Electric control box and air conditioner with same

Abstract

The electric control box comprises a circuit board and a heat dissipation structure, the circuit board comprises a substrate and a heating device arranged on the substrate, the heat dissipation structure comprises a first part, a second part and a third part, the first part is arranged on the heating device and matched with the heating device in a heat transfer mode, and the third part is arranged on the substrate and matched with the heating device in a heat transfer mode. The third part is separated from the first part, a matching part for embedding a radiating pipe is arranged on the third part, the second part is connected between the first part and the third part, and heat is transferred between the first part and the third part. According to the electric control box provided by the embodiment of the utility model, the third part provided with the radiating tube is separated from the first part, and the third part and the heating device are arranged in a staggered manner, so that the size of the electric control box in the thickness direction of the substrate can be reduced, the size of the electric control box is reduced, the pulling stress of the pin of the heating device is reduced, and the service life of the electric control box is prolonged. The service life of a heating device can be prolonged, and the working reliability of the electric control box is improved.

Description

Technical Field

[0001] The utility model relates to the field of air-conditioning equipment, in particular to an electric control box and an air conditioner having the same. Background Art

[0002] In air conditioning systems, good heat dissipation for electronic controls is crucial, ensuring reliable, continuous, and full-load operation. In the prior art, there is room for improvement in heat sinks for electronic control devices. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an electric control box having a heat sink that can reduce the size of the electric control box, reduce the pulling force on the pins of the heating element, and improve the operating reliability of the electric control box.

[0004] The utility model also provides an air conditioner with the electric control box.

[0005] According to the first aspect of the present invention, the electric control box includes: a circuit board, the circuit board includes a substrate and a heating device arranged on the substrate; a heat dissipation structure, the heat dissipation structure includes a first part, a second part and a third part, the first part is arranged on the heating device and cooperates with the heating device for heat transfer, the third part is separated from the first part, and the third part has a matching part for embedding a heat dissipation pipe, the second part is connected between the first part and the third part, and transfers heat between the first part and the third part.

[0006] According to the electric control box of the embodiment of the present invention, by separating the third part provided with the heat dissipation pipe from the first part, the third part and the heating device are staggered, which can not only reduce the size of the electric control box in the thickness direction of the substrate, which is conducive to reducing the volume of the electric control box, but also reduce the pulling force on the pins of the heating device, which can extend the service life of the heating device and improve the working reliability of the electric control box.

[0007] In some embodiments, the heat dissipation structure includes a heat conducting plate and a heat sink, the heat conducting plate includes a first plate portion, a second plate portion and a third plate portion, the first plate portion constitutes the first part, the second plate portion constitutes the second part, the heat sink cooperates with the third plate portion to jointly constitute the third part, and the cooperating portion is formed between the heat sink and the third plate portion, or formed on the heat sink.

[0008] In some embodiments, the third plate portion is located on the peripheral side of the first plate portion, and the plane where the side surface of the substrate close to the first part is located is used as the reference plane. The orthographic projection of the heat sink on the reference plane is outside the outline range of the orthographic projection of the first plate portion on the reference plane.

[0009] In some embodiments, the thickness of the heat conducting plate is respectively on the inner side and the outer side, the circuit board is located on the inner side of the first plate portion, the heat sink is plate-shaped and the thickness direction is consistent with the thickness direction of the third plate portion, and the heat sink is stacked on the inner side of the third plate portion.

[0010] In some embodiments, the second plate portion gradually extends in a direction away from the reference plane in a direction from the first plate portion to the third plate portion.

[0011] In some embodiments, the height of the radiator is not less than the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

[0012] In some embodiments, the second plate portion gradually extends from the first plate portion to the third plate portion in a direction approaching the reference plane.

[0013] In some embodiments, the third plate portion extends beyond the edge of the substrate so that the orthographic projection of the third plate portion on the reference plane is outside the contour range of the orthographic projection of the substrate on the reference plane, and at least a portion of the heat sink extends toward the side of the substrate facing away from the first plate portion to exceed the substrate.

[0014] In some embodiments, the heat conducting plate is a flat plate, and the second plate portion is parallel to the reference plane.

[0015] In some embodiments, the orthographic projection of the third plate portion on the reference plane is located within the outline of the orthographic projection of the substrate on the reference plane, the heat sink is located on the side of the substrate facing the heat conducting plate in the thickness direction, and there is a gap between the heat sink and the reference plane.

[0016] In some embodiments, the thickness of the heat conducting plate is respectively inner and outer, the circuit board is located on the inner side of the first plate portion, the heat sink is plate-shaped and the thickness direction is consistent with the thickness direction of the third plate portion, and the heat sink is stacked on the outer side of the third plate portion.

[0017] In some embodiments, the second plate portion extends in a direction close to the reference plane in a direction from the first plate portion to the third plate portion, the height of the radiator does not exceed the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

[0018] In some embodiments, the third plate portion extends beyond the edge of the substrate so that the orthographic projection of the third plate portion on the reference plane is outside the contour range of the orthographic projection of the substrate on the reference plane, and at least a portion of the heat sink extends toward the side of the substrate facing away from the first plate portion to exceed the substrate.

[0019] In some embodiments, the third part is located on the peripheral side of the first part, and the plane of the side surface of the substrate close to the first part is used as the reference plane. The orthographic projection of the third part on the reference plane is outside the outline range of the orthographic projection of the first part on the reference plane.

[0020] In some embodiments, the height of the third part does not exceed the height of the first part, wherein the thickness of the heat dissipation structure is respectively on the inner side and the outer side, the circuit board is located on the inner side of the first part, the distance from the outer surface of the first part to the reference plane is the height of the first part, and the distance from the outer surface of the third part to the reference plane is the height of the third part.

[0021] In some embodiments, the height of the third portion does not exceed the height of the heating device, and the distance from the end of the heating device away from the substrate to the reference plane is the height of the heating device.

[0022] In some embodiments, the heat dissipation structure includes a heat conducting plate and a radiator, the heat conducting plate includes a first plate portion, a second plate portion and a third plate portion, the first plate portion constitutes the first part, the second plate portion constitutes the second part, the thickness of the heat conducting plate is respectively inner and outer, the circuit board is located on the inner side of the first plate portion, the radiator is plate-shaped and the thickness direction is consistent with the thickness direction of the third plate portion, the radiator is stacked on the inner side or outer side of the third plate portion, the radiator and the third plate portion cooperate to jointly constitute the third part, the cooperation portion is formed between the radiator and the third plate portion, or formed on the radiator, wherein the height of the radiator does not exceed the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

[0023] In some embodiments, the height of the heat sink does not exceed the height of the heating device, and the distance from the end of the heating device away from the substrate to the reference plane is the height of the heating device.

[0024] In some embodiments, the third portion extends beyond the edge of the substrate, so that the orthographic projection of the third portion on the reference plane is outside the outline range of the orthographic projection of the substrate on the reference plane.

