Liquid metal radiator for computer

Abstract

The utility model discloses a liquid metal radiator for a computer, which belongs to the technical field of metal radiators and comprises radiating fins, a liquid metal radiator and a liquid metal radiator, the cooling fan is used for blowing out the heat absorbed by the cooling fins to cool the CPU; the dustproof assembly comprises a dustproof net which is arranged on one side of the cooling fan and is used for preventing dust; the fixing assembly comprises a connecting rod which is rotationally connected to the cooling fan and is used for mounting the cooling fins and the cooling fan; the dustproof net is arranged on one side of the cooling fan, dust can be blocked when a CPU is cooled, the situation that the dust adheres to the interior of the cooling fan, the cooling fan is inconvenient to clean, and the cooling effect is affected is avoided, the dustproof net is fixed through the four sets of fixing bolts and nuts, and the stable effect is good; and vibration during operation of the cooling fan is avoided, disassembly is convenient, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of metal radiators, in particular to a liquid metal radiator for computers. Background Art

[0002] With the rapid development of computer technology, CPU performance continues to improve, and the heat generated during operation has also increased accordingly. To ensure stable CPU operation, effective heat dissipation measures have become crucial. Traditional heat dissipation methods, such as air cooling, can meet heat dissipation needs to a certain extent, but their heat dissipation effect is often unsatisfactory when facing high-performance CPUs. Therefore, liquid metal heat sinks, as a new heat dissipation method, have gradually attracted attention due to their excellent thermal conductivity.

[0003] Liquid metal heat sinks use liquid metal coated on the CPU and utilize the high thermal conductivity of liquid metal to quickly transfer heat generated by the CPU to the heat sink, which is then discharged through the cooling fan. However, in actual application, liquid metal heat sinks also face some problems. First, the cooling fan easily absorbs dust during operation, which not only reduces the cooling effect, but also increases the fan's operating noise and even shortens the fan's lifespan. Second, the contact area between the liquid metal and the heat sink is limited, which limits the heat conduction efficiency, thereby affecting the cooling effect. Utility Model Content

[0004] The utility model solves the technical problems in the above-mentioned background technology and provides a liquid metal radiator for a computer.

[0005] In order to solve the above technical problems, the technical solutions provided by the present invention are as follows:

[0006] A liquid metal radiator for a computer, comprising:

[0007] The heat sink fins are used to increase the heat dissipation area of ​​the computer CPU and are composed of several groups of aluminum sheets;

[0008] The cooling fan is used to blow out the heat absorbed by the cooling fins to cool the CPU;

[0009] A dustproof component, comprising a dustproof net arranged on one side of the cooling fan for dust prevention;

[0010] A fixing assembly includes a connecting rod rotatably connected to the cooling fan for mounting the cooling fins to the cooling fan;

[0011] The connecting component includes a connecting copper tube which penetrates and is fixed on the heat dissipation fins and is used to fix multiple groups of heat dissipation fins and transfer heat.

[0012] Preferably, the dustproof component further includes:

[0013] Fixing holes are arranged on the dustproof net for installing the dustproof net;

[0014] Fixing bolts, fixed to the cooling fan, are used to insert into the fixing holes on the dust screen;

[0015] The nut is threadedly connected to the fixing bolt and is used to fix the dust screen inserted on the fixing bolt.

[0016] Preferably, the fixing holes and fixing bolts are provided in four groups and are evenly distributed. The dustproof net is located on a side of the cooling fan away from the cooling fins, and the size of the dustproof net is consistent with the size of the cooling fan.

[0017] Preferably, the fixing assembly further comprises:

[0018] A handle is fixed to the end of the connecting rod away from the cooling fan and is used to press the connecting rod to clamp it onto the cooling fins;

[0019] Grooves are arranged on both sides of the heat dissipation fins;

[0020] The card slot is arranged in the groove and is used to card the connecting rod and thus fix the heat dissipation fan to the heat dissipation fin.

[0021] Preferably, the connecting rods are provided in two groups and are distributed on both sides of the heat dissipation fan. The connecting rods are ductile and are located between the two groups of aluminum sheets when they are clamped on the heat dissipation fins.

[0022] Preferably, the connection assembly further comprises:

[0023] The contact piece is fixed to the end of the connecting copper tube away from the heat sink fins and is used to fit the CPU for heat dissipation;

[0024] The square groove is arranged on the contact sheet to increase the contact area with the liquid metal coated on the CPU.

[0025] Preferably, the connecting copper tubes are provided in several groups and are evenly distributed on both symmetrical sides of the contact piece, and the square grooves are provided in several groups.

[0026] With the above structure, the utility model has the following advantages:

[0027] 1. By arranging a dustproof net on one side of the cooling fan, dust can be blocked when cooling the CPU, preventing dust from adhering to the inside of the cooling fan, making it inconvenient to clean the cooling fan, and thus affecting the cooling effect. The dustproof net is fixed by four sets of fixing bolts and nuts, which has a good stability effect, avoids vibration when the cooling fan is running, and is easy to disassemble, thereby improving the practicality of the device.

