Electronic atomization device and conductive structure thereof
Automatic assembly of electronic atomization devices is achieved through the conductive arms of the conductive structure, solving the problems of cumbersome welding and space limitations, and improving assembly efficiency and electrical connection stability.
Patent Information
- Application Number
- CN202422689370.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-11-05
AI Technical Summary
The existing electronic atomization device has problems such as manual welding when connecting circuits, which can easily damage the circuit board and require reserved welding space, which increases the difficulty of assembly.
It adopts a conductive structure, including a conductive arm on the circuit board. The conductive arm consists of an elastic part, a clamping part and a guide part. The external element is plugged into the clamping area through the guide part, and uses the deformation of the elastic part and the preloading force of the clamping part to achieve automatic assembly and stable connection.
It realizes simplified assembly process, improves assembly efficiency, ensures the stability of electrical connections, reduces the rate of bad parts, and reduces space occupation.
Smart Images
Figure CN223247589U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic atomization technology, and in particular to an electronic atomization device and a conductive structure thereof. Background Art
[0002] The electronic atomization device of the related technology is a device that can generate heat by being powered on, so that the aerosol-generating matrix is atomized, thereby generating an aerosol. When assembling a general product, the conduction of the circuit requires the Pogo pin (spring-type probe) to be pre-installed on the plastic part first, and then the Pogo pin is manually welded to the PCB (Printed Circuit Board) circuit board with wires to achieve electrical connection of the circuit. However, this manual welding method is cumbersome and uncontrollable, and there is a certain probability of damaging the circuit board. Sometimes due to limited space, there is no extra space to hide the wires. Since welding also requires reserved welding space, it is difficult to weld wires if the space is too small. In addition, the Pogo pin and the PCB circuit board need to be welded before they can be assembled into the bracket inside the electronic atomization device, which increases the difficulty of product assembly. Utility Model Content
[0003] The present application provides an electronic atomization device and a conductive structure thereof, which are used to solve the problems of manual welding being cumbersome, prone to damage, and requiring reserved space when connecting circuits.
[0004] In one embodiment, a conductive structure for an electronic atomization device is provided, including a circuit board and at least two conductive arms relatively arranged on the circuit board, the conductive arm including an elastic part, a clamping part and a guide part connected in sequence in a direction perpendicular to the circuit board, and the elastic part has a normal state and a deformed state; wherein, when the elastic part is in the normal state, the clamping part has a pre-tightening force, and a clamping area is spaced apart between at least two of the clamping parts, and the guide part is used to guide an external element to overcome the pre-tightening force and be plugged into the clamping area; when the elastic part is in the deformed state, the clamping part has a clamping force toward the clamping area.
[0005] In one embodiment, the clamping portion and the guiding portion are elastic bodies.
[0006] In one embodiment, there is a gap between at least two of the elastic parts and between at least two of the guide parts.
[0007] In one embodiment, the interval between at least two of the guide portions gradually increases in a direction away from the clamping portion.
[0008] In one embodiment, when the elastic parts are in a normal state, the maximum distance between at least two of the elastic parts is greater than the maximum distance between at least two of the clamping parts.
[0009] In one embodiment, the elastic portion is an arc-shaped structure.
[0010] In one embodiment, the conductive structure further includes a base connected to the circuit board, and at least two elastic parts are disposed on the base.
[0011] In one embodiment, an electronic atomization device is provided, comprising any one of the conductive structures for an electronic atomization device described above, and further comprising a first shell for accommodating the conductive structure, wherein the circuit board is arranged parallel to an extension direction of the first shell.
[0012] In one embodiment, the electronic atomization device further includes a second shell for accommodating a heating element and an aerosol generating matrix, the first shell and the second shell are detachably connected, and the conductive arm and the heating element are selectively electrically connected.
[0013] In one embodiment, an electronic atomization device is provided, comprising the conductive structure for an electronic atomization device described in any one of the above items, and also comprising a first shell for accommodating the conductive structure, the circuit board is arranged perpendicular to the extension direction of the first shell, and the conductive arm is exposed from the first shell.
