Full-automatic film sticking machine for wafer

Abstract

The utility model discloses a wafer full-automatic film sticking machine which comprises a bottom plate, one side of the top of the bottom plate is fixedly connected with first supports, one end of a conveying belt is rotatably installed at the bottom between the first supports, the other end of the conveying belt is rotatably connected with the bottom of a second support, and the second support is fixedly connected with the other side of the top of the bottom plate. The top between the first supports is rotationally provided with an unwinding roller, the top between the second supports is rotationally provided with a winding roller, one end of the winding roller is fixedly connected with a first gear, the bottom of the first gear is meshed with a second gear, the second gear is fixedly connected with one end of a driving roller of a conveying belt, and the other end of the driving roller is fixedly connected with an output shaft of a first servo motor. The servo motor I is fixedly mounted at the top of the bottom plate; the top of the side, close to the first support, of the bottom plate is fixedly connected with a supporting plate, a second servo motor is fixedly installed on one side of the top of the supporting plate, and an output shaft of the second servo motor is fixedly connected with a rotating disc which is rotationally arranged on the other side of the top of the supporting plate.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film lamination, in particular to a fully automatic wafer film lamination machine. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor integrated circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced to form silicon wafers, also known as wafers. Currently, domestic wafer production lines primarily focus on 8-inch and 12-inch wafers.

[0003] Wafers need to be laminated multiple times during the processing process to avoid damage. Currently, most wafer processing plants use manual or semi-automatic methods to perform laminating operations, which has low laminating efficiency and cannot guarantee quality. Therefore, we propose a fully automatic wafer laminating machine to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to provide a fully automatic wafer laminating machine to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a fully automatic wafer laminating machine, comprising a bottom plate, one side of the top of the bottom plate is fixedly connected to bracket one, one end of a conveyor belt is rotatably installed at the bottom between the brackets one, the other end of the conveyor belt is rotatably connected to the bottom of bracket two, the bracket two is fixedly connected to the other side of the top of the bottom plate, an unwinding roller is rotatably installed at the top between the brackets one, a winding roller is rotatably installed at the top between the brackets two, one end of the winding roller is fixedly connected to gear one, the bottom of the gear one is meshed and connected to gear two, the gear two is fixedly connected to one end of a driving roller of the conveyor belt, and the other end of the driving roller is fixedly connected to the output shaft of servo motor one, and the servo motor one is fixedly mounted on the top of the bottom plate;

[0006] The top of the bottom plate near the side of the bracket one is fixedly connected to the support plate, and a servo motor 2 is fixedly installed on one side of the top of the support plate, and the output shaft of the servo motor 2 is fixedly connected to the turntable, and the turntable is rotatably arranged on the other side of the top of the support plate, and the turntable is fixedly connected to one end of a cylindrical pin at an eccentric position away from the support plate, and the other side of the cylindrical pin is slidably sleeved on the slide frame, and the end of the slide frame away from the turntable is fixedly connected to one end of the sliding column, and the other end of the sliding column is slidably connected to the film cutting assembly, and the sliding column is externally slidably sleeved on the support slide frame, and one end of the support slide frame is fixedly connected to one end of the connecting column, and the other end of the connecting column is fixedly connected to the support plate.

[0007] Preferably, a plurality of spacers are fixedly connected to the conveyor belt, and the spacers are evenly distributed.

[0008] Preferably, the sliding column is an L-shaped structure.

[0009] Preferably, the sliding frame is a runway-type structure.

[0010] Preferably, the supporting sliding frame is a U-shaped structure.

[0011] Preferably, the film cutting assembly includes a movable groove, a spring, a limiting plate, a movable rod, a pressure cover, and an annular cutter. The movable groove is opened at the bottom end of the sliding column, the inner wall of the movable groove is fixedly connected to one end of the spring, the other end of the spring is fixedly connected to the limiting plate, the limiting plate is slidably engaged in the movable groove, the end of the limiting plate away from the spring is fixedly connected to one end of the movable rod, the other end of the movable rod is fixedly connected to the pressure cover, and the edge of the end of the pressure cover away from the movable rod is fixedly connected to the annular cutter.