[0028] 2. By arranging several groups of through square grooves at the bottom of the contact piece, more liquid metal can be applied to enhance the contact surface between the contact piece and the liquid metal, thereby enhancing the heat absorption of the CPU by the heat sink fins, and cooperating with the cooling fan to improve the heat dissipation effect, ensuring the stability of the CPU temperature during operation.

[0029] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is a schematic diagram of the structure of a liquid metal radiator for computers in this utility model. Figure 1 ;

[0032] Figure 2 This is an exploded view of the structure of a liquid metal radiator for computers in the utility model;

[0033] Figure 3 This is a schematic diagram of the structure of a liquid metal radiator for computers in this utility model. Figure 2 ;

[0034] Figure 4 yes Figure 2 A in the enlarged view.

[0035] As shown in the figure: 1. Heat dissipation fins; 2. Heat dissipation fan; 201. Dustproof net; 202. Fixing hole; 203. Fixing bolt; 204. Nut; 301. Connecting rod; 302. Handle; 303. Groove; 304. Card slot; 401. Connecting copper tube; 402. Contact piece; 403. Square slot. DETAILED DESCRIPTION

[0036] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0038] The following is a further detailed description of the present invention in conjunction with the full text:

[0039] Example 1:

[0040] Combined with attachment Figures 1 to 4 This embodiment provides a liquid metal radiator for a computer, including a heat dissipation fin 1 composed of several groups of aluminum sheets for increasing the heat dissipation area of ​​the computer CPU, and a heat dissipation fan 2 for blowing out the heat absorbed by the heat dissipation fin 1 to cool the CPU.

[0041] In order to increase the heat dissipation effect on the CPU, a connecting component is arranged. The connecting component includes a connecting copper tube 401 that penetrates and is fixed on the heat dissipation fins 1 for fixing multiple groups of heat dissipation fins 1 and transferring heat.

[0042] As a preferred embodiment, the connecting component also includes: a contact piece 402, fixedly connected to the end of the connecting copper tube 401 away from the heat sink 1 for attaching to the CPU for heat dissipation; a square groove 403, arranged on the contact piece 402 for increasing the contact area with the liquid metal coated on the CPU.

[0043] As a preferred embodiment, the connecting copper tubes 401 are provided in several groups and are evenly distributed on both sides of the contact piece 402 symmetrically, and the square grooves 403 are provided in several groups.

[0044] It should be noted that the top and bottom of the connecting copper tube 401 both pass through the heat sink 1, the size of the contact piece 402 is smaller than the size of the heat sink, the position where the contact piece 402 is connected to the connecting copper tube 401 is set in an arc shape, and the square groove 403 does not pass through the contact piece 402 to prevent the liquid metal from being squeezed beyond the position of the contact piece 402. The liquid metal is evenly applied on the CPU, and then the contact piece 402 is pressed onto the CPU so that the square groove 403 and the area below the contact piece 402 are evenly coated with liquid technology, and fixed to the computer motherboard with screws through the fixing plate (not shown) extended from the heat sink 1.

[0045] Example 2:

[0046] On the basis of embodiment 1, a fixing component is arranged to enhance the heat dissipation effect on the CPU. The fixing component includes a connecting rod 301 rotatably connected to the heat dissipation fan 2 for mounting the heat dissipation fins 1 and the heat dissipation fan 2 .

[0047] As a preferred embodiment, the fixing assembly also includes: a handle 302, fixed to the end of the connecting rod 301 away from the cooling fan 2, used to press the connecting rod 301 to clamp it on the cooling fin 1; a groove 303, arranged on both sides of the cooling fin 1; a clamping groove 304, arranged in the groove 303, used to clamp the connecting rod 301 and thereby fix the cooling fan 2 to the cooling fin 1.

[0048] As a preferred embodiment, two groups of connecting rods 301 are provided and distributed on both sides of the cooling fan 2 . The connecting rods 301 are ductile and are located between the two groups of aluminum sheets when they are clamped on the cooling fins 1 .

[0049] It should be noted that when installation is required, it is necessary to first snap one set of handles 302 into the slots 304, and then snap another set of handles 302 into place so that the cooling fan 2 is completely fitted to the cooling fins 1. Since the connecting rod 301 and the handles 302 have a certain degree of ductility, they will provide a pulling force to the cooling fan 2 toward the cooling fins 1 after being fixed, so that the cooling fan 2 can be fixed. The heat of the CPU can be transferred to the cooling fins 1 by connecting the copper tube 401. The cooling fan 2 installed on the side can make the heat dissipation effect better, and the hot air can be blown out through the spacing inside the cooling fins 1.

[0050] Example 3:

[0051] On the basis of Example 1 and Example 2, a dustproof component is arranged to prevent dust from adhering to the cooling fan 2 during use, thereby reducing the heat dissipation effect. The dustproof component includes a dustproof net 201 arranged on one side of the cooling fan 2 for dust prevention.

