Grounding device and equipment

Abstract

The utility model discloses a grounding device and equipment, the grounding device comprises a connector, a compatible connector, a first shielding module and a grounding module, the compatible connector comprises a grounding pin and other pins, and the first shielding module is located above the compatible connector and is not in contact with the other pins; the target area of the first shielding module is conductively connected with the grounding pin; and the grounding module covers the first shielding module and the connector and is connected with the grounding pin of the compatible connector and the grounding pin of the connector through the target area of the first shielding module, so that the grounding of the compatible connector and the grounding pin of the connector is realized. Through the grounding device, grounding schemes of connectors of different specifications are unified, and the connectors of different specifications are shared, so that sharing of antennas of various versions is realized, and the problem of antenna interference is further relieved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a grounding device and equipment. Background Art

[0002] As the consumer electronics market matures, manufacturers are increasingly focused on cost control in product design, often achieving compatibility by sharing components developed after initial project mold opening. However, this compatibility design can lead to interference issues in printed circuit board (PCB) layouts. This is especially true when sharing components of different specifications. Due to inconsistent pin functionality, designers often need to perform complex PCB flyout design to address pins that cannot be directly shared. This not only increases design complexity but can also impact product reliability and performance, hindering further optimization and advancement of the technology.

[0003] In related technologies, in order to achieve the sharing of antennas of various versions, Mylar is used to insulate the pins that need to shield the signal above the compatible connector to ensure electrical isolation and prevent short circuits. Above the Mylar, the connector's grounding copper foil is arranged to cover the compatible connector and extend to the top of the shielding cover, thereby achieving simultaneous grounding connection between the compatible connector and the connector. Although this design can reduce some signal interference, due to structural limitations, it cannot completely eliminate problems such as RF spurious emission, radiation sensitivity, and decreased sensitivity. Summary of the Invention

[0004] The embodiments of the present application disclose a grounding device and equipment, which uses a shielding module composed of a pad to shield the pins of the connector, thereby achieving the sharing of connectors of different specifications, thereby achieving the sharing of antennas of various versions, and further alleviating the problem of antenna interference.

[0005] A first aspect of an embodiment of the present application discloses a grounding device, including a connector, a compatible connector, a first shielding module, and a grounding module, wherein:

[0006] The compatible connector includes a ground pin and other pins;

[0007] The first shielding module covers the compatible connector, the first shielding module is not in contact with the other pins, and is conductively connected to the ground pin through the target area in the first shielding module;

[0008] The grounding module covers the first shielding module and the connector, and connects the grounding pin of the compatible connector and the grounding pin of the connector through the target area of ​​the first shielding module to achieve grounding of the compatible connector and the connector.

[0009] As an optional implementation, in the first aspect of this embodiment, the first shielding module includes at least one first raised plate and at least one second raised plate, the at least one first raised plate constituting a first portion of the first shielding module, the at least one second raised plate constituting a second portion of the first shielding module, and the second portion being disposed on the first portion, wherein:

[0010] A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector;

[0011] The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

[0012] As an optional implementation manner, in the first aspect of this embodiment, the first elevated plate is composed of a layer of insulating material and a layer of conductive medium, or the first elevated plate is composed of at least one layer of insulating material.

[0013] As an optional implementation manner, in the first aspect of this embodiment, the second elevated plate is composed of a conductive medium, or the second elevated plate is composed of a layer of insulating material and a layer of conductive medium.

[0014] As an optional embodiment, in the first aspect of this embodiment, the non-hollowed portion of the first elevated plate is provided with through holes, the number of the through holes is the same as the number of ground pins of the compatible connector, the ground pins of the compatible connector are connected to the second elevated plate through the through holes, and the second elevated plate is composed of a conductive medium.

[0015] As an optional embodiment, in the first aspect of this embodiment, the non-hollowed portion of the first raising plate is provided with a first through hole, and the target area of ​​the second raising plate is provided with a second through hole, the positions of the first through hole and the second through hole correspond to each other, and the number of the first through holes is the same as the number of ground pins of the compatible connector.