[0012] Compared with the existing technology, the beneficial effects of the present invention are: the wafer tray is transported by a conveyor belt, the spacer bars limit the positioning of the wafer tray, the wafer tray stops after being transported to the bottom of the film cutting assembly, the film cutting assembly is pressed down, and the film located above the wafer tray is pressed down and cut off, thereby realizing fully automatic film operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the back structure of the utility model;

[0015] Figure 3 This is a schematic diagram of the cross-sectional structure of the membrane cutting component of the present invention.

[0016] In the figure: base plate 1, bracket 1 2, conveyor belt 3, spacer 31, unwinding roller 4, winding roller 5, bracket 2 6, gear 1 7, gear 2 8, support plate 9, turntable 10, cylindrical pin 11, slide frame 12, sliding column 13, connecting column 14, support slide frame 15, film cutting assembly 16, movable groove 161, spring 162, limit plate 163, movable rod 164, pressure cover 165, annular cutter 166, servo motor 1 17, servo motor 2 18. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] Example 1

[0019] Reference Figure 1 、 2 , which is the first embodiment of the utility model, and provides a fully automatic wafer laminating machine, comprising a base plate 1, one side of the top of the base plate 1 is fixedly connected to a bracket 1 2, one end of a conveyor belt 3 is rotatably installed at the bottom between the brackets 1 2, the other end of the conveyor belt 3 is rotatably connected to the bottom of a bracket 2 6, the bracket 2 6 is fixedly connected to the other side of the top of the base plate 1, a reeling roller 4 is rotatably installed at the top between the brackets 1 2, a reeling roller 5 is rotatably installed at the top between the brackets 2 6, one end of the reeling roller 5 is fixedly connected to a gear 1 7, the bottom of the gear 1 7 is meshed with a gear 2 8, the gear 2 8 is fixedly connected to one end of a driving roller of the conveyor belt 3, and the other end of the driving roller is fixedly connected to the output shaft of a servo motor 17, and the servo motor 17 is fixedly mounted on the top of the base plate 1;

[0020] The top of the side of the base plate 1 close to the bracket 2 is fixedly connected to the support plate 9, and a servo motor 2 18 is fixedly installed on one side of the top of the support plate 9. The output shaft of the servo motor 2 18 is fixedly connected to the turntable 10. The turntable 10 is rotatably arranged on the other side of the top of the support plate 9. The turntable 10 is fixedly connected to the end of the cylindrical pin 11 at the eccentric point away from the support plate 9. The other side of the cylindrical pin 11 is slidably sleeved on the slide frame 12. The end of the slide frame 12 away from the turntable 10 is fixedly connected to one end of the sliding column 13, and the other end of the sliding column 13 is slidably connected to the film cutting assembly 16. The sliding column 13 is externally slidably sleeved on the support slide frame 15. One end of the support slide frame 15 is fixedly connected to one end of the connecting column 14, and the other end of the connecting column 14 is fixedly connected to the support plate 9.

[0021] The film is placed on the unwinding roller 4, and a scroll spring is provided at one end of the unwinding roller 4. The scroll spring is installed in the bracket 1 2, so that the unwinding roller 4 has a certain rotational force, so that when the film is wound on the winding roller 5, the film can maintain tension. The wafer tray is transported by the conveyor belt 3, and the spacer 31 limits the positioning of the wafer tray. The wafer tray is transported to the bottom of the film cutting component 16 and stops. Then the servo motor 2 18 works, and the servo motor 2 18 drives the turntable 10 to rotate in a circle. The turntable 10 drives the cylindrical pin 11 set at the eccentric position to rotate in a circle. The cylindrical pin 11 drives the slide frame 12 to move down, and the slide frame 12 drives the sliding column 13 to move down. The sliding column 13 drives the film cutting assembly 16 at the bottom to move downward synchronously. After the film cutting assembly 16 moves downward, it cuts the film and then applies it to the wafer. After the film is applied, the film cutting assembly 16 is lifted. After it is lifted to the highest position, the servo motor 17 works to drive the conveyor belt 3 to transport the wafer tray, thereby driving the wafer with the film applied to shift. The wafer without the film applied is located directly under the film cutting assembly 16 again. At the same time, through the meshing cooperation of gear 1 7 and gear 2 8, the winding roller 5 is driven to rotate, and the winding roller 5 drives the film to be reeled up, thereby making the new film located directly under the film cutting assembly 16 at the same time, realizing a new round of film application operation.

