Cooling plate

Abstract

The utility model provides a cooling plate which can restrain enlargement in the thickness direction and improve cooling efficiency. The heat medium circulation space (2) is formed between the heat dissipation surface (13) of the bottom plate (10) and the cover plate (20). The bottom plate (10) has a plurality of heat transfer sections (14) that are provided so as to protrude from the heat dissipation surface (13) toward the cover plate (20), and transfer heat released from the heat dissipation surface (13) to the heat medium circulating in the heat medium circulation space (2). A heat transfer joining section (32) for joining the top end section of the heat transfer section (14) and the cover plate (20) is formed between the top end section of at least a part of the plurality of heat transfer sections (14) and the surface of the cover plate (20) on the heat medium flow space (2) side.

Description

Technical Field

[0001] The utility model relates to a cooling plate for cooling cooling objects such as electronic equipment and a manufacturing method of the cooling plate. Background Art

[0002] A known conventional cooling plate, as shown in Patent Document 1, is a cooling plate having a heat medium circulation space formed therein for circulating a heat medium, and releasing heat released from an object to be cooled to the heat medium circulating in the heat medium circulation space. The cooling plate comprises: a bottom plate, one surface of which is provided with a heat absorbing surface, and the other surface of which is provided with a heat dissipating surface, the heat absorbing surface absorbing heat released from the object to be cooled, and the heat dissipating surface releasing heat absorbed by the heat absorbing surface to the heat medium circulating in the heat medium circulation space; a cover plate covering the heat dissipating surface of the bottom plate; the bottom plate having a plurality of heat transfer portions, the plurality of heat transfer portions being provided to protrude from the heat dissipating surface toward the cover plate, and transferring heat released by the heat dissipating surface to the heat medium circulating in the heat medium circulation space.

[0003] In the cooling plate described in Patent Document 1, when gaps are formed between the top ends of the plurality of heat transfer sections and the surface of the cover plate facing the heat medium circulation space, the heat medium flowing in the heat medium circulation space is more likely to flow through the gaps between the top ends of the plurality of heat transfer sections and the cover plate than through the gaps between the heat transfer sections. Therefore, in the cooling plate described in Patent Document 1, the heat medium flowing in the heat medium circulation space flows out of the heat medium circulation space without fully absorbing heat from the heat transfer sections, failing to improve cooling efficiency.

[0004] Therefore, in the cooling plate described in Patent Document 2, a butt joint is arranged between the top ends of the plurality of heat transfer sections and the surface of the cover plate on the side of the heat medium circulation space, thereby restricting the flow of the heat medium in the gap between the top ends of the plurality of heat transfer sections and the surface of the cover plate on the side of the heat medium circulation space, thereby achieving improved cooling efficiency.

[0005] Patent Document 1: Japanese Patent Application No. 2013-506996

[0006] Patent Document 2: Japanese Patent Application Publication No. 2019-186297

[0007] However, in the cooling plate described in Patent Document 2, because abutment members are disposed between the top ends of the plurality of heat transfer sections and the surface of the cover plate facing the heat medium circulation space, the height of the plurality of heat transfer sections is reduced, and the contact area between the heat transfer sections and the heat medium circulating in the heat medium circulation space is reduced, thereby potentially reducing cooling capacity. Furthermore, in the cooling plate described in Patent Document 2, if the height of the heat transfer sections is set to a level sufficient to achieve the required cooling capacity, the overall thickness dimension of the cooling plate increases. Utility Model Content

[0008] An object of the present invention is to provide a cooling plate and a method for manufacturing the cooling plate, which can suppress an increase in size in the thickness direction and can improve cooling efficiency.