[0025] In some embodiments, at least a portion of the heat sink extends beyond the substrate toward a side of the substrate facing away from the first portion.

[0026] In some embodiments, the second part is bent from one side of the substrate in the thickness direction to the other side of the substrate in the thickness direction, so that the third part and the first part are located on both sides of the thickness direction of the substrate; the heat dissipation structure includes a heat conducting plate and a radiator, the heat conducting plate includes a third plate portion, the radiator cooperates with the third plate portion to jointly constitute the third part, and the radiator is arranged on the side of the third plate portion close to or away from the substrate.

[0027] An air conditioner according to a second aspect of the present invention includes the electric control box according to the first aspect of the present invention.

[0028] According to the air conditioner of the present invention, the operating reliability of the air conditioner is improved by providing the electric control box of the first aspect.

[0029] In some embodiments, the electric control box is provided in the outdoor unit of the air conditioner, and at least a portion of the refrigerant pipe in the outdoor unit serves as the heat dissipation pipe.

[0030] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of an electric control box according to an embodiment of the present utility model from a front view;

[0032] Figure 2 This is a structural diagram of an electric control box according to the first embodiment of the present utility model;

[0033] Figure 3 This is a structural diagram of an electric control box according to the second embodiment of the present utility model;

[0034] Figure 4 This is a schematic structural diagram of an electric control box according to the third embodiment of the present utility model;

[0035] Figure 5 This is a schematic structural diagram of an electric control box according to another embodiment of the present utility model from a front view;

[0036] Figure 6 is a structural diagram of an electric control box according to the fourth embodiment of the present application;

[0037] Figure 7 This is a structural diagram of an electric control box according to a fifth embodiment of the present utility model;

[0038] Figure 8 The figure is a schematic structural diagram of an outdoor unit of an air conditioner according to an embodiment of the present utility model.

[0039] Reference numerals:

[0040] Air conditioner 1000;

[0041] Electric control box 100;

[0042] Circuit board 1; substrate 11; reference surface 11a; heating element 12; height L5 of the heating element;

[0043] Heat dissipation structure 2; first portion 2a; height L4 of first portion; second portion 2b; third portion 2c; height L3 of third portion; mating portion 2c1; heat conducting plate 21; inner side 21e; ​​outer side 21f; first plate portion 211; height L2 of first plate portion; second plate portion 212; third plate portion 213; radiator 22; height L1 of radiator;

[0044] Heat pipe 3;

[0045] Box body 4;

[0046] First fastener 5;

[0047] Second fastener 6;

[0048] Outdoor unit 200; refrigerant pipe 300. DETAILED DESCRIPTION

[0049] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0050] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will appreciate the applicability of other processes and / or the use of other materials.

[0051] The electric control box 100 according to the first embodiment of the present invention will be described below with reference to the accompanying drawings.

[0052] According to the electric control box 100 of the embodiment of the present utility model, Figure 1 and Figure 2 As shown, the electric control box 100 includes: a circuit board 1 and a heat dissipation structure 2. The circuit board 1 includes a substrate 11 and a heating element 12 provided on the substrate 11. The heat dissipation structure 2 includes a first portion 2a, a second portion 2b, and a third portion 2c. The first portion 2a is provided on the heating element 12 and cooperates with the heating element 12 for heat transfer. The third portion 2c is provided separately from the first portion 2a and has a mating portion 2c1 for embedding a heat dissipation pipe 3. The second portion 2b is connected between the first portion 2a and the third portion 2c and transfers heat between the first portion 2a and the third portion 2c. The third portion 2c is provided separately from the first portion 2a, meaning that the third portion 2c is not adjacent to the first portion 2a, but can be connected to the first portion 2a via the second portion 2b.

[0053] A heating element 12 is provided on the substrate 11. When operating, the heating element 12 generates heat. As the power of the electric control box 100 increases, the heat generated by the heating element 12 also increases. Failure to dissipate the heat from the heating element 12 in a timely manner can affect the normal operation of the electric control box 100. Therefore, the electric control box 100 is provided with a heat dissipation structure 2. This heat dissipation structure 2 accelerates the heat dissipation of the heating element 12, thereby improving the operational reliability of the electric control box 100.

[0054] The heat dissipation structure 2 is embedded with a heat dissipation pipe 3. The temperature of the heat dissipation pipe 3 is relatively low. By using the heat dissipation pipe 3 to cool the heating element 12, the heat dissipation speed of the heating element 12 can be accelerated. In addition, the heat dissipation pipe 3 is embedded in the heat dissipation structure 2, which can improve the layout stability of the heat dissipation pipe 3.

[0055] In related technologies, a heat sink is placed directly opposite the heating element along the thickness of the substrate. Heat transfer occurs through contact between the heat sink and the heating element, which increases the size of the electrical control box along the thickness of the substrate and its volume. Furthermore, when the heat sink is subjected to force and shakes, it exerts a pulling force on the pins of the heating element, which can easily damage the heating element. For example, a pump driving a circulating refrigerant through a heat pipe causes the pipe to continuously vibrate, subjecting the pins of the heating element to a force perpendicular to the substrate. This can easily damage the heating element and reduce the reliability of the electrical control box.

[0056] The heat dissipation structure 2 of this embodiment of the utility model comprises a first portion 2a, a second portion 2b, and a third portion 2c. The first portion 2a is located in the thickness direction of the substrate 11 and cooperates with the heat-generating device 12 for heat transfer. The third portion 2c is provided with a heat pipe 3 for accelerating heat dissipation. The second portion 2b is connected between the first portion 2a and the second portion 2b. After the first portion 2a transfers heat with the heat-generating device 12, the heat is transferred to the third portion 2c through the second portion 2b. The third portion 2c accelerates heat dissipation, thereby improving the heat dissipation efficiency of the heat-generating device 12.

[0057] By separating the third portion 2c, where the heat pipe 3 is located, from the first portion 2a, the third portion 2c is staggered with the heating element 12, thereby reducing the size of the electrical control box 100 at the heating element 12 and facilitating a reduction in the volume of the electrical control box 100. Furthermore, more space is available for the third portion 2c. For example, the third portion 2c can be positioned closer to the substrate 11 than the first portion 2a, thereby reducing the size of the electrical control box 100 in the thickness direction of the substrate 11.

[0058] The third portion 2c does not directly contact the heating element 12. Instead, the third portion 2c makes contact with the heating element 12 at a distance through the second portion 2b and the first portion 2a. Therefore, the vibration generated by the heat pipe 3 is attenuated, reducing the pulling force on the pins of the heating element 12, thereby extending the service life of the heating element 12. Furthermore, compared to an arrangement in which the heat sink 22 is arranged directly opposite the heating element 12 along the thickness direction of the substrate 11, the heat dissipation structure 2 of the present invention includes the first portion 2a, the second portion 2b, and the third portion 2c. Fixing the heat dissipation structure 2 to the electrical control box 100 is relatively simple. For example, the second portion 2b is fixedly connected to the box body 4 of the electrical control box 100, thereby further reducing the vibration transmitted to the heating element 12.

