Mold for local electroplating

Abstract

The utility model relates to the technical field of local electroplating, in particular to a mold for local electroplating, which comprises a bottom mold and a sealing shielding mold, the bottom mold is detachably connected with the sealing shielding mold, and the bottom mold is provided with a mounting groove for placing a product and an electroplating assembly for connecting the product with a power supply. The sealing shielding mold is provided with shielding parts used for shielding and protecting a non-to-be-plated area of a product, the shielding parts divide the sealing shielding mold into a plurality of electroplating areas, and the bottom mold and the sealing shielding mold are detachably connected, so that assembly and disassembly of the bottom mold and the sealing shielding mold become simple and rapid, and the working efficiency is improved; according to the invention, the shielding part is arranged on the sealing shielding mold, so that the shielding part can accurately shield and protect the non-to-be-plated area of the product, and only the specified to-be-plated area is ensured to be subjected to electroplating treatment, thereby realizing accurate control of local electroplating, reducing pollution and damage of the non-to-be-plated area of the product, and further reducing the reject ratio of electroplated products.

Description

Technical Field

[0001] The present application relates to the technical field of local electroplating, and in particular to a mold for local electroplating. Background Art

[0002] Local electroplating technology is a technology that electroplates the metal coating of a product only in specific areas. Usually the product is divided into the area to be plated and the area not to be plated. The principle of local electroplating is mainly to expose the area to be plated that only needs to be plated to the plating solution, while covering the non-area to be plated that does not need to be plated, thereby achieving local electroplating.

[0003] At present, tape is usually used to wrap and block the non-plating areas that do not require electroplating, but this blocking method is only suitable for small batches or individual processing needs. For products that require large-scale electroplating operations, the use of this wrapping and blocking method will consume a lot of manpower costs, and the accuracy requirements for wrapping and blocking the products are high. Artificial wrapping and blocking will increase the defective rate of electroplated products, and there is room for improvement. Utility Model Content

[0004] In order to reduce the defective rate of electroplated products, the present application provides a mold for local electroplating.

[0005] This application provides a mold for local electroplating, which adopts the following technical solution:

[0006] A mold for local electroplating includes a base mold and a sealing shielding mold. The base mold and the sealing shielding mold are detachably connected. The base mold is provided with a mounting groove for placing a product and an electroplating assembly for connecting the product to a power supply. The sealing shielding mold is provided with a shielding portion for shielding and protecting the non-to-be-plated area of ​​the product. The shielding portion divides the sealing shielding mold into several electroplating areas.

[0007] By adopting the above technical solution, a detachable connection is formed between the bottom mold and the sealing shielding mold, making the assembly and disassembly of the bottom mold and the sealing shielding mold simple and quick, thereby improving work efficiency; by utilizing the setting of the shielding part on the sealing shielding mold, the shielding part can accurately shield and protect the non-to-be-plated area of ​​the product, ensuring that only the designated area to be plated is subjected to electroplating treatment, thereby realizing precise control of local electroplating, reducing pollution and damage to the non-to-be-plated area of ​​the product, and thereby reducing the defective rate of electroplated products.

[0008] Preferably, the sealing shielding mold includes an upper mold base and a sealing structure, the sealing structure is fixedly arranged on the upper mold base, and the sealing structure is provided with electroplating holes, and the electroplating holes are arranged in the electroplating area.

[0009] By adopting the above technical solution and utilizing the setting of the sealing structure, the sealing structure can block and seal the connection gap between the bottom mold and the sealing shielding mold, thereby enhancing the sealing of the bottom mold and the sealing shielding mold during the electroplating process, thereby improving the electroplating quality and the qualified rate of the product; utilizing the setting of the electroplating hole, it is convenient for the staff to perform electroplating operations on the product in the subsequent process.

[0010] Preferably, the sealing structure includes a protecting portion, which is arranged in a shape and position corresponding to the shielding portion, and a folded edge is provided on a side of the protecting portion close to the area to be plated of the product.

[0011] By adopting the above technical solution and utilizing the setting of the folded edge on the protective part, the folded edge is deformed by external force during installation and forms a tighter abutment with the product. At this time, the folded edge isolates the area to be plated from the area not to be plated of the product, effectively reducing the possibility of leakage of the plating solution or infiltration into the area not to be plated, thereby providing tight shielding and protection for the area not to be plated of the product.

[0012] Preferably, an embedding groove is provided on the sealing structure, and an embedding structure is provided on the bottom mold, and the embedding structure and the embedding groove form an embedding fit.