[0016] As an optional implementation manner, in the first aspect of this embodiment, the grounding device further includes a second shielding module, wherein:

[0017] The second shielding module covers the top of the connector, the second shielding module is in a non-contact state with other pins of the connector, and is conductively connected to the ground pin of the connector through the target area in the second shielding module;

[0018] The grounding module covers the first shielding module and the second shielding module, and connects the grounding pin of the compatible connector and the grounding pin of the connector to ground through the target area of ​​the first shielding module and the target area of ​​the second shielding module.

[0019] As an optional implementation, in the first aspect of this embodiment, the second shielding module has the same structure as the first shielding module, and the second shielding module includes at least one first raised plate and at least one second raised plate, the at least one first raised plate constituting a first portion of the second shielding module, the at least one second raised plate constituting a second portion of the second shielding module, and the second portion is disposed on the first portion, wherein:

[0020] A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector;

[0021] The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

[0022] As an optional implementation manner, in the first aspect of this embodiment, the first shielding module and the second shielding module have the same height.

[0023] A second aspect of the embodiments of the present application discloses an electronic device, comprising any one of the grounding devices disclosed in the embodiments of the present application.

[0024] Compared with the related art, the embodiments of the present application have at least the following beneficial effects:

[0025] A grounding device provided in an embodiment of the present application includes: a connector, a compatible connector, a first shielding module and a grounding module, wherein: the compatible connector includes a grounding pin and other pins, the first shielding module covers the top of the compatible connector, the first shielding module and the other pins are in a non-contact state, and is conductively connected to the grounding pin through a target area in the first shielding module, the grounding module covers the first shielding module and the connector, and connects the grounding pin of the compatible connector and the grounding pin of the connector through the target area of ​​the first shielding module to achieve grounding of the compatible connector and the connector. Through this design, the grounding schemes of connectors of different specifications are unified, so that connectors of different specifications can be shared, thereby achieving sharing of antennas of different versions, and further alleviating the problems of antenna RF spurious emission, radiation sensitivity and sensitivity reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A side view of a schematic structural diagram of a first grounding device disclosed in an embodiment of the present application;

[0028] Figure 2 This is a schematic diagram of the front structure of the connector and the compatible connector disclosed in the embodiment of the present application;

[0029] Figure 3 A schematic structural diagram of a first shielding module provided in an embodiment of the present application;

[0030] Figure 4 A side cutaway view of a schematic structure of a second shielding module provided in an embodiment of the present application;

[0031] Figure 5 A side cutaway view of a schematic structure of a third shielding module provided in an embodiment of the present application;

[0032] Figure 6 A schematic structural diagram of a fourth shielding module provided in an embodiment of the present application;

[0033] Figure 7 A schematic structural diagram of a fifth shielding module provided in an embodiment of the present application;

[0034] Figure 8 A side view of a schematic structural diagram of a second grounding device disclosed in an embodiment of the present application;

[0035] Figure 9 It is a structural diagram of an electronic device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] It should be pointed out that the terms "first\second\third" involved in the embodiments of the present application are used to distinguish similar or different objects, and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described here can be implemented in an order other than that illustrated or described here.

[0038] It should be noted that the terms "including," "having," and any variations thereof in the embodiments and drawings of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to the process, method, product, or apparatus.

[0039] As the consumer electronics market matures, more and more manufacturers are realizing the importance of cost control in product design. Consequently, they often achieve compatibility between different products by sharing components developed in previous projects. While this approach effectively reduces development costs, it can lead to interference issues in PCB layout. Especially when sharing components of different specifications, inconsistent pin functionality often requires designers to perform complex PCB flywire design to address pins that cannot be directly shared. This additional design effort not only increases overall design complexity but can also impact product reliability and performance, hindering further optimization and advancement of the technology.

