Protective structure

By setting a heat-resistant film and air conduction through grooves on the dustproof film of Bluetooth headphones, the damage problem of thermal expansion pressure on MIC devices during welding is solved, and the product performance and production yield is improved, the manufacturing process is simplified and the equipment life is extended.

CN223250189UActive Publication Date: 2025-08-22TCL TECH ELECTRONICS (HUIZHOU) CO LTD
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Patent Information

Application Number
CN202422274891.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-14
Publication Date
2025-08-22
Estimated Expiration
2034-09-14

AI Technical Summary

Technical Problem

During the SMT welding process of Bluetooth headphones, the glueless area of ​​the dustproof film is surrounded by the MIC sound hole to form a closed space. The air thermal expansion under high temperature conditions forms a pressure, which may damage the MIC device, causing solder explosion, affecting product performance and production yield.

Method used

A dust-proof film including a heat-resistant film and an adhesive layer is adopted. The adhesive layer is equipped with accommodating space and a gas conducting channel communicating with the outside world to discharge hot air, prevent the thermal expansion pressure from damaging the MIC device, and maintain the ventilation and dust-proof effect of the MIC sound hole.

Benefits of technology

Effectively discharge hot air, prevent damage to MIC devices, improve product performance and production yield, reduce defect rate, extend equipment life, and simplify manufacturing processes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a protection structure, relates to the earphone welding technology field, and the protection structure comprises a dustproof film, the dustproof film comprises a heatproof film and a bonding layer, the bonding layer is arranged on one side surface of the heatproof film, the bonding layer is provided with an accommodation space and an air guide through groove communicated with the accommodation space, and the heatproof film is provided with an air guide through groove communicated with the air guide through groove. And the air guide through groove is communicated with the outside.
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Description

Technical Field

[0001] The utility model relates to the technical field of earphone welding, in particular to a protective structure. Background Art

[0002] During Bluetooth headset manufacturing, especially during the SMT (surface mount technology) soldering process, protecting the MIC (microphone) sound hole is crucial. To prevent impurities from entering the MIC sound hole during soldering, a dustproof film is typically applied to the MIC device. A non-adhesive area is defined on one side of the film, corresponding to the MIC sound hole. This prevents impurities from entering the MIC sound hole during soldering and ensures that the opening of the MIC sound hole is not covered by adhesive.

[0003] However, the SMT soldering process involves passing the MIC device through a reflow oven along with the motherboard. During this process, the glue-free area of ​​the dustproof film and the MIC sound hole form a confined space. Under high temperature conditions, the thermal expansion of the air inside will create pressure, which may damage the MIC device and even cause the MIC solder to explode, thereby affecting product performance and production yield. Utility Model Content

[0004] The main purpose of the utility model is to provide a protective structure, aiming to improve the performance and production yield of the product.

[0005] In order to achieve the above-mentioned purpose, the protective structure proposed in the utility model includes a dustproof film, and the dustproof film includes a heat-resistant film and an adhesive layer. The adhesive layer is arranged on one side of the heat-resistant film, and the adhesive layer is provided with a accommodating space and an air-guiding groove connected to the accommodating space, and the air-guiding groove is connected to the outside world. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0007] Figure 1 The utility model provides a structural schematic diagram of an embodiment of a material tray and a protective structure;

[0008] Figure 2 A front view of an embodiment of a dustproof film is provided for the utility model;

[0009] Figure 3 A front view of another embodiment of the dustproof film provided by the present invention;

[0010] Figure 4 A side view of an embodiment of a dustproof film is provided for the present invention;

[0011] Figure 5 The utility model provides a side view of an embodiment of a dustproof film and release paper.

[0012] Description of Figure Numbers:

[0013] 100. Protective structure; 1. Dust-proof film; 11. Heat-resistant film; 12. Adhesive layer; 121. Accommodating space; 122. Air guide groove; 123. Breathable groove; 123a. Flat wall; 123b. Sealing surface; 2. Release paper; 3. Material tray; 31. Positioning hole.

[0014] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0016] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0017] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0018] The present invention provides a protective structure 100 .

[0019] See also Figures 1 to 5 In one embodiment of the present invention, the protective structure 100 includes a dustproof film 1, which includes a heat-resistant film 11 and an adhesive layer 12. The adhesive layer 12 is arranged on one side of the heat-resistant film 11. The adhesive layer 12 is provided with a accommodating space 121 and an air guide groove 122 connected to the accommodating space 121, and the air guide groove 122 is connected to the outside world.