[0059] According to the electric control box 100 of the embodiment of the present invention, by separating the third part 2c provided with the heat dissipation pipe 3 from the first part 2a, the third part 2c and the heating device 12 are staggered, which can not only reduce the size of the electric control box 100 in the thickness direction of the substrate 11, which is conducive to reducing the volume of the electric control box 100, but also reduce the pulling force on the pins of the heating device 12, which can extend the service life of the heating device 12 and improve the working reliability of the electric control box 100.

[0060] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the electric control box 100 further includes a box body 4 , in which the circuit board 1 and the heat dissipation structure 2 are both arranged. The box body 4 protects the circuit board 1 and the heat dissipation structure 2 .

[0061] It is worth mentioning that Figure 1 and Figure 2 Only the portion of the housing 4 located on the side of the substrate 11 facing away from the heating element 12 is shown; the portion of the housing 4 located on the side of the substrate 11 where the heating element 12 is located is not shown. The housing 4 of the electrical control box 100 is an enclosing structure that surrounds the circuit board 1 and the heat dissipation structure 2, preventing external dust or condensed water from contacting the circuit board 1 and improving the operational reliability of the electrical control box 100.

[0062] The electric control box 100 of the present invention dissipates heat from the circuit board 1 through the heat dissipation structure 2 embedded with the heat pipe 3. Therefore, the box body 4 can be set as a closed box body 4. Only the heat pipe 3 is used to dissipate heat from the heating element 12, and air cooling is not used for heat dissipation, which can further improve the safety of the electric control box 100.

[0063] Alternatively, the box body 4 may also be a structure that allows airflow to flow, which can not only use the heat pipe 3 to dissipate heat from the heating element 12 , but also use the airflow to dissipate heat from the heating element 12 , thereby improving the heat dissipation effect of the electric control box 100 .

[0064] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the heat dissipation structure 2 includes a heat conducting plate 21 and a radiator 22. The heat conducting plate 21 includes a first plate portion 211, a second plate portion 212 and a third plate portion 213. The first plate portion 211 constitutes a first part 2a, the second plate portion 212 constitutes a second part 2b, and the radiator 22 cooperates with the third plate portion 213 to jointly constitute a third part 2c. The matching portion 2c1 is formed between the radiator 22 and the third plate portion 213, or is formed on the radiator 22.

[0065] The first plate portion 211 of the heat conducting plate 21 is positioned on the heating element 12 and cooperates with the heating element 12 for heat transfer. The third plate portion 213 and the heat sink 22 together constitute the third portion 2c. The second plate portion 212 of the heat conducting plate 21 is connected between the first plate portion 211 and the third plate portion 213. After the first plate portion 211 exchanges heat with the heating element 12, the heat is transferred to the third plate portion 213 through the second plate portion 212. The third plate portion 213 then exchanges heat with the heat pipe 3 to accelerate heat dissipation, thereby improving the heat dissipation efficiency of the heating element 12.

[0066] Alternatively, as Figure 2 As shown, the mating portion 2c1 is formed between the heat sink 22 and the third plate portion 213, which together sandwich the heat pipe 3. The heat pipe 3, heat sink 22, and third plate portion 213 can be assembled after the first plate portion 211 is mated with the heating element 12. Alternatively, the heat pipe 3, heat sink 22, and third plate portion 213 can be assembled first, followed by the first plate portion 211 and heating element 12. The preferred method is to choose one based on actual needs.

[0067] Or, alternatively, as Figure 6 As shown, the matching portion 2c1 is formed on the radiator 22. After the heat pipe 3 and the radiator 22 have been pre-assembled, only the radiator 22 and the third plate portion 213 need to be assembled, which can save the steps of assembling the heat pipe 3 and facilitate operation.

[0068] It is worth noting that the heat pipe 3 can be part of another refrigerant component or a separate heat pipe 3. When the heat pipe 3 is part of another refrigerant component, the mating portion 2c1 can be formed between the radiator 22 and the third plate portion 213. After the heat conducting plate 21 is connected to the heating element 12, the heat pipe 3 is connected to the heat conducting plate 21. When the heat pipe 3 is a separate component, the mating portion 2c1 can be formed on the radiator 22, and the radiator 22 and heat pipe 3 are assembled to the heat conducting plate 21.

[0069] In some embodiments of the present invention, a first receiving groove for accommodating the heat pipe 3 is formed on the heat conducting plate 21, and a second receiving groove for accommodating the heat pipe 3 is formed on the radiator 22. The heat pipe 3 is arranged between the first receiving groove and the second receiving groove, so that the heat pipe 3 is embedded between the radiator 22 and the third plate portion 213. The contact area between the heat conducting plate 21 and the radiator 22 and the heat pipe 3 is large, the heat conducting plate 21 and the radiator 22 have good heat transfer performance, and the heat pipe 3 is effectively restrained.

[0070] In some embodiments of the present invention, the heat conducting plate 21 and the heat sink 22 are metal parts. Metal parts have good heat transfer performance and high structural strength, which is beneficial to improving the heat dissipation efficiency of the heat dissipation structure 2.

[0071] Optionally, the heat conducting plate 21 and the heat sink 22 are aluminum plates.

[0072] In some embodiments of the present invention, Figure 2 、 Figure 3 、 Figure 4 and Figure 6 As shown, the third plate portion 213 is located on the peripheral side of the first plate portion 211, and the plane where the side surface of the substrate 11 close to the first part 2a is located is taken as the reference plane 11a. The positive projection of the heat sink 22 on the reference plane 11a is located outside the outline range of the positive projection of the first plate portion 211 on the reference plane 11a.

[0073] It is worth noting that the third plate portion 213 is located on the peripheral side of the first plate portion 211, which means that it is located at a position perpendicular to the thickness direction of the substrate 11. The positive projection of the heat sink 22 on the reference plane 11a is the front direction of the attached Figure 1 The direction of the attached drawings is Figure 2 The thickness direction of the middle substrate 11.

[0074] Compared with the heating device 12, the radiator 22 is arranged on the peripheral side, which can reduce the size of the electric control box 100 in the thickness direction of the substrate 11, which is beneficial to reducing the volume of the electric control box 100; and compared with setting the third plate portion 213 on the thickness direction side of the substrate 11 of the first plate portion 211, the bending amplitude of the second plate portion 212 can be reduced, which facilitates the molding and assembly of the heat conducting plate 21.

[0075] The orthographic projection of the radiator 22 on the reference plane 11a is outside the contour range of the orthographic projection of the first plate portion 211 on the reference plane 11a. The radiator 22 is arranged away from the heating device 12, which provides a larger layout space for the radiator 22 and avoids interference with the heating device 12.

[0076] In some embodiments of the present invention, Figure 3 、 Figure 4 and Figure 6 As shown, the thickness of the heat conducting plate 21 is respectively an inner side 21e and an outer side 21f, the circuit board 1 is located on the inner side 21e of the first plate portion 211, the radiator 22 is plate-shaped and the thickness direction is consistent with the thickness direction of the third plate portion 213, and the radiator 22 is stacked on the inner side 21e of the third plate portion 213.