[0040] To address compatibility and interference issues between different devices, related technologies in the field of antenna design use Mylar insulation material to shield the signal pins that need to be isolated above the compatible connector to ensure electrical isolation and prevent short circuits. At the same time, the connector's grounding copper foil is arranged above the Mylar. This copper foil covers the connector and the compatible connector and extends above the shielding cover, thereby achieving a common ground connection between the compatible connector and the connector. This design can reduce signal interference to a certain extent and improve system stability. However, due to the limitations of the structural design, this solution still cannot completely eliminate problems such as RF spurious emissions, radiation sensitivity, and sensitivity reduction. Therefore, other shielding measures and optimization strategies still need to be explored in subsequent designs to further improve product performance and reliability.

[0041] A grounding device provided in an embodiment of the present application includes: a connector, a compatible connector, a first shielding module and a grounding module, wherein: the compatible connector includes a grounding pin and other pins, the first shielding module covers the top of the compatible connector, the first shielding module and the other pins are in a non-contact state, and is conductively connected to the grounding pin through a target area in the first shielding module, the grounding module covers the first shielding module and the connector, and connects the grounding pin of the compatible connector and the grounding pin of the connector through the target area of ​​the first shielding module to achieve grounding of the compatible connector and the connector. Through this grounding device, the grounding schemes of connectors of different specifications are unified, so that connectors of different specifications can be shared, thereby achieving sharing of antennas of different versions, and further alleviating the problems of antenna RF spurious emission, radiation sensitivity and sensitivity reduction.

[0042] The grounding device disclosed in the embodiments of the present application is applicable to various electronic product fields requiring high reliability and low interference, and plays an important role in devices that need to process high-frequency signals. Its applicable scenarios include, but are not limited to, the fields of communication systems, broadcasting and television, navigation systems, the Internet of Things, military and security fields, the automotive industry, medical equipment, and scientific research and experimental fields. In the field of communication systems, it can be used for, but is not limited to, 4G base stations, 5G base stations, user equipment, wireless local area networks, Bluetooth devices, and satellite communication systems; in the field of broadcasting and television, it can be used for, but is not limited to, transmitting antennas for radio and television stations, home television receiving antennas, etc.; in navigation systems, it can be used for, but is not limited to, global positioning system antennas, aviation, marine, and automotive navigation equipment, etc.; in the field of the Internet of Things, it can be used for, but is not limited to, wireless transmission of various smart home devices and communication of industrial Internet of Things devices, etc.; in the field of military and security, it can be used for, but is not limited to, radar and electronic warfare systems, drones, and remote control systems; in the automotive industry, it can be used for, but is not limited to, in-vehicle communication systems, wireless entertainment and navigation systems, etc.; in the field of medical equipment, it can be used for, but is not limited to, wireless communication of medical monitoring equipment and telemedicine equipment; in the field of scientific research and experimental fields, it can be used for, but is not limited to, wireless sensor networks and radio telescopes in astronomy, etc.

[0043] Please also see Figure 1 and Figure 2 , Figure 1 This is a side view of a schematic structural diagram of a first grounding device disclosed in an embodiment of the present application, including a PCB board 10, a connector 11, a compatible connector 12, a first shielding module 13, and a grounding module 14; Figure 2 This is a schematic diagram of the front structure of the connector and compatible connector disclosed in the embodiment of the present application, including a PCB board 10, the connector including a ground pin 211 and other pins 212, and the compatible connector including a ground pin 221 and other pins 222, wherein:

[0044] The first shielding module 13 covers the top of the compatible connector 12, the first shielding module 13 is not in contact with other pins 212 of the compatible connector 12, and is conductively connected to the ground pin 222 of the compatible connector 12 through the target area in the first shielding module 13;

[0045] The grounding module 14 covers the first shielding module 13 and the connector 11, and connects the grounding pin 221 of the compatible connector 12 and the grounding pin 211 of the connector 21 through the target area of ​​the first shielding module 13 to achieve grounding of the compatible connector 12 and the connector 11.

[0046] The connector 11 is mainly used to connect the antenna to other devices to ensure that the signal can be effectively transmitted. Other devices connected to the antenna include but are not limited to a transmitter, a receiver, and a signal processor.