[0020] In the technical solution of the present invention, the dustproof film 1 is attached to the MIC device, the adhesive layer 12 is connected to the MIC device, and the accommodating space 121 corresponds to the position of the MIC sound hole. When the MIC device is passed through the reflow furnace along with the mainboard, under high temperature conditions, hot air can flow out from the air guide groove 122, discharging the hot air and preventing the pressure generated by the thermal expansion of the air from damaging the MIC device, thereby improving the performance and production yield of the product. In addition, the MIC device with the dustproof film 1 can also effectively prevent dust and foreign matter from entering during the manufacturing, testing, storage and transportation processes, greatly reducing the product defect rate. The provision of the air guide groove 122 allows hot air to be discharged through the air guide groove 122, while also preventing dust from entering the MIC sound hole. The heat-resistant film 11 can be a polytetrafluoroethylene film or a polyethersulfone film, which is not limited by the present invention. The shape of the heat-resistant film 11 can be square or triangular, which is not limited by the present invention. The number of the air guide grooves 122 can be one or two, which is not limited by the present invention.

[0021] To improve the efficiency of hot air discharge, refer to Figure 3 In one embodiment of the present invention, the adhesive layer 12 is provided with two air guide grooves 122, which are spaced apart, and the two ends of each air guide groove 122 are respectively connected to the accommodating space 121 and the outside world. The design of the two air guide grooves 122 allows air to flow freely between the space below the dustproof film 1 and the external environment. The presence of two air guide grooves 122 means that air exchange can be carried out more effectively through these channels, thereby improving the ventilation effect of the space below the dustproof film 1; the two air guide grooves 122 can help to evenly distribute the pressure on the surface of the dustproof film 1, especially in high temperature environments, and can reduce the thermal stress and pressure concentration between the dustproof film 1 and the equipment, helping to extend the life of the equipment; the two air guide grooves 122 provide a backup ventilation path. When one channel may be blocked or affected by other factors, the other channel can still maintain the ventilation function, which increases the stability and reliability of the dustproof film 1.

[0022] For ease of processing, please refer to Figure 1In one embodiment of the present invention, the adhesive layer 12 is provided with a ventilation groove 123, which includes the accommodation space 121 and the air guide groove 122. The ventilation groove 123 not only accommodates the MIC sound hole, but also communicates with the outside world to allow hot air to be discharged. This design not only takes into account functionality, but also the actual processing operations during the production process. Through the reasonable layout of the ventilation groove 123, the manufacturing process can be simplified and the normal implementation of the ventilation and heat management functions can be ensured. The ventilation groove 123 can have one air vent connected to the outside world, or it can have two air vents connected to the outside world. The present invention does not impose any restrictions on this.

[0023] To further improve the efficiency of hot air discharge, see Figure 4 In one embodiment of the present invention, the two side walls of the ventilation slot 123 are straight walls 123a. The straight walls 123a can more effectively guide air flow and reduce the flow resistance of gas in the ventilation slot 123, which is particularly important for maintaining the unobstructed ventilation slot 123 and effectively discharging hot air. The design of the straight walls 123a is generally easier to process and manufacture than complex curves or bends, which can reduce production costs and improve production efficiency. The straight walls 123a can ensure more stable and predictable air flow, thereby helping to optimize the overall thermal management effect.

[0024] To improve the sealing effect of the MIC sound hole, please refer to Figure 4 In one embodiment of the present invention, the bottom wall of the vent slot 123 is a sealing plane 123b. Sealing plane 123b fits more closely around the MIC sound hole, reducing or preventing the ingress of dust, moisture, or other impurities from the external environment, effectively protecting the MIC sound hole. Effective sealing prevents adverse effects on the MIC sound hole from external substances, such as degradation of acoustic performance or damage to the circuit. Sealing plane 123b generally provides more stable mechanical support, ensuring that the MIC sound hole and its surrounding structures remain stable and reliable during use.

[0025] In one embodiment of the present invention, the width of the ventilation slot 123 is D, where 0.8 mm ≤ D ≤ 1 mm. An appropriate width of the ventilation slot 123 ensures that the ventilation slot 123 can effectively operate around MIC sound holes of varying sizes. Excessively large widths may reduce structural strength or complicate the design, while excessively small widths may limit ventilation or increase manufacturing costs. A moderate width helps optimize ventilation, maintains good air flow and thermal management, and thus ensures stable temperature and environmental conditions for the MIC sound hole during normal operation. Selecting a width range of 0.8 mm to 1 mm generally ensures manufacturing feasibility while meeting design requirements.

