold fixture 4 is arranged on the transmission line 1 3, the transmission line 2 5 is arranged above the transmission line 1 3, the grabbing mechanism 1 6 is arranged on the transmission line 2 5, and the transmission line 2 5 is arranged parallel to the transmission line 1 3. The grabbing mechanism 1 6 includes a moving platform 1 601 and a gripper 1 602. The moving platform 1 601 is arranged on the transmission line 2 5, and the gripper 1 602 is connected to the moving platform 1 601 in a transmission direction, and the movement direction is perpendicular to the transmission line 2 5.

[0062] Among them, the glue injection assembly includes a glue injection robot 7 and a glue injection shaft 8. The glue injection shaft 8 is arranged on the bottom plate 11 and is located above the upper transmission line 3. The glue injection robot 7 is arranged on the glue injection shaft 8. The glue injection robot 7 includes a glue mixing mechanism 701, a glue injection mechanism 702 and a feeding mechanism 703. The feeding mechanism 703 is fixed on the bottom plate 11 and is connected to the glue mixing mechanism 701. The glue mixing mechanism 701 is connected to the glue injection mechanism 702. The glue mixing mechanism 701 and the glue injection mechanism 702 are arranged on the glue injection shaft 8. Figure 5 There are two glue injection mechanisms 702, which are respectively connected to the glue mixing mechanism 701 and the glue injection mechanism 702. When in use, the glue is first drawn into the two glue mixing mechanisms 701, then enters the glue injection mechanism 702 for mixing, and then injected onto the release film. The glue mixing mechanism 701 is a transparent glue tube. This process realizes the visualization of glue mixing and glue injection, improves the glue mixing effect, and reduces the defective rate;

[0063] Among them, the unloading component includes a transmission line 49 and a grabbing mechanism 2 10. The transmission line 49 is arranged on the bottom plate 11 and is located above the transmission line 13. The grabbing mechanism 2 10 is passed through the transmission line 49. The transmission line 49 is arranged parallel to the transmission line 13. The grabbing mechanism 2 10 includes a moving platform 2 1001 and a grabber 2 1002. The moving platform 2 1001 is passed through the transmission line 49. The grabber 2 1002 is connected to the moving platform 2 1001 in a transmission direction, and the movement direction is perpendicular to the transmission line 49.

[0064] In addition, it also includes a drying component 12, which is connected to the transmission line 13.

[0065] It should be noted that the aforementioned release film loading platform 1, lower mold fixture 4, gripping mechanism 1 6, glue injection robot 7, and gripping mechanism 2 10 all utilize high-precision transmission methods, such as the interaction of a double-nut ball screw and a servo motor. Furthermore, the clamps in gripper 1 602 and gripper 2 1002 are mechanical or electromagnetic clamps commonly used in the art. The folding assembly 13 includes a circular plate that is sleeved onto the main body of the release film loading platform 1 and a drive device, such as an electric push rod, that drives its upward movement. During upward movement, the four edges of the release film on the release film loading platform 1 are folded.

[0066] The steps of packaging the panelized display module packaging device include:

[0067] S1. The release film is fed into the packaging equipment, and the four sides are bent in the release film feeding assembly. The release film is transferred to the lower mold fixture 4 located in the vacuum pressing module 2 on the release film feeding platform 1, and folded by the folding assembly 13;

[0068] S2, the bent release film is transferred to the glue injection assembly for glue injection, and the glue injection robot 7 injects glue on the release film;

[0069] S3. The external display panel is transferred to the release film by the panel loading assembly. In this step, the release film with the injected glue is transferred to the bottom of the transmission line 2 5. The external display panel is loaded onto the release film on the lower mold fixture 4 by the gripping mechanism 1 6.

[0070] S3, entering the release film feeding assembly for vacuum pressing;

[0071] S5, unloading, the second grabbing mechanism 10 grabs the display panel onto the drying assembly 12;

[0072] S6, drying, after being transported to the drying assembly 12, is achieved by UV curing or room temperature curing.

[0073] Working principle: The lower mold fixture 4 moves on the transmission line 3 and enters the vacuum pressing module. The release film is introduced into the lower mold fixture 4 through the release film loading platform 1, and is folded by the folding component 13. Then the lower mold fixture 4 moves to the glue injection area and the glue is injected by the glue injection robot 7, and then moves to the vicinity of the grabbing mechanism 6. The grabbing mechanism 6 grabs the external display panel and places it on the release film. The lower mold fixture 4 moves to the vacuum pressing module 2. The release film loading platform 1 leaves the vacuum pressing module 2, and the vacuum pressing module 2 changes to a closed state. The template 2021 descends to absorb the display panel, and then drives the display panel to move up for glue degassing. After the time is reached, the template 2021 drives the display panel to descend, and the display panel is separated by the ejector pin 2023 and falls onto the lower mold fixture 4. It is driven into the area where the grabbing mechanism 2 10 is located, and it is moved to the drying component 12 for drying.