[0047] Different types of connectors are suitable for different application scenarios. You can choose the appropriate connector according to your needs. Connectors include but are not limited to SMA connectors (SubMiniature version A connector), N-type connectors (N connector), BNC connectors (Bayonet Neill-Concelman connector), TNC connectors (Threaded Neill-Concelman connector), MCX connectors (Miniature Coaxial connector), UHF connectors (Ultra High Frequency connector), F-type connectors (F connector), RP-SMA connectors (Reverse Polarity SMA connector), etc. Among them, SMA connectors can be used in wireless communication equipment and have good frequency characteristics and miniaturized design; N-type connectors can be used in high-power and low-frequency applications, including but not limited to base stations and antenna systems; BNC connectors can be used for video signal transmission and are suitable for short-distance connections; TNC connectors are similar to BNCs but are designed with threaded connections and are suitable for higher-frequency applications; MCX connectors are small connectors and can be used in mobile devices and GPS antennas; UHF connectors can be used in low-frequency and high-power applications, including but not limited to broadcasting and amateur radio; F-type connectors can provide stable connections for cable TV and satellite receivers, etc.; RP-SMA connectors are reverse-plug SMA connectors and can be used in wireless LAN equipment.

[0048] The grounding device disclosed in the embodiment of the present application can unify the grounding schemes of the connector 11 and the compatible connector 12.

[0049] Compatible connector 12 refers to the fact that in the early stages of product development, some prototype devices that have been molded may be used for testing and verification. These devices are designed to meet specific needs to ensure the functionality and adaptability of the product in the design stage. However, in actual production, designers may hope that these prototype devices can be reused in other designs, that is, in different products or different design versions. Reusing these prototype devices means that some devices designed for other needs can be applied to designs for other needs. Therefore, in actual situations, the sharing of compatible connectors can reduce the number of different components required in development and production, reduce material costs, and use existing prototype connectors to reduce the time for developing new devices. In addition, the use of verified devices in new designs can reduce uncertainty and improve product reliability.

[0050] The first shielding module 13 covers the top of the compatible connector 12, and the first shielding module 13 is not in contact with other pins 212 of the compatible connector 12, and is conductively connected to the ground pin 222 of the compatible connector 12 through the target area in the first shielding module 13;

[0051] The first shielding module 13 shields the other pins of the compatible connector 12 and makes the ground pin of the compatible connector conductive with the ground module through the target area, so as to shield the interference of the signals of other pins of the compatible connector. It can not only effectively block the interference of external electromagnetic waves and prevent it from affecting the internal circuit, but also isolate sensitive signal lines, reduce crosstalk between signals, ensure signal quality, reduce bit error rate, and improve data transmission reliability. In addition, it can also limit the electromagnetic radiation generated by the compatible connector itself to prevent interference with the surrounding environment and other equipment, so that the compatible connector can improve the anti-interference ability of the equipment in high-frequency applications and improve its working performance in complex electromagnetic environments.

[0052] The grounding module 14 covers the first shielding module 13 and the connector 11 and connects the grounding pin 221 of the compatible connector 12 and the grounding pin 211 of the connector through the target area of ​​the first shielding module 13 to achieve common grounding of the compatible connector 12 and the connector 11.

[0053] The grounding module 14 typically consists of several components, including but not limited to grounding pins, conductive material, and a fixed structure connection interface. The grounding pins are primarily used to connect to the ground terminal of a device or system, ensuring that current can safely flow into the ground. The conductive material, typically made of copper or aluminum, provides effective electrical connection. The insulating material isolates the conductive parts to prevent unnecessary short circuits and electrical interference. The fixed structure securely mounts the grounding module on the device, ensuring connection stability. The connection interface, for example, connects to a connector to ensure signal and current transmission. These components work together to achieve the function of the grounding module and ensure device safety and performance.

[0054] The function of the grounding module 14 is to provide a safe grounding path for the connector to prevent static electricity and overvoltage from damaging the equipment. By grounding the connector, it can also reduce noise and interference and improve signal quality and stability. In addition, when a device fails, the grounding module can also effectively disperse the current and protect other components from damage.