[0052] As a preferred embodiment, the dustproof component also includes: a fixing hole 202, arranged on the dustproof net 201 for installing the dustproof net 201; a fixing bolt 203, fixed to the cooling fan 2 for inserting the fixing hole 202 on the dustproof net 201; a nut 204, threadedly connected to the fixing bolt 203 for fixing the dustproof net 201 inserted on the fixing bolt 203.

[0053] As a preferred embodiment, there are four groups of fixing holes 202 and fixing bolts 203 and they are evenly distributed. The dustproof net 201 is located on the side of the cooling fan 2 away from the cooling fins 1, and the size of the dustproof net 201 is consistent with the size of the cooling fan 2.

[0054] It should be noted that when the cooling fan 2 is started, the external cold air will be absorbed through the dustproof net 201 to blow out the hot air on the cooling fins 1. At this time, the dustproof net 201 will block the external dust from entering. The dust attached to the cooling fan 2 is not convenient to clean, but it is convenient to clean it on the dustproof net 201. The dustproof net 201 will have a certain impact on the air intake of the cooling fan 2, which can be solved by increasing the power of the cooling fan 2. The dustproof net 201 is fixed by four sets of fixing bolts 203 and nuts 204. The four corners are fixed with strong stability and can also be disassembled to clean the cooling fan 2.

[0055] The operation steps are as follows: when the CPU is coated with liquid metal so that the contact piece 402 is completely attached to the CPU, the device is fixedly installed on the computer motherboard. The heat of the CPU is transferred to the connecting copper tube 401 through the contact piece 402 and evenly distributed to the heat dissipation fin 1. At this time, the cooling fan 2 is started to suck air from one side of the dustproof net 201, and then the heat on the heat dissipation fin 1 is blown away through the gap between the heat dissipation fins 1 to cool the CPU. At this time, the dustproof net 201 will block external dust. When cleaning is needed, you only need to wipe the dust on the dustproof net 201. If there is too much dust, you can first remove the four sets of nuts 204 and then remove the dustproof net 201 from the fixing bolts 203 and clean it separately.

[0056] The above description of the present invention and its embodiments is non-limiting. What is shown in the full text is only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to the technical solution without creatively designing, they shall fall within the scope of protection of the present invention.

Claims

1. A liquid metal radiator for a computer, characterized by: include: The heat dissipation fin (1) is used to increase the heat dissipation area of ​​the computer CPU and is composed of several groups of aluminum sheets; A cooling fan (2) is used to blow out the heat absorbed by the cooling fins (1) to cool the CPU; A dustproof component, comprising a dustproof net (201) arranged on one side of the heat dissipation fan (2) for preventing dust; A fixing assembly includes a connecting rod (301) rotatably connected to the heat dissipation fan (2) for mounting the heat dissipation fins (1) and the heat dissipation fan (2); The connection assembly comprises a connection copper tube (401) which penetrates and is fixedly connected to the heat dissipation fins (1) and is used to fix multiple groups of heat dissipation fins (1) and transfer heat.

2. The liquid metal heat sink for a computer according to claim 1, characterized in that: The dustproof component also includes: A fixing hole (202) is arranged on the dustproof net (201) and is used for installing the dustproof net (201); A fixing bolt (203) is fixedly connected to the heat dissipation fan (2) and is used to insert the fixing hole (202) on the dustproof net (201); The nut (204) is threadedly connected to the fixing bolt (203) and is used to fix the dustproof net (201) inserted into the fixing bolt (203).

3. The liquid metal heat sink for a computer according to claim 2, characterized in that: The fixing holes (202) and the fixing bolts (203) are each provided in four groups and are evenly distributed. The dustproof net (201) is located on a side of the cooling fan (2) away from the cooling fins (1). The size of the dustproof net (201) is consistent with the size of the cooling fan (2).

4. The liquid metal radiator for a computer according to claim 3, characterized in that: The fixing assembly further comprises: A handle (302) is fixed to an end of the connecting rod (301) away from the heat dissipation fan (2) and is used to press the connecting rod (301) to be clamped onto the heat dissipation fin (1); Grooves (303) are arranged on both sides of the heat dissipation fins (1); The clamping slot (304) is arranged in the groove (303) and is used to clamp the connecting rod (301) and thereby fix the heat dissipation fan (2) to the heat dissipation fin (1).

5. The liquid metal heat sink for a computer according to claim 4, characterized in that: The connecting rods (301) are provided in two groups and are distributed on both sides of the heat dissipation fan (2). The connecting rods (301) are ductile and are located between the two groups of aluminum sheets when being clamped on the heat dissipation fins (1).

6. The liquid metal heat sink for a computer according to claim 5, characterized in that: The connection component further includes: The contact piece (402) is fixedly connected to the end of the connecting copper tube (401) away from the heat dissipation fin (1) and is used for being attached to the CPU for heat dissipation; The square groove (403) is arranged on the contact sheet (402) to increase the contact area with the liquid metal coated on the CPU.

7. The liquid metal heat sink for a computer according to claim 6, characterized in that: The connecting copper tubes (401) are provided in several groups and are evenly distributed on two symmetrical sides of the contact piece (402), and the square grooves (403) are provided in several groups.

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