Wafer cutting equipment

Abstract

The utility model provides wafer cutting equipment. The utility model provides wafer cutting equipment. The wafer cutting equipment comprises a workbench, a base, a cutting assembly, a water supply assembly and a fixing assembly; the workbench is used for placing a wafer; the base is arranged above the workbench; the cutting assembly is mounted on the base; the cutting assembly comprises a knife rest and a cutting knife mounted on the knife rest; a hexagonal hole is formed in the center of a main shaft of the knife rest; the water supply assembly comprises a water inlet and an L-shaped water pipe; the water inlet is fixed on the base, the water inlet end of the water inlet is connected with an external water supply source, and the water outlet end of the water inlet is connected with the water inlet end of the L-shaped water pipe in the vertical direction; the water supply assembly is used for spraying water to a processing point where the cutting knife cuts the wafer; the fixing assembly is of a U-shaped structure. The first end of the U-shaped structure is provided with a hexagonal section matched with the hexagonal hole, and the first end of the fixing assembly is fixed in the hexagonal hole; the water pipe in the horizontal direction of the L-shaped water pipe is located at the second end of the fixing assembly so that the L-shaped water pipe can be stabilized through the fixing assembly.

Description

Technical Field

[0001] The present application relates to the field of semiconductor cutting technology, and in particular to a wafer cutting device. Background Art

[0002] A wafer is a circular piece of silicon that holds thousands of integrated circuits, or chips. To facilitate subsequent packaging and testing of the integrated circuits on the wafer, these microcircuits need to be separated into individual chips. Precise cutting maximizes the arrangement of chips on the wafer, increasing the number of chips that can be produced from a single wafer.

[0003] During the wafer dicing process, the heat generated by cutting can cause thermal damage to the wafer surface and edges. To reduce this heat damage, water jets are typically used to cool the cutting process. However, the reaction force from the water jet often causes the water pipes guiding the water flow to deviate from their position, and the jetted water cannot be sprayed to the intended location. Therefore, how to accurately control the water flow to the cutting process without interfering with the cutting operation has become a pressing issue. Utility Model Content

[0004] In view of this, the present application provides a wafer cutting device to solve the problem that the position of the water pipe that sprays water to the cutting processing point is easily offset.

[0005] Specifically, this application is implemented through the following technical solutions:

[0006] The first aspect of the present application provides a wafer cutting device, which includes a workbench, a base, a cutting assembly, a water supply assembly, and a fixing assembly; wherein,

[0007] The workbench is used to place wafers;

[0008] The base is arranged above the workbench;

[0009] The cutting assembly is mounted on the base; the cutting assembly comprises a tool holder and a cutting knife mounted on the tool holder, and the main shaft center of the tool holder has a hexagonal hole;

[0010] The water supply assembly includes a water inlet and an L-shaped water pipe; wherein the water inlet is fixed to the base, the water inlet end of the water inlet is connected to an external water supply source, and the water outlet end of the water inlet is connected to the water inlet end of the L-shaped water pipe in the vertical direction; the water supply assembly is used to spray water to the processing point of the cutting knife cutting the wafer;

[0011] The fixing component is a U-shaped structure; the first end of the U-shaped structure has a hexagonal cross-section that matches the hexagonal hole, and the first end of the fixing component is fixed in the hexagonal hole; the water pipe in the horizontal direction of the L-shaped water pipe is located on the second end of the fixing component to stabilize the L-shaped water pipe through the fixing component.

[0012] Optionally, the fixing assembly includes a top plate, a bottom plate and a connecting plate; wherein,

[0013] The top plate is a stick-shaped object with a hexagonal cross-section; one end of the top plate is fixed to one end of the connecting plate; the other end of the top plate is inserted into the hexagonal hole;

[0014] The bottom plate is a plate-shaped object, one end of which is fixed to the other end of the connecting plate to form a U-shaped structure with the top plate and the connecting plate; the horizontal water pipe of the L-shaped water pipe is located on the bottom plate in a manner perpendicular to the bottom plate to stabilize the L-shaped water pipe through the fixing assembly.