[0014] By implementing this application, the following beneficial effects are achieved:
[0015] The present application is a conductive structure for an electronic atomization device. External components only need to be plugged into the clamping area from the guide part and can be clamped by the clamping parts on both sides. The conductive structure makes assembly simple and efficient, can ensure that the contact is not loose, the conductivity is stable, meets the automation requirements, and can also reduce the failure rate and occupy less space. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, in which:
[0017] Figure 1 A schematic structural diagram of an embodiment of the conductive structure of the present application is shown;
[0018] Figure 2 A front view of an embodiment of the conductive structure of the present application is shown;
[0019] Figure 3 A schematic structural diagram of an embodiment of the conductive structure, circuit board, and conductive member of the present application is shown;
[0020] Figure 4 A schematic structural diagram of an embodiment of the present application in which the conductive structure is accommodated in the first housing is shown;
[0021] Figure 5 A schematic structural diagram of an embodiment of the conductive structure and the first housing of the present application is shown;
[0022] The accompanying drawings are numerals as follows:
[0023] Conductive structure 1; circuit board 10; conductive arm 11; elastic portion 111; clamping portion 112; clamping area 1121; guide portion 113; base 12; component 2; first housing 3; bracket 4. DETAILED DESCRIPTION
[0024] In order to have a clearer understanding of the technical features, purposes and effects of this application, the specific implementation methods of this application are now described in detail with reference to the accompanying drawings.
[0025] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.
[0026] In the description of the application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.
[0027] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "located at," and "located at" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections. They may also refer to mechanical connections or chemical connections. They may also refer to direct connections or indirect connections through an intermediate medium. They may also refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this application based on specific circumstances.
[0028] like Figure 1 and Figure 2As shown, some embodiments of the present application disclose a conductive structure 1 for an electronic atomization device, including a circuit board 10 and at least two conductive arms 11 arranged relative to the circuit board 10. The conductive arms 11 include an elastic portion 111, a clamping portion 112, and a guide portion 113 connected in sequence in a direction perpendicular to the circuit board 10. It is understandable that the at least two can be two, three, or any number. For example, the circuit board 10 is a PCB board. The PCB board here is only an example and does not limit the present application.
[0029] For example, Figure 2 In the orientation shown, the elastic portion 111 is located at the bottom, the clamping portion 112 is located in the middle, and the guide portion 113 is located at the top, that is, the elastic portion 111, the clamping portion 112 and the guide portion 113 are sequentially connected in a direction perpendicular to the circuit board 10 and away from the circuit board 10. The bottom, middle and top mentioned here are only for reference only. Figure 2 The examples shown are for reference only and are not intended to limit the present application.
[0030] The elastic portion 111 has the following features: Figure 1 and Figure 2 The normal state shown and Figure 3 The deformation state shown. Figure 1 and Figure 2 As shown, when the elastic portion 111 is in a normal state, the clamping portion 112 has a preload, and a clamping region 1121 is defined between at least two clamping portions 112. The guide portion 113 is used to guide the external component 2 to overcome the preload and be inserted into the clamping region 1121, thereby deforming the elastic portion 111. The normal state of the elastic portion 111 refers to a state in which no external force is applied. In this normal state, the elastic portion 111 naturally generates a preload due to the elastic properties of its material. Since the clamping portion 112 is connected to the elastic portion 111, the clamping portion 112 also has a preload.
[0031] like Figure 3 As shown, when the elastic portion 111 is in a deformed state, the clamping portion 112 exerts a clamping force toward the clamping region 1121. The deformed state of the elastic portion 111 refers to a state in which the elastic portion 111 is elastically deformed by an external force. In the deformed state, the elastic portion 111 generates an elastic force for returning to its original state. Since the clamping portion 112 is connected to the elastic portion 111, the clamping portion 112 exerts a clamping force on the external component 2, i.e., a clamping force toward the clamping region 1121.
[0032] This embodiment is a conductive structure 1 for an electronic atomization device, such as Figure 3As shown, the external component 2 only needs to be inserted from the guide part 113 into the clamping area 1121 to be clamped by the clamping parts 112 on both sides. The conductive structure 1 makes assembly simple and efficient, can ensure that the contact is not loose, the conductivity is stable, meets the automation requirements, and can also reduce the failure rate and occupy less space.
[0033] In addition, since the elastic portion 111, the clamping portion 112 and the guide portion 113 are connected in sequence (for example, Figure 2 In the orientation shown, the elastic portion 111 is located at the bottom, the clamping portion 112 is located in the middle, and the guide portion 113 is located at the top. Since the elastic portion 111 is at the bottom, the preload force that the external component 2 needs to overcome at the clamping portion 112 is smaller than the preload force at the elastic portion 111, allowing it to be more easily inserted into the clamping area 1121. At the same time, when the external component 2 is inserted into the clamping area 1121, the clamping force at the clamping portion 112 is greater than the elastic force at the elastic portion 111, allowing the external component 2 to be more stably fixed.
[0034] In some embodiments, in order to facilitate plugging and secure the connection more stably, the clamping portion 112 and the guiding portion 113 are also made of elastic bodies, so that the entire conductive arm 11 is made of an elastic body, such as a spring.