[0077] The thickness direction of the radiator 22 is consistent with the thickness direction of the third plate portion 213. The radiator 22 and the third plate portion 213 are evenly attached to each other, which can increase the contact area, facilitate heat transfer, and improve the heat dissipation effect.

[0078] The heat sink 22 is located on the inner side 21e of the third plate portion 213. Therefore, the distance between the outer surface of the third plate portion 213 and the reference plane 11a is greater than the distance between the outer surface of the heat sink 22 and the reference plane 11a. The thickness direction of the substrate 11 is defined as the height direction, and the heat sink's height L1 is lower than the height of the third plate portion 213. Given the same structure as the heat conducting plate 21, placing the heat sink 22 on the outer side 21f of the third plate portion 213 helps reduce the size of the heat dissipation structure 2 in the thickness direction of the substrate 11, compared to placing the heat sink 22 on the outer side 21f of the heat conducting plate 21.

[0079] The radiator 22 is installed on the side opposite to the circuit board 1, and the space available for installing the radiator 22 is relatively small. Therefore, when assembling the radiator 22, the refrigerant tube 300 and the heat conducting plate 21, the radiator 22 and the refrigerant tube 300 can be installed to the third plate portion 213 first, and then the heat conducting plate 21 can be connected to the heating device 12. This not only facilitates the installation of the radiator 22 and the heat pipe 3, but also avoids interference with the heating device 12 during the installation process, thereby reducing the force applied to the heating device 12.

[0080] In some embodiments of the present invention, Figure 3 As shown, the second plate portion 212 gradually extends in the direction from the first plate portion 211 to the third plate portion 213 in the direction away from the reference plane 11a, and the distance from the outer surface of the third plate portion 213 to the reference plane 11a is greater than the distance from the outer surface of the first plate portion 211 to the reference plane 11a.

[0081] The radiator 22 is stacked on the inner side 21e of the third plate portion 213. By arranging the third plate portion 213 farther away from the circuit board 1 than the first plate portion 211, the space in the direction of the inner side 21e of the third plate portion 213 can be increased, so that a larger installation space can be provided for the radiator 22, so that the setting position of the radiator 22 does not need to be too far away from the circuit board 1. The layout position can be flexibly selected, which is beneficial to the layout and installation of the radiator 22, and is beneficial to avoiding the circuit board 1, thereby improving the working reliability of the circuit board 1.

[0082] In some embodiments of the present invention, Figure 3 As shown, the height L1 of the radiator is not less than the height L2 of the first plate portion, the distance from the outer surface of the radiator 22 to the reference plane 11a is the height L1 of the radiator, and the distance from the outer surface of the first plate portion 211 to the reference plane 11a is the height L2 of the first plate portion.

[0083] The height L1 of the radiator is higher than the height L2 of the first plate portion, or the height L1 of the radiator is the same as the height L2 of the first plate portion. The third plate portion 213 is arranged away from the circuit board 1 along the outer side 21f direction compared to the first plate portion 211, and the dimension of the third plate portion 213 away from the circuit board 1 is larger to ensure that the height L1 of the radiator arranged on the inner side 21e of the third plate portion 213 is not less than the height L2 of the first plate portion.

[0084] The arrangement position of the third plate portion 213 can increase the space in the direction of the inner side 21e of the third plate portion 213. The heat sink 22 stacked on the inner side 21e of the third plate portion 213 can avoid other components on the substrate 11, further avoiding interference with the circuit board 1 and improving the working reliability of the circuit board 1.

[0085] In some embodiments of the present invention, Figure 4 As shown, the second plate portion 212 gradually extends toward the direction approaching the reference surface 11 a in the direction from the first plate portion 211 to the third plate portion 213 .

[0086] The distance between the outer surface of the third plate portion 213 and the reference plane 11a is smaller than the distance between the outer surface of the first plate portion 211 and the reference plane 11a. The radiator 22 is stacked on the inner side 21e of the third plate portion 213, which can reduce the overall height of the heat dissipation structure 2 and help reduce the volume of the electric control box 100.

[0087] In some embodiments of the present invention, Figure 4 As shown, the third plate portion 213 extends beyond the edge of the substrate 11 so that the orthographic projection of the third plate portion 213 on the reference plane 11a is located outside the contour range of the orthographic projection of the substrate 11 on the reference plane 11a, and at least a portion of the heat sink 22 extends toward the side of the substrate 11 that is away from the first plate portion 211 and exceeds the substrate 11.

[0088] The third plate portion 213 extends beyond the edge of the substrate 11 , and the substrate 11 does not interfere with the arrangement of the third plate portion 213 . The third plate portion 213 has a larger extendable dimension toward the inner side 21 e , which can further reduce the overall height of the heat dissipation structure 2 .

[0089] The heat sink 22 is arranged on the inner side 21e of the third plate portion 213. At least a portion of the heat sink 22 is arranged farther away from the first plate portion 211 than the base plate 11, so that the height L3 of the third portion is reduced, making full use of the internal space of the electric control box 100, which is conducive to reducing the volume of the electric control box 100.

[0090] In some embodiments of the present invention, Figure 6 As shown, the heat conducting plate 21 is a flat plate, and the second plate portion 212 is parallel to the reference plane 11 a.

[0091] The heat conducting plate 21 is a flat plate, and the first plate portion 211, the second plate portion 212 and the third plate portion 213 are all flat plates. The distance from the outer surface of the first plate portion 211 to the reference plane 11a, the distance from the outer surface of the second plate portion 212 to the reference plane 11a and the distance from the third plate portion 213 to the reference plane 11a are consistent, which not only improves the structural complexity of the heat conducting plate 21 and reduces the manufacturing difficulty, but also reduces the overall height of the heat dissipation structure 2.

[0092] In some embodiments of the present invention, Figure 6 As shown, the orthographic projection of the third plate portion 213 on the reference plane 11a is located within the outline of the orthographic projection of the substrate 11 on the reference plane 11a, the heat sink 22 is located on the side of the substrate 11 facing the heat conducting plate 21 in the thickness direction, and there is a gap between the heat sink 22 and the reference plane 11a.

[0093] like Figure 5 and Figure 6 As shown, in some embodiments, the substrate 11 has a larger dimension in the direction extending from the first plate portion 211 to the third plate portion 213. In the thickness direction of the heat conducting plate 21, the third plate portion 213 is located within the projection of the substrate 11. The heat sink 22 is located between the third plate portion 213 and the substrate 11, sandwiched between the third plate portion 213 and the substrate 11. A gap is provided between the heat sink 22 and the substrate 11, preventing interference with the substrate 11 and improving the reliability of the circuit board 1.

