Air guide structure of radiator

Abstract

The air guide structure comprises a first fin group, a second fin group and a heat conduction pipe, the second fin group is provided with a through hole, a heat dissipation part used for installing the heat conduction pipe is formed on the first fin group, the heat conduction pipe is provided with a heat conduction part which is in direct or indirect contact with a heat source, and the heat conduction part is provided with an air inlet and an air outlet. The heat conduction part is embedded in the heat dissipation part, and the lower end of the first fin set is further provided with an air guide part which is in direct or indirect contact with a heat source and used for guiding air flow to dissipate heat. According to the utility model, the trumpet-shaped air guide part with the large upper part and the small lower part is arranged below the first fin group, and the air guide part can collect the air flow and guide the air flow through the inclination, so that the air flow is blown to a heat source on the PCB, and the heat dissipation performance is enhanced. In addition, the lower end plane of the heat conduction part in the heat conduction pipe is in contact with the air guide component, and heat conduction is carried out on the heat source through the air guide component, so that the heat source on the PCB can be subjected to heat pipe type and air cooling type dual heat dissipation at the same time.

Description

Technical field:

[0001] The utility model relates to the technical field of radiators, in particular to an air guide structure of a radiator. Background technology:

[0002] With the continuous iterative development of electronic devices, not only are their operating speeds constantly increasing, but their heat generation is also constantly increasing. Currently, radiators are widely used to dissipate heat from electronic devices to reduce their temperature and maintain their normal operation. Commonly used radiators include air-cooled radiators, heat pipe radiators, and water-cooled radiators. Among them, heat pipe radiators are heat transfer elements with extremely high thermal conductivity. They transfer heat through the evaporation and condensation of liquid within a fully enclosed vacuum tube. They combine the advantages of air cooling and heat pipes and have extremely high heat dissipation performance.

[0003] Traditional heat pipe radiators include heat pipes and fin groups. The fin groups include fins arranged at a certain distance. Each fin has a through hole that allows the heat pipe to pass through, so that the heat pipe can be installed on multiple fins at the same time. The heat pipe transfers the heat from the electronic device to the fins, and then quickly transfers the heat to the external environment through the fins.

[0004] For example, patent application CN102543914A discloses a heat sink comprising a plurality of mutually parallel fins, each of which has a through hole for a heat pipe to pass through. The heat pipe comprises a tube body and an inactive end connected to the tube body, the inactive end having a smaller diameter than the tube body. The tube body contacts the fin assembly. A heat sink cover penetrates some of the through holes of the fins to cover the inactive end and contact the fins, and the inactive end contacts the heat sink cover.

[0005] However, in actual application, the heat dissipation effect of heat pipes is very limited when heat is dissipated only through the heat pipe body and support columns in a contact manner. In particular, high-power chips generate a large amount of heat, and the above-mentioned heat sink cannot meet their heat dissipation requirements.

[0006] In view of this, the inventors propose the following technical solutions. Utility model content:

[0007] The purpose of the utility model is to overcome the deficiencies of the prior art and provide an air guide structure for a radiator.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions: a radiator air guide structure, comprising: a first fin group, a second fin group and a heat pipe passing through the second fin group, the second fin group is provided with a through hole for the heat pipe to pass through, the first fin group is formed with a heat dissipation portion for installing the heat pipe, correspondingly, the heat pipe has a heat conduction portion that is in direct or indirect contact with the heat source, and the heat conduction portion is embedded in the heat dissipation portion, and the lower end of the first fin group is also provided with an air guide component that is in direct or indirect contact with the heat source and is used to guide airflow for heat dissipation.

[0009] Furthermore, in the above technical solution, the air-guiding component includes: a heat sink in direct contact with the heat source and at least one air-guiding channel integrally arranged with the heat sink and used to guide the airflow for heat dissipation, and the heat sink is pressed from bottom to top on the lower end of the heat-conducting part to define a heat-conducting pipe; the air-guiding channel is provided with an air outlet at one end facing the heat sink for blowing the airflow toward the heat source.

[0010] Furthermore, in the above technical solution, the number of the second fin groups is two, which are distributed on both sides of the first fin group and form a gap with the first fin group, and the air guide channel is arranged in the gap.

[0011] Furthermore, in the above technical solution, the upper end of the air guide channel has a collecting portion that opens upward and is used for airflow to enter, and the lower end of the air guide channel has a guiding portion that gradually decreases and is used to gather airflow.