[0009] A cooling plate according to the present invention is a cooling plate that forms a heat medium circulation space within which a heat medium circulates, and releases heat absorbed from a cooling object to the heat medium circulating in the heat medium circulation space. The cooling plate comprises: a base plate having a heat absorbing surface disposed on one side for absorbing heat released from the cooling object, and a heat dissipating surface disposed on the other side for releasing heat absorbed by the heat absorbing surface to the heat medium circulating in the heat medium circulation space; and a cover plate covering the heat dissipating surface of the base plate. The heat medium circulation space is formed between the heat dissipating surface of the base plate and the cover plate. The base plate has a plurality of heat transfer portions that protrude from the heat dissipating surface toward the cover plate and transfer heat released from the heat dissipating surface to the heat medium circulating in the heat medium circulation space. A heat transfer joint is formed between at least a portion of the top ends of the plurality of heat transfer portions and a surface of the cover plate facing the heat medium circulation space, joining the top ends of the heat transfer portions to the cover plate.

[0010] In addition, preferably, the plurality of heat transfer portions of the cooling plate of the present invention are fins extending along a flow direction of the heat medium flowing in the heat medium flow space.

[0011] In addition, preferably, in the cooling plate of the present invention, the bottom plate has a bottom plate side joint portion arranged to extend circumferentially along the entire outer peripheral side, and the cover plate has a cover plate side joint portion arranged to extend circumferentially along the entire outer peripheral side, and a sealing joint portion is formed between the bottom plate side joint portion and the cover plate side joint portion to seal the heat medium circulation space.

[0012] In addition, preferably, the base plate and the cover plate of the cooling plate of the present invention are respectively made of copper, copper alloy, aluminum, aluminum alloy, stainless steel or stainless steel alloy.

[0013] 18. The heat dissipation device of claim 17, wherein the heat dissipation device is configured to dissipate heat from the heat source to the heat medium flowing in the heat medium circulation space. The heat dissipation device is configured to dissipate heat from the heat source to the heat medium flowing in the heat medium circulation space. The heat dissipation device is configured to dissipate heat from the heat source to the heat source. The heat dissipation device is configured to dissipate heat from the heat source to the heat source.

[0014] Furthermore, preferably, the method for manufacturing a cooling plate of the present invention includes a heat transfer portion forming step of forming the heat transfer portion into a fin shape extending along a flow direction of the heat medium flowing in the heat medium flow space.

[0015] In addition, preferably, the manufacturing method of the cooling plate of the present invention includes: a bottom plate side joint forming process, forming a bottom plate side joint, and the bottom plate side joint is set to extend circumferentially along the entire outer peripheral side of the bottom plate; a cover plate side joint forming process, forming a cover plate side joint, and the cover plate side joint is set to extend circumferentially along the entire outer peripheral side of the cover plate; a sealing joint process, joining the bottom plate side joint formed by the bottom plate side joint forming process and the cover plate side joint formed by the cover plate side joint forming process to each other, thereby sealing the heat medium circulation space.

[0016] Furthermore, preferably, in the cooling plate manufacturing method of the present invention, in the sealing and joining step, the bottom plate side joining portion and the cover side joining portion are joined by brazing, diffusion joining, friction stir joining, or pressure welding.

[0017] According to the present invention, since the gap between the top end of the heat transfer unit and the surface of the cover plate on the heat medium circulation space side is eliminated, the heat medium flow rate on the cover plate side in the heat medium circulation space can be reduced, while the heat medium flow rate between adjacent heat transfer units can be increased, thereby improving cooling efficiency. In addition, since the thickness direction can be suppressed, the installation space can be saved, and the material usage can be reduced and the weight can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall three-dimensional view of the cooling plate according to the embodiment of the present invention.

[0019] Figure 2 This is an exploded perspective view of the cooling plate viewed from the cover plate side according to one embodiment of the present invention.

[0020] Figure 3 This is an exploded perspective view of the cooling plate viewed from the bottom plate side according to one embodiment of the present invention.

[0021] Figure 4 It is a side view of the main part of the bottom plate of one embodiment of the present invention.

[0022] Figure 5 This is a top view of a cooling plate according to one embodiment of the present invention.

[0023] Figure 6 It is a bottom view of a cooling plate according to one embodiment of the present invention.

[0024] Figure 7 This is a side cross-sectional view illustrating a method for manufacturing a cooling plate according to one embodiment of the present invention.

[0025] Figure 8 This is a side cross-sectional view of a cooling plate for explaining a method for manufacturing a cooling plate according to an embodiment of the present invention.

