Swing arm overturning flip chip die bonding mechanism and device
By flipping the inverted crystal solidification mechanism by swinging the swing arm, the problem of slow flipping speed and inconsistent dipping position in traditional crystal solidification equipment is solved, and efficient and stable wafer flipping and rotation are achieved, improving production efficiency and packaging accuracy.
Patent Information
- Application Number
- CN202422338225.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-25
AI Technical Summary
During the flip process, traditional crystal solidification equipment has problems such as slow speed, inconsistent distance of the dipping glue position, and poor stability, which affects production efficiency and packaging accuracy.
The swing arm flips inverted crystal solidification mechanism is adopted. By flipping and rotating after picking up, the swing arm motor and lifting motor drive the flip module to achieve flip and rotate the wafer, shorten the motion stroke, and maintain the consistency of the horizontal plane.
It improves crystal solidification speed and stability, improves production efficiency and packaging accuracy, has a simple structure and low cost, and is easy to promote and apply.
Smart Images
Figure CN223260579U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a swing arm flip-up die bonding mechanism and device. Background Art
[0002] The die bonder is one of the key mechanical equipment required for the post-packaging process on a semiconductor production line. Its mechanical parts include a bonding head assembly, a pin assembly, a wafer workbench assembly, an optical system, an oxide dispensing assembly, and a rotary positioning mechanism assembly.
[0003] The die bonding process of a die bonder is as follows: the substrate or PCB is transferred to the working position of the fixture manually or by a loading mechanism. The dispensing mechanism first dispenses glue at the location on the substrate or PCB where the wafer needs to be bonded. The die pick-up arm then moves from its origin position to the wafer pickup position. The wafer is placed on the film-supported expander wafer tray. After the die pick-up arm is in place, the nozzle moves downward, and the ejector pins move upward to lift the wafer. After picking up the wafer, the die bond is returned to the origin position. The die pick-up arm then moves from its origin position to the bonding position, with the nozzle downward to bond the wafer and return to the origin position. This completes the bonding process. The main working component in the die pick-up and die bonding process is the bonding head assembly.
[0004] In the traditional semiconductor industry, vision is often used for precise positioning when bonding flip-chip wafers. Only after precise positioning is achieved can the bonding performance of the soldering head and the flip-chip pickup head on the wafer pad be guaranteed, and only then can precise bonding be performed. In the traditional flip-chip bonding process, the flip-chip pickup head lifts the chip to a certain height and then flips it 180 degrees. The mounting head then picks up the flipped chip and flips it to the target position on the substrate after the adhesive is applied. To increase the bonding speed, the working distance between the loading wafer and the adhesive dip station is shortened to a minimum and kept on the same horizontal plane, ensuring that the back-and-forth operation is completed in a short time. However, due to structural limitations, after the wafer is picked up and flipped, there is a certain horizontal plane gap with the adhesive dip station, resulting in a long Z-axis motion stroke. This limits the efficiency of the equipment and the stability of the adhesive dip. Traditional packaging precision also makes it difficult to handle high-precision bonding.
[0005] Based on this, it is necessary to improve the defects in the existing technology to overcome the shortcomings in practical applications. Utility Model Content
[0006] Based on the above-mentioned shortcomings and deficiencies in the prior art, one of the purposes of the present invention is to at least solve one or more of the above-mentioned problems in the prior art. In other words, one of the purposes of the present invention is to provide a swing arm flip-chip solid crystal mechanism and device that meets one or more of the above-mentioned needs.
[0007] In order to achieve the above-mentioned purpose of the utility model, the utility model adopts the following technical solutions:
[0008] The utility model provides a swing arm flip and flip chip bonding mechanism, comprising a base, a swing arm motor, a lifting motor, a transmission assembly and a flip module, wherein the swing arm motor and the lifting motor are installed on the base, the swing arm motor and the lifting motor are respectively connected to the transmission assembly, and the transmission assembly is connected to the flip module; the swing arm motor is used to drive the flip module to swing along a first direction, and the lifting motor is used to drive the flip module to move up and down; the flip module comprises a flip motor and a material picking arm, the flip motor drives the material picking arm to rotate along a second direction, and a suction nozzle is provided on the material picking arm, and the suction nozzle is used to suck wafers.