[0015] Optionally, the bottom plate has a snap-fit ​​portion; wherein,

[0016] The L-shaped horizontal water pipe is clamped in the clamping portion.

[0017] Optionally, the height of the lowest end of the horizontal water pipe of the L-shaped water pipe is 1.75 mm to 2 mm higher than the height of the lowest end of the blade of the cutting knife.

[0018] Optionally, the fixing component is an integrally formed component.

[0019] Optionally, the fixing component is a separately arranged component.

[0020] Optionally, the fixing component is made of metal material.

[0021] Optionally, the fixing assembly is made of steel.

[0022] The wafer cutting equipment provided by the present application is provided with a fixing component, and the fixing component adopts a U-shaped structure, and the first end has a hexagonal cross-section that matches the hexagonal hole in the main shaft center of the tool holder of the cutting component. In this way, firstly, the fixing component can be firmly embedded in the main shaft center of the tool holder, effectively preventing the fixing component from loosening due to vibration or external force during the cutting process. Secondly, since the fixing component and the cutting component are matched and fixed through the hexagonal hole and the hexagonal cross-section, the installation and disassembly of the fixing component becomes more convenient, and the user can easily replace or adjust the fixing component when needed; further, the L-shaped water pipe can be stabilized by the fixing component to prevent the L-shaped water pipe from moving in the vertical direction, so that the water supply component can accurately spray water to the processing point where the cutting knife cuts the wafer. In this way, the water cooling system can be ensured to operate effectively during the cutting process to avoid safety hazards caused by overheating or cutting dust. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a wafer cutting device according to an exemplary embodiment of the present application;

[0024] Figure 2 A front view of a wafer cutting device according to an exemplary embodiment of the present application;

[0025] Figure 3 A perspective view of a wafer cutting device according to an exemplary embodiment of the present application;

[0026] Figure 4 A front view of a fixing assembly shown as an exemplary embodiment of the present application;

[0027] Figure 5 This is a left side view of a fixing assembly shown as an exemplary embodiment of the present application.

[0028] Description of reference numerals:

[0029] 1: workbench;

[0030] 2: base;

[0031] 3: Cutting components;

[0032] 31: knife holder;

[0033] 4: Water supply components;

[0034] 41: water inlet;

[0035] 42: L-shaped water pipe;

[0036] 5: Fixed components;

[0037] 51: top plate;

[0038] 52: bottom plate;

[0039] 521: snap-fitting portion;

[0040] 53: Connecting plate. DETAILED DESCRIPTION

[0041] Exemplary embodiments are described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different drawings represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this application.

[0042] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0044] Specific embodiments are given below to introduce the technical solutions of the present application in detail.

[0045] Figure 1 This is a schematic diagram of a wafer cutting device according to an exemplary embodiment of the present application. Figure 2 This is a front view of a wafer cutting device shown in an exemplary embodiment of the present application. Figure 3 This is a three-dimensional diagram of a wafer cutting device according to an exemplary embodiment of the present application. Figures 1 to 3 The wafer cutting equipment provided in this embodiment includes a workbench 1, a base 2, a cutting assembly 3, a water supply assembly 4 and a fixing assembly 5; wherein,

[0046] The workbench 1 is used to place wafers;

[0047] The base 2 is arranged above the workbench 1;

[0048] The cutting assembly 3 is mounted on the base 2; the cutting assembly 3 includes a tool holder 31 and a cutting knife (not shown in the figure) mounted on the tool holder 31, and the main shaft center of the tool holder 31 has a hexagonal hole;

[0049] The water supply assembly 4 includes a water inlet 41 and an L-shaped water pipe 42; wherein the water inlet 41 is fixed to the base 2, the water inlet end of the water inlet 41 is connected to an external water supply source, and the water outlet end of the water inlet 41 is connected to the water inlet end of the L-shaped water pipe 42 in the vertical direction; the water supply assembly 4 is used to spray water to the processing point of the cutting knife cutting the wafer;

[0050] The fixing component 5 is a U-shaped structure; the first end of the U-shaped structure has a hexagonal cross-section that matches the hexagonal hole, and the first end of the fixing component 5 is fixed in the hexagonal hole; the water pipe in the horizontal direction of the L-shaped water pipe 42 is located on the second end of the fixing component 5 to stabilize the L-shaped water pipe 42 through the fixing component 5.