[0094] In some embodiments of the present invention, Figure 2 As shown, the thickness of the heat conducting plate 21 is respectively an inner side 21e and an outer side 21f, the circuit board 1 is located on the inner side 21e of the first plate portion 211, the radiator 22 is plate-shaped and the thickness direction is consistent with the thickness direction of the third plate portion 213, and the radiator 22 is stacked on the outer side 21f of the third plate portion 213.

[0095] The thickness direction of the radiator 22 is consistent with the thickness direction of the third plate portion 213. The radiator 22 and the third plate portion 213 are evenly attached to each other, which can increase the contact area, facilitate heat transfer, and improve the heat dissipation effect.

[0096] The inner side 21e of the third plate portion 213 is the side close to the circuit board 1. Therefore, compared with the inner side 21e of the third plate portion 213, the outer side 21f of the third plate portion 213 has a larger space. The radiator 22 is located on the outer side 21f of the third plate portion 213, which is beneficial to the arrangement and installation of the radiator 22 and to avoiding the circuit board 1.

[0097] When assembling the radiator 22, the heat pipe 3, and the heat conducting plate 21, the radiator 22 and the refrigerant pipe 300 can be first mounted on the third plate portion 213, and then the heat conducting plate 21 can be connected to the heating element 12. This facilitates the installation of the radiator 22 and the heat pipe 3, avoids interference with the heating element 12 during installation, and reduces the force applied to the heating element 12. Alternatively, the first plate portion 211 can be first connected to the heating element 12, and then the radiator 22, the heat pipe 3, and the third plate portion 213 can be assembled to reduce the difficulty of installing the heat pipe 3 and the heat dissipation structure 2, which cannot be moved.

[0098] In some embodiments of the present invention, Figure 2 As shown, the second plate portion 212 extends in the direction from the first plate portion 211 to the third plate portion 213, toward the direction close to the reference plane 11a, the height L1 of the radiator does not exceed the height L2 of the first plate portion, the distance from the outer surface of the radiator 22 to the reference plane 11a is the height L1 of the radiator, and the distance from the outer surface of the first plate portion 211 to the reference plane 11a is the height L2 of the first plate portion.

[0099] The distance between the outer surface of the third plate portion 213 and the reference plane 11 a is smaller than that between the outer surface of the first plate portion 211 and the reference plane 11 a . The height of the heat conducting plate 21 is relatively low, which helps to reduce the volume of the electric control box 100 .

[0100] Although the radiator 22 is arranged on the outer side 21f of the third plate portion 213, the height L1 of the radiator does not exceed the height L2 of the first plate portion, and the distance from the outer surface of the third portion 2c to the reference plane 11a does not exceed the distance from the outer surface of the first portion 2a to the reference plane 11a. This can reduce the overall height of the heat dissipation structure 2, which is beneficial to reducing the volume of the electrical control box 100.

[0101] In some embodiments of the present invention, Figure 2 As shown, the third plate portion 213 extends beyond the edge of the substrate 11 so that the orthographic projection of the third plate portion 213 on the reference plane 11a is located outside the contour range of the orthographic projection of the substrate 11 on the reference plane 11a, and at least a portion of the heat sink 22 extends toward the side of the substrate 11 that is away from the first plate portion 211 and exceeds the substrate 11.

[0102] The third plate portion 213 extends beyond the edge of the substrate 11 , and the substrate 11 does not interfere with the arrangement of the third plate portion 213 . The third plate portion 213 has a larger extendable dimension toward the inner side 21 e , which can further reduce the space occupied by the heat conducting plate 21 .

[0103] The heat sink 22 is arranged on the outer side 21f of the third plate portion 213, and the third plate portion 213 extends toward the inner side 21e with a larger dimension, so that at least a portion of the heat sink 22 is arranged further away from the first plate portion 211 than the substrate 11, so that the height L3 of the third portion is reduced, making full use of the internal space of the electric control box 100, which is conducive to reducing the volume of the electric control box 100.

[0104] In some embodiments of the present invention, Figure 2 、 Figure 3 、 Figure 4 and Figure 6 As shown, the third part 2c is located on the peripheral side of the first part 2a, and the plane where the surface of the side of the substrate 11 close to the first part 2a is located is taken as the reference plane 11a. The orthographic projection of the third part 2c on the reference plane 11a is located outside the outline range of the orthographic projection of the first part 2a on the reference plane 11a.

[0105] It is worth noting that the third part 2c is located on the circumferential side of the first part 2a, and the circumferential side refers to the position perpendicular to the thickness direction of the substrate 11. Compared with setting the third part 2c on the thickness direction side of the substrate 11 of the first part 2a, the bending degree of the second part 2b can be reduced, which facilitates the molding and assembly of the heat conducting plate 21.

[0106] The orthographic projection of the third portion 2c on the reference plane 11a is outside the contour range of the orthographic projection of the first portion 2a on the reference plane 11a. The third portion 2c is arranged away from the heating device 12, which provides a larger space for arranging the radiator 22 and reduces the interference with the heating device 12.

[0107] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the heat dissipation structure 2 includes a heat conducting plate 21 and a radiator 22. The heat conducting plate 21 includes a first plate portion 211, a second plate portion 212 and a third plate portion 213. The first plate portion 211 constitutes a first part 2a, the second plate portion 212 constitutes a second part 2b, and the radiator 22 cooperates with the third plate portion 213 to jointly constitute a third part 2c. The matching portion 2c1 is formed between the radiator 22 and the third plate portion 213, or is formed on the radiator 22.

[0108] In other embodiments of the present invention, the heat dissipation structure 2 includes a first heat conducting plate and a second heat conducting plate, the structures of the first heat conducting plate and the second heat conducting plate are consistent and are arranged in parallel, the first heat conducting plate and the second heat conducting plate together form a first part 2a, a second part 2b and a third part 2c, and the matching portion 2c1 is formed between the first heat conducting plate and the second heat conducting plate, or is formed separately on one of the first heat conducting plate and the second heat conducting plate.

[0109] In some embodiments of the present invention, Figure 2 、 Figure 4 and Figure 6 As shown, the height L3 of the third part does not exceed the height L4 of the first part, wherein the thickness of the heat dissipation structure 2 is respectively on the inner side 21e and the outer side 21f, the circuit board 1 is located on the inner side 21e of the first part 2a, the distance from the outer surface of the first part 2a to the reference plane 11a is the height L4 of the first part, and the distance from the outer surface of the third part 2c to the reference plane 11a is the height L3 of the third part.

[0110] The height L3 of the third portion is less than the height L4 of the first portion, or the height L3 of the third portion is equal to the height L4 of the first portion. By setting the third portion 2c of the heat dissipation structure 2 no higher than the first portion 2a, the size of the heat dissipation structure 2 in the thickness direction of the substrate 11 can be reduced, reducing the space occupied, and facilitating a reduction in the volume of the electric control box 100.

[0111] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, the height L3 of the third portion does not exceed the height L5 of the heating device, and the distance from the end of the heating device 12 away from the substrate 11 to the reference surface 11 a is the height L5 of the heating device.