[0009] As a preferred solution, the transmission assembly includes a C-shaped frame and a spline shaft, the lifting motor is connected to the C-shaped frame, the C-shaped frame is connected to the spline shaft, and the spline shaft passes through the base and is connected to the flip module.
[0010] As a preferred solution, the transmission assembly further includes an eccentric wheel, a follower wheel and a lifting plate, the lifting motor is connected to the eccentric wheel, the eccentric wheel is connected to the follower wheel, and the follower wheel is in contact with the lifting plate; the lifting motor drives the eccentric wheel to rotate, and the eccentric wheel drives the follower wheel to rotate, so that the follower wheel drives the lifting plate to move up and down.
[0011] As a preferred solution, the lifting plate passes through the spline shaft, the lifting plate is connected to a clamp, and the clamp is tightly clamped to the spline shaft.
[0012] As a preferred solution, the spline shaft is connected to an inner bearing and an outer bearing, the spline shaft cooperates with the inner bearing to realize the up and down movement of the spline shaft, and the spline shaft cooperates with the outer bearing to realize the rotational movement of the spline shaft.
[0013] As a preferred solution, a spring is sleeved on the end of the spline shaft, and two ends of the spring are respectively in contact with the outer bearing and the material taking arm.
[0014] As a preferred solution, the swing angle of the turnover module along the first direction is 0 to 180 degrees, and the turnover angle of the material taking arm along the second direction is 0 to 180 degrees.
[0015] As a preferred solution, the flip motor is transmission-connected to the material-picking arm, and a suction nozzle is provided at the end of the material-picking arm, and the suction nozzle is arranged perpendicular to the material-picking arm.
[0016] As a preferred solution, a plurality of hollow grooves are evenly provided on the material taking arm.
[0017] The utility model provides a swing arm flip-chip die bonding device, comprising a flip module as described in any of the above schemes, for transferring wafers.
[0018] Compared with the prior art, the present invention has the following beneficial effects:
[0019] The utility model provides a swing arm flip and flip chip bonding mechanism, which solves the problem of slow traditional bonding speed by changing the flipping method of picking up the wafer and adopts the method of flipping and rotating the wafer after picking up. The mechanism is closer to the dipping position and keeps it on a consistent horizontal plane, thereby greatly improving the efficiency and stability of production. The mechanism is simple and fast to use, low in cost and easy to promote and apply. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying any creative work, they can also obtain drawings of other embodiments based on these drawings.
[0021] Figure 1 This is a schematic diagram of the overall structure of the crystal bonding mechanism of an embodiment of the present utility model;
[0022] Figure 2 is a cross-sectional view of a die-bonding mechanism according to an embodiment of the present invention;
[0023] Figure 3 This is a cross-sectional view from another perspective of the die-bonding mechanism of an embodiment of the present invention;
[0024] Figure 4 This is a partial structural connection diagram of the crystal bonding mechanism of an embodiment of the present utility model;
[0025] In the figure: 1 base, 2 swing arm motor, 3 lifting motor, 4 transmission assembly, 41 C-frame, 42 spline shaft, 43 clamp, 44 eccentric wheel, 45 follower wheel, 46 lifting plate, 47 outer bearing, 48 inner bearing, 49 spring, 5 flip module, 51 flip motor, 52 material picking arm, 521 hollow slot, 53 suction nozzle. DETAILED DESCRIPTION
[0026] To more clearly illustrate the embodiments of the present application, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without inventive work.