[0035] In some embodiments, such as Figure 1 and Figure 2 As shown, there is a gap between at least two elastic portions 111 and between at least two guide portions 113 , that is, at least two conductive arms 11 are arranged opposite to each other and at a gap.
[0036] In some embodiments, such as Figure 1 and Figure 2 As shown, in order to better guide the insertion, the guide portion 113 extends obliquely toward the direction away from the conductive arm 11 on the opposite side, and the interval between at least two guide portions 113 gradually increases toward the direction away from the clamping portion 112, forming an inverted eight-shaped opening.
[0037] In some embodiments, such as Figure 1 and Figure 2 As shown, in order to improve the smoothness of guidance, the opposing surfaces of at least two guide portions 113 are smooth surfaces, such as smooth planes or smooth arc surfaces.
[0038] In some embodiments, such as Figure 1 and Figure 2 As shown, in order to further facilitate plugging and secure the connection more stably, when the elastic portions 111 are in a normal state, the maximum distance between at least two elastic portions 111 is greater than the maximum distance between at least two clamping portions 112 .
[0039] In some embodiments, such as Figure 1 and Figure 2As shown, in order to ensure that the conductive arm 11 has a good elastic force, the elastic portion 111 is an arc-shaped structure, specifically an arc-shaped structure that is concave in a direction away from the elastic portion 111 on the opposite side.
[0040] In some embodiments, such as Figure 1 and Figure 2 As shown, the opposing surfaces of at least two clamping portions 112 are arcuate surfaces, specifically arcuate surfaces that are concave in a direction away from the opposing clamping portion 112. In other embodiments, the opposing surfaces of at least two clamping portions 112 are curved surfaces or flat surfaces.
[0041] In some embodiments, such as Figure 1 、 Figure 2 and Figure 3 As shown, the conductive structure 1 also includes a base 12 connected to the circuit board 10, at least two elastic parts 111 are arranged on the base 12, the base 12 and the conductive arm 11 form a "U"-shaped structure, and the base 12 and the conductive arm 11 are an integrally formed structure, the base 12 and the conductive arm 11 are springs made of metal material, for example, the metal material is stainless steel, copper, etc., the stainless steel and copper here are only examples and are not intended to limit the present application.
[0042] In some embodiments, the base 12 of the conductive structure 1 is connected to the circuit board 10 via surface mounting. The surface mounting technology (SMT) herein is merely an example and is not intended to limit the present application.
[0043] like Figure 4 and Figure 5 As shown, some embodiments of the present application disclose an electronic atomization device, which includes the conductive structure 1 described in any of the above embodiments. The conductive structure 1 will not be described in detail here.
[0044] The electronic atomization device includes an atomizer and a power supply device. The power supply device can supply power to the atomizer through the conductive structure 1. The atomizer is powered on and generates heat, causing the aerosol-generating matrix to be atomized, thereby generating an aerosol for the user to inhale.
[0045] In some embodiments, such as Figure 4 and Figure 5 As shown, the electronic atomization device further includes a first shell 3 accommodating the conductive structure 1 , and the circuit board 10 is arranged parallel to the extension direction of the first shell 3 , for example, the first shell 3 is the shell of the power supply device.
[0046] In some embodiments, the electronic atomization device also includes a second shell that accommodates a heating element and an aerosol generating matrix. For example, the second shell is the shell of the atomizer. The first shell and the second shell are detachably connected, and the conductive arm 11 is selectively electrically connected to the heating element, that is, the atomizer can be disassembled and replaced as a whole.
[0047] In some embodiments, the electronic atomization device further includes an element 2 for conducting electricity. The element 2 is inserted into the clamping area 1121. The element 2 can be accommodated in the first housing 3 and partially exposed from the first housing 3. The heating element can be electrically connected to the conductive arm 11 through the element 2. For example, the element 2 is a Pogo pin serving as an electrode column. The Pogo pin herein is merely an example and does not limit the present application.
[0048] Among them, such as Figure 3 As shown, the component 2 is parallel to the circuit board 10, and the component 2 is along Figure 3 Insertion is performed in direction A as shown, first abutting the guide portion 113. The guide portion 113 then guides the component 2 to overcome the preload force and insert it into the clamping area 1121, causing the elastic portion 111 to deform. Finally, the clamping portion 112 generates a clamping force acting on the component 2. In some embodiments, the electronic atomization device further includes a bracket 4, and the component 2 can be pre-installed in the bracket 4. The component 2 and the bracket 4 are then assembled together into the conductive structure 1.
