Low-temperature welding device for tantalum alloy

Abstract

The utility model discloses a low-temperature welding device of tantalum alloy, which relates to the technical field of tantalum alloy processing and comprises a case and a jacking component, a support is arranged at the lower end in the case, the top of the support is connected with a lower heating die holder, and the jacking component is arranged at the bottom of the lower heating die holder. The jacking assembly comprises a limiting rod, a jacking plate, a spring, a jacking rod and a limiting cylinder. According to the low-temperature welding device for the tantalum alloy, through the arrangement of the jacking assembly, when a hydraulic cylinder drives a lifting plate to move downwards, the lifting plate is in contact with a limiting barrel firstly, so that a jacking rod on the jacking plate is driven to move downwards at the same time, a workpiece can be located in a lower heating die holder, and after low-temperature diffusion welding, when the hydraulic cylinder drives the lifting plate to move upwards, the jacking rod is in contact with the limiting barrel; and the spring pushes the jacking plate under the limiting of the limiting rod and the case, so that the workpiece is jacked out from the interior of the lower heating die holder by utilizing the jacking rod, and the convenience during subsequent workpiece taking is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of tantalum alloy processing, in particular to a low-temperature welding device for tantalum alloy. Background Art

[0002] Tantalum alloy is an alloy composed of tantalum as the base and other elements. The anodic oxide film of tantalum is very stable, corrosion-resistant, and has excellent dielectric properties. It is suitable for the manufacture of electrolytic capacitors. Tantalum has strong resistance to chemical corrosion. Except for hydrogen fluoride, sulfur trioxide, hydrofluoric acid, hot concentrated sulfuric acid and alkali, it can resist the corrosion of all organic and inorganic acids. Therefore, it can be used as a corrosion-resistant material in the chemical industry and medicine. When processing tantalum alloy, a diffusion welding device is required to weld the workpiece at a low melting point.

[0003] For example, the utility model with publication number CN216227505U discloses a copper busbar polymer diffusion welding device. This device uses a positioning assembly to calibrate the copper busbar inside the lower module, making it more stable during welding and improving welding accuracy. A pressure rod and a telescopic spring compress the busbar, cushioning the downward pressure of the upper module. It also compresses the busbar when the upper module is raised to prevent adhesion between the two, ensuring the busbar's stability during welding and reducing the scrap rate. However, after use, this type of diffusion welding device can cause the workpiece to become embedded in the lower module, making it difficult to remove the material.

[0004] Therefore, in view of this, research and improvement are conducted on the existing structure and defects, and a low-temperature welding device for tantalum alloy is provided. Utility Model Content

[0005] The purpose of the present utility model is to provide a low-temperature welding device for tantalum alloy to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a low-temperature welding device for tantalum alloy, comprising a chassis and a lifting assembly, a bracket is arranged at the lower end of the interior of the chassis, and the top of the bracket is connected to the lower heating mold base, the lifting assembly is arranged at the bottom of the lower heating mold base, the lifting assembly comprises a limit rod, a lifting plate, a spring, a push rod and a limit cylinder, the outer side of the upper end of the limit rod is slidably connected to the lifting plate, and the two ends of the bottom of the lifting plate are connected to springs, push rods are arranged at the four ends of the middle part of the lifting plate, and limiting cylinders are fixed at the left and right ends of the top of the lifting plate, a hydraulic cylinder is arranged at the top center of the chassis, and the bottom of the hydraulic cylinder is connected to a lifting plate, and the bottom of the lifting plate is provided with an upper heating mold base.

[0007] Furthermore, the limiting rod is fixedly connected to the chassis, and the limiting rod is slidably connected to the limiting cylinder.

[0008] Furthermore, guide rods are arranged at the four ends of the top of the lifting plate, and the guide rods are slidably connected to the chassis.

[0009] Furthermore, a cooling component is connected to the top end of the chassis, and the cooling component includes a heat exchange box and a filter plate. The heat exchange box is placed at the top end of the chassis, and a filter plate is fixed to one side of the heat exchange box.