[0027] In the description of the embodiments of this application, terms such as "upper," "lower," "front," and "rear" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the application. Furthermore, terms such as "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0028] According to some embodiments of the present application, Figures 1 to 4 As shown, a swing arm flip and flip chip bonding mechanism is provided, including a base 1, a swing arm motor 2, a lifting motor 3, a transmission assembly 4 and a flip module 5. The swing arm motor 2 and the lifting motor 3 are installed on the base 1, the swing arm motor 2 and the lifting motor 3 are respectively connected to the transmission assembly, and the transmission assembly is connected to the flip module 5; the swing arm motor 2 is used to drive the flip module 5 to swing along a first direction, and the lifting motor 3 is used to drive the flip module 5 to move up and down; the flip module 5 includes a flip motor 51 and a material picking arm 52, the flip motor 51 drives the material picking arm 52 to rotate along the second direction, and the material picking arm 52 is provided with a suction nozzle 53, and the suction nozzle 53 is used to suck the wafer.
[0029] Specifically, the transmission assembly includes a C-shaped frame 41 and a spline shaft 42. The C-shaped frame 41 is located inside the base 1. The output end of the lifting motor 3 is in transmission connection with the upper end of the C-shaped frame 41, and the lower end of the C-shaped frame 41 is connected to the spline shaft 42. The lower end of the spline shaft 42 passes through the base 1 and is in transmission connection with the flip module 5. The lifting motor 3 drives the C-shaped frame 41 to rotate, which in turn drives the spline shaft 42 to rotate, thereby driving the flip module 5 to rotate and swing in the circumferential direction.
[0030] Furthermore, the transmission assembly also includes an eccentric wheel 44, a follower wheel 45, and a lifting plate 46 disposed inside the base 1. The output end of the lifting motor 3 is connected to the eccentric wheel 44, and the side end surface of the eccentric wheel 44 is fixedly connected to the follower wheel 45. The outer circumference of the follower wheel 45 abuts against the lower end surface of the lifting plate 46. The lifting motor 3 drives the eccentric wheel 44 to rotate, and the eccentric wheel 44 drives the follower wheel 45 to rotate, so that the follower wheel 45 drives the lifting plate 46 to move up and down.
[0031] Furthermore, the center hole of the lifting plate 46 passes through the spline shaft 42, and the lower end surface of the lifting plate 46 is connected to the clamp 43, and the clamp 43 is tightly clamped to the spline shaft 42, so that the lifting plate 46, the clamp 43 and the spline shaft 42 are fixedly connected. When the lifting plate 46 moves up and down, the spline shaft 42 is linked to move up and down synchronously.
[0032] Furthermore, the spline shaft 42 is connected to an inner bearing 48 and an outer bearing 47, and the inner bearing 48 and the outer bearing 47 are arranged inside the base 1, and the inner bearing 48 is located on the inner side of the outer bearing 47. The spline shaft 42 cooperates with the inner bearing 48 to realize the up and down movement of the spline shaft 42, and the spline shaft 42 cooperates with the outer bearing 47 to realize the rotational movement of the spline shaft 42.
[0033] Furthermore, a spring 49 is sleeved on the end of the spline shaft 42, and the two ends of the spring 49 respectively abut against the outer bearing 47 and the material picking arm 52. When the lifting motor 3 drives the spline shaft 42 to move upward, the spring 49 is compressed. When the lifting motor 3 drives the spline shaft 42 to move downward, the spring 49 is stretched, thereby offsetting the movement clearance.
[0034] In some embodiments of the present application, the swing arm motor 2 drives the flip module 5 to swing along a first direction at an angle of 0 to 180°, and the specific swing angle can be set according to the actual application. The flip motor 51 drives the retrieving arm 52 to flip along a second direction at an angle of 0 to 180°, and the specific flip angle can be set according to the actual application. The first direction is configured as the flip module rotating and swinging around the spline shaft; the second direction is configured as the retrieving arm rotating around its axis.
[0035] Furthermore, after the wafer is sucked up by the pick-up arm 52 in conjunction with the suction nozzle 53, it can be flipped 180 degrees, thereby realizing the transfer of the wafer.