[0112] The heating device 12 is located on the inner side 21e of the first part 2a. The height L3 of the third part not only does not exceed the height L4 of the first part, but also does not exceed the height L5 of the heating device. This can further reduce the size of the heat dissipation structure 2 in the thickness direction of the substrate 11, reduce the space occupied, and help reduce the volume of the electrical control box 100.

[0113] In some embodiments of the present invention, Figure 2 、 Figure 4 and Figure 6 As shown, the heat dissipation structure 2 includes a heat conducting plate 21 and a radiator 22. The heat conducting plate 21 includes a first plate portion 211, a second plate portion 212 and a third plate portion 213. The first plate portion 211 constitutes a first portion 2a, and the second plate portion 212 constitutes a second portion 2b. The thickness of the heat conducting plate 21 is respectively an inner side 21e and an outer side 21f. The circuit board 1 is located on the inner side 21e of the first plate portion 211. The radiator 22 is plate-shaped and its thickness direction is consistent with the thickness direction of the third plate portion 213. The radiator 22 is stacked on The inner side 21e or the outer side 21f of the third plate portion 213, the radiator 22 and the third plate portion 213 cooperate to jointly constitute the third part 2c, and the matching portion 2c1 is formed between the radiator 22 and the third plate portion 213, or is formed on the radiator 22, wherein the height L1 of the radiator does not exceed the height L2 of the first plate portion, the distance from the outer surface of the radiator 22 to the reference plane 11a is the height L1 of the radiator, and the distance from the outer surface of the first plate portion 211 to the reference plane 11a is the height L2 of the first plate portion.

[0114] The first plate portion 211 of the heat conducting plate 21 is positioned on the heating element 12 and cooperates with the heating element 12 for heat transfer. The third plate portion 213 and the heat sink 22 together constitute the third portion 2c. The second plate portion 212 of the heat conducting plate 21 is connected between the first plate portion 211 and the third plate portion 213. After the first plate portion 211 exchanges heat with the heating element 12, the heat is transferred to the third plate portion 213 through the second plate portion 212. The third plate portion 213 then exchanges heat with the heat pipe 3 to accelerate heat dissipation, thereby improving the heat dissipation efficiency of the heating element 12.

[0115] Alternatively, as Figure 2 As shown, the matching portion 2c1 is formed between the heat sink 22 and the third plate portion 213, and the heat sink 22 and the third plate portion 213 are sandwiched together to form the heat pipe 3. Alternatively, as Figure 6 As shown, the matching portion 2c1 is formed on the radiator 22. After the heat pipe 3 and the radiator 22 have been pre-assembled, only the radiator 22 and the third plate portion 213 need to be assembled, which can save the steps of assembling the heat pipe 3 and facilitate operation.

[0116] Alternatively, as Figure 2 As shown, the heat sink 22 is stacked on the outer side 21f of the third plate portion 213; or, alternatively, as shown Figure 4 and Figure 6 As shown, the heat sink 22 is stacked on the inner side 21e of the third plate portion 213. Regardless of whether the heat sink 22 is located on the inner side 21e or the outer side 21f of the third plate portion 213, the heat sink's height L1 does not exceed the height L2 of the first plate portion. This reduces the size of the heat dissipation structure 2 in the thickness direction of the substrate 11, minimizes the space occupied, and helps reduce the volume of the electric control box 100.

[0117] In some embodiments of the present invention, the heat sink 22 is stacked on the outer side 21f of the third plate portion 213, such as Figure 2 As shown, the second plate portion 212 extends from the first plate portion 211 to the third plate portion 213 in a direction approaching the reference plane 11a, and the distance between the outer surface of the third plate portion 213 and the reference plane 11a is shorter than the distance between the outer surface of the first plate portion 211 and the reference plane 11a. By lowering the height of the third plate portion 213, the height L1 of the heat sink disposed on the outer side 21f of the third plate portion 213 is shorter than the height L2 of the first plate portion.

[0118] In other embodiments of the present invention, the heat sink 22 is stacked on the inner side 21e of the third plate portion 213, and the height L1 of the heat sink is necessarily smaller than the height of the third plate portion 213. Therefore, it is only necessary to set the height of the third plate portion 213 to be no higher than the height L2 of the first plate portion. Figure 4As shown, the second plate portion 212 gradually extends from the first plate portion 211 to the third plate portion 213 in the direction close to the reference surface 11a, so that the distance from the outer surface of the third plate portion 213 to the reference surface 11a is smaller than the distance from the outer surface of the first plate portion 211 to the reference surface 11a. Alternatively, Figure 6 As shown, the heat conducting plate 21 is set as a flat plate, and the distance from the outer surface of the first plate portion 211 to the reference surface 11 a is consistent with the distance from the third plate portion 213 to the reference surface 11 a.

[0119] In some embodiments of the present invention, Figure 4 As shown, the third plate portion 213 is arranged closer to the inner side 21e than the first plate portion 211, and the third plate portion 213 extends to a greater extent, so that the outer surface of the radiator 22 stacked on the third plate portion 213 and the outer surface of the first plate portion 211 are on both sides of the reference plane 11a. It is worth noting that the height L1 of the radiator and the height L2 of the first plate portion are both based on one side of the reference plane 11a, that is, the comparison is made when the outer surface of the first plate portion 211 and the outer surface of the radiator 22 are both on one side of the reference plane 11a. When the outer surface of the radiator 22 is both on the other side of the reference plane 11a, the greater the distance between the outer surface of the radiator 22 and the reference plane 11a, the smaller the height L1 of the radiator is than the height L2 of the first plate portion. Therefore, when the radiator 22 is located on the other side of the reference plane 11a and the distance between the outer surface of the radiator 22 and the reference plane 11a is greater than the distance between the outer surface of the first plate portion 211 and the reference plane 11a, it is also within the protection scope of the present invention.

[0120] In some embodiments of the present invention, Figure 2 、 Figure 4 and Figure 6 As shown, the height L1 of the heat sink does not exceed the height L5 of the heating device, and the distance from the end of the heating device 12 away from the substrate 11 to the reference surface 11 a is the height L5 of the heating device.

[0121] The heating device 12 is located on the inner side 21e of the first part 2a. The height L1 of the radiator not only does not exceed the height L4 of the first part, but also does not exceed the height L5 of the heating device. This can further reduce the size of the heat dissipation structure 2 in the thickness direction of the substrate 11, reduce the space occupied, and help reduce the volume of the electrical control box 100.

[0122] In some embodiments of the present invention, Figure 2 、 Figure 3 and Figure 4As shown, the third portion 2c extends beyond the edge of the substrate 11, so that the orthographic projection of the third portion 2c on the reference plane 11a is located outside the outline of the orthographic projection of the substrate 11 on the reference plane 11a. The third portion 2c is arranged away from the heating element 12, which provides more space for the layout of the heat sink 22 and reduces the possibility of interference with the heating element 12.