[0026] Figure 9 This is a front cross-sectional view of a cooling plate for explaining a method for manufacturing a cooling plate according to an embodiment of the present invention.

[0027] Figure 10 This is a side cross-sectional view of a cooling plate for explaining a method for manufacturing a cooling plate according to an embodiment of the present invention.

[0028] Figure 11 (a)~ Figure 11 (c) is a plan view of the cooling plate showing another example of the arrangement of the heat transfer joints.

[0029] Figure 12 It is a side cross-sectional view of a cooling plate showing another example of the heat transfer portion.

[0030] Figure 13 (a) and Figure 13 (b) is a plan view of a cooling plate for explaining another example of a flow path of the heat medium formed in the heat medium circulation space.

[0031] Figure 14 (a)~ Figure 14 (e) is a side cross-sectional view of the cooling plate showing another example of the shape of the heat transfer joint.

[0032] Figure 15 (a) and Figure 15(b) is a side view of the bottom plate showing another example of the shape of the front end side of the heat transfer portion.

[0033] Description of Reference Numerals

[0034] 1 cooling plate

[0035] 2Heat medium circulation space

[0036] 10 bottom plate

[0037] 11 Bottom plate side joint

[0038] 12 heat absorbing surface

[0039] 13 heat dissipation surface

[0040] 14Heat transfer unit

[0041] 20 cover

[0042] 31 Sealing joint

[0043] 32 heat transfer joint DETAILED DESCRIPTION

[0044] Figures 1 to 10 This shows one embodiment of the present invention. Figure 1 This is the overall three-dimensional diagram of the cooling plate. Figure 2 This is an exploded perspective view of the cooling plate viewed from the cover plate side. Figure 3 This is an exploded perspective view of the cooling plate viewed from the bottom plate side. Figure 4 This is a side view of the main part of the base plate. Figure 5 is a top view of the cooling plate. Figure 6 This is a bottom view of the cooling plate. Figure 7 is a side sectional view illustrating a method for manufacturing a cooling plate, Figure 8 is a side sectional view of a cooling plate for explaining a method of manufacturing the cooling plate, Figure 9 is a front cross-sectional view of a cooling plate for explaining a method of manufacturing the cooling plate. Figure 10 This is a side cross-sectional view of the cooling plate for explaining a method of manufacturing the cooling plate.

[0045] The cooling plate 1 of this embodiment is used to cool a cooling object such as an electronic device that generates heat. Figure 1 and Figure 9As shown, the cooling plate 1 is provided with a heat medium inlet 2a for admitting heat medium into the heat medium circulation space 2 formed therein, and a heat medium outlet 2b for discharging the heat medium flowing through the heat medium circulation space 2. The cooling plate 1 is used with a heat medium supply pipe (not shown) connected to the heat medium inlet 2a and a heat medium discharge pipe (not shown) connected to the heat medium outlet 2b. The cooling plate 1 allows the cooled heat medium to flow into the heat medium circulation space 2 through the heat medium inlet 2a. The heat medium absorbs heat released from the object being cooled in the heat medium circulation space 2. The heat medium, having absorbed heat in the heat medium circulation space 2, then flows out of the heat medium circulation space 2 through the heat medium outlet 2b. Water, for example, can be used as the heat medium.

[0046] like Figure 2 and Figure 3 As shown, the cooling plate 1 includes a base plate 10 and a cover plate 20 .

[0047] The bottom plate 10 is a substantially rectangular plate-shaped member made of a metal with high thermal conductivity, such as copper, copper alloy, aluminum, aluminum alloy, stainless steel, or stainless steel alloy. Figure 2 and Figure 3 As shown, the base plate 10 includes: a base plate side joint portion 11, which is joined to the cover plate 20; a heat absorbing surface 12, which absorbs heat released from the cooling object; a heat dissipating surface 13, which releases the heat absorbed by the heat absorbing surface 12 to the heat medium circulating in the heat medium circulation space 2; and a plurality of heat transfer portions 14, which are arranged to protrude from the heat dissipating surface 13 and are used to transfer the heat released from the heat dissipating surface 13 to the heat medium circulating in the heat medium circulation space 2.