[0051] It should be noted that wafers are a type of semiconductor material that can be used to manufacture various electronic devices and integrated circuits, and are usually made of silicon.

[0052] The wafer cutting device provided in this embodiment is used for cutting wafers. The wafer cutting device includes a workbench 1, a base 2, a cutting assembly 3, a water supply assembly 4, and a fixing assembly 5. The workbench 1 is used to place the wafer to be cut, and the cutting assembly 3 and the water supply assembly 4 are assembled and installed on the base 2 to cooperate in performing the cutting operation. Furthermore, the hexagonal prism at the first end of the fixing assembly 5 is fixed to the spindle center of the tool holder 31, and the other end serves as the support point of the L-shaped water pipe 42. In this way, the L-shaped water pipe 42 can be prevented from shifting when the cutting knife performs the cutting operation on the wafer, so that the water outlet of the L-shaped water pipe 42 can be controlled to accurately spray water on the cutting point of the cutting knife on the wafer.

[0053] The following is a detailed description of the wafer cutting equipment provided in this embodiment:

[0054] For details, please refer to Figure 1 The workbench 1 is used to place wafers. It is understandable that in order to ensure the stability and precision of the wafers during processing, the surface of the workbench 1 needs to be kept flat. Furthermore, when the wafer cutting equipment is cutting the wafers, the static electricity generated may cause damage to the wafers. In order to reduce the damage caused by static electricity to the wafers, an anti-static workbench 1 can be used to place the wafers.

[0055] It should be noted that the antistatic workbench 1 can be made of insulating material, and the specific insulating material can be selected according to actual needs and is not limited here. For example, in one embodiment, ceramic material can be used as the manufacturing material of the workbench 1.

[0056] Furthermore, the base 2 is arranged above the workbench 1. It should be noted that the base 2, as the main structure of the wafer cutting equipment, needs to support the cutting assembly 3, water supply assembly 4 and fixing assembly 5 in the wafer cutting equipment. The cutting assembly 3, water supply assembly 4 and fixing assembly 5 are combined into the wafer cutting equipment through the base 2 to jointly achieve wafer cutting.

[0057] It is understood that the base 2 must be made of a high-strength material to ensure sufficient rigidity and durability during the cutting process. In a specific implementation, in one possible embodiment, the base 2 can be made of a metal material. For example, in one embodiment, the base 2 can be made of an aluminum alloy; in another embodiment, the base 2 can be made of a titanium alloy.

[0058] Please continue to refer to Figure 2 and Figure 3 The cutting assembly 3 is mounted on the base 2. The cutting assembly 3 includes a tool holder 31 and a cutting knife (not shown in the figure) mounted on the tool holder 31. The main shaft center of the tool holder 31 has a hexagonal hole.

[0059] Specifically, the cutting assembly 3 is mounted on the base 2 via the tool holder 31 , so that the cutting assembly 3 is stable when performing a cutting operation.

[0060] It should be noted that the way the cutting assembly 3 is mounted on the base 2 needs to meet sufficient rigidity and stability to prevent the cutting error in the wafer cutting caused by the loose connection between the cutting assembly 3 and the base 2 when the cutting knife rotates during the cutting operation.

[0061] It is understood that, in one possible implementation, the cutting assembly 3 can be mounted on the base 2 through a mechanical connection, for example, by securing the cutting assembly 3 to the base 2 with bolts and nuts to provide a stable connection. In another possible implementation, the cutting assembly 3 can be secured to the base 2 by installing a sliding track on the base 2 and adding a guide rail to the cutting assembly 3. This allows the cutting assembly 3 to be precisely moved horizontally and vertically on the base 2, adjusting the position for performing cutting operations.

