Soldering tin bar forming cooling device

Through the combined heat dissipation system of thermal columns, heat sinks and fans, and the design of filter plates and threaded rods, the problems of poor cooling effect and inconvenient material removal of solder strip forming cooling device are solved, and efficient cooling and convenient material removal are achieved.

CN223250535UActive Publication Date: 2025-08-22TIANJIN ZHIBO ELECTRONIC TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202422535979.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-21
Publication Date
2025-08-22
Estimated Expiration
2034-10-21

AI Technical Summary

Technical Problem

The cooling effect of the solder strip forming cooling device is poor and it is inconvenient to remove the cooled materials.

Method used

The heat dissipation system consisting of thermal columns, heat sinks and fans accelerates cooling, and combines the design of filter plates, connecting rods and threaded rods to facilitate the removal of materials.

Benefits of technology

Improves cooling effect and simplifies material removal process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223250535U_ABST
    Figure CN223250535U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of cooling devices, and particularly relates to a soldering tin bar forming cooling device which comprises a box body, a heat conduction column is fixedly connected in the box body, cooling fins are fixedly connected to the outer side of the heat conduction column, and mounting frames are fixedly connected to the two ends of the box body. A fan is fixedly connected to the end, away from the box body, of the mounting frame, a circulating pipe is fixedly connected to the box body, and a material taking mechanism is arranged on the box body. Through the arrangement of the heat conduction columns, the cooling fins, the draught fan and other components, the heat conduction columns can absorb heat of the box body, then the heat of the heat conduction columns is led out through the cooling fins, the heat dissipated by the cooling fins can be taken away through the draught fan, heat dissipation can be effectively conducted on the box body, cooling of materials can be accelerated, and the service life of the materials is prolonged. The problem that the cooling effect is poor when the forming cooling device for the soldering tin bar is used is solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of cooling devices, in particular to a forming cooling device for solder bars. Background Art

[0002] The solder bar forming cooling device is a device used to quickly cool and solidify the solder bar. It is usually used in the production line of solder bar to ensure that the solder bar can be quickly formed and maintain its required shape.

[0003] According to the utility model disclosed in patent authorization announcement number CN203664637U, a cooling device for solder bar forming includes a bracket, a water trough, a water inlet pipe, a water outlet pipe and a cooling shell assembly; the bottom surface of the cooling shell is an open structure, and the top surface of the cooling shell is provided with at least one hole, and a solder bar forming mold is fixed in the hole; the water trough is provided on the bracket, the water inlet pipe is connected to one end of the water trough, and the water outlet pipe is connected to the other end of the water trough; the cooling shell cover is provided on the water trough, and the solder bar forming mold is located in the water trough.

[0004] However, the cooling effect of the solder bar forming cooling device is poor during use, and it is inconvenient to remove the cooled material during use. Utility Model Content

[0005] The purpose of the utility model is to provide a solder bar forming cooling device, which solves the problem that the solder bar forming cooling device has poor cooling effect during use and is inconvenient to remove the cooled material during use.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a forming cooling device for solder bars, comprising a box body, a heat-conducting column fixedly connected to the interior of the box body, a heat sink fixedly connected to the outside of the heat-conducting column, mounting frames fixedly connected to both ends of the box body, a fan fixedly connected to the end of the mounting frame away from the box body, a circulation pipe fixedly connected to the box body, and a material taking mechanism provided on the box body.

[0007] Preferably, the lower end of the box is fixedly connected with a bracket, and the number of the brackets is four. Through the design of the brackets, the box can be placed and maintained stable.

[0008] Preferably, the number of the heat-conducting columns is four, and the four heat-conducting columns are evenly distributed on the box body. Through the design of the heat-conducting columns, the heat generated by the box body can be conducted away.

[0009] Preferably, the material taking mechanism includes a filter plate, the filter plate is slidably connected to the inside of the box, the filter plate contacts the heat-conducting column, the lower end of the filter plate is fixedly connected to a connecting rod, the connecting rod is slidably connected to the box, the lower end of the connecting rod is fixedly connected to a connecting plate, the inside of the connecting plate is connected to a threaded rod through a thread, and the knob is driven by the threaded rod to rotate, so that the threaded rod and the connecting plate undergo threaded movement, so that the connecting plate moves on the threaded rod, which can make the connecting plate drive the connecting rod to move, and the connecting rod drives the filter plate to move, so that the filter plate can slide in the box, so that the filter plate can push the material to the top of the box, so that the material in the box can be easily taken out.

[0010] Preferably, the lower end of the box body is fixedly connected to a limiting sleeve, and the limiting sleeve is connected to the threaded rod through a bearing. The design of the limiting sleeve can limit the threaded rod.

[0011] Preferably, a knob is fixedly connected to the lower end of the threaded rod, and the knob is in contact with the connecting plate. The threaded rod can be easily rotated through the design of the knob.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] 1. The utility model is provided with components such as a heat-conducting column, a heat sink, and a fan, so that the heat-conducting column can absorb the heat of the box body, and then the heat of the heat-conducting column is discharged through the heat sink, and the heat emitted by the heat sink can be extracted by the fan, which can effectively dissipate the heat of the box body and accelerate the cooling of the material, solving the problem of poor cooling effect of the solder bar forming cooling device during use.

[0014] 2. The utility model is provided with a filter plate, a connecting rod, a threaded rod and other components. By rotating the threaded rod, the threaded rod and the connecting plate can generate a threaded motion, so that the connecting plate drives the filter plate to move, so that the filter plate can push the material to the top of the box body, which makes it convenient to take out the material from the box body, solving the problem that it is inconvenient to take out the cooled material when the forming cooling device of the solder bar is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0016] Figure 2 For the utility model Figure 1 A top view of

[0017] Figure 3 For the utility model Figure 1 Front cross-sectional view of

[0018] Figure 4 For the utility model Figure 3 A magnified view of the structure of part A.

