Injection molding packaged CCS busbar connector port
Through the injection-molded CCS busbar connector port, the upper and lower staggered plug heads and injection-molded pressure fill sealing material are used to solve the problems of PIN pin oxidation and short circuit and achieve better sealing and insulation effects.
Patent Information
- Application Number
- CN202423083983.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-12-13
AI Technical Summary
The existing CCS busbar connector ports have problems with PIN pin oxidation and short circuit during long-term use. The dispensing sealing method is prone to bubbles, resulting in degradation of sealing performance, and the sealing glue is difficult to fill the space between the PIN pins, resulting in poor insulation.
The CCS busbar connector ports in injection molded packaging are arranged in an up and down manner through the upper and lower insertion pins. The PIN pins are arranged in a three-dimensional dislocation manner in a spatial three-dimensional manner, and the sealing material is filled with injection molding pressure to form a three-dimensional sealing structure.
The antioxidant effect and insulation distance of the PIN foot are improved, and the problem of poor sealing is avoided, ensuring the sealing performance and insulation between the PIN foot.
Smart Images

Figure CN223260955U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of energy storage batteries for new energy vehicles, and in particular to an injection-molded encapsulated CCS busbar connector port. Background Art
[0002] The CCS busbar is mainly composed of signal acquisition components, plastic structural parts, copper and aluminum bars, etc., which are connected into an integral body through processes such as hot pressing or riveting. It is used in new energy vehicles and energy storage battery modules to realize high-voltage series and parallel connection of battery cells and temperature sampling and battery cell voltage sampling functions. The CCS busbar connector port is used to connect the signals collected by the CCS busbar to the connector to realize the transmission of information such as temperature and voltage to the BMS system.
[0003] In the existing technology, during the use of the CCS busbar connector port, in order to prevent the PIN pins on the PIN pin connection area from oxