Heat dissipation structure of embedded server

Abstract

The utility model discloses a heat dissipation structure of an embedded server, which comprises a server shell, a mainboard is fixedly connected inside the server shell, a switch button is fixedly connected to the front side of the left side of the server shell, and a movable plate is movably connected to the rear side of the server shell. By using the heat dissipation mechanism, heat dissipation of the mainboard in the server shell is enhanced, damage to the mainboard caused by overheating of the mainboard after long-time use is avoided, by using the clamping assembly, when a refrigeration part is installed on the mainboard, the mainboard is rapidly and fixedly installed, and the server shell has the advantage of enhancing heat dissipation; the problems that due to the fact that the embedded server is small in size, a cooling fan of the embedded server cannot well cool the embedded server, high temperature can be generated in the embedded server after the embedded server is used for a long time, internal parts can be damaged, the use effect of the embedded server is poor, and the use effect of the embedded server is reduced are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to a heat dissipation structure of an embedded server. Background Art

[0002] An embedded server is a server integrated into a specific device or system. It has the following characteristics: to adapt to the embedded environment, its hardware size is usually small, it can run stably under limited energy supply, and it is optimized for specific application scenarios and tasks. For example, it is used for data acquisition and device management in industrial automation control. For example, in smart home systems, embedded servers can be embedded in smart gateways to achieve centralized control and data processing of various smart devices. For example, in medical equipment, embedded servers can process and transmit patients' physiological data in real time.

[0003] The existing technical solutions have the following defects: due to the small size of the embedded server, its built-in cooling fan cannot dissipate heat well, and after long-term use, high temperature will be generated inside, causing internal parts to be damaged, making the use effect of the embedded server poor and reducing the use effect of the embedded server. Utility Model Content

[0004] In order to solve the problems raised in the above-mentioned background technology, the purpose of the present invention is to provide a heat dissipation structure for an embedded server, which has the advantage of enhanced heat dissipation and solves the problem that due to the small size of the embedded server, its own cooling fan cannot dissipate heat well, and after long-term use, high temperature will be generated inside the server, causing damage to internal parts, making the use effect of the embedded server poor and reducing the use effect of the embedded server.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a heat dissipation structure for an embedded server, comprising a server housing, a mainboard fixedly connected to the interior of the server housing, a switch button fixedly connected to the front side of the left side of the server housing, a movable plate movably connected to the rear side of the server housing, an air outlet provided on the left side of the server housing, an air inlet provided on the right side of the server housing, a heat dissipation mechanism provided inside the server housing, and a clamping assembly provided inside the server housing.

[0006] As a preferred embodiment of the present invention, the heat dissipation mechanism includes a heat dissipation fan, and the number of the heat dissipation fans is two. The right side of the heat dissipation fan is fixedly connected to the output end of the air inlet, the right side of the heat dissipation fan is fixedly connected to a filter, and the filter is fixedly connected to the output end of the air inlet, the inner side of the heat dissipation fan is fixedly connected to a circulation part, the front and rear sides of the circulation part are fixedly connected to a heat dissipation part, the right side of the heat dissipation part is fixedly connected to the left side of the heat dissipation fan, the output end of the circulation part is connected to a delivery pipe, the output end of the delivery pipe is connected to a refrigeration part, the output end of the refrigeration part is connected to an output pipe, and the output end of the output pipe is connected to the input end of the circulation part.

[0007] As a preferred embodiment of the present invention, the clamping assembly includes a sliding rod, and the number of the sliding rods is several. The inner side of the sliding rod is slidably connected to the outer side of the refrigeration component. A spring is fixedly sleeved on the surface of the sliding rod, and the spring is fixedly connected to the inner wall of the refrigeration component. The outer side of the sliding rod is fixedly connected to a pulling member.

[0008] As a preferred embodiment of the present invention, a groove is provided on the surface of the pulling member, and the groove is located on the top of the main board.

[0009] As a preferred embodiment of the present invention, the top and the bottom of the movable plate are rotatably connected with bolts, and the number of the bolts is several.

[0010] As a preferred embodiment of the present invention, handles are fixedly connected to the left and right sides of the front side of the server housing, and the handles are located on the front side of the movable panel.

[0011] As a preferred embodiment of the present invention, the top and bottom of the handle are both provided with openings, and the openings are located on the front side of the main board.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] The heat is then blown away by the fan, and the heat is then blown away by the fan. The heat is blown away by the fan, and the heat is blown away by the fan. The heat is blown away by the fan, and the heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat is blown away by the fan. The heat

[0014] 2. The utility model sets a heat dissipation mechanism. By starting the refrigeration component, the bottom of the refrigeration component absorbs the temperature generated by the motherboard processor, transfers the heat to the circulation component through the output end of the output pipe, and the circulation component transfers the heat to the heat dissipation component respectively. The heat circulating inside the heat dissipation component is blown by the heat dissipation fan to reduce the internal heat and then flow into the refrigeration component through the circulation component and the delivery pipe, thereby quickly cooling the motherboard and improving the heat dissipation effect inside the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a rear view of the server housing of the present invention;

[0017] Figure 3 A half-section view of the server housing of the present invention;

[0018] Figure 4 A three-dimensional diagram of the mainboard of the present utility model;

[0019] Figure 5 It is a half-section view of the refrigeration component of the present utility model.