[0013] By adopting the above technical solution and utilizing the embedding cooperation between the embedding structure and the embedding groove, the overall stability and sealing performance of the mold are enhanced.

[0014] Preferably, the bottom mold and the sealing shielding mold are connected by bolt threads.

[0015] By adopting the above technical solution, a fastened threaded connection is achieved between the bottom mold and the sealing shielding mold through bolts, which not only makes the structure stable but also facilitates installation and disassembly.

[0016] Preferably, the electroplating assembly includes a fixing portion and a connecting portion, the fixing portion is fixedly connected to the connecting portion, the fixing portion is arranged in the mounting groove, and the connecting portion is located at the bottom of the bottom mold and is electrically connected to the external circuit.

[0017] By adopting the above technical solution, the fixing part and the connecting part are fixedly connected, and the connecting part is connected to the external circuit, so that the external current can smoothly pass through the electroplating component and connect with the product, thereby facilitating the subsequent electroplating operation on the area to be plated of the product.

[0018] Preferably, an insulating layer is provided on the connecting portion.

[0019] By adopting the above technical solution and utilizing the provision of an insulating layer, the potential safety hazards caused by current leakage during the electroplating process are effectively reduced, thereby protecting the safety of the workers.

[0020] Preferably, the sealing shielding mold is provided with injection holes for injecting glue to form the sealing structure, and a plurality of the injection holes are provided and are evenly spaced apart on the upper mold base.

[0021] By adopting the above technical solution and utilizing the setting of the injection holes, rapid molding of the sealing structure is achieved, thereby improving the production efficiency of the mold; at the same time, the uniform distribution of multiple injection holes ensures the uniformity of the sealing structure after molding.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. The base mold and the sealing shielding mold are connected in a detachable manner, making the assembly and disassembly of the base mold and the sealing shielding mold simple and quick, thereby improving work efficiency; the shielding part on the sealing shielding mold is set so that the shielding part can accurately shield and protect the non-to-be-plated area of ​​the product, ensuring that only the designated to-be-plated area receives electroplating treatment, thereby achieving precise control of local electroplating, reducing contamination and damage to the non-to-be-plated area, and further reducing the defective rate of electroplated products;

[0024] 2. The sealing structure can block and seal the gap between the bottom mold and the sealing shielding mold, thereby enhancing the sealing between the bottom mold and the sealing shielding mold during the electroplating process, thereby improving the electroplating quality and product qualification rate. At the same time, the setting of the electroplating holes facilitates the staff to perform electroplating operations on the products in the future.

[0025] 3. The bottom mold and the sealing shielding mold are connected by fixing bolts to achieve a tight threaded connection, which not only ensures a stable structure but also facilitates installation and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an axonometric diagram mainly showing the overall structure in the embodiment of the present application;

[0027] Figure 2 This is a partial exploded view of the structure between the bottom mold and the sealing shielding mold in the embodiment of the present application;

[0028] Figure 3 This is a structural diagram mainly showing the sealing shielding mold structure in an embodiment of the present application;

[0029] Figure 4 It is a partial exploded view mainly showing the connection relationship between the fixing part and the connecting part in the embodiment of the present application.

[0030] Figure markings: 1. Base mold; 11. Mounting groove; 12. Electroplating assembly; 121. Fixing portion; 122. Connecting portion; 1221. Insulating layer; 13. Embedded structure; 14. Extension portion; 141. Fixing bolt; 142. Matching hole; 15. Matching groove; 16. Opening groove; 2. Sealing shielding mold; 21. Upper mold base; 211. Shielding portion; 212. Frame-shaped portion; 213. Electroplating area; 22. Sealing structure; 221. Protective portion; 2211. Folding edge; 222. Embedded portion; 2221. Embedded groove; 223. Contoured hole. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1 -Attached Figure 4 This application is described in further detail.

[0032] The embodiment of the present application discloses a mold for local electroplating.

[0033] Reference Figure 1 A mold for local electroplating includes a bottom mold 1 and a sealing shielding mold 2. In this embodiment, the bottom mold 1 and the sealing shielding mold 2 are both made of nylon material. The bottom mold 1 and the sealing shielding mold 2 form a detachable connection, which makes the assembly and disassembly of the bottom mold 1 and the sealing shielding mold 2 simple and quick, thereby improving work efficiency. The bottom mold 1 is provided with a mounting groove 11 for placing the product, and the bottom mold 1 is provided with an electroplating component 12 for connecting the product to the power supply in the mounting groove 11.

