Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronics. The electronic equipment comprises a camera assembly and a heat dissipation piece. The heat sink includes a support region configured to support one side of the camera assembly. According to the electronic equipment, the heat dissipation piece can support the camera assembly, the camera assembly does not need to be supported through a middle frame or a steel sheet, the arrangement space in the electronic equipment is optimized, and the heat dissipation effect of the camera assembly can be improved through the structure, supporting the camera assembly, of the heat dissipation piece.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] At present, small foldable mobile phones that can be folded up and down have occupied an increasingly higher share in the foldable screen mobile phone market. The size of the camera module in small foldable mobile phones directly affects the design thickness of the mobile phone.

[0003] To achieve thinner and lighter foldable phones, the phone's midframe features a hollowed-out structure, with the camera module mounted within it and supported by steel sheets. However, the heat sink in the phone is located far from the camera module, resulting in poor heat dissipation. Utility Model Content

[0004] In view of this, an embodiment of the present disclosure provides an electronic device capable of improving the heat dissipation effect of a camera module.

[0005] The electronic device provided by the embodiment of the present disclosure includes a camera assembly and a heat sink;

[0006] The heat sink includes a support area configured to support a side of the camera assembly.

[0007] Optionally, the heat sink is located on a side of the camera assembly away from the lens, and a supporting area of the heat sink is thermally connected to the camera assembly.

[0008] Optionally, the electronic device further includes a middle frame, wherein in the thickness direction of the middle frame, the middle frame has a first surface and a second surface relative to each other, the camera assembly is located on the first surface of the middle frame, and the heat sink is located on the second surface of the middle frame.

[0009] Optionally, the middle frame includes a middle plate, the middle plate is provided with a first mounting opening passing through the first surface and the second surface, and the camera assembly is installed in the first mounting opening.

[0010] Optionally, the electronic device further includes a battery assembly, the battery assembly is located on the first surface of the middle frame, and the heat sink further includes a heat sink, which is thermally connected to the battery assembly.

[0011] Optionally, the middle plate is provided with a second mounting opening that passes through the first surface and the second surface, and the battery assembly is mounted in the second mounting opening.

[0012] Optionally, the orthographic projection of the support area on the mid-plate covers the first mounting opening;

[0013] And / or the orthographic projection of the heat sink on the middle plate covers the second mounting opening.

[0014] Optionally, the heat sink further includes a skirt area, an edge of the heat sink is connected to an edge of the support area, and the skirt area surrounds the heat sink and the support area.

[0015] Optionally, a plurality of protrusions are provided on the edge of the skirt area, and the heat sink is welded to the middle frame via the protrusions.

[0016] Optionally, the thickness of the support area is 0.05 mm to 0.16 mm;

[0017] And / or the thickness of the heat sink is 0.2 mm to 0.5 mm.

[0018] Optionally, the electronic device further includes a colloid, and the skirt area of the heat sink is bonded to the middle frame via the colloid.

[0019] Optionally, the electronic device further includes a heat conducting member and a screen assembly, the screen assembly is connected to the second surface of the middle frame, and the heat conducting member is located between the screen assembly and the heat dissipation member.

[0020] Optionally, the heat sink is a vacuum chamber heat sink or a loop heat pipe.

[0021] The beneficial effects of the technical solutions provided by the embodiments of the present disclosure include at least:

[0022] The electronic device provided by the embodiment of the present disclosure includes a camera assembly and a heat sink. The camera assembly is supported by the heat sink, and there is no need to support the camera assembly through a middle frame or steel sheet, thereby optimizing the internal layout space of the electronic device. In addition, the structure of the heat sink supporting the camera assembly is conducive to improving the heat dissipation effect of the camera assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present disclosure;

[0025] Figure 2 An exploded view of an electronic device provided in an embodiment of the present disclosure;

[0026] Figure 3A schematic diagram of a battery assembly, a camera assembly, and a heat sink provided in an embodiment of the present disclosure;

[0027] Figure 4 A schematic diagram of a heat sink provided in accordance with an embodiment of the present disclosure.

[0028] The reference numerals in the figures represent respectively:

[0029] 1-Middle frame; 2-Camera assembly; 3-Heat sink; 4-Battery assembly; 5-Colloid; 6-Heat conductor; 7-Screen assembly;

[0030] 11-middle plate; 31-support area; 32-heat sink; 33-skirt area;

[0031] 111 - first mounting opening; 112 - second mounting opening; 331 - convex portion.