[0062] For further information, please refer to Figures 1 to 3 The center of the spindle of the tool holder 31 of the cutting assembly 3 has a hexagonal hole.

[0063] For further information, please refer to Figures 1 to 3The water supply component 4 includes a water inlet 41 and an L-shaped water pipe 42; wherein, the water outlet end of the water inlet 41 is connected to the water inlet end of the L-shaped water pipe 42 in the vertical direction; the water supply component 4 is used to spray water to the processing point where the cutting knife cuts the wafer.

[0064] Specifically, the water outlet end of the water inlet 41 is connected to the water inlet end of the L-shaped water pipe 42 in the vertical direction, and water is introduced into the L-shaped water pipe 42 through the water inlet 41. The introduced water then flows through the L-shaped water pipe 42 and sprays water toward the processing point where the cutting knife cuts the wafer.

[0065] It should be noted that the L-shaped water pipe 42 is a whole water pipe, one end of which serves as the water inlet end of the L-shaped water pipe 42 and is connected to the water outlet end of the water inlet 41, and the other end serves as the water outlet end for spraying water to the processing point where the cutting knife cuts the wafer. It is understandable that during the cutting process, the L-shaped water pipe 42 needs to have good flexibility to flexibly adjust the direction of the water spray. Furthermore, the L-shaped water pipe 42 also needs to have certain high temperature resistance and corrosion resistance. Therefore, in actual applications, the material for making the L-shaped water pipe 42 can be selected according to actual needs and is not limited here. For example, in one embodiment, polyvinyl chloride can be selected as the material for making the L-shaped water pipe 42; for another example, in another embodiment, polytetrafluoroethylene can also be selected as the material for making the L-shaped water pipe 42.

[0066] Furthermore, the water inlet 41 is connected to an external water supply device, and the water provided by the external water supply device is introduced through the water inlet end of the water inlet 41 of the water supply component 4. By connecting the water outlet end of the water inlet 41 with the water inlet end of the L-shaped water pipe 42 in the vertical direction, the introduced water source can flow through the vertical water pipe of the L-shaped water pipe 42 and the horizontal water outlet end of the L-shaped water pipe 42, and the outflowing water source can spray water to the processing point where the cutting knife cuts the wafer.

[0067] It should be noted that the height of the lowest end of the L-shaped water pipe 42 in the horizontal direction needs to be 1.75 mm to 2 mm higher than the height of the lowest end of the cutting blade.

[0068] It is understandable that if the height of the lowest end of the L-shaped water pipe 42 is lower than a certain value, the water flowing out of the water pipe may overflow, and it may be impossible to spray water to the processing point where the cutting knife cuts the wafer; and if the lowest end of the water pipe is higher than a certain value, the water flowing out of the water pipe may splash onto the cutting knife, causing damage to the equipment and endangering the life safety of the operator. Therefore, in specific implementation, it is required that the height of the lowest end of the water pipe in the horizontal direction of the L-shaped water pipe 42 is higher than the height of the lowest end of the blade of the cutting knife by 1.75mm to 2mm. It should be noted that the specific value of the height of the lowest end of the water pipe in the horizontal direction of the L-shaped water pipe 42 higher than the height of the lowest end of the blade of the cutting knife can be set according to the actual blade position of the cutting knife and is not limited here.

[0069] Optionally, in a possible implementation, a valve may be provided on the water outlet 41 to help control the size of the water flow that is ultimately sprayed onto the processing point where the cutting knife cuts the wafer, thereby improving the safety of the overall operation.