[0034] Reference Figure 2 The sealing shielding mold 2 includes an upper mold base 21 and a sealing structure 22. The sealing structure 22 can block and seal the connection gap between the bottom mold 1 and the upper mold base 21, thereby enhancing the sealing of the bottom mold 1 and the upper mold base 21 during the electroplating process, thereby preventing the electroplating liquid from leaking from the connection gap between the bottom mold 1 and the upper mold base 21, and improving the electroplating quality and product qualification rate.

[0035] Reference Figure 2 , a glue injection hole 23 is also provided on the upper mold base 21. The staff injects glue into the glue injection hole 23 to form the sealing structure 22 on the upper mold base 21, thereby realizing the rapid molding of the sealing structure 22 and improving the production efficiency of the mold; there are multiple glue injection holes 23 and they are evenly spaced on the upper mold base 21, ensuring the uniformity of the sealing structure 22 after molding.

[0036] Reference Figure 2The upper mold base 21 includes a shielding portion 211 and a frame portion 212. The shielding portion 211 and the frame portion 212 are integrally formed. The shielding portion 211 can accurately shield and protect the non-to-be-plated area of ​​the product, ensuring that only the designated area to be plated is electroplated, thereby achieving precise control of local electroplating, reducing pollution and damage to the non-to-be-plated area of ​​the product, and thus reducing the defective rate of electroplated products.

[0037] Reference Figure 2 and Figure 3 The shielding portion 211 divides the frame-shaped portion 212 into several hollow electroplating areas 213. In this embodiment, one shielding portion 211 is provided and two electroplating areas 213 are provided. The sealing structure 22 includes a protective portion 221 and an embedded portion 222. The protective portion 221 is integrally formed on the embedded portion 222. The protective portion 221 corresponds to the shape and position of the shielding portion 211, and the embedded portion 222 corresponds to the shape and position of the frame-shaped portion 212. A plating hole 223 is provided between the protective portion 221 and the embedded portion 222. There are two electroplating holes 223 corresponding to the shape, position and number of the electroplating area 213, that is, the two electroplating holes 223 are respectively provided on both sides of the protective portion 221 and are located in the electroplating area 213. The setting of the electroplating area 213 and the electroplating holes 223 is used to expose the product's area to be plated, so that the staff can perform electroplating operations on the product's area to be plated in the subsequent process.

[0038] Reference Figure 2 and Figure 3 The side of the protection part 221 close to the product area to be plated is integrally formed with a downward-inclined folded edge 2211. In this embodiment, two folded edges 2211 are provided, and the inclination direction of any folded edge 2211 is set by the protection part 221 toward the product area to be plated. Therefore, when the bottom mold 1 and the upper mold base 21 are installed, the folded edge 2211 is deformed by external force and forms a tighter abutment with the product. At this time, the folded edge 2211 isolates the product area to be plated from the non-to-be-plated area, effectively reducing the possibility of leakage or infiltration of the plating solution into the non-to-be-plated area, thereby providing a solid shielding protection for the product non-to-be-plated area.

[0039] Reference Figure 2 and Figure 3 A frame-shaped embedded structure 13 is integrally formed on the bottom mold 1, the mounting groove 11 is arranged inside the embedded structure 13, and the embedded portion 222 is provided with an embedded groove 2221 at a position corresponding to the embedded structure 13, thereby enhancing the overall stability and sealing of the mold.

[0040] Reference Figure 2, extensions 14 are symmetrically provided on the edges of both sides of the bottom mold 1, and any extension 14 is integrally formed with the bottom mold 1, and fixing bolts 15 and matching holes 16 are coaxially provided on the extension 14 of the bottom mold 1 and the shielding portion 211 of the upper mold base 21, and the fixing bolts 15 are threadedly matched with the shielding portion 211 and the matching holes 16 on the extension 14 in turn, further enhancing the stable connection between the bottom mold 1 and the upper mold base 21, and at the same time facilitating the staff to install and disassemble the bottom mold 1 and the upper mold base 21. The setting of the extension 14 ensures that the connection between the bottom mold 1 and the upper mold base 21 will not interfere with the electroplating process.