[0010] Furthermore, the cooling component also includes a fan and a solenoid valve. The other side of the heat exchange box is connected to the fan, and one side of the fan is connected to the solenoid valve through a pipeline.

[0011] Furthermore, the cooling component also includes a telescopic tube and an air jet hole. The bottom of the solenoid valve is connected to the telescopic tube, and the telescopic tube is fixedly connected to the lifting plate. The bottom of the upper heating mold base is provided with an air jet hole, and the interior of the telescopic tube is connected to the interior of the air jet hole.

[0012] Furthermore, the cooling component also includes a semiconductor refrigeration fin, a heat sink and a heat conductive fin. The front end of the heat exchange box is fixed with a semiconductor refrigeration fin, a heat sink is provided on one side of the semiconductor refrigeration fin, and a heat conductive fin is provided on the other side of the semiconductor refrigeration fin.

[0013] Furthermore, the heat conducting plates are equidistantly staggered with respect to the interior of the heat exchange box, and a serpentine channel is formed between the heat conducting plates and the heat exchange box.

[0014] The utility model provides a low-temperature welding device for tantalum alloy, which has the following beneficial effects:

[0015] 1. The utility model adopts the setting of the lifting assembly. When the hydraulic cylinder drives the lifting plate to move downward, the lifting plate will first contact the limiting cylinder, thereby driving the ejector rod on the lifting plate to move downward at the same time, so that the workpiece can be located inside the lower heating mold base. After low-temperature diffusion welding, when the hydraulic cylinder drives the lifting plate to move upward, the spring will push the lifting plate under the limit of the limiting rod and the chassis, so that the workpiece is ejected from the lower heating mold base by the ejector rod, thereby improving the convenience of subsequent removal.

[0016] 2. The utility model is provided with a cooling component. When the lifting plate moves upward, the solenoid valve can be opened and the fan can be started, so that the external air can enter the flow channel of the upper heating mold base through the telescopic tube under the filtration of the filter plate and be ejected from the air jet hole, thereby avoiding adhesion between the workpiece and the upper heating mold base. At the same time, when the air flow flows inside the heat exchange box, the cold end of the semiconductor refrigeration plate is connected to the heat conducting plate, so the air flow can be cooled, and the heat conducting plate can extend the flow path of the internal air flow, thereby improving the heat exchange effect. Therefore, the low-temperature air flow can be blown to the workpiece, thereby increasing the cooling speed of the workpiece, thereby facilitating the subsequent retrieval operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a low-temperature welding device for tantalum alloy according to the present invention;

[0018] Figure 2 This is a bottom view structural diagram of a jacking assembly of a low-temperature welding device for tantalum alloy according to the present invention;

[0019] Figure 3 This is a schematic diagram of the internal structure of a heat exchange box of a low-temperature welding device for tantalum alloy in the utility model.

[0020] In the figure: 1. Chassis; 2. Bracket; 3. Lower heating mold base; 4. Lifting assembly; 401. Limit rod; 402. Lifting plate; 403. Spring; 404. Push rod; 405. Limit cylinder; 5. Hydraulic cylinder; 6. Lifting plate; 7. Upper heating mold base; 8. Guide rod; 9. Cooling assembly; 901. Heat exchange box; 902. Filter plate; 903. Fan; 904. Solenoid valve; 905. Telescopic tube; 906. Jet hole; 907. Semiconductor refrigeration plate; 908. Heat sink; 909. Thermal conductive plate. DETAILED DESCRIPTION