[0070] The wafer cutting equipment provided in this embodiment introduces external water flow through the water inlet to supply water into the L-shaped water pipe during the cutting process. The design of the L-shaped water pipe can achieve precise water spraying on the processing point where the cutting knife cuts the wafer, and then use the water flow sprayed from the L-shaped water pipe to cool the cutting point to prevent the wafer from overheating and damage. In addition, the design of the L-shaped water pipe also helps to reduce vibration and swing during the water supply process, ensure the stability of the water flow in the water pipe, reduce the risk of static electricity that may be generated during the cutting process, and improve the safety level of the entire cutting process.

[0071] For further information, please refer to Figures 1 to 3 , the fixing component 5 is a U-shaped structure; the first end of the U-shaped structure has a hexagonal cross-section that matches the hexagonal hole, and the first end of the fixing component 5 is fixed in the hexagonal hole; the water pipe in the horizontal direction of the L-shaped water pipe 42 is located on the second end of the fixing component 5, so as to stabilize the L-shaped water pipe 42 through the fixing component 5.

[0072] Specifically, in one embodiment, the U-shaped structure contains a hexagonal prism structure, and the first end of the U-shaped structure is the end where the hexagonal prism structure of the U-shaped structure is located. The hexagonal cross-section of the hexagonal prism of the U-shaped structure matches the hexagonal hole in the main shaft center of the tool holder 31, and the hexagonal prism of the U-shaped structure is fixed in the hexagonal hole in the main shaft center of the tool holder 31. At this time, the U-shaped structure is hung on the tool holder 31 like a hook, and its second end is located below the L-shaped water pipe 42. The water pipe in the horizontal direction of the L-shaped water pipe 42 is located on the second end of the U-shaped structure, and the L-shaped water pipe 42 is supported by the fixing component 5 to stabilize the L-shaped water pipe 42.

[0073] Figure 4This is a front view of a fixing assembly shown in an exemplary embodiment of the present application. Figure 5 This is a left view of a fixing assembly according to an exemplary embodiment of the present application. Figure 4 and Figure 5 In a possible implementation, the fixing assembly 5 includes a top plate 51, a bottom plate 52 and a connecting plate 53; wherein the top plate 51 is a stick-shaped object with a hexagonal cross-section; one end of the top plate 51 is fixed to one end of the connecting plate 53; the other end of the top plate 51 is inserted into the hexagonal hole; the bottom plate 52 is a plate-shaped object, one end of which is fixed to the other end of the connecting plate 53 to form a U-shaped structure with the top plate 51 and the connecting plate 53; the horizontal water pipe of the L-shaped water pipe 42 is located on the bottom plate 52 in a manner perpendicular to the bottom plate 52, so as to stabilize the L-shaped water pipe 42 through the fixing assembly 5.

[0074] Specifically, the fixing assembly 5 uses a U-shaped structure to surround and support the L-shaped water pipe 42 through the joint action of the top plate 51, the bottom plate 52 and the connecting plate 53, ensuring that the horizontal part of the L-shaped water pipe 42 is fixed in the required position to prevent it from shifting in the vertical direction.

[0075] It should be noted that the fixing assembly 5 is made of metal and is used to support the horizontal water pipe of the L-shaped water pipe 42. It is understood that the metal material of the fixing assembly 5 can be selected according to actual needs and is not limited here. For example, in one embodiment, steel, stainless steel, or titanium alloy can be selected as the material for the fixing assembly 5.

[0076] In one possible implementation, the fixing component 5 can be an integrally formed component, and the top plate 51, the bottom plate 52 and the connecting plate 53 are non-detachable; in another possible implementation, the fixing component 5 can also be a separately arranged component, and the top plate 51, the bottom plate 52 and the connecting plate 53 are detachable components. Furthermore, when the fixing component 5 is a separately arranged component, the top plate 51, the bottom plate 52 and the connecting plate 53 can be mechanically connected by bolts and nuts, or fixed together by welding.

[0077] Optional, please continue to refer to Figure 4 and Figure 5 In a possible implementation, the bottom plate 52 has a locking portion 521 , and the L-shaped water pipe 42 is locked in the horizontal direction of the water pipe at the locking portion 521 .