[0032] The above drawings illustrate specific embodiments of the present disclosure, which will be described in more detail below. These drawings and textual descriptions are not intended to limit the scope of the present disclosure in any way, but rather to illustrate the concepts of the present disclosure to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0034] The directional nouns involved in the embodiments of the present disclosure, such as "upper", "lower", "side", etc., are generally expressed in the form of Figure 1 The relative relationships shown in the figure are used as a reference, and these directional terms are used only to more clearly describe the relationship between structures, not to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "up" and "down" may be interchangeable.

[0035] Figure 1 Schematic diagram of an electronic device provided by an embodiment of the present disclosure. Figure 1 As shown, the electronic device includes a camera assembly 2 and a heat sink 3.

[0036] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present disclosure, such as Figure 2 As shown, the heat sink 3 includes a supporting area 31 , which is configured to support one side of the camera assembly 2 .

[0037] The electronic device provided by the embodiment of the present disclosure includes a camera assembly 2 and a heat sink 3. The support area 31 of the heat sink 3 is configured to support the camera assembly 2. There is no need to support the camera assembly 2 through a middle frame or a steel sheet, which optimizes the internal layout space of the electronic device. In addition, the structure in which the camera assembly 2 is supported by the heat sink 3 is conducive to improving the heat dissipation effect of the camera assembly 2.

[0038] To make the technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings.

[0039] like Figure 1 As shown, the electronic device provided by the embodiment of the present disclosure includes a middle frame 1, a camera assembly 2, and a heat sink 3. The middle frame 1 has a first surface and a second surface facing each other in the thickness direction. The camera assembly 2 is located on the first surface of the middle frame 1, and the heat sink 3 is located on the second surface of the middle frame 1. The camera assembly 2 and the heat sink 3 are respectively fixedly connected to the middle frame 1. The heat sink 3 is opposite to the camera assembly 2 and is thermally connected to the end of the camera assembly 2 away from the lens, thereby dissipating heat from the camera assembly 2.

[0040] It should be noted that the electronic device provided in the embodiments of the present disclosure may be, but is not limited to, a mobile phone, a remote control, a tablet computer, an MP3 player (Moving Picture Experts Group Audio Layer III, Moving Picture Experts Group Audio Layer 3), or an MP4 player (Moving Picture Experts Group Audio Layer IV, Moving Picture Experts Group Audio Layer 4). The electronic device may also be referred to as a user device, a portable terminal, a laptop terminal, or other names. In some embodiments of the present disclosure, the electronic device is an electronic device with a foldable function, such as a foldable mobile phone, and the electronic device includes at least two middle frames 1. In some embodiments of the present disclosure, the electronic device is a non-foldable device, and the electronic device includes one middle frame 1. See Figure 1 The first surface of the middle frame 1 is located on a side close to the rear shell of the foldable electronic device, and the second surface of the middle frame 1 is located on a side close to the display screen of the foldable electronic device.

[0041] In some embodiments of the present disclosure, the heat sink 3 is located on a side of the camera assembly 2 away from the lens, and the support area 31 of the heat sink 3 is thermally connected to the camera assembly 2. For example, the side of the support area 31 close to the camera assembly 2 is connected to the camera assembly 2 via a thermal pad, which can be thermal grease, thermal adhesive, thermal gasket, graphite, etc.

[0042] like Figure 2As shown, the heat sink 3 includes a support area 31, and the middle frame 1 includes a middle plate 11. The support area 31 is located at a corner of the heat sink 3 and corresponds to the installation position of the camera assembly 2 on the middle plate 11. The area of the support area 31 is slightly larger than the area of the end of the camera assembly 2 near the middle plate 11, and the support area 31 can completely cover the end of the camera assembly 2 near the middle plate 11, thereby firmly supporting the camera assembly 2 and providing better heat dissipation for the camera assembly 2.

[0043] In some embodiments of the present disclosure, Figure 2 As shown, the middle plate 11 is provided with a first mounting opening 111 that passes through the first and second surfaces, and the camera assembly 2 is mounted in the first mounting opening 111. The end of the camera assembly 2 that is closest to the middle plate 11 can pass through the first mounting opening 111 and contact the support area 31 of the heat sink 3, thereby dissipating heat from the camera assembly 2.