[0055] The grounding module 14 covers the first shielding module 13 and the connector 11, realizing common grounding of the connector 11 and the compatible connector 12, realizing the unification of the grounding scheme of the connector 11 and the compatible connector 12, simplifying the design, making the design process simpler, and reducing the complexity of electrical design between different connectors. This design allows different types of connectors to be used in the same system, improving the compatibility and flexibility between devices, and the reuse of compatible connectors also reduces the diversity of materials and production processes, thereby reducing production costs and maintenance fees. In addition, the unified grounding scheme can also help reduce signal interference and improve the overall stability and reliability of the system. In addition, during troubleshooting and maintenance, the unified grounding scheme makes problem location and resolution faster.

[0056] In some embodiments, the first shielding module is composed of a raised plate, the first shielding module includes at least one first raised plate and at least one second raised plate, the at least one first raised plate constitutes a first part of the first shielding module, the at least one second raised plate constitutes a second part of the first shielding module, and the second part is arranged on the first part, wherein:

[0057] A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector;

[0058] The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

[0059] See also Figure 3 , Figure 3 A schematic structural diagram of a first shielding module provided in an embodiment of the present application includes a first elevated plate 31, a second elevated plate 32, and a target area 321. The first elevated plate 31 constitutes a first portion of the first shielding module, and the second elevated plate 32 constitutes a second portion of the shielding module. The second portion is disposed on the first portion, wherein:

[0060] A hollow portion 311 is provided in the middle area of ​​the first elevated plate 31. Other pins of the compatible connector are disposed in the accommodation space formed by the hollow portion 311 of the first elevated plate of the shielding module. The ground pin of the compatible connector is disposed in contact with the non-hollow portion of the first elevated plate 31 of the shielding module. The height of the first elevated plate of the shielding module is greater than that of the compatible connector.

[0061] The target area 321 is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

[0062] Among them, the raising plate is an auxiliary tool used to raise the height of equipment or objects. It is widely used in multiple industries and scenarios. Common materials include wood, plastic, metal, etc., which are not specifically limited here. It can be selected according to the specific usage scenario and load-bearing requirements. The shape and size of the design can also be selected according to actual needs. It can be a plate structure or a plate structure with an anti-slip design to increase safety.

[0063] Optionally, the thickness of each pad can also be selected according to actual needs, and 20um to 50um can meet the needs.

[0064] Optionally, the shape of the hollow portion 311 in the middle of the first raising plate 31 can be elliptical, rectangular, diamond-shaped, etc., which is not specifically limited here.

[0065] The height of the first raised plate 31 of the shielding module is greater than the height of the compatible connector, which can prevent other pins of the compatible connector from touching the second raised plate, thereby forming a spatial isolation between the second raised plate and other pins of the compatible connector to isolate the signals of other pins of the compatible connector, and also avoid the situation where the second raised plate is conductive, so that other pins of the compatible connector cannot be electrically connected to the second raised plate, thereby achieving the purpose of isolating other pins of the compatible connector.

[0066] In some embodiments, the first elevated plate is composed of a layer of insulating material and a layer of conductive medium, or is composed of at least one layer of insulating material.

[0067] In some embodiments, the second elevated plate is made of a conductive medium, or is made of a layer of insulating material and a layer of conductive medium.

[0068] Optionally, the conductive medium may be a metal, a semiconductor material, a conductive polymer, a carbon material, etc., wherein the metal may be copper, aluminum, silver, etc., which are not specifically limited herein; the semiconductor material may be silicon, germanium, etc., which are not specifically limited herein; the conductive polymer may be polyaniline, polyvinyl alcohol, etc., which are not specifically limited herein; the carbon material may be graphite, carbon nanotubes, etc., which are not specifically limited herein;

[0069] Optionally, the insulating material may be plastic, rubber, ceramic, glass fiber, wood, silicone, etc., which is not specifically limited here.