[0022] Example 2

[0023] Reference Figure 1-3 , which is the second embodiment of the present utility model, is based on the previous embodiment. Specifically, a plurality of spacers 31 are fixedly connected to the conveyor belt 3, and the spacers 31 are evenly distributed. The spacers 31 limit the positioning of the wafer tray.

[0024] Specifically, the sliding post 13 has an L-shaped structure, which allows the sliding post 13 to be located in the middle of the conveyor belt 3 .

[0025] Specifically, the sliding frame 12 is a runway-shaped structure, which facilitates the sliding movement of the cylindrical pin 11 .

[0026] Specifically, the support sliding frame 15 is a U-shaped structure, and the support sliding frame 15 supports the sliding column 13 .

[0027] Specifically, the film cutting assembly 16 includes a movable groove 161, a spring 162, a limiting plate 163, a movable rod 164, a pressure cover 165, and an annular cutter 166. The movable groove 161 is opened at the bottom end of the sliding column 13. The inner wall of the movable groove 161 is fixedly connected to one end of the spring 162, and the other end of the spring 162 is fixedly connected to the limiting plate 163. The limiting plate 163 slides and is clamped in the movable groove 161. The end of the limiting plate 163 away from the spring 162 is fixedly connected to one end of the movable rod 164, and the other end of the movable rod 164 is fixedly connected to the pressure cover 165. The edge of the end of the pressure cover 165 away from the movable rod 164 is fixedly connected with the annular cutter 166.

[0028] The wafer tray is transferred to the bottom of the film cutting assembly 16 and stops, and then the servo motor 2 18 works, and the servo motor 2 18 drives the turntable 10 to rotate in a circle, and the turntable 10 drives the cylindrical pin 11 set at the eccentric position to rotate in a circle, and the cylindrical pin 11 drives the slide frame 12 to move downward, and the slide frame 12 drives the sliding column 13 to move downward, and the sliding column 13 drives the bottom film cutting assembly 16 to move downward synchronously, and the annular cutter 166 of the film cutting assembly 16 first presses on the film, and then under continuous downward movement, the annular cutter 166 cuts the film, and at the same time, the pressure cover 165 drives the cut film to be attached to the wafer. The inner wall of the pressure cover 165 is fixedly connected with a buffer cotton to prevent the pressure cover 165 from damaging the wafer. At the same time, the elastic force of the spring 162 provides a certain buffering effect on the downward pressure of the pressure cover 165 to prevent the impact force of the pressure cover 165 from damaging the wafer.