[0074] All standard parts used in this utility model can be purchased commercially, and special-shaped parts can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as bolts, rivets, welding, etc. that are mature in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology. In addition, the circuit connections adopt conventional connection methods in the existing technology and will not be described in detail here. Any matters not described in detail in this specification belong to the existing technology known to professional and technical personnel in this field.

[0075] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. "Multiple" means two or more, unless otherwise specifically defined.

[0076] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0077] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0078] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0079] In the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are involved. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0080] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A panel display module packaging device, characterized in that: include: A release film feeding assembly comprises a release film feeding platform (1), a vacuum pressing module (2), and a folding assembly (13) provided on the release film feeding platform (1); A panel loading assembly, comprising a lower mold fixture (4), a second transmission line (5) and a first gripping mechanism (6); A glue injection assembly, comprising a glue injection manipulator (7) and a glue injection shaft (8); A blanking assembly, comprising a transmission line four (9) and a gripping mechanism two (10); The packaging station comprises a base plate (11) and a transmission line (3) arranged on the base plate (11), wherein the transmission line (3) is provided with two groups; The panel loading assembly and the blanking assembly are respectively arranged on both sides of the bottom plate (11), and the glue injection assembly and the release film loading assembly are arranged between the loading assembly and the blanking assembly; The lower mold fixture (4) is installed on the transmission line 1 (3); The second transmission line (5) is arranged above the first transmission line (3), and the first grabbing mechanism (6) is passed through the second transmission line (5); The glue injection shaft (8) is arranged on the bottom plate (11) and is located above the upper transmission line (3), and the glue injection manipulator (7) is arranged on the glue injection shaft (8); The vacuum pressing module (2) is installed on the transmission line 1 (3), the vacuum pressing module (2) is provided with an inner cavity, and the release film loading platform (1) is inserted into the vacuum pressing module (2); The transmission line four (9) is arranged on the bottom plate (11) and is located above the transmission line one (3), and the grabbing mechanism two (10) is passed through the transmission line four (9).

2. The panel display module packaging device according to claim 1, characterized in that: It also includes a drying component (12) connected to the transmission line one (3).

3. The panel display module packaging device according to claim 1, characterized in that: The vacuum pressing module (2) comprises an outer shell (201), an upper mold (202) arranged in the outer shell (201), and a transmission assembly (203); The transmission assembly (203) is fixed to the inner wall of the outer shell (201), and its output end is fixed to the upper mold (202).

4. The panel display module packaging device according to claim 1, characterized in that: The second transmission line (5) is arranged in parallel with the first transmission line (3); The gripping mechanism (6) includes a moving platform (601) and a gripper (602); The moving platform 1 (601) is arranged on the transmission line 2 (5); The gripper 1 (602) is connected to the moving platform 1 (601) in a transmission manner, and the moving direction is perpendicular to the transmission line 2 (5).

5. The panel display module packaging device according to claim 1, characterized in that: The transmission line four (9) is arranged in parallel with the transmission line one (3); The second gripping mechanism (10) includes a second moving platform (1001) and a second gripper (1002); The second moving platform (1001) is arranged on the fourth transmission line (9); The gripper 2 (1002) is connected to the moving platform 2 (1001) in a transmission manner, and the moving direction is perpendicular to the transmission line 4 (9).

6. The panel display module packaging device according to claim 3, characterized in that: The upper mold (202) includes a mold plate (2021), a connecting plate (2022) and an ejector pin (2023); The connecting plate (2022) is connected to the template (2021) via a spring (2024); The ejector pin (2023) is fixed on the template (2021) and extends out of the connecting plate (2022); It also includes a magnetic attraction fixture (2025), which is installed on the connecting plate (2022) and the display panel to be packaged.

7. The panel display module packaging device according to claim 1, characterized in that: The glue injection robot (7) comprises a glue mixing mechanism (701), a glue injection mechanism (702) and a feeding mechanism (703); The feeding mechanism (703) is fixed on the bottom plate (11) and is connected to the glue mixing mechanism (701). The glue mixing mechanism (701) is connected to the glue injection mechanism (702). The glue mixing mechanism (701) and the glue injection mechanism (702) are arranged on the glue injection shaft (8).

Images