[0048] The bottom plate side joint portion 11 is formed along the entire circumference of the outer peripheral side of the surface of the bottom plate 10 on the cover plate 20 side.

[0049] The heat absorbing surface 12 is a surface on which an object to be cooled is placed, and is provided on the outer side of the bottom plate 10 in the stacking direction.

[0050] The heat dissipation surface 13 is a flat surface located on the inner peripheral side of the bottom plate side joint portion 11 , and the entire surface protrudes further toward the cover plate 20 than the bottom plate side joint portion 11 .

[0051] The plurality of heat transfer parts 14 are formed together with the heat dissipation surface 13 by, for example, skiving the surface of the bottom plate 10 on the cover plate 20 side. The plurality of heat transfer parts 14 are fins that protrude from the heat dissipation surface 13 and extend along the flow direction of the heat medium flowing in the heat medium flow space 2. Figure 4 As shown, for example, each of the plurality of heat transfer portions 14 has a height H of 3 mm, a thickness T of 0.1 mm, and a gap G between adjacent heat transfer portions 14 of 0.1 mm.

[0052] The cover plate 20 is a plate-shaped member made of a metal with high thermal conductivity, such as copper, a copper alloy, aluminum, an aluminum alloy, stainless steel, or a stainless steel alloy. The cover plate 20 has a cover-side joint 21 extending along the entire circumference of the outer periphery of the cover plate 20 and joined to the base plate 10 while overlapping the base plate 10. The inner side of the cover-side joint 21 is concave. When the base plate-side joint 11 and the cover-side joint 21 are joined, a heat medium circulation space 2 is formed between the heat dissipation surface 13 of the base plate 10 and the cover plate 20. A heat medium inlet 2a is formed on one longitudinal side of the cover plate 20, and a heat medium outlet 2b is formed on the other longitudinal side.

[0053] Here, a sealing joint 31 for sealing the heat medium circulation space 2 is formed between the bottom plate side joint 11 of the bottom plate 10 and the cover plate side joint 21 of the cover plate 20. The sealing joint 31 is formed when the bottom plate 10 and the cover plate 20 are stacked on each other. Figure 6 and Figure 8 As shown, it is formed by performing laser welding from the bottom plate 10 side along the bottom plate side joint portion 11 .

[0054] Furthermore, a heat transfer joint 32 is formed between the top end of at least a portion of the plurality of heat transfer parts 14 and the surface of the cover plate 20 on the side of the heat medium flow space 2 to join the top end of the heat transfer part 14 and the cover plate 20. The heat transfer joint 32 is formed when the base plate 10 and the cover plate 20 are stacked on each other. Figure 5 、 Figure 9 and Figure 10 As shown, it is formed by laser welding from the cover plate 20 side. Figure 5 As shown, the heat transfer joint 32 extends linearly along the entire width of the heat medium circulation space 2 in a direction perpendicular to the heat medium circulation direction in the heat medium circulation space 2. The heat transfer joint 32 is formed at five locations spaced apart in the heat medium circulation direction. Figure 5 Even when the heat transfer portion 14 extends linearly as shown, there may be a state where not the entire top end portion of the heat transfer portion 14 located on the heat medium circulation space 2 side is bonded to the cover plate 20, but a portion of the top end portion of the heat transfer portion 14 corresponding to the linear portion is bonded to the cover plate 20, and the other portion does not contact the cover plate 20.

[0055] In the cooling plate 1 constructed as described above, when the object to be cooled is placed on the heat absorbing surface 12 of the base plate 10, the heat medium flows into the heat medium circulation space 2 through the heat medium inlet 2a, and the heat medium flowing in the heat medium circulation space 2 flows out of the heat medium circulation space 2 through the heat medium outlet 2b.

[0056] At this time, the heat released from the object to be cooled is absorbed by the heat absorbing surface 12 of the base plate 10, transferred from the heat absorbing surface 12 to the heat dissipating surface 13 and the plurality of heat transfer parts 14, and released to the heat medium circulating in the heat medium circulation space 2. As a result, the object to be cooled can release heat to the heat medium circulating in the heat medium circulation space 2, thereby maintaining cooling.