[0019] In the figure: 1. Box body; 11. Bracket; 12. Heat-conducting column; 13. Heat sink; 14. Mounting frame; 15. Fan; 16. Circulation pipe; 2. Material taking mechanism; 21. Filter plate; 22. Connecting rod; 23. Connecting plate; 24. Threaded rod; 25. Limit sleeve; 26. Knob. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 A forming cooling device for solder bars includes a box body 1. The lower end of the box body 1 is fixedly connected to a bracket 11. There are four brackets 11. The design of the bracket 11 can keep the box body 1 stable. The inside of the box body 1 is fixedly connected to a heat-conducting column 12. There are four heat-conducting columns 12. The four heat-conducting columns 12 are evenly distributed on the box body 1. The design of the heat-conducting columns 12 can conduct the heat generated by the box body 1. The outer side of the heat-conducting column 12 is fixedly connected to a heat sink 13. Both ends of the box body 1 are fixedly connected to a mounting bracket 14. The end of the mounting bracket 14 away from the box body 1 is fixedly connected to a fan 15. A circulation pipe 16 is fixedly connected to the box body 1. A material taking mechanism 2 is provided on the box body 1.

[0022] See also Figure 2-4 The material taking mechanism 2 includes a filter plate 21, which is slidably connected to the inside of the box body 1. The filter plate 21 contacts the heat-conducting column 12. The lower end of the filter plate 21 is fixedly connected to a connecting rod 22, which is slidably connected to the box body 1. The lower end of the connecting rod 22 is fixedly connected to a connecting plate 23. The inside of the connecting plate 23 is connected to a threaded rod 24 through a thread. The lower end of the box body 1 is fixedly connected to a limiting sleeve 25, which is connected to the threaded rod 24 through a bearing. The design of the limiting sleeve 25 can limit the threaded rod 24.

[0023] See also Figure 2-4The lower end of the threaded rod 24 is fixedly connected to a knob 26, and the knob 26 is in contact with the connecting plate 23. Through the design of the knob 26, the threaded rod 24 can be easily rotated. By rotating the knob 26, the knob 26 drives the threaded rod 24 to rotate, so that the threaded rod 24 and the connecting plate 23 undergo threaded motion, so that the connecting plate 23 moves on the threaded rod 24, and the connecting plate 23 can drive the connecting rod 22 to move, and the connecting rod 22 drives the filter plate 21 to move, so that the filter plate 21 can slide in the box body 1, and the filter plate 21 can push the material to the top of the box body 1, so that the material in the box body 1 can be easily taken out.

[0024] The specific implementation process of the utility model is as follows: when in use, by putting the material into the box body 1, the material is made to fall on the filter plate 21, and then the cooling water is injected through the circulation pipe 16 to cool the material, and the heat-conducting column 12 on the box body 1 will absorb the heat generated by the box body 1 and the cooling water, and then guide the heat to the heat sink 13, so that the heat sink 13 dissipates the heat into the air, and then start the fan 15, so that the fan 15 can extract the heat generated by the heat sink 13, which can effectively dissipate heat from the box body 1, thereby accelerating the cooling of the material;

[0025] By turning the knob 26, the knob 26 drives the threaded rod 24 to rotate, causing the threaded rod 24 and the connecting plate 23 to perform threaded motion, thereby moving the connecting plate 23 on the threaded rod 24, and the connecting plate 23 can drive the connecting rod 22 to move, and the connecting rod 22 can drive the filter plate 21 to move, so that the filter plate 21 can slide in the box body 1, and the filter plate 21 can push the material to the top of the box body 1, so that the material in the box body 1 can be easily taken out.

[0026] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A solder bar forming and cooling device, comprising a box (1), characterized in that: A heat-conducting column (12) is fixedly connected to the interior of the box (1), a heat sink (13) is fixedly connected to the exterior of the heat-conducting column (12), mounting brackets (14) are fixedly connected to both ends of the box (1), a fan (15) is fixedly connected to one end of the mounting bracket (14) away from the box (1), a circulation pipe (16) is fixedly connected to the box (1), and a material taking mechanism (2) is provided on the box (1).

2. The solder bar forming and cooling device according to claim 1, characterized in that: The lower end of the box body (1) is fixedly connected with a bracket (11), and the number of the brackets (11) is four.

3. The solder bar forming and cooling device according to claim 1, characterized in that: The number of the heat-conducting columns (12) is four, and the four heat-conducting columns (12) are evenly distributed on the box body (1).

4. The solder bar forming and cooling device according to claim 1, characterized in that: The material taking mechanism (2) includes a filter plate (21), the filter plate (21) is slidably connected to the interior of the box (1), the filter plate (21) is in contact with the heat-conducting column (12), the lower end of the filter plate (21) is fixedly connected to a connecting rod (22), the connecting rod (22) is slidably connected to the box (1), the lower end of the connecting rod (22) is fixedly connected to a connecting plate (23), and the interior of the connecting plate (23) is connected to a threaded rod (24) via a thread.

5. The solder bar forming and cooling device according to claim 4, characterized in that: The lower end of the box body (1) is fixedly connected to a limiting sleeve (25), and the limiting sleeve (25) is connected to the threaded rod (24) via a bearing.

6. The solder bar forming and cooling device according to claim 4, characterized in that: The lower end of the threaded rod (24) is fixedly connected to a knob (26), and the knob (26) is in contact with the connecting plate (23).

Citation Information

Patent Citations

  • Cooling device for molding soldering tin bar

    CN203664637U