[0012] Furthermore, in the above technical solution, the first fin group is formed by vertically stacking a plurality of first fins, wherein a first heat dissipation gap in a vertical direction is formed between two adjacent first fins.

[0013] Furthermore, in the above technical solution, the heat dissipation portion is formed by a plurality of inlay grooves penetrating through two side surfaces of the first fin group, and the inlay grooves are distributed in parallel; the heat conduction portion is inlaid and installed in the inlay grooves.

[0014] Furthermore, in the above technical solution, the heat source is a chip and a pad arranged on the PCB board.

[0015] Furthermore, in the above technical solution, the air guide component, the first fin group, and the second fin group are all installed on the PCB board, and a first side panel is also installed on the PCB board, and a plurality of heat dissipation holes for ventilation are formed on the first side panel.

[0016] A radiator air guide structure includes a fin group formed by vertically stacking a plurality of fins, and a heat pipe passing through the fin group. The fin group is provided with a through hole for the heat pipe to pass through. The fin group is formed with a heat dissipation portion for mounting the heat pipe. Correspondingly, the heat pipe has a heat conduction portion that is in direct or indirect contact with a heat source, and the heat conduction portion is embedded in the heat dissipation portion. The lower end of the fin group is further provided with an air guide component that is in direct or indirect contact with the heat source and is used to guide airflow for heat dissipation.

[0017] The air guide component includes: a heat sink in direct contact with the heat source and at least one air guide channel integrally provided with the heat sink and used to guide airflow for heat dissipation, and the heat sink is pressed from bottom to top on the lower end of the heat conducting portion to define a heat conducting pipe; the air guide channel is provided with an air outlet at one end facing the heat sink for blowing airflow toward the heat source.

[0018] After adopting the above technical solution, the present invention has the following beneficial effects compared to the prior art: In the present invention, a trumpet-shaped air guide component, which is larger at the top and smaller at the bottom, is provided below the first fin group. This component collects airflow and guides it at an angle, directing it toward the heat source on the PCB board, thereby enhancing heat dissipation performance. Furthermore, the air guide component contacts the heat source on the PCB board, and the lower end plane of the heat-conducting portion of the heat pipe contacts the air guide component and conducts heat to the heat source through it. The heat is then transferred to the first and second fin groups, where it is dissipated by the second fin group. This allows the heat source on the PCB board to receive both heat pipe and air cooling, resulting in a more effective heat dissipation effect. This effectively meets the heat dissipation requirements of even high-power chips with high heat generation. Description of the drawings:

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic structural diagram of the air guide component in the utility model;

[0021] Figure 3 It is a schematic diagram of the decomposed state of the utility model;

[0022] Figure 4 This is a schematic structural diagram of the first fin group in the present utility model;

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the utility model from another perspective. Specific implementation method:

[0024] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0025] See Figures 1 to 5 The figure shows a heat sink air guide structure, which includes: a first fin group 1, a second fin group 2, and a heat pipe 3 passing through the second fin group 2. The second fin group 2 is provided with a through hole 31 for the heat pipe 3 to pass through. The first fin group 1 is formed with a heat dissipation portion 11 for mounting the heat pipe 3. Correspondingly, the heat pipe 3 has a heat conduction portion 32 that directly or indirectly contacts the heat source. The heat conduction portion 32 is embedded in the heat dissipation portion 11. The lower end of the first fin group 1 is also provided with an air guide component 4 that directly or indirectly contacts the heat source and is used to guide airflow for heat dissipation. In the present invention, by providing an air guide component 4 below the first fin group 1, it can collect airflow and guide it through an inclination so that the airflow blows toward the heat source on the PCB board 5, thereby enhancing heat dissipation performance. In addition, the air guide component 4 is in contact with the heat source on the PCB board 5. The lower end plane of the heat conducting portion 31 in the heat pipe 3 is in contact with the air guide component 4 and conducts heat to the heat source through it, and transfers the heat to the first fin group 1 and the second fin group 2. The heat is dissipated by the second fin group 2, so that the heat source on the PCB board 5 can be cooled by both heat pipe and air cooling, thereby forming a better heat dissipation effect. Even for high-power chips with large heat generation, their heat dissipation requirements can be well met.

[0026] The heat source is the chip 51 and the pads 52 provided on the PCB board 5. Here, the chip 51 and the pads 52 located around it generate a large amount of heat when the device is working, and are the main heat sources. The main purpose of the present invention is to guide the wind / airflow to blow towards the chip 51 at a faster flow rate to achieve the heat dissipation effect.