[0029] Example 3

[0030] Reference Figure 1-3, which is the third embodiment of the present invention. This embodiment is based on the above two embodiments. When in use, the film is placed on the unwinding roller 4, and one end of the unwinding roller 4 is provided with a spiral spring. The spiral spring is installed in the bracket 1 2, which makes the unwinding roller 4 have a certain rotational force. When the film is wound on the take-up roller 5, the film can maintain tension. The wafer tray is transported by the conveyor belt 3, and the spacer bar 31 limits the positioning of the wafer tray. The wafer tray is transferred to the bottom of the film cutting assembly 16 and stops. Then the servo motor 2 18 works, and the servo motor 2 18 drives the turntable 10 to rotate in a circle. The turntable 10 drives the cylindrical pin 11 set at the eccentric position to rotate in a circle. The cylindrical pin 11 drives the slide frame 12 to move downward, and the slide frame 12 drives the sliding column 13 to move downward. The sliding column 13 drives the bottom film cutting assembly 16 to move downward synchronously. The annular cutter 166 of the film cutting assembly 16 is first pressed on the film, and then The circular cutter 166 continues to move downward, and the annular cutter 166 cuts the film, and the pressure cover 165 drives the cut film to be attached to the wafer. The inner wall of the pressure cover 165 is fixedly connected with a buffer cotton to prevent the pressure cover 165 from damaging the wafer. At the same time, the elastic force of the spring 162 provides a certain buffering effect on the downward pressure of the pressure cover 165 to prevent the pressure cover 165 from causing damage to the wafer due to the impact force of the downward pressure. After the film is completed, the pressure cover 165 is lifted. When the pressure cover 165 is lifted to the highest position, the servo motor 17 works to drive the conveyor belt 3 to transport the wafer tray, thereby driving the wafer with the film completed to shift, and the wafer without film is located again directly under the film cutting assembly 16. At the same time, through the meshing cooperation of gear 1 7 and gear 2 8, the winding roller 5 is driven to rotate, and the winding roller 5 drives the film to be wound, so that the new film is located directly under the film cutting assembly 16 at the same time, realizing a new round of film sticking operation.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic wafer laminating machine, comprising a base plate (1), characterized in that: One side of the top of the bottom plate (1) is fixedly connected to bracket one (2), one end of the conveyor belt (3) is rotatably mounted on the bottom between the brackets one (2), the other end of the conveyor belt (3) is rotatably connected to the bottom of bracket two (6), the bracket two (6) is fixedly connected to the other side of the top of the bottom plate (1), the unwinding roller (4) is rotatably mounted on the top between the brackets one (2), the winding roller (5) is rotatably mounted on the top between the brackets two (6), one end of the winding roller (5) is fixedly connected to gear one (7), the bottom of the gear one (7) is meshed with gear two (8), the gear two (8) is fixedly connected to one end of the driving roller of the conveyor belt (3), and the other end of the driving roller is fixedly connected to the output shaft of a servo motor one (17), and the servo motor one (17) is fixedly mounted on the top of the bottom plate (1); The top of the bottom plate (1) close to the bracket (2) is fixedly connected to the support plate (9), and the top side of the support plate (9) is fixedly installed with the servo motor (18). The output shaft of the servo motor (18) is fixedly connected to the turntable (10). The turntable (10) is rotatably arranged on the other side of the top of the support plate (9). The turntable (10) is fixedly connected to the end of the cylindrical pin (11) at the eccentric position away from the support plate (9). The other side of the cylindrical pin (11) is slidably connected to the slide frame (12). The end of the slide frame (12) away from the turntable (10) is fixedly connected to one end of the sliding column (13). The other end of the sliding column (13) is slidably connected to the film cutting assembly (16). The sliding column (13) is externally slidably connected to the support slide frame (15). The end of one side of the support slide frame (15) is fixedly connected to one end of the connecting column (14), and the other end of the connecting column (14) is fixedly connected to the support plate (9).

2. The fully automatic wafer laminating machine according to claim 1, characterized in that: A plurality of spacers (31) are fixedly connected to the conveyor belt (3), and the spacers (31) are evenly distributed.

3. The fully automatic wafer laminating machine according to claim 1, characterized in that: The sliding column (13) is an L-shaped structure.

4. The fully automatic wafer laminating machine according to claim 1, characterized in that: The sliding frame (12) is a runway-type structure.

5. The fully automatic wafer laminating machine according to claim 1, characterized in that: The supporting sliding frame (15) is a square-shaped structure.

6. The fully automatic wafer laminating machine according to claim 1, characterized in that: The film cutting assembly (16) includes a movable groove (161), a spring (162), a limiting plate (163), a movable rod (164), a pressure cover (165), and an annular cutter (166). The movable groove (161) is opened at the bottom end of the sliding column (13). The inner wall of the movable groove (161) is fixedly connected to one end of the spring (162). The other end of the spring (162) is fixedly connected to the limiting plate (163). The limiting plate (163) is slidably engaged in the movable groove (161). The end of the limiting plate (163 away from the spring (162) is fixedly connected to one end of the movable rod (164). The other end of the movable rod (164) is fixedly connected to the pressure cover (165). The edge of one end of the pressure cover (165) away from the movable rod (164) is fixedly connected to the annular cutter (166).

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