[0123] In other embodiments of the present invention, Figure 5 and Figure 6 As shown, the substrate 11 is larger in the extension direction from the first plate portion 211 to the third plate portion 213 , and the orthographic projection of the third portion 2c on the reference plane 11a is within the contour range of the orthographic projection of the substrate 11 on the reference plane 11a .

[0124] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, at least a portion of the heat sink 22 extends beyond the base plate 11 toward the side of the base plate 11 facing away from the first portion 2 a .

[0125] At least part of the heat sink 22 is disposed further away from the first plate portion 211 than the base plate 11 , so that the height L3 of the third portion is reduced, fully utilizing the internal space of the electric control box 100 and facilitating reduction in the volume of the electric control box 100 .

[0126] In some embodiments of the present invention, Figure 7 As shown, the second part 2b is bent from one side of the substrate 11 in the thickness direction to the other side of the substrate 11 in the thickness direction, so that the third part 2c and the first part 2a are located on both sides of the thickness direction of the substrate 11. The heat dissipation structure includes a heat conducting plate 21 and a radiator 22. The heat conducting plate 21 includes a third plate portion 213. The radiator 22 cooperates with the third plate portion 213 to jointly constitute the third part 2c. The radiator 22 is arranged on the side of the third plate portion 213 close to or away from the substrate 11.

[0127] The first portion 2a and the third portion 2c are located on either side of the substrate 11 in the thickness direction, reducing the space occupied perpendicular to the thickness of the substrate 11. Furthermore, the third portion 2c is connected to the first portion 2a via the bent second portion 2b. The third portion 2c is further away from the heating element 12, reducing the pulling force on the pins of the heating element 12 and thereby extending the service life of the heating element 12.

[0128] like Figure 7 As shown, the heat sink 22 may be disposed on a side of the third plate portion 213 away from the substrate 11 ; alternatively, the heat sink 22 may also be disposed on a side of the third plate portion 213 close to the substrate.

[0129] In some embodiments of the present invention, Figure 4As shown, the base plate 11 and the first plate portion 211 are fixedly connected by a first fastener 5 , and the heat sink 22 and the third plate portion 213 are fixedly connected by a second fastener 6 .

[0130] like Figure 2 As shown, in the first embodiment of the present application, the heat dissipation structure 2 includes a heat conducting plate 21 and a heat sink 22. The heat conducting plate 21 includes a first plate portion 211, a second plate portion 212, and a third plate portion 213. The first plate portion 211 constitutes the first portion 2a, and the second plate portion 212 constitutes the second portion 2b. The thickness of the heat conducting plate 21 is defined by an inner side 21e and an outer side 21f, respectively. The circuit board 1 is located on the inner side 21e of the first plate portion 211. The heat sink 22 is plate-shaped, and its thickness direction coincides with the thickness direction of the third plate portion 213. The heat sink 22 is stacked on the outer side 21f of the third plate portion 213, and the heat sink 22 and the third plate portion 213 cooperate to form the third portion 2c. The second plate portion 212 gradually extends from the first plate portion 211 to the third plate portion 213, toward the reference surface 11a. The heat sink's height L1 does not exceed the height L2 of the first plate portion, thereby reducing the thickness of the heat dissipation structure 2 in the substrate 11 and minimizing space usage.

[0131] like Figure 3 As shown, in the second embodiment of the present application, the second plate portion 212 gradually extends in the direction from the first plate portion 211 to the third plate portion 213 in the direction away from the reference plane 11a, the distance from the outer surface of the third plate portion 213 to the reference plane 11a is greater than the distance from the outer surface of the first plate portion 211 to the reference plane 11a, and the heat sink 22 is stacked on the inner side 21e of the third plate portion 213.

[0132] like Figure 4 As shown, in the third embodiment of the present application, the second plate portion 212 gradually extends from the first plate portion 211 to the third plate portion 213 in a direction close to the reference surface 11a, and the heat sink 22 is stacked on the inner side 21e of the third plate portion 213. The height of the third plate portion 213 is set to be no higher than the height L2 of the first plate portion.

[0133] like Figure 6 As shown, in embodiment four of the present application, the radiator 22 is stacked on the inner side 21e of the third plate portion 213, the heat conducting plate 21 is a flat plate, and the distance from the outer surface of the first plate portion 211 to the reference plane 11a is consistent with the distance from the third plate portion 213 to the reference plane 11a.

[0134] like Figure 7As shown, in embodiment five of the present application, the second part 2b is bent from one side of the substrate 11 in the thickness direction to the other side of the substrate 11 in the thickness direction, so that the third part 2c and the first part 2a are located on both sides of the thickness direction of the substrate 11, and the heat dissipation structure includes a heat conducting plate 21 and a radiator 22. The heat conducting plate 21 includes a third plate portion 213. The radiator 22 cooperates with the third plate portion 213 to jointly constitute the third part 2c. The radiator 22 is arranged on the side of the third plate portion 213 away from the substrate 11.

[0135] The air conditioner 1000 according to the second aspect of the present invention will be described below with reference to the accompanying drawings.

[0136] The air conditioner 1000 according to the embodiment of the present invention includes the electric control box 100 according to the first aspect of the present invention.

[0137] According to the air conditioner 1000 of the embodiment of the present invention, by applying the electric control box 100 of the first aspect, the working reliability of the air conditioner 1000 can be improved.

[0138] In some embodiments of the present invention, Figure 8 As shown, the electric control box 100 is provided in the outdoor unit 200 of the air conditioner 1000 , and at least a portion of the refrigerant pipe 300 in the outdoor unit 200 serves as the heat dissipation pipe 3 .

[0139] The refrigerant pipe 300 in the outdoor unit 200 is used as the heat dissipation pipe 3 to dissipate heat from the electric control box 100, without the need for additional heat dissipation components to cooperate with the electric control box 100. This reduces manufacturing costs and improves the operating reliability of the air conditioner 1000.

[0140] In some embodiments of the present invention, the air conditioner 1000 includes: a compressor, a condenser, an evaporator and a throttling device. The condenser is arranged on the first refrigerant flow path from the exhaust port of the compressor to the throttling device, and the evaporator is arranged on the second refrigerant flow path from the throttling device to the return air port of the compressor. The refrigerant pipe 300 of the second refrigerant flow path located in the outdoor unit 200 is embedded in the mating part 2c1.

[0141] The compressor compresses the refrigerant into a high-temperature, high-pressure gaseous refrigerant. This high-temperature, high-pressure gaseous refrigerant is discharged from the compressor's exhaust port and flows along the first refrigerant flow path to the condenser. The refrigerant liquefies in the condenser, releasing heat and heating the airflow passing through it. The liquefied, low-temperature, high-pressure liquid refrigerant then flows along the first refrigerant flow path to the throttling device. The throttling device reduces the refrigerant's pressure, and the low-temperature, low-pressure liquid refrigerant flows along the second refrigerant flow path to the evaporator. The refrigerant vaporizes in the evaporator, absorbing heat and cooling the airflow. The vaporized, low-temperature, low-pressure gaseous refrigerant then flows back to the compressor along the second refrigerant flow path.