[0057] Furthermore, the heat medium flowing into the heat medium circulation space 2 sequentially flows between the plurality of heat transfer joints 32 extending linearly along the entire width direction in a direction perpendicular to the heat medium circulation direction and the heat dissipation surface 13, and flows out of the heat medium circulation space 2. The heat medium flowing into the heat medium circulation space 2 does not flow through the gaps between the top ends of the plurality of heat transfer parts 14 and the cover plate 20, but flows between the heat transfer parts 14, effectively absorbing the heat released by the heat transfer parts 14.

[0058] Furthermore, the method for manufacturing the cooling plate 1 includes the following steps.

[0059] Bottom plate side joint forming step: The bottom plate side joint 11 extending along the outer circumference of the bottom plate 10 in the entire circumference is formed by cutting or the like. The bottom plate side joint 11 projects less than the heat dissipation surface 13 .

[0060] Deck-plate-side joining portion forming step: The deck-plate-side joining portion 21 extending in the entire circumferential direction along the outer peripheral side of the deck plate 20 is formed by cutting or the like.

[0061] Heat transfer part forming step: By skiving, the heat dissipation surface 13 of the bottom plate and the plurality of heat transfer parts 14 are formed. In the heat transfer part forming step, each of the plurality of heat transfer parts 14 is formed into a fin shape extending along the flow direction of the heat medium flowing through the heat medium flow space.

[0062] Plate stacking step: The cover plate 20 is stacked on the base plate 10 , on which the base plate side joint portion 11 is formed in the base plate side joint portion forming step, and the heat dissipation surface 13 and the plurality of heat transfer portions 14 are formed in the heat transfer portion forming step.

[0063] Plate pressing process: Figure 7 As shown, the bottom plate 10 and the cover plate 20 stacked in the plate stacking process are pressed against each other in the stacking direction, so that the top ends of the plurality of heat transfer parts 14 abut against the surface of the cover plate 20 facing the heat dissipation surface 13 .

[0064] Sealing and joining process: Figure 8 As shown, in a state where the base plate 10 and the cover plate 20 are stacked on each other, laser welding is performed from the base plate side joint 11 side, thereby forming a sealed joint 31 in the entire circumference between the base plate side joint 11 of the base plate 10 and the cover plate side joint 21 of the cover plate 20.

[0065] Heat transfer bonding process: Figure 9 and Figure 10 As shown, after the base plate 10 and the cover plate 20 are joined to each other by the sealing joining process, laser welding is performed from the cover plate 20 side to form a heat transfer joint portion 32 between a portion of the top end portion of the plurality of heat transfer portions 14 and the surface of the cover plate 20 on the side of the heat medium circulation space 2.

[0066] As can be seen, the cooling plate of this embodiment is a cooling plate 1 having a heat medium circulation space 2 formed therein for circulating a heat medium, and dissipating heat absorbed from an object to be cooled to the heat medium circulating in the heat medium circulation space 2. The cooling plate 1 comprises a base plate 10 having a heat absorbing surface 12 disposed on one side thereof and a heat dissipating surface 20 disposed on the other side thereof. The heat absorbing surface 12 absorbs heat released from the object to be cooled, and the heat dissipating surface 20 dissipates the heat absorbed by the heat absorbing surface 12 to the heat medium circulating in the heat medium circulation space 2; and a cover plate 20 covering the heat dissipating surface 13 of the base plate 10. The heat medium circulation space 2 is formed between the heat dissipating surface 13 of the base plate 10 and the cover plate 20. The base plate 10 has a plurality of heat transfer portions 14, which are arranged to protrude from the heat dissipating surface 13 toward the cover plate 20 and transfer heat released from the heat dissipating surface 13 to the heat medium circulating in the heat medium circulation space 2. A heat transfer joint 32 is formed between the top ends of at least some of the heat transfer parts 14 and the surface of the cover plate 20 facing the heat medium circulation space 2 . The heat transfer joint 32 joins the top ends of the heat transfer parts 14 to the cover plate 20 .