[0036] In some embodiments of the present application, the flip motor 51 is transmission-connected to the material picking arm 52 , and a suction nozzle 53 is provided at the end of the material picking arm 52 . The suction nozzle 53 is arranged perpendicular to the material picking arm 52 , and the suction nozzle picks up the wafer through vacuum adsorption.
[0037] Furthermore, a plurality of hollow grooves 521 are evenly provided on the material taking arm 52. The hollow grooves 521 can reduce the weight of the material taking arm, so as to facilitate the swinging of the material taking arm.
[0038] According to some embodiments of the present application, a swing-arm flip-chip die bonding device is also provided, comprising the flip module described above, for transferring wafers. After the wafer is picked up by the pick-up arm, a flip motor drives the pick-up arm to flip 180 degrees, positioning the bottom of the wafer upward. Simultaneously, the swing-arm motor controls the pick-up arm to rotate 90 degrees, thereby removing, lifting, flipping, and rotating the wafer.
[0039] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.
[0040] The above description is only a detailed description of the preferred embodiments and principles of the present application. For ordinary technicians in this field, there may be changes in the specific implementation methods based on the ideas provided by this application, and these changes should also be regarded as the scope of protection of this application.
Claims
1. A swing arm flip chip bonding mechanism, characterized in that: It includes a base, a swing arm motor, a lifting motor, a transmission assembly and a flip module. The swing arm motor and the lifting motor are installed on the base. The swing arm motor and the lifting motor are respectively connected to the transmission assembly, and the transmission assembly is connected to the flip module. The swing arm motor is used to drive the flip module to swing in a first direction, and the lifting motor is used to drive the flip module to move up and down; the flip module includes a flip motor and a material picking arm, and the flip motor drives the material picking arm to rotate in a second direction. The material picking arm is provided with a suction nozzle, and the suction nozzle is used to suck wafers.
2. The swing arm flip chip bonding mechanism according to claim 1, characterized in that: The transmission assembly includes a C-shaped frame and a spline shaft, the lifting motor is connected to the C-shaped frame, the C-shaped frame is connected to the spline shaft, and the spline shaft passes through the base and is connected to the flip module.
3. The swing arm flip chip bonding mechanism according to claim 2, characterized in that: The transmission assembly also includes an eccentric wheel, a follower wheel and a lifting plate. The lifting motor is connected to the eccentric wheel, the eccentric wheel is connected to the follower wheel, and the follower wheel is in contact with the lifting plate. The lifting motor drives the eccentric wheel to rotate, and the eccentric wheel drives the follower wheel to rotate, so that the follower wheel drives the lifting plate to move up and down.
4. The swing arm flip chip bonding mechanism according to claim 3, characterized in that: The lifting plate passes through the spline shaft, and the lifting plate is connected to a clamp, and the clamp is tightly clamped to the spline shaft.
5. The swing arm flip chip bonding mechanism according to claim 2, characterized in that: The spline shaft is connected to an inner bearing and an outer bearing. The spline shaft cooperates with the inner bearing to realize the up and down movement of the spline shaft, and the spline shaft cooperates with the outer bearing to realize the rotational movement of the spline shaft.
6. The swing arm flip chip bonding mechanism according to claim 5, characterized in that: A spring is sleeved on the end of the spline shaft, and two ends of the spring are respectively in contact with the outer bearing and the material taking arm.
7. The swing arm flip chip bonding mechanism according to claim 1, characterized in that: The swing angle of the turnover module along the first direction is 0-180 degrees, and the turnover angle of the material taking arm along the second direction is 0-180 degrees.
8. The swing arm flip chip bonding mechanism according to claim 1, characterized in that: The flip motor is in transmission connection with the material taking arm. A suction nozzle is provided at the end of the material taking arm. The suction nozzle is arranged perpendicular to the material taking arm.
9. The swing arm flip chip bonding mechanism according to claim 1, characterized in that: A plurality of hollow slots are evenly arranged on the material taking arm.
10. A swing arm flip chip bonding device, characterized in that: The invention comprises a flip module as described in any one of claims 1 to 9, which is used for transferring wafers.