[0027] The air guide component 4 includes: a heat sink 41 in direct contact with the heat source and at least one air guide channel 42 integrally provided with the heat sink 41 and used to guide the wind flow for heat dissipation, and the heat sink 41 is pressed from bottom to top on the lower end of the heat conducting portion 32 to define the heat conducting pipe 3; the air guide channel 42 is provided with an air outlet 43 at one end facing the heat sink 41 for blowing the wind flow toward the heat source. The upper end of the air guide channel 42 has a collecting portion 421 that opens upward and is used for the wind flow to enter, and the lower end of the air guide channel 42 has a gradually decreasing guide portion 422 that is used to gather the wind flow. Here, combined with Figure 2 As shown, the air guide component 4 is shaped like a trumpet, which is larger at the top and smaller at the bottom. This shape can effectively collect and guide the air / wind flowing around, so that it blows toward the chip 51 and the pad 52 at a faster flow rate. Specifically, the upper end of the air guide channel 42 is an outwardly enlarged collection portion 421 to facilitate collecting the air flowing around and directing it into the air guide channel 42. The lower end of the air guide channel 42 is a guide portion 422 with an inclined surface, which can guide the airflow at a faster flow rate by its inclination and blow it toward the chip 51.

[0028] There are two second fin groups 2, distributed on both sides of the first fin group 1, with a gap 20 formed between them and the first fin group 1. The air guide channel 42 is disposed within the gap 20. Here, the heat pipe 3 is bent at the gap 20, so that the heat conduction portion 32 is embedded in the heat dissipation portion 11. The air guide channel 42 is also disposed within the gap 20, without occupying additional space and without affecting the original structure of the radiator. It can simultaneously meet the requirements of heat pipe-based heat dissipation and air cooling within a limited space.

[0029] The first fin assembly 1 is formed by a plurality of vertically stacked first fins 101, wherein a vertical first heat dissipation gap 10 is formed between two adjacent first fins 101. Here, the first heat dissipation gap 10 can discharge heat from the heat pipe 3 and the heat sink 41 upward and out of the first fin assembly 1, further enhancing the heat dissipation effect and achieving the purpose of efficient heat dissipation.

[0030] The heat dissipation portion 11 is formed by a plurality of inlay grooves 111 extending through both sides of the first fin group 1. The inlay grooves 111 are arranged in parallel. The heat conducting portion 32 is inlaid and mounted in the inlay grooves 111. Compared with the existing structure, the present invention forms the inlay grooves 111 directly on the bottom of the first fin group 1 to allow the heat conducting portion 32 of the heat pipe 3 to pass through, eliminating the need for slots in the PCB board 5. This not only increases the heat transfer area between the heat conducting portion 32 and the first fin group 1, but also facilitates production assembly and management.

[0031] The air guide component 4, the first fin group 1, and the second fin group 2 are all mounted on the PCB board 5. A first side panel 6 is also mounted on the PCB board 5. The first side panel 6 has a plurality of heat dissipation holes 61 formed therein for ventilation. Heat / hot air dissipated by the first fin group 1 and the second fin group 2 can be discharged to the outside through the heat dissipation holes 61 in the first side panel 6.

[0032] In summary, in the present invention, a trumpet-shaped air guide component 4, larger at the top and smaller at the bottom, is provided below the first fin group 1. This component collects airflow and directs it at an angle, directing it toward the heat source on the PCB board 5 to enhance heat dissipation. Furthermore, the air guide component 4 contacts the heat source on the PCB board 5. The lower end plane of the heat conducting portion 31 in the heat pipe 3 contacts the air guide component 4 and conducts heat to the heat source through it, transferring the heat to the first fin group 1 and the second fin group 2. The second fin group 2 dissipates the heat, allowing the heat source on the PCB board 5 to receive both heat pipe and air cooling, resulting in a more effective heat dissipation effect. This effectively meets the heat dissipation requirements of even high-power chips with high heat generation.

[0033] The present invention also proposes a second structure, which is as follows:

[0034] 19. The heat dissipation device as described in claim 18, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, the wires being collected by the bridge. The bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, so that the bridge can get rid of the heat. In this utility model, a trumpet-shaped air guide component, larger at the top and smaller at the bottom, is positioned below the first fin group. This component collects airflow and directs it at an angle, directing it toward the heat source on the PCB, thereby enhancing heat dissipation. Furthermore, the air guide component contacts the heat source on the PCB. The lower end plane of the heat-conducting portion of the heat pipe contacts the air guide component, conducting heat from the heat source through the component and transferring the heat to the first and second fin groups. The second fin group dissipates the heat, allowing the heat source on the PCB to receive both heat pipe and air cooling, resulting in a superior heat dissipation effect. This effectively meets the heat dissipation requirements of even high-power chips with high heat generation.