[0067] Furthermore, the manufacturing method of the cooling plate according to the present embodiment is a manufacturing method for a cooling plate having a heat medium circulation space 2 formed therein for circulating a heat medium, and dissipating heat absorbed from an object to be cooled to the heat medium circulating in the heat medium circulation space 2, comprising: a plate laminating step of laminating a cover plate 20 on a base plate 10, wherein the base plate 10 has a heat absorbing surface 12 disposed on one side thereof for absorbing heat released from the object to be cooled, and a heat dissipating surface 20 disposed on the other side thereof for dissipating heat absorbed by the heat absorbing surface 12 to the heat medium circulating in the heat medium circulation space 2, a plurality of heat transfer portions 14 disposed protruding from the heat dissipating surface 13 for transferring heat released from the heat dissipating surface 13 to the heat medium circulating in the heat medium circulation space 2, and the cover plate 20 covering the heat dissipating surface 13; and a heat transfer bonding step of bonding at least a portion of the top ends of the plurality of heat transfer portions 14 to a surface of the cover plate 20 facing the heat medium circulation space 2 by laser welding, with the cover plate 20 being laminated to the base plate 10 in the plate laminating step.

[0068] This eliminates the gap between the top end of the heat transfer section 14 and the surface of the cover plate 20 on the side of the heat medium circulation space 2, thereby reducing the flow of heat medium on the cover plate 20 side in the heat medium circulation space 2 and increasing the flow of heat medium between adjacent heat transfer sections 14, thereby improving cooling efficiency. Furthermore, because the thickness-wise enlargement can be suppressed, space can be saved for installation, and the use of materials can be reduced and weight can be reduced. Furthermore, when forming the heat transfer joint 32 by laser welding, because softening due to annealing does not occur, the thickness of the cover plate 20 can be reduced, cooling performance can be improved by reducing thermal resistance, and manufacturing costs can be reduced and weight can be reduced by reducing the use of materials. Furthermore, when forming the heat transfer joint 32 by laser welding, because brazing material is not required, manufacturing costs can be further reduced. Furthermore, when the heat transfer joint 32 is formed by laser welding, since only the materials of the base plate 10 and the cover plate 20 are melted, compared with the case of using brazing material, the occurrence of blockage caused by the molten material seeping into the gap between the heat transfer parts 14 can be suppressed, and corrosion caused by containing different types of materials can be prevented.

[0069] In addition, it is preferable that the plurality of heat transfer portions 14 of the cooling plate of the present embodiment are fins extending along the flow direction of the heat medium flowing in the heat medium flow space 2 .

[0070] Furthermore, the method for manufacturing the cooling plate of the present embodiment preferably includes a heat transfer portion forming step of forming the heat transfer portion 14 into a fin shape extending along the flow direction of the heat medium flowing in the heat medium flow space 2 .

[0071] Thus, since the heat transfer unit 14 can be arranged in the entire flow direction of the heat medium in the heat medium flow space 2 , heat can be more efficiently transferred from the heat transfer unit 14 to the heat medium.

[0072] In addition, preferably, in the cooling plate of this embodiment, the base plate 10 has a base plate side joint portion 11 arranged to extend circumferentially along the entire outer peripheral side, the cover plate 20 has a cover plate side joint portion 21 arranged to extend circumferentially along the entire outer peripheral side, and a sealing joint portion 31 for sealing the heat medium circulation space 2 is formed between the base plate side joint portion 11 and the cover plate side joint portion 21.

[0073] In addition, preferably, the manufacturing method of the cooling plate of this embodiment includes: a bottom plate side joint forming process, forming a bottom plate side joint 11, and the bottom plate side joint 11 is set to extend circumferentially along the entire outer peripheral side of the bottom plate 10; a cover plate side joint forming process, forming a cover plate side joint 21, and the cover plate side joint 21 is set to extend circumferentially along the entire outer peripheral side of the cover plate 20; a sealing joint process, joining the bottom plate side joint 11 formed by the bottom plate side joint forming process and the cover plate side joint 21 formed by the cover plate side joint forming process to each other, thereby sealing the heat medium circulation space 2.