[0044] In some embodiments of the present disclosure, see Figure 2 The electronic device also includes a battery assembly 4, which is located on the first side of the middle frame 1. The battery assembly 4 is fixedly connected to the middle plate 11. The heat sink 3 also includes a heat sink 32, which is thermally connected to the battery assembly 4. The heat sink 32 of the heat sink 3 is used to dissipate heat from the battery assembly 4.

[0045] Alternatively, as Figure 2 As shown, the middle plate 11 is provided with a second mounting opening 112 that passes through the first and second surfaces, and the battery assembly 4 is mounted within the second mounting opening 112. The second mounting opening 112 reduces the volume occupied by the middle plate 11, thereby providing more space for the battery assembly 4 and facilitating an increase in the capacity of the battery assembly 4. Furthermore, the battery assembly 4 directly contacts the heat sink 32 of the heat sink 3, enhancing the heat dissipation effect of the heat sink 3 on the battery assembly 4.

[0046] In some embodiments of the present disclosure, see Figure 2 , the orthographic projection of the support area 31 on the middle plate 11 covers the first mounting opening 111 ; and / or the orthographic projection of the heat sink 32 on the middle plate 11 covers the second mounting opening 112 .

[0047] Figure 3 Schematic diagram of the battery assembly, camera assembly and heat sink provided in the embodiment of the present disclosure. Figure 3 As shown, the support area 31 can cover the first mounting port 111, and the heat sink 32 can cover the second mounting port 112, thereby completely covering the portion of the camera assembly 2 located in the first mounting port 111 and the portion of the battery assembly 4 located in the second mounting port 112, providing better heat dissipation effect for the battery assembly 4 and the camera assembly 2.

[0048] In some embodiments of the present disclosure, the electronic device further includes a mainboard, and the heat sink 32 can also cover at least a portion of the mainboard, that is, the area of the mainboard where the chip is provided, thereby dissipating heat from the mainboard of the electronic device.

[0049] Optionally, the thickness of the support region 31 is 0.05mm to 0.16mm; and / or the thickness of the heat sink 32 is 0.2mm to 0.5mm. Preferably, the thickness of the support region 31 is 0.12mm, and the thickness of the heat sink 32 is 0.38mm. The appropriate thickness of the support region 31 and the heat sink 32 can increase the strength of the heat sink 3 and prevent it from deforming when the electronic device is dropped or impacted.

[0050] It should be noted that the heat sink 3 provided in the embodiment of the present disclosure is a vacuum chamber heat spreader or a loop heat pipe. Among them, the loop heat pipe (Loop Heat Pipe, abbreviated as LHP in English) is a closed-loop ring-type heat pipe that can perform cyclic heat dissipation and has a good heat dissipation function. The vacuum chamber heat spreader (Vapor Chamber, abbreviated as VC in English) has a vacuum cavity with a microstructure and has a good heat dissipation function. Its materials include but are not limited to copper, stainless steel, titanium alloy, etc. The heat sink 3 may include an upper cover plate and a lower cover plate, and the edge of the upper cover plate is sealed to the edge of the lower cover plate. In the heat sink 32 part, a cavity is formed between the upper cover plate and the lower cover plate, and the cavity is filled with a heat-conducting medium to improve the heat dissipation effect of the battery assembly 4. In the support area 31 part, the upper cover plate and the lower cover plate are completely attached to each other, and there is no cavity between the upper cover plate and the lower cover plate to reduce the thickness of the heat sink 3 at the support area 31. The thickness of the upper cover plate and the lower cover plate can be equal, respectively 0.06mm.

[0051] Figure 4 Schematic diagram of a heat sink provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 4 As shown, the heat sink 3 further includes a skirt region 33. The edge of the heat sink 32 is connected to the edge of the support region 31. The skirt region 33 surrounds the heat sink 32 and the support region 31. The skirt region 33 is formed by the connection between the upper cover plate and the lower cover plate to form a sealed cavity in the heat sink 3.