[0020] In the figure: 1. Server housing; 2. Main board; 3. Switch button; 4. Movable panel; 5. Air outlet; 6. Air inlet; 7. Heat dissipation mechanism; 71. Cooling fan; 72. Filter; 73. Circulation component; 74. Heat dissipation component; 75. Delivery pipe; 76. Refrigeration component; 77. Output pipe; 8. Clamping assembly; 81. Slide rod; 82. Spring; 83. Pulling member; 9. Groove; 10. Bolt; 11. Handle; 12. Opening. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] like Figures 1 to 5 As shown, the utility model provides a heat dissipation structure of an embedded server, including a server shell 1, a mainboard 2 is fixedly connected to the inside of the server shell 1, a switch button 3 is fixedly connected to the front side of the left side of the server shell 1, a movable plate 4 is movably connected to the rear side of the server shell 1, an air outlet 5 is opened on the left side of the server shell 1, an air inlet 6 is opened on the right side of the server shell 1, a heat dissipation mechanism 7 is arranged inside the server shell 1, and a clamping assembly 8 is arranged inside the server shell 1.

[0023] refer to Figure 5 The heat dissipation mechanism 7 includes a heat dissipation fan 71. There are two heat dissipation fans 71. The right side of the heat dissipation fan 71 is fixedly connected to the output end of the air inlet 6. The right side of the heat dissipation fan 71 is fixedly connected to a filter screen 72. The filter screen 72 is fixedly connected to the output end of the air inlet 6. The inner side of the heat dissipation fan 71 is fixedly connected to a circulation member 73. The front and rear sides of the circulation member 73 are fixedly connected to a heat dissipation member 74. The right side of the heat dissipation member 74 is fixedly connected to the left side of the heat dissipation fan 71. The output end of the circulation member 73 is connected to a delivery pipe 75. The output end of the delivery pipe 75 is connected to a refrigeration member 76. The output end of the refrigeration member 76 is connected to an output pipe 77. The output end of the output pipe 77 is connected to the input end of the circulation member 73.

[0024] As a technical optimization solution of the present invention, a heat dissipation mechanism 7 is provided and the refrigeration component 76 is started. The bottom of the refrigeration component 76 absorbs the temperature generated by the processor of the mainboard 2, and the heat is transferred to the circulation component 73 through the output end of the output pipe 77. The circulation component 73 transfers the heat to the heat dissipation component 74 respectively. The heat circulating inside the heat dissipation component 74 is blown by the heat dissipation fan 71 to reduce the internal heat and then flow into the direction of the refrigeration component 76 through the circulation component 73 and the delivery pipe 75, thereby quickly cooling the mainboard 2 and improving the heat dissipation effect inside the server.

[0025] refer to Figure 4 The clamping assembly 8 includes a sliding rod 81, and the number of the sliding rod 81 is several. The inner side of the sliding rod 81 is slidably connected to the outer side of the refrigeration component 76. A spring 82 is fixedly sleeved on the surface of the sliding rod 81. The spring 82 is fixedly connected to the inner wall of the refrigeration component 76. The outer side of the sliding rod 81 is fixedly connected to a pulling member 83.

[0026] As a technical optimization solution of the present invention, by setting a clamping assembly 8, when the heat dissipation mechanism 7 is installed, by pulling the pulling piece 83, the pulling piece 83 drives the slide bar 81 and the spring 82 to move toward the outside of the refrigeration component 76 and squeeze the spring 82. After the refrigeration component 76 is clamped to the top of the main board 2, the pulling piece 83 is released, and the spring 82 is reset to push the slide bar 81 to fix the main board 2, thereby improving the fixing effect of the refrigeration component 76 and the main board 2.

[0027] refer to Figure 5 A groove 9 is formed on the surface of the pulling member 83 , and the groove 9 is located on the top of the main board 2 .

[0028] As a technical optimization solution of the present invention, by providing the groove 9 , when pulling the pulling member 83 , the pulling effect of the pulling member 83 can be improved by inserting a finger into the inside of the groove 9 and pulling.

[0029] refer to Figure 2 The top and bottom of the movable plate 4 are both rotatably connected with bolts 10, and the number of bolts 10 is several.

[0030] As a technical optimization solution of the present invention, by providing the bolts 10 , the movable plate 4 can be disassembled by screwing the bolts 10 when maintaining the server, thereby improving the maintenance efficiency of the server.