[0021] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] like Figure 1 and Figure 2As shown, a low-temperature welding device for tantalum alloy includes a chassis 1 and a lifting assembly 4. A bracket 2 is arranged at the lower end of the interior of the chassis 1, and the top of the bracket 2 is connected to the lower heating mold base 3. The lifting assembly 4 is arranged at the bottom of the lower heating mold base 3. The lifting assembly 4 includes a limit rod 401, a lifting plate 402, a spring 403, a push rod 404 and a limit cylinder 405. The outer side of the upper end of the limit rod 401 is slidably connected to the lifting plate 402, and the bottom two ends of the lifting plate 402 are connected to springs 403. The four ends of the middle part of the lifting plate 402 are provided with push rods 404, and the left and right ends of the top of the lifting plate 402 are fixed with limit cylinders 405. When the hydraulic cylinder 5 drives the lifting plate 6 to move upward, the spring 403 will push the lifting plate under the limit of the limit rod 401 and the chassis 1. 402, thereby using the push rod 404 to push the workpiece out from the inside of the lower heating mold base 3, thereby improving the convenience of subsequent retrieval. A hydraulic cylinder 5 is arranged in the top center of the chassis 1, and the bottom of the hydraulic cylinder 5 is connected to a lifting plate 6. The bottom of the lifting plate 6 is provided with an upper heating mold base 7. The limiting rod 401 is fixedly connected to the chassis 1, and the limiting rod 401 is slidably connected to the limiting cylinder 405. When the hydraulic cylinder 5 drives the lifting plate 6 to move downward, the lifting plate 6 will first contact the limiting cylinder 405, thereby driving the push rod 404 on the lifting plate 402 to move downward at the same time, so that the workpiece can be located inside the lower heating mold base 3. Guide rods 8 are arranged at the four ends of the top of the lifting plate 6, and the guide rods 8 are slidably connected to the chassis 1, and the guide rods 8 are used to improve the stability of the lifting plate 6 during movement.

[0023] like Figures 1 to 3As shown, a cooling component 9 is connected to the top end of the chassis 1, and the cooling component 9 includes a heat exchange box 901 and a filter plate 902. A heat exchange box 901 is placed at the top end of the chassis 1, and a filter plate 902 is fixed on one side of the heat exchange box 901. The filter plate 902 can filter out dust impurities in the air. The cooling component 9 also includes a fan 903 and a solenoid valve 904. The other side of the heat exchange box 901 is connected to the fan 903, and one side of the fan 903 is connected to the solenoid valve 904 through a pipeline. The cooling component 9 also includes a telescopic tube 905 and an air jet 906. The bottom of the solenoid valve 904 is connected to the telescopic tube 905, and the telescopic tube 905 is fixedly connected to the lifting plate 6. The bottom of the upper heating mold base 7 is provided with an air jet 906, and the interior of the telescopic tube 905 is connected to the interior of the air jet 906, so that the airflow is ejected from the air jet 906, thereby avoiding In order to prevent adhesion between the workpiece and the upper heating mold base 7, the cooling component 9 also includes a semiconductor refrigeration sheet 907, a heat sink 908 and a thermal conductive sheet 909. The front end of the heat exchange box 901 is fixed with a semiconductor refrigeration sheet 907, and a heat sink 908 is provided on one side of the semiconductor refrigeration sheet 907, and a thermal conductive sheet 909 is provided on the other side of the semiconductor refrigeration sheet 907. Since the cold end of the semiconductor refrigeration sheet 907 is connected to the thermal conductive sheet 909, the airflow can be cooled, and the heat sink 908 can improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration sheet 907. The thermal conductive sheets 909 are equidistantly staggered with respect to the interior of the heat exchange box 901, and a serpentine channel is formed between the thermal conductive sheet 909 and the heat exchange box 901. The thermal conductive sheet 909 can extend the flow path of the internal airflow, thereby improving the heat exchange effect, so that the low-temperature airflow can be blown to the workpiece.