[0070] See also Figure 4 , Figure 4 A side-cut view of the schematic structure of the second shielding module provided in an embodiment of the present application includes two first raised plates 411, 412 and two second raised plates 421, 422, wherein the first raised plate 411 is composed of a layer of insulating material 43 and a layer of conductive medium 44, the first raised plate 412 is composed of two layers of insulating material 43, the two layers of first raised plates 411 constitute the first part 41 of the shielding module, the second raised plate 421 is composed of a conductive medium 44, the second raised plate 422 is composed of a layer of insulating material 43 and a layer of conductive medium 44, the two second raised plates constitute the second part of the shielding module, and the second part of the shielding module constituted by the two second raised plates is located above the first part of the shielding module constituted by the two first raised plates.

[0071] See also Figure 5 , Figure 5 A side-sectional view of the schematic structure of the third shielding module provided in an embodiment of the present application includes a first raised plate 511 and three second raised plates 521, 522, and 523, wherein the first raised plate 511 is composed of a layer of insulating material 53, and a first raised plate 511 constitutes the first part 51 of the shielding module, the second raised plate 521 is composed of a layer of insulating material 53 and a layer of conductive medium 54, the second raised plate 522 is composed of a layer of conductive medium 54, and the second raised plate 523 is composed of a layer of insulating material 53 and a layer of conductive medium 54, and the three second raised plates constitute the second part of the shielding module, and the second part of the shielding module composed of the three second raised plates is located above the first part of the shielding module composed of the first raised plate.

[0072] In some embodiments, the non-hollowed portion of the first elevated plate is provided with through holes, the number of the through holes is the same as the number of ground pins of the compatible connector, the ground pins of the compatible connector are connected to the second elevated plate through the through holes, and the second elevated plate is composed of a conductive medium.

[0073] Please also refer to 2 and Figure 6 , Figure 6 The schematic structural diagram of the fourth shielding module provided in the embodiment of the present application includes a first padding plate 61, a hollow portion 611, a through hole 612, and two second padding plates 621 and 622. Please refer to Figure 2 , Figure 2 The ground pins of the compatible connector are 6, which are distributed on both sides of the compatible connector 22, with 3 ground pins on each side. Figure 2 The ground pin 221 of the compatible connector is provided with 6 through holes, a first raised plate 61 constitutes the first part of the shielding module, two second raised plates 621 and 622 are composed of a conductive medium, and the two second raised plates constitute the second part of the shielding module. The second part of the shielding module constituted by the two second raised plates is located above the first part of the shielding module constituted by the first raised plate.

[0074] Among them, through-hole 612 is a commonly used technology in PCB design, which is used to make electrical connections between different layers and can realize interconnection between different circuit layers. Its manufacturing process is mainly through drilling holes at corresponding positions and plating the inner walls of the holes with conductive media to ensure that the layers can be connected through the through-holes. Its manufacturing process includes but is not limited to drilling, cleaning, electroplating, and thickening the copper layer. Drilling usually uses a high-precision CNC drilling machine to drill through holes on the PCB substrate. The position and size of the holes are set according to the design drawings during drilling; cleaning refers to cleaning to remove powder and impurities in the holes to ensure that the surface of the holes is clean for subsequent processing; electroplating refers to electroplating the through-holes to form a conductive metal layer on the hole wall, which can improve the conductivity and durability of the through-holes; thickening the copper layer means that according to the needs of the circuit design, the metal layers inside and outside the hole can be thickened to meet the requirements of carrying current.

[0075] Using through-holes in the elevated board to electrically connect the ground pin of the compatible connector to the second elevated board not only ensures that signals between circuits can be effectively transmitted to ensure normal operation of the equipment, but also helps dissipate heat, directing heat from the compatible connector to other areas of the elevated layer, thereby improving the stability and reliability of the system. In addition, the through-holes can also serve as mechanical support points to enhance the structural strength of the PCB and prevent the compatible connector from falling off due to vibration or impact.

[0076] Optionally, the shape of the through hole can be circular, square, or triangular, which is not specifically limited here.