[0026] See also Figure 2 In one embodiment of the present invention, the heat-resistant film 11 has a circular cross-section along its height. The circular shape of the heat-resistant film 11 facilitates the adhesive layer 12 to form a ventilation slot 123 with two open ends in the middle of the circular heat-resistant film 11, effectively preventing dust and other particles from entering the protected area while maintaining ventilation and air circulation during use.

[0027] See also Figure 1 In one embodiment of the present invention, the protective structure 100 includes a release paper 2 and a plurality of dustproof films 1. Each dustproof film 1 is attached to the release paper 2 at intervals along its length. The release paper 2 with the plurality of dustproof films 1 attached is rolled up on a material tray 3. The release paper 2 is a base material used to support and secure the dustproof films 1 and provide mechanical protection and support when necessary. It typically has a certain degree of flexibility and tear resistance to ensure the stability and durability of the overall structure. The entire structure, including the release paper 2 and the dustproof films 1, is rolled up on the material tray 3. This method facilitates handling and processing during the manufacturing process while protecting the dustproof films 1 from damage or contamination.

[0028] See also Figure 1 In one embodiment of the present invention, the tray 3 is provided with positioning holes 31. Precise positioning: The positioning holes 31 allow the tray 3 to be precisely positioned and fixed during the assembly process, especially on an automated assembly line, to ensure that each component is correctly placed. Fixation through the positioning holes 31 ensures that the component layout and assembly sequence in each tray 3 remain consistent, which is very important for ensuring product quality and performance consistency, especially for mass production. The positioning holes 31 can be used in conjunction with automated assembly equipment to achieve an automated assembly process for the dustproof film 1 and the release paper 2. This approach not only improves production efficiency but also reduces possible errors in human operation.

[0029] In one embodiment of the present invention, the heat-resistant film 11 is provided with an identification color layer on the side facing away from the adhesive layer 12. The identification color layer can clearly distinguish the back side of the heat-resistant film 11, allowing workers to easily find the correct side during the assembly process, significantly reducing the possibility of operational errors; once the heat-resistant film 11 is attached to the required position, the identification color layer makes the operation of tearing off the back side more intuitive and simple, allowing workers to clearly identify the side to be torn off, thereby quickly completing the assembly work and avoiding damage or incorrect operations; reducing operation delays caused by confusion or unclear back side, the identification color layer helps save time in searching and confirming, thereby improving overall assembly efficiency; the obvious identification color layer can reduce incorrect assembly caused by misunderstanding or confusion, ensure that each stage is carried out correctly, and improve overall assembly quality and consistency.

[0030] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A protective structure, characterized in that: include; The dustproof film includes a heat-resistant film and an adhesive layer, wherein the adhesive layer is arranged on one side of the heat-resistant film, and the adhesive layer is provided with a receiving space and an air guide groove communicating with the receiving space, and the air guide groove is communicated with the outside world.

2. The protective structure according to claim 1, wherein: The adhesive layer is provided with two air guiding grooves, which are spaced apart from each other, and two ends of each air guiding groove are respectively connected with the accommodating space and the outside.

3. The protective structure according to claim 1, wherein: The adhesive layer is provided with a ventilation groove, and the ventilation groove includes the accommodation space and the air guide groove.

4. The protective structure according to claim 3, characterized in that: The two side walls of the ventilating groove are straight walls.

5. The protective structure according to claim 3, characterized in that: The bottom wall of the ventilating groove is a sealing plane.

6. The protective structure according to claim 3, characterized in that: The width of the ventilation slot is D, wherein 0.8 mm ≤ D ≤ 1 mm.

7. The protective structure according to any one of claims 1 to 6, characterized in that: The cross section of the heat-resistant film along its height direction is circular.

8. The protective structure according to any one of claims 1 to 6, characterized in that: The protective structure includes a release paper and a plurality of dustproof films, each of the dustproof films is attached to the release paper at intervals along the length direction of the release paper, and the release paper attached with the plurality of dustproof films is rolled up on a material tray.

9. The protective structure according to claim 8, characterized in that: The material tray is provided with a positioning hole.

10. The protective structure according to any one of claims 1 to 6, characterized in that: A marking color layer is provided on the side of the heat-resistant film facing away from the adhesive layer.