[0142] The refrigerant in the second refrigerant flow path is a low-temperature refrigerant, so the refrigerant pipe 300 located in the outdoor unit 200 of the second refrigerant flow path is embedded in the matching part 2c1 as a heat dissipation pipe 3 to dissipate heat from the electrical control box 100, thereby improving the heat dissipation efficiency of the electrical control box 100.

[0143] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0144] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0145] In this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0146] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0147] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0148] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electric control box, characterized in that: include: A circuit board, comprising a substrate and a heating element disposed on the substrate; The heat dissipation structure includes a first part, a second part and a third part. The first part is arranged on the heating device and cooperates with the heating device for heat transfer. The third part is arranged separately from the first part, and the third part has a matching part for embedding a heat dissipation pipe. The second part is connected between the first part and the third part, and transfers heat between the first part and the third part.

2. The electric control box according to claim 1, characterized in that: The heat dissipation structure includes a heat conducting plate and a radiator, the heat conducting plate includes a first plate portion, a second plate portion and a third plate portion, the first plate portion constitutes the first part, the second plate portion constitutes the second part, the radiator and the third plate portion cooperate to jointly constitute the third part, and the matching portion is formed between the radiator and the third plate portion, or formed on the radiator.

3. The electric control box according to claim 2, characterized in that: The third plate portion is located on the peripheral side of the first plate portion, and the plane where the side surface of the substrate close to the first part is located is used as the reference plane. The orthographic projection of the radiator on the reference plane is outside the outline range of the orthographic projection of the first plate portion on the reference plane.

4. The electric control box according to claim 3, characterized in that: The thickness of the heat conducting plate is respectively on the inner side and the outer side. The circuit board is located on the inner side of the first plate portion. The radiator is plate-shaped and its thickness direction is consistent with the thickness direction of the third plate portion. The radiator is stacked on the inner side of the third plate portion.

5. The electric control box according to claim 4, characterized in that: The second plate portion gradually extends in a direction away from the reference plane in a direction from the first plate portion to the third plate portion.

6. The electric control box according to claim 5, characterized in that: The height of the radiator is not less than the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

7. The electric control box according to claim 4, characterized in that: The second plate portion gradually extends toward the reference plane in a direction from the first plate portion to the third plate portion.

8. The electric control box according to claim 7, characterized in that: The third plate portion extends beyond the edge of the substrate so that the orthographic projection of the third plate portion on the reference plane is outside the contour range of the orthographic projection of the substrate on the reference plane, and at least a portion of the heat sink extends beyond the substrate toward the side of the substrate facing away from the first plate portion.

9. The electric control box according to claim 4, characterized in that: The heat conducting plate is a flat plate, and the second plate portion is parallel to the reference plane.

10. The electric control box according to claim 9, characterized in that: The orthographic projection of the third plate portion on the reference plane is located within the outline of the orthographic projection of the substrate on the reference plane. The heat sink is located on the side of the substrate facing the heat conducting plate in the thickness direction, and there is a gap between the heat sink and the reference plane.

11. The electric control box according to claim 3, characterized in that: The thickness of the heat conducting plate is respectively on the inner side and the outer side. The circuit board is located on the inner side of the first plate portion. The radiator is plate-shaped and its thickness direction is consistent with the thickness direction of the third plate portion. The radiator is stacked on the outer side of the third plate portion.

12. The electric control box according to claim 11, characterized in that: The second plate portion extends in a direction from the first plate portion to the third plate portion in a direction close to the reference plane, the height of the radiator does not exceed the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

13. The electric control box according to claim 12, characterized in that: The third plate portion extends beyond the edge of the substrate so that the orthographic projection of the third plate portion on the reference plane is outside the contour range of the orthographic projection of the substrate on the reference plane, and at least a portion of the heat sink extends beyond the substrate toward the side of the substrate facing away from the first plate portion.

14. The electric control box according to claim 1, characterized in that: The third part is located on the peripheral side of the first part, and the plane of the side surface of the substrate close to the first part is used as the reference plane. The orthographic projection of the third part on the reference plane is outside the outline range of the orthographic projection of the first part on the reference plane.

15. The electric control box according to claim 14, characterized in that: The height of the third part does not exceed the height of the first part, wherein the thickness of the heat dissipation structure is respectively on the inner side and the outer side, the circuit board is located on the inner side of the first part, the distance from the outer surface of the first part to the reference plane is the height of the first part, and the distance from the outer surface of the third part to the reference plane is the height of the third part.

16. The electric control box according to claim 15, characterized in that: The height of the third portion does not exceed the height of the heating device, and the distance from the end of the heating device away from the substrate to the reference plane is the height of the heating device.

17. The electric control box according to claim 14, characterized in that:

19. The heat dissipation structure of claim 18, wherein the heat dissipation structure comprises a heat conducting plate and a radiator, the heat conducting plate comprising a first plate portion, a second plate portion and a third plate portion, the first plate portion constituting the first part, the second plate portion constituting the second part, the thickness of the heat conducting plate being on the inner side and the outer side respectively, the circuit board being located on the inner side of the first plate portion, the radiator being plate-shaped and the thickness direction being consistent with the thickness direction of the third plate portion, the radiator being stacked on the inner side or the outer side of the third plate portion, the radiator and the third plate portion cooperating to jointly constitute the third part, the cooperating portion being formed between the radiator and the third plate portion, or on the radiator, wherein the height of the radiator does not exceed the height of the first plate portion, the distance from the outer surface of the radiator to the reference plane is the height of the radiator, and the distance from the outer surface of the first plate portion to the reference plane is the height of the first plate portion.

18. The electric control box according to claim 17, characterized in that: The height of the heat sink does not exceed the height of the heating device, and the distance from one end of the heating device away from the substrate to the reference plane is the height of the heating device.

19. The electric control box according to any one of claims 14 to 18, characterized in that: The third portion extends beyond the edge of the substrate, so that an orthographic projection of the third portion on the reference plane is outside a contour range of an orthographic projection of the substrate on the reference plane.

20. The electric control box according to claim 17 or 18, characterized in that: At least a portion of the heat sink extends beyond the base plate toward a side of the base plate facing away from the first portion.

21. The electric control box according to claim 1, characterized in that: The second part is bent from one side of the substrate in the thickness direction to the other side of the substrate in the thickness direction, so that the third part and the first part are located on both sides of the thickness direction of the substrate; the heat dissipation structure includes a heat conducting plate and a radiator, the heat conducting plate includes a third plate portion, the radiator cooperates with the third plate portion to jointly constitute the third part, and the radiator is arranged on the side of the third plate portion close to or away from the substrate.

22. An air conditioner, characterized in that: include: An electric control box according to any one of claims 1 to 21.

23. The air conditioner according to claim 22, characterized in that The electric control box is arranged in the outdoor unit of the air conditioner, and at least a part of the refrigerant pipe in the outdoor unit serves as the heat dissipation pipe.

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