[0024] In summary, when using the low temperature welding device of tantalum alloy, firstly according to Figure 1 、 Figure 2 and Figure 3404, and then the upper heating mold base 7 is pressed against the workpiece. Then, after the low-temperature diffusion welding, the hydraulic cylinder 5 is controlled to drive the lifting plate 6 to move upward, and the spring 403 pushes the lifting plate 402 under the limit of the limiting rod 401 and the chassis 1, so that the workpiece is ejected from the lower heating mold base 3 by the use of the lifting plate 6, which is convenient for subsequent removal. During the upward movement of plate 6, the solenoid valve 904 can be opened and the fan 903 can be started, so that the external air can enter the heat exchange box 901 under the filtration of the filter plate 902. At this time, since the cold end of the semiconductor refrigeration plate 907 is connected to the heat conducting plate 909, the airflow can be cooled, and the heat conducting plate 909 can extend the flow path of the internal airflow, thereby improving the heat exchange effect. Finally, the airflow can enter the flow channel of the upper heating mold base 7 through the telescopic tube 905 and be ejected from the jet hole 906, thereby avoiding adhesion between the workpiece and the upper heating mold base 7. At the same time, it can also make the low-temperature airflow blow to the workpiece, thereby increasing the cooling rate of the workpiece.

[0025] The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for specific applications.

Claims

1. A low-temperature welding device for tantalum alloy, comprising a chassis (1) and a lifting assembly (4), characterized in that: A bracket (2) is arranged at the lower end of the interior of the chassis (1), and the top of the bracket (2) is connected to the lower heating mold base (3). The lifting assembly (4) is arranged at the bottom of the lower heating mold base (3). The lifting assembly (4) includes a limiting rod (401), a lifting plate (402), a spring (403), a push rod (404) and a limiting cylinder (405). The outer side of the upper end of the limiting rod (401) is slidably connected to the lifting plate (402), and the two ends of the bottom of the lifting plate (402) are connected to the spring (403). The four ends of the middle part of the lifting plate (402) are provided with push rods (404), and the left and right ends of the top of the lifting plate (402) are fixed with limiting cylinders (405). A hydraulic cylinder (5) is arranged at the center of the top of the chassis (1), and the bottom of the hydraulic cylinder (5) is connected to the lifting plate (6). The bottom of the lifting plate (6) is provided with an upper heating mold base (7).

2. The low-temperature welding device for tantalum alloy according to claim 1, characterized in that: The limiting rod (401) is fixedly connected to the chassis (1), and the limiting rod (401) is slidably connected to the limiting cylinder (405).

3. The low-temperature welding device for tantalum alloy according to claim 1, characterized in that: Guide rods (8) are arranged at the four ends of the top of the lifting plate (6), and the guide rods (8) are slidably connected to the chassis (1).

4. The low-temperature welding device for tantalum alloy according to claim 1, characterized in that: A cooling component (9) is connected to one end of the top of the chassis (1), and the cooling component (9) comprises a heat exchange box (901) and a filter plate (902). The heat exchange box (901) is placed at one end of the top of the chassis (1), and a filter plate (902) is fixed to one side of the heat exchange box (901).

5. The low-temperature welding device for tantalum alloy according to claim 4, characterized in that: The cooling component (9) further comprises a fan (903) and a solenoid valve (904); the other side of the heat exchange box (901) is connected to the fan (903), and one side of the fan (903) is connected to the solenoid valve (904) via a pipeline.

6. The low-temperature welding device for tantalum alloy according to claim 5, characterized in that: The cooling component (9) further comprises a telescopic tube (905) and an air jet hole (906); the bottom of the solenoid valve (904) is connected to the telescopic tube (905), and the telescopic tube (905) is fixedly connected to the lifting plate (6); the bottom of the upper heating mold base (7) is provided with an air jet hole (906), and the interior of the telescopic tube (905) is connected to the interior of the air jet hole (906).

7. The low-temperature welding device for tantalum alloy according to claim 6, characterized in that: The cooling component (9) further comprises a semiconductor refrigeration fin (907), a heat sink (908) and a heat conducting fin (909); the front end of the heat exchange box (901) is fixed with the semiconductor refrigeration fin (907), a heat sink (908) is provided on one side of the semiconductor refrigeration fin (907), and a heat conducting fin (909) is provided on the other side of the semiconductor refrigeration fin (907).

8. The low-temperature welding device for tantalum alloy according to claim 7, characterized in that: The heat conducting sheets (909) are distributed in an equidistant and staggered manner with respect to the interior of the heat exchange box (901), and a serpentine channel is formed between the heat conducting sheets (909) and the heat exchange box (901).

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