[0074] Thus, by joining the bottom plate side joining portion 11 and the cover plate side joining portion 21 to each other, the heat medium circulation space 2 can be reliably sealed.

[0075] In addition, preferably, the base plate 10 and the cover plate 20 of the cooling plate of the present embodiment are respectively made of copper, copper alloy, aluminum, aluminum alloy, stainless steel or stainless steel alloy.

[0076] Furthermore, according to the method for manufacturing a cooling plate of the present embodiment, preferably, in the sealing and joining step, the bottom plate side joining portion 11 and the cover plate side joining portion 21 are joined by brazing, diffusion joining, friction stir joining, or pressure welding.

[0077] In addition, although the embodiment shows as an example that each of the plurality of heat transfer parts 14 is set to a fin with a height dimension of 3 mm, a thickness dimension of 0.1 mm, and a spacing of 0.1 mm between adjacent heat transfer parts 14, the present invention is not limited to this, and the height dimension, thickness dimension, and spacing between adjacent heat transfer parts of each of the plurality of heat transfer parts can be arbitrarily set.

[0078] In addition, although the heat transfer joints 32 are formed in a manner that extends linearly along the entire width of the heat medium circulation space 2 in a direction perpendicular to the heat medium circulation direction in the heat medium circulation space 2 in the above embodiment, and five heat transfer joints 32 are formed at intervals in the heat medium circulation direction, the present invention is not limited to this. Figure 11 As shown in (a), the heat transfer joints 32 may be arranged extending in a direction perpendicular to the heat medium flow direction on the upstream and downstream sides of the heat medium flow direction, and the heat transfer joints 32 may be formed on the central side and both sides of the width direction of the heat medium flow space 2 on the midstream side of the heat medium flow direction. Figure 11 As shown in (b), the heat transfer joint 32 may be arranged to extend in a direction perpendicular to the flow direction of the heat medium at the upstream, midstream and downstream sides of the flow direction of the heat medium. Figure 11As shown in (c), heat transfer joints 32 can also be arranged at multiple locations in the heat medium flow direction. These heat transfer joints 32 are formed so as to bend at the center of the heat medium flow space 2 in the width direction and extend obliquely from the center to either side, toward the downstream side of the heat medium flow direction. By adjusting the placement, extension direction, extension length, and number of heat transfer joints 32 in the heat medium flow space 2, the heat medium flow path can be set and the heat medium flow rate can be adjusted. As long as the heat transfer joint 32 extends in a direction perpendicular to the heat medium flow direction, even if only one heat transfer joint 32 is arranged in the heat medium flow space 2, cooling capacity can be improved.

[0079] In addition, although the heat transfer portion 14 is shown to extend perpendicularly to the heat dissipation surface 13 in the above embodiment, it is not limited thereto. As long as the heat transfer portion 14 extends from the heat dissipation surface to the cover plate 20 side, for example, Figure 12 As shown, the heat transfer portion 14 may extend obliquely from the heat dissipation surface 13 toward the cover plate 20 .

[0080] In addition, although the above embodiment shows that the heat medium flows into the heat medium circulation space 2 from the heat medium inlet 2a provided at one end in the longitudinal direction of the cover plate 20, and the heat medium flowing in the heat medium circulation space 2 flows out from the heat medium outlet 2b provided at the other end, the present invention is not limited to this. Figure 13 As shown in (a), a heat medium inlet 2a can be provided at the center of the cover plate 20 in the longitudinal direction, and a heat medium outlet 2b can be provided at both ends in the longitudinal direction, so that the heat medium flowing into the center of the heat medium circulation space 2 in the longitudinal direction is split and flows out from both sides in the longitudinal direction. In addition, for example, Figure 13 As shown in (b), the heat medium inlet 2a and the heat medium outlet 2b can be arranged in the width direction on one end side in the longitudinal direction of the cover plate 20, and the heat transfer joint 32 can be extended along the longitudinal direction at the central part in the width direction except for the other end side in the longitudinal direction. As a result, the heat medium circulation space 2 is divided, so that the heat medium flowing from the one end side in the longitudinal direction of the heat medium circulation space 2 flows to the other end side in the longitudinal direction, and the heat medium flowing to the other end side in the longitudinal direction flows from the other end side in the longitudinal direction to the one end side.