[0077] In some embodiments, the non-hollowed portion of the first raising plate is provided with a first through hole, and the target area of ​​the second raising plate is provided with a second through hole, the positions of the first through hole and the second through hole correspond to each other, and the number of the first through holes is the same as the number of ground pins of the compatible connector.

[0078] Please also see Figure 2 and Figure 7 , Figure 7 The schematic structural diagram of the fifth shielding module provided in the embodiment of the present application includes a first padding plate 71, a hollow portion 711, a through hole 712, and two second padding plates 721 and 722. Please refer to Figure 2 , Figure 2 The ground pins of the compatible connector are 6, which are distributed on both sides of the compatible connector 22, with 3 ground pins on each side. Figure 2 The ground pin 221 of the compatible connector is provided with 6 first through holes, a first raising plate 61 constitutes the first part of the shielding module, the second raising plate 621 is composed of a layer of insulating material and a layer of conductive medium, the second raising plate 622 is composed of a layer of insulating material and a layer of conductive medium, the two second raising plates are provided with second through holes corresponding to the target areas of the first through holes, the two second raising plates constitute the second part of the shielding module, and the second part of the shielding module constituted by the two second raising plates is located above the first part of the shielding module constituted by the first raising plate.

[0079] Optionally, the size and shape of the second through hole can be freely selected according to actual conditions and are not specifically limited here.

[0080] In some embodiments, the grounding device further includes a second shielding module, wherein:

[0081] The second shielding module covers the top of the connector, the second shielding module is in a non-contact state with other pins of the connector, and is conductively connected to the ground pin of the connector through the target area in the second shielding module;

[0082] The grounding module covers the first shielding module and the second shielding module, and connects the grounding pin of the compatible connector and the grounding pin of the connector to ground through the target area of ​​the first shielding module and the target area of ​​the second shielding module.

[0083] Please also see Figure 2 and Figure 8 , Figure 8 A side view of a schematic structural diagram of a first grounding device disclosed in an embodiment of the present application, comprising a PCB board 80, a connector 81, a compatible connector 82, a first shielding module 83, a second shielding module 84, and a grounding module 85;

[0084] The first shielding module 83 covers the compatible connector 82, the first shielding module 83 is not in contact with other pins 221 of the compatible connector 82, and is conductively connected to the ground pin 222 of the compatible connector through the target area in the first shielding module 83;

[0085] The second shielding module 84 covers the top of the connector 81, the second shielding module 84 is not in contact with other pins 211 of the connector 81, and is conductively connected to the ground pin 212 of the connector 81 through the target area in the second shielding module 84;

[0086] The grounding module 85 covers the first shielding module 83 and the second shielding module 84 and connects the grounding pin 221 of the compatible connector 82 and the grounding pin 211 of the connector to ground through the target area of ​​the first shielding module 83 and the target area of ​​the second shielding module 84.

[0087] In some embodiments, the second shielding module has the same structure as the first shielding module, and includes at least one first raised plate and at least one second raised plate. The at least one first raised plate constitutes a first portion of the second shielding module, and the at least one second raised plate constitutes a second portion of the second shielding module. The second portion is disposed on the first portion, wherein:

[0088] A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector;

[0089] The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

[0090] Optionally, the second shielding module can be Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 The shielding module shown in, but not limited to, will not be described in detail here.

[0091] In some embodiments, the first shielding module and the second shielding module have the same height, thereby enhancing structural stability. This is because the same height helps to maintain the overall balance of the equipment, reduce damage caused by uneven force, and better utilize the installation space and improve layout flexibility. In addition, the same height makes it more convenient to interchange modules, which is beneficial for later maintenance and upgrading, and using the same height can also ensure a more uniform shielding effect, thereby improving system performance.

[0092] See also Figure 9 , Figure 9 This is a schematic diagram of the structure of the electronic device disclosed in the embodiment of this application Figure 9 .like Figure 9 As shown, the electronic device may include any grounding device disclosed in the embodiments of the present application.

[0093] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present application. Therefore, the references to "in one embodiment" or "in an embodiment" throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present application.