[0035] That is to say, the air guide structure of the radiator of the second structure is different from the air guide structure of the radiator of the first structure in that: the high-efficiency radiator of the second structure adopts a fin group, and the heat pipe is bent upward to pass through the fin group. Apart from this, the other structures are the same and can achieve the same technical effects, so they will not be elaborated here.

[0036] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made based on the structure, features and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A radiator air guide structure, comprising a first fin group (1), a second fin group (2), and a heat pipe (3) passing through the second fin group (2), wherein the second fin group (2) is provided with a through hole (31) for the heat pipe (3) to pass through, characterized in that: A heat dissipation portion (11) for mounting the heat-conducting pipe (3) is formed on the first fin group (1); correspondingly, the heat-conducting pipe (3) has a heat-conducting portion (32) that is in direct or indirect contact with a heat source; the heat-conducting portion (32) is embedded in the heat dissipation portion (11); and an air guide component (4) is further provided at the lower end of the first fin group (1) that is in direct or indirect contact with a heat source and is used to guide airflow for heat dissipation.

2. The air guide structure of a radiator according to claim 1, characterized in that: The air guide component (4) comprises: a heat dissipation plate (41) in direct contact with a heat source, and at least one air guide channel (42) integrally provided with the heat dissipation plate (41) and used for guiding airflow for heat dissipation, and the heat dissipation plate (41) is pressed from bottom to top against the lower end of the heat conduction portion (32) to define the heat conduction pipe (3); the air guide channel (42) is provided with an air outlet (43) at one end facing the heat dissipation plate (41) for blowing airflow toward the heat source.

3. The air guide structure of a radiator according to claim 2, characterized in that: The number of the second fin groups (2) is two, which are distributed on both sides of the first fin group (1) and form a gap (20) between the first fin group (1), and the air guide channel (42) is arranged in the gap (20).

4. The air guide structure of a radiator according to claim 2, characterized in that: The upper end of the wind guide channel (42) has a collecting portion (421) that opens upward and is used for wind flow to enter, and the lower end of the wind guide channel (42) has a guiding portion (422) that gradually decreases and is used for gathering wind flow.

5. The air guide structure of a radiator according to claim 1, characterized in that: The first fin group (1) is formed by vertically stacking a plurality of first fins (101), wherein a first heat dissipation gap (10) in a vertical direction is formed between two adjacent first fins (101).

6. The air guide structure of a radiator according to claim 1, characterized in that: The heat dissipation portion (11) is formed by a plurality of inlay grooves (111) penetrating the two side surfaces of the first fin group (1), and the inlay grooves (111) are distributed in parallel; the heat conduction portion (32) is inlaid and installed in the inlay grooves (111).

7. The air guide structure of a radiator according to any one of claims 1 to 6, characterized in that: The heat source is a chip (51) and a solder pad (52) arranged on a PCB board (5).

8. The air guide structure of a radiator according to claim 7, characterized in that: The air guide component (4), the first fin group (1), and the second fin group (2) are all mounted on the PCB board (5). A first side panel (6) is also mounted on the PCB board (5). The first side panel (6) is provided with a plurality of heat dissipation holes (61) for ventilation.

9. A heat sink air guide structure comprising a fin group formed by vertically stacking a plurality of fins, and a heat pipe passing through the fin group, wherein the fin group is provided with a through hole for the heat pipe to pass through, characterized in that: The fin group is formed with a heat dissipation portion for mounting the heat pipe. Correspondingly, the heat pipe has a heat conduction portion that is in direct or indirect contact with the heat source, and the heat conduction portion is embedded in the heat dissipation portion. The lower end of the fin group is also provided with an air guide component that is in direct or indirect contact with the heat source and is used to guide airflow for heat dissipation. The air guide component includes: a heat sink in direct contact with the heat source and at least one air guide channel integrally provided with the heat sink and used to guide airflow for heat dissipation, and the heat sink is pressed from bottom to top on the lower end of the heat conducting portion to define a heat conducting pipe; the air guide channel is provided with an air outlet at one end facing the heat sink for blowing airflow toward the heat source.

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