[0081] In addition, if Figure 14 As shown in (a), the heat transfer joint 32 may be formed into a semicircular cross-section convex toward the heat medium flow space 2, or may be formed as Figure 14 As shown in (b), the cross section is formed into a rectangular shape that is convex toward the heat medium flow space 2. Figure 14 (c) and Figure 14As shown in (d), the heat transfer joint 32 may also be formed into a triangular cross section that is convex toward the heat medium flow space 2. Figure 14 As shown in (e), the heat transfer joint portion 32 may be formed to protrude toward the heat medium circulation space 2 in the entire circulation direction of the heat medium.

[0082] In addition, although the heat transfer portion 14 is shown in the embodiment to have the same width from the base end to the top end, and has a flat surface facing the heat medium flow space 2 in the cover plate 20 at the top end, the present invention is not limited to this. Figure 15 As shown in (a), the top end side of the heat transfer portion 14 can be formed into a shape that becomes increasingly thinner toward the top end, as shown in FIG. Figure 15 As shown in (b), the front end side of the heat transfer portion 14 may be formed into a curved surface shape that is convex toward the center portion in the thickness direction.

[0083] In addition, although water is shown as an example of the heat medium in the above embodiment, the heat medium is not limited thereto. For example, antifreeze containing ethylene glycol, refrigerant gas such as hydrofluorocarbon (HFC), etc. can be used as the heat medium.

[0084] Furthermore, while the above embodiment illustrates that each of the plurality of heat transfer sections 14 is provided as a fin extending along the direction of heat medium flow in the heat medium circulation space 2, this is not limiting. The heat transfer section may be configured such that it projects from the heat dissipation surface toward the cover plate in the heat medium circulation space. For example, a conical projection may be provided that projects from the heat dissipation surface toward the cover plate.

[0085] In addition, although the cover plate 20 and the base plate 10 are joined by laser welding in the above embodiment, the present invention is not limited thereto. The cover plate 20 may be joined to the base plate 10 by brazing, diffusion welding, friction stir welding (FSW), or pressure welding.

[0086] In addition, although the heat transfer joint portion 32 is formed by laser welding in the above embodiment, the present invention is not limited thereto, and the heat transfer joint portion 32 may be formed by diffusion welding, friction stir welding (FSW), or pressure welding.

Claims

1. A cooling plate having a heat medium circulation space formed therein for circulating a heat medium, and releasing heat absorbed from a cooling object to the heat medium circulating in the heat medium circulation space, wherein: The cooling plate has: a bottom plate having a heat absorbing surface disposed on one side for absorbing heat released from an object to be cooled and a heat dissipating surface disposed on the other side for releasing the heat absorbed by the heat absorbing surface to a heat medium circulating in the heat medium circulation space; and a cover plate, covering the heat dissipation surface of the base plate, The heat medium circulation space is formed between the heat dissipation surface of the bottom plate and the cover plate. The bottom plate has a plurality of heat transfer parts, which are arranged to protrude from the heat dissipation surface toward the cover plate and transfer heat released from the heat dissipation surface to the heat medium flowing in the heat medium circulation space. A heat transfer joint portion for joining the top ends of the heat transfer portions to the cover plate is formed between at least a portion of the top ends of the plurality of heat transfer portions and a surface of the cover plate on the heat medium flow space side.

2. The cooling plate according to claim 1, wherein The plurality of heat transfer parts are fins extending along a flow direction of the heat medium flowing through the heat medium flow space.

3. The cooling plate according to claim 1, wherein The bottom plate has a bottom plate side joint portion provided to extend in the circumferential direction along the entire outer peripheral side. The cover plate has a cover plate side joint portion provided to extend in the circumferential direction along the entire outer peripheral side. A sealing joint portion for sealing the heat medium circulation space is formed between the bottom plate side joint portion and the cover plate side joint portion.

4. The cooling plate according to claim 1, wherein The bottom plate and the cover plate are made of copper, copper alloy, aluminum, aluminum alloy, stainless steel or stainless steel alloy.

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