[0094] In the various embodiments of the present application, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0095] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one place or distributed across multiple network units. Some or all of these units may be selected based on actual needs to achieve the objectives of this embodiment.

[0096] In addition, the functional units in the embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0097] The term "and / or" in this article is only a description of the association relationship between associated objects, indicating that there can be three relationships. For example, object A and / or object B can mean: object A exists alone, object A and object B exist at the same time, and object B exists alone.

[0098] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0099] The methods disclosed in the several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.

[0100] The features disclosed in the several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.

[0101] The features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.

[0102] The grounding device disclosed in the embodiments of the present application has been described in detail above. Specific examples have been used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to facilitate understanding of the method and core concept of the present application. Furthermore, those skilled in the art will appreciate that variations in the specific implementation methods and scope of application may occur based on the concepts of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A grounding device, characterized in that: The device comprises a connector, a compatible connector, a first shielding module, and a grounding module, wherein: The compatible connector includes a ground pin and other pins; The first shielding module covers the compatible connector, the first shielding module is not in contact with the other pins, and is conductively connected to the ground pin through the target area in the first shielding module; The grounding module covers the first shielding module and the connector, and connects the grounding pin of the compatible connector and the grounding pin of the connector through the target area of ​​the first shielding module to achieve grounding of the compatible connector and the connector.

2. The grounding device according to claim 1, characterized in that: The first shielding module includes at least one first raised plate and at least one second raised plate, wherein the at least one first raised plate constitutes a first portion of the first shielding module, and the at least one second raised plate constitutes a second portion of the first shielding module, and the second portion is disposed on the first portion, wherein: A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector; The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

3. The grounding device according to claim 2, characterized in that: The first elevated plate is composed of an insulating material layer and a conductive medium layer, or the first elevated plate is composed of at least one insulating material layer.

4. The grounding device according to claim 2 or 3, characterized in that: The second raised plate is made of a conductive medium, or the second raised plate is made of an insulating material layer and a conductive medium layer.

5. The grounding device according to claim 2, characterized in that: The non-hollowed portion of the first elevated plate is provided with through holes, the number of the through holes being the same as the number of the ground pins of the compatible connector, the ground pins of the compatible connector being connected to the second elevated plate through the through holes, and the second elevated plate being made of a conductive medium.

6. The grounding device according to claim 2, characterized in that: The non-hollowed portion of the first raising plate is provided with a first through hole, and the target area of ​​the second raising plate is provided with a second through hole. The positions of the first through hole and the second through hole correspond to each other, and the number of the first through holes is the same as the number of ground pins of the compatible connector.

7. The grounding device according to claim 1, characterized in that: The grounding device further includes a second shielding module, wherein: The second shielding module covers the top of the connector, the second shielding module is in a non-contact state with other pins of the connector, and is conductively connected to the ground pin of the connector through the target area in the second shielding module; The grounding module covers the first shielding module and the second shielding module, and connects the grounding pin of the compatible connector and the grounding pin of the connector to ground through the target area of ​​the first shielding module and the target area of ​​the second shielding module.

8. The grounding device according to claim 7, characterized in that: The second shielding module has the same structure as the first shielding module. The second shielding module includes at least one first raising plate and at least one second raising plate. The at least one first raising plate constitutes the first part of the second shielding module, and the at least one second raising plate constitutes the second part of the second shielding module. The second part is arranged on the first part, wherein: A hollow portion is provided in the middle area of ​​the first raised plate, and other pins of the compatible connector are provided in the accommodation space formed by the hollow portion of the at least one first raised plate of the first shielding module, and the ground pin of the compatible connector is provided in contact with the non-hollow portion of the at least one first raised plate of the first shielding module; the height of the at least one first raised plate of the first shielding module is greater than the height of the compatible connector; The target area is an area of ​​the second elevated plate corresponding to the non-hollowed portion of the first elevated plate.

9. The grounding device according to claim 7 or 8, characterized in that: The first shielding module and the second shielding module have the same height.

10. An electronic device, characterized in that: Includes the grounding device described in any one of 1-9.

Images