[0031] refer to Figure 2 The left and right sides of the front side of the server housing 1 are fixedly connected with handles 11, and the handles 11 are located on the front side of the movable plate 4.

[0032] As a technical optimization solution of the present invention, by providing the handle 11, the embedded server can be easily pulled out through the handle 11 when maintaining the server, thereby improving the maintenance effect of the server.

[0033] refer to Figure 1 The top and bottom of the handle 11 are both provided with openings 12 , and the openings 12 are located on the front side of the main board 2 .

[0034] As a technical optimization solution of the present invention, by providing the opening 12, when fixing the embedded server, the server can be quickly fixed through the opening 12, thereby improving the fixing effect of the server.

[0035] The working principle and usage process of the present invention are as follows: when in use, the refrigeration component 76 is started, and the bottom of the refrigeration component 76 absorbs the temperature generated by the processor of the mainboard 2, and transmits the heat to the circulation component 73 through the output end of the output tube 77. The circulation component 73 transmits the heat to the heat sink 74 respectively, and the heat circulating inside the heat sink 74 is blown by the heat dissipation fan 71 to reduce the internal heat and then flow into the refrigeration component 76 through the circulation component 73 and the delivery pipe 75, so as to quickly cool down the mainboard 2. When the heat dissipation mechanism 7 is installed, by pulling the pulling member 83, the pulling member 83 drives the sliding rod 81 and the spring 82 to move toward the outside of the refrigeration component 76 and squeeze the spring 82. After the refrigeration component 76 is clamped to the top of the mainboard 2, the pulling member 83 is released, and the spring 82 is reset to push the sliding rod 81 to fix the mainboard 2.

[0036] In summary, the heat dissipation structure of the embedded server, through the coordinated use of the server housing 1, the mainboard 2, the switch button 3, the movable plate 4, the air outlet 5, the air inlet 6, the heat dissipation mechanism 7 and the clamping assembly 8, solves the problem that due to the small size of the embedded server, its own heat dissipation fan cannot dissipate heat well, and after long-term use, high temperature will be generated inside the server, causing damage to the internal parts, making the use effect of the embedded server poor, and reducing the use effect of the embedded server.

[0037] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for an embedded server, comprising a server housing (1), characterized in that: The server housing (1) is fixedly connected to a mainboard (2), the front side of the left side of the server housing (1) is fixedly connected to a switch button (3), the rear side of the server housing (1) is movably connected to a movable plate (4), the left side of the server housing (1) is provided with an air outlet (5), the right side of the server housing (1) is provided with an air inlet (6), the interior of the server housing (1) is provided with a heat dissipation mechanism (7), and the interior of the server housing (1) is provided with a clamping assembly (8).

2. The heat dissipation structure of an embedded server according to claim 1, wherein: The heat dissipation mechanism (7) includes a heat dissipation fan (71), the number of the heat dissipation fans (71) is two, the right side of the heat dissipation fan (71) is fixedly connected to the output end of the air inlet (6), the right side of the heat dissipation fan (71) is fixedly connected to a filter (72), the filter (72) is fixedly connected to the output end of the air inlet (6), the inner side of the heat dissipation fan (71) is fixedly connected to a circulation member (73), the front and rear sides of the circulation member (73) are fixedly connected to a heat dissipation member (74), the right side of the heat dissipation member (74) is fixedly connected to the left side of the heat dissipation fan (71), the output end of the circulation member (73) is connected to a delivery pipe (75), the output end of the delivery pipe (75) is connected to a refrigeration member (76), the output end of the refrigeration member (76) is connected to an output pipe (77), and the output end of the output pipe (77) is connected to the input end of the circulation member (73).

3. The heat dissipation structure of an embedded server according to claim 2, wherein: The clamping assembly (8) includes a plurality of slide rods (81), the inner side of each slide rod (81) is slidably connected to the outer side of the refrigeration component (76), a spring (82) is fixedly sleeved on the surface of the slide rod (81), the spring (82) is fixedly connected to the inner wall of the refrigeration component (76), and a pulling member (83) is fixedly connected to the outer side of the slide rod (81).

4. The heat dissipation structure of an embedded server according to claim 3, wherein: A groove (9) is provided on the surface of the pulling member (83), and the groove (9) is located on the top of the main board (2).

5. The heat dissipation structure of an embedded server according to claim 1, wherein: The top and bottom of the movable plate (4) are both rotatably connected with bolts (10), and the number of the bolts (10) is several.

6. The heat dissipation structure of an embedded server according to claim 1, wherein: The left and right sides of the front side of the server housing (1) are both fixedly connected with handles (11), and the handles (11) are located on the front side of the movable plate (4).

7. The heat dissipation structure of an embedded server according to claim 6, wherein: The top and bottom of the handle (11) are both provided with openings (12), and the openings (12) are located on the front side of the main board (2).

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