[0052] In some embodiments of the present disclosure, Figure 4 As shown, a plurality of protrusions 331 are provided at the edge of the skirt area 33 , and the heat sink 3 is welded to the middle frame 1 via the protrusions 331 .

[0053] Alternatively, see Figure 1 The electronic device further includes a colloid 5, through which the skirt region 33 of the heat sink 3 is bonded to the middle frame 1. The colloid 5 may be a conductive colloid, through which the heat sink 3 is connected to the grounding point of the middle frame 1.

[0054] Optionally, the heat sink 3 may also be connected to the middle frame 1 via screws.

[0055] In some embodiments of the present disclosure, Figure 1 As shown, the electronic device further includes a heat conductor 6 and a screen assembly 7. The screen assembly 7 is connected to the second surface of the middle frame 1, and the heat conductor 6 is located between the screen assembly 7 and the heat sink 3. Specific implementations of the heat conductor 6 include, but are not limited to, thermal grease, thermal adhesive, and thermal pads. The heat conductor 6 is used to transfer heat from the heat sink 3 to the screen assembly 7, and dissipate heat to the external environment through the screen assembly 7.

[0056] It should be noted that the terms "several" and "at least one" in this document refer to one or more, while "multiple" and "at least two" refer to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates an "or" relationship between the associated objects.

[0057] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections; they may refer to direct connections or indirect connections through an intermediate medium; they may refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0058] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0060] In the description of this specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure.

[0061] The above descriptions are merely embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. An electronic device, characterized in that: It includes a camera assembly (2) and a heat sink (3); The heat sink (3) includes a support area (31), and the support area (31) is configured to support one side of the camera assembly (2).

2. The electronic device according to claim 1, wherein The heat sink (3) is located on a side of the camera assembly (2) away from the lens, and a supporting area (31) of the heat sink (3) is thermally connected to the camera assembly (2).

3. The electronic device according to claim 2, wherein: The invention also includes a middle frame (1), wherein in the thickness direction of the middle frame (1), the middle frame (1) has a first surface and a second surface opposite to each other, the camera assembly (2) is located on the first surface of the middle frame (1), and the heat sink (3) is located on the second surface of the middle frame (1).

4. The electronic device according to claim 3, wherein: The middle frame (1) comprises a middle plate (11), the middle plate (11) is provided with a first mounting opening (111) penetrating the first surface and the second surface, and the camera assembly (2) is mounted in the first mounting opening (111).

5. The electronic device according to claim 4, characterized in that It also includes a battery assembly (4), the battery assembly (4) is located on the first surface of the middle frame (1), and the heat sink (3) also includes a heat sink (32), the heat sink (32) is thermally connected to the battery assembly (4).

6. The electronic device according to claim 5, characterized in that The middle plate (11) is provided with a second mounting opening (112) penetrating the first surface and the second surface, and the battery assembly (4) is mounted in the second mounting opening (112).

7. The electronic device according to claim 6, wherein: The orthographic projection of the support area (31) on the middle plate (11) covers the first mounting opening (111); And / or the positive projection of the heat sink (32) on the middle plate (11) covers the second mounting opening (112).

8. The electronic device according to claim 5, wherein: The heat sink (3) further comprises a skirt area (33), the edge of the heat sink (32) is connected to the edge of the support area (31), and the skirt area (33) surrounds the heat sink (32) and the support area (31).

9. The electronic device according to claim 8, wherein: The edge of the skirt area (33) is provided with a plurality of protrusions (331), and the heat sink (3) is welded to the middle frame (1) via the protrusions (331).

10. The electronic device according to claim 8, wherein The thickness of the support area (31) is 0.05 mm to 0.16 mm; And / or the thickness of the heat sink (32) is 0.2 mm to 0.5 mm.

11. The electronic device according to claim 8, wherein It also includes a colloid (5), and the skirt area (33) of the heat dissipation element (3) is bonded to the middle frame (1) through the colloid (5).

12. The electronic device according to claim 3, wherein: It also includes a heat conducting member (6) and a screen assembly (7), wherein the screen assembly (7) is connected to the second surface of the middle frame (1), and the heat conducting member (6) is located between the screen assembly (7) and the heat dissipating member (3).

13. The electronic device according to any one of claims 1 to 12, characterized in that: The heat sink (3) is a vacuum chamber soaking plate or a loop heat pipe.

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