[0041] Reference Figure 1 and Figure 4 The electroplating component 12 includes a fixing portion 121 and a connecting portion 122, and the fixing portion 121 is fixedly connected to the connecting portion 122. In this embodiment, the fixing portion 121 and the connecting portion 122 are threadedly connected by bolts, which makes the replacement and maintenance of the electroplating component 12 simple and convenient, reducing the maintenance cost and time of the staff; the fixing portion 121 is arranged in the mounting groove 11, and the side of the fixing portion 121 facing away from the mounting groove 11 forms an abutment fit with the area to be plated of the product; a matching groove 17 and an opening groove 18 are provided on the bottom mold 1, and the matching groove 17 is connected to the opening groove 18 and are both located at the bottom of the bottom mold 1, and a part of the connecting portion 122 is embedded in the matching groove 17, and the other part extends out of the bottom mold 1 through the opening groove 18 and is electrically connected to the external circuit, so that the external current can smoothly pass through the electroplating component 12 and connect with the product, thereby facilitating the subsequent electroplating operation on the area to be plated of the product.

[0042] Reference Figure 1 An insulating layer 1221 is provided on the connecting portion 122. In this embodiment, the insulating layer 1221 is preferably set to nylon material. The setting of the insulating layer 1221 effectively reduces the safety hazards caused by current leakage during the electroplating process and protects the safety of the staff.

[0043] The implementation principle of the embodiment of the present application is as follows: in actual operation, the staff first places the product into the installation groove 11 of the bottom mold 1, so that the lower surface of the product forms an abutment fit with the fixing portion 121 of the electroplating component 12, and then forms an abutment fit with the embedding groove 2221 on the upper mold base 21 and the embedding structure 13 on the bottom mold 1, thereby achieving preliminary fixation of the electroplating component 12, and finally the bottom mold 1 and the upper mold base 21 are threadedly connected by the fixing bolts 15, thereby achieving further reliable fixation of the bottom mold 1 and the upper mold base 21. At this time, the shielding portion 211 on the sealing structure 22 can effectively shield the non-to-be-plated area of ​​the product, and at the same time expose the to-be-plated area of ​​the product through the electroplating hole 223 and the electroplating area 213, so that the subsequent electroplating operation can be performed on the to-be-plated area of ​​the product.

[0044] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A mold for local electroplating, characterized by: The invention comprises a bottom mold (1) and a sealing shielding mold (2), wherein the bottom mold (1) and the sealing shielding mold (2) are detachably connected, the bottom mold (1) is provided with a mounting groove (11) for placing a product and an electroplating assembly (12) for connecting the product to a power supply, and the sealing shielding mold (2) is provided with a shielding portion (211) for shielding and protecting a non-to-be-plated area of ​​the product, and the shielding portion (211) divides the sealing shielding mold (2) into a plurality of electroplating areas (212).

2. The mold for partial electroplating according to claim 1, characterized in that: The sealing shielding mold (2) comprises an upper mold base (21) and a sealing structure (22); the sealing structure (22) is fixedly arranged on the upper mold base (21); a plating hole (223) is provided on the sealing structure (22); and the plating hole (223) is arranged in the plating area (212).

3. The mold for partial electroplating according to claim 2, characterized in that: The sealing structure (22) comprises a protection portion (221), the protection portion (221) being arranged in a shape and position corresponding to the shielding portion (211), and a folding edge (2211) being arranged on a side of the protection portion (221) close to the product to-be-plated area.

4. The mold for partial electroplating according to claim 2, characterized in that: An embedding groove (2221) is provided on the sealing structure (22), and an embedding structure (13) is provided on the bottom mold (1), wherein the embedding structure (13) and the embedding groove (2221) form an embedding fit.

5. The mold for partial electroplating according to claim 1, characterized in that: The bottom mold (1) and the sealing shielding mold (2) are connected via bolt threads.

6. The mold for partial electroplating according to claim 1, characterized in that: The electroplating assembly (12) comprises a fixing portion (121) and a connecting portion (122), wherein the fixing portion (121) is fixedly connected to the connecting portion (122), the fixing portion (121) is arranged in the mounting groove (11), and the connecting portion (122) is located at the bottom of the bottom mold (1) and is electrically connected to an external circuit.

7. The mold for partial electroplating according to claim 6, characterized in that: An insulating layer (1221) is provided on the connecting portion (122).

8. The mold for partial electroplating according to claim 2, characterized in that: The sealing shielding mold (2) is provided with a glue injection hole (23) for injecting glue to form the sealing structure (22), and a plurality of the glue injection holes (23) are provided and are evenly spaced and distributed on the upper mold base (21).

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