[0049] In some embodiments, in order to ensure a larger conductive contact area, the shapes of the opposing surfaces on at least two clamping portions 112 are adapted to the shape of the outer surface of the component 2. For example, the opposing surfaces on at least two clamping portions 112 are arc surfaces, and the position on the component 2 that contacts the clamping portion 112 is a cylinder. In order to be able to clamp and hold well after assembly, the diameter of the opposing arc surfaces is smaller than the diameter of the cylinder, for example, 0.1 to 0.4 mm smaller. The arc surfaces, cylinders, 0.1, and 0.4 mm here are only examples and are not intended to limit the present application.
[0050] Some embodiments of the present application disclose an electronic atomization device, which includes the conductive structure 1 described in any of the above embodiments. The conductive structure 1 will not be described in detail here.
[0051] Among them, the electronic atomization device includes an atomizer and a power supply device. The power supply device supplies power to the atomizer. The atomizer is powered on and generates heat, causing the aerosol-generating matrix to be atomized, thereby generating an aerosol for the user to inhale.
[0052] In some embodiments, the electronic atomization device further includes a first shell accommodating the conductive structure 1 , the circuit board 10 is arranged perpendicular to the extension direction of the first shell, and the conductive arm 11 is exposed from the first shell, for example, the first shell is a shell of a power supply device.
[0053] In some embodiments, the atomizer cannot be disassembled and replaced as a whole, and the conductive arm 11 is exposed from the first shell and can be electrically connected to an external power source to charge the power supply device.
[0054] By implementing this application, the following beneficial effects are achieved:
[0055] The present application is a conductive structure 1 for an electronic atomization device. The external element 2 only needs to be inserted from the guide part 113 into the clamping area 1121 to be clamped by the clamping parts 112 on both sides. The conductive structure 1 makes assembly simple and efficient, can ensure that the contact is not loose, the conductivity is stable, meets the automation requirements, and can also reduce the failure rate and occupy less space.
[0056] It is understandable that the above embodiments only express some of the implementation methods of the present application, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, the above embodiments or technical features can be freely combined, and several deformations and improvements can be made, which all fall within the scope of protection of the present application, that is, the embodiments described in "some embodiments" can be freely combined with any of the above and below embodiments. Therefore, all equivalent transformations and modifications made to the scope of the claims of the present application should fall within the scope of coverage of the claims of the present application.
Claims
1. A conductive structure for an electronic atomization device, characterized in that: The device comprises a circuit board and at least two conductive arms arranged opposite to each other on the circuit board, wherein the conductive arms comprise an elastic portion, a clamping portion, and a guide portion connected in sequence in a direction perpendicular to the circuit board, and the elastic portion has a normal state and a deformed state; Wherein, when the elastic portion is in the normal state, the clamping portion has a pre-tightening force, and a clamping area is spaced apart between at least two of the clamping portions, and the guide portion is used to guide the external element to overcome the pre-tightening force and be inserted into the clamping area; When the elastic portion is in the deformed state, the clamping portion has a clamping force toward the clamping area.
2. The conductive structure for an electronic atomization device according to claim 1, characterized in that: The clamping portion and the guiding portion are elastic bodies.
3. The conductive structure for an electronic atomization device according to claim 1, characterized in that: There is a gap between at least two of the elastic parts and between at least two of the guide parts.
4. The conductive structure for an electronic atomization device according to claim 3, characterized in that: The interval between at least two of the guide portions gradually increases in a direction away from the clamping portion.
5. The conductive structure for an electronic atomization device according to claim 3, characterized in that: When the elastic parts are in a normal state, a maximum distance between at least two of the elastic parts is greater than a maximum distance between at least two of the clamping parts.
6. The conductive structure for an electronic atomization device according to claim 1, characterized in that: The elastic portion is an arc-shaped structure.
7. The conductive structure for an electronic atomization device according to any one of claims 1 to 6, characterized in that: The conductive structure further includes a base connected to the circuit board, and at least two elastic parts are arranged on the base.
8. An electronic atomization device, characterized in that: It includes the conductive structure for an electronic atomization device according to any one of claims 1 to 7, and also includes a first shell for accommodating the conductive structure, and the circuit board is arranged parallel to the extension direction of the first shell.
9. The electronic atomization device according to claim 8, characterized in that: The electronic atomization device further comprises a second shell for accommodating a heating element and an aerosol generating substrate, the first shell and the second shell are detachably connected, and the conductive arm and the heating element are selectively electrically connected.
10. An electronic atomization device, characterized in that: It includes the conductive structure for an electronic atomization device according to any one of claims 1 to 7, and also includes a first shell for accommodating the conductive structure, the circuit board is arranged perpendicular to the extension direction of the first shell, and the conductive arm is exposed from the first shell.