[0078] Specifically, the engaging portion 521 may be a groove or a buckle structure, which is not limited in this embodiment.

[0079] It should be noted that by providing a locking portion 521 on the base plate 52 and locking the horizontal water pipe of the L-shaped water pipe 42 in the locking portion 521, the horizontal movement of the L-shaped water pipe 42 can be restricted to ensure that when performing the cutting operation, the sprayed water flow can be accurately sprayed to the processing point where the cutting knife cuts the wafer.

[0080] The wafer cutting equipment provided in this embodiment is provided with a fixing component, and the fixing component adopts a U-shaped structure, and the first end has a hexagonal cross-section that matches the hexagonal hole in the main shaft center of the tool holder of the cutting component. In this way, firstly, the fixing component can be firmly embedded in the main shaft center of the tool holder, effectively preventing the fixing component from loosening due to vibration or external force during the cutting process. Secondly, since the fixing component and the cutting component are matched and fixed by the hexagonal hole and the hexagonal cross-section, the installation and disassembly of the fixing component becomes more convenient, and the user can easily replace or adjust the fixing component when needed; further, the L-shaped water pipe can be stabilized by the fixing component to prevent the L-shaped water pipe from moving in the vertical direction, so that the water supply component can accurately spray water to the processing point where the cutting knife cuts the wafer. In this way, the water cooling system can be ensured to operate effectively during the cutting process to avoid safety hazards caused by overheating or cutting dust.

[0081] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A wafer cutting device, characterized in that: The wafer cutting equipment includes a workbench, a base, a cutting assembly, a water supply assembly and a fixing assembly; wherein, The workbench is used to place wafers; The base is arranged above the workbench; The cutting assembly is mounted on the base; the cutting assembly comprises a tool holder and a cutting knife mounted on the tool holder, and the main shaft center of the tool holder has a hexagonal hole; The water supply assembly includes a water inlet and an L-shaped water pipe; wherein the water inlet is fixed to the base, the water inlet end of the water inlet is connected to an external water supply source, and the water outlet end of the water inlet is connected to the water inlet end of the L-shaped water pipe in the vertical direction; the water supply assembly is used to spray water to the processing point of the cutting knife cutting the wafer; The fixing component is a U-shaped structure; the first end of the U-shaped structure has a hexagonal cross-section that matches the hexagonal hole, and the first end of the fixing component is fixed in the hexagonal hole; the water pipe in the horizontal direction of the L-shaped water pipe is located on the second end of the fixing component to stabilize the L-shaped water pipe through the fixing component.

2. The wafer cutting equipment according to claim 1, characterized in that: The fixing assembly includes a top plate, a bottom plate and a connecting plate; wherein, The top plate is a stick-shaped object with a hexagonal cross-section; one end of the top plate is fixed to one end of the connecting plate; the other end of the top plate is inserted into the hexagonal hole; The bottom plate is a plate-shaped object, one end of which is fixed to the other end of the connecting plate to form a U-shaped structure with the top plate and the connecting plate; the horizontal water pipe of the L-shaped water pipe is located on the bottom plate in a manner perpendicular to the bottom plate to stabilize the L-shaped water pipe through the fixing assembly.

3. The wafer cutting equipment according to claim 2, characterized in that: The bottom plate has a clamping portion; wherein, The water pipe in the horizontal direction of the L-shaped water pipe is clamped in the clamping portion.

4. The wafer cutting equipment according to claim 1, wherein: The height of the lowest end of the horizontal water pipe of the L-shaped water pipe is 1.75 mm to 2 mm higher than the height of the lowest end of the blade of the cutting knife.

5. The wafer cutting equipment according to claim 1, wherein: The fixing component is an integrally formed component.

6. The wafer cutting equipment according to claim 1, wherein: The fixing component is a component that is separately arranged.

7. The wafer cutting equipment according to claim 1, wherein: The fixing component is made of metal material.

8. The wafer cutting equipment according to claim 1 or 6, characterized in that: The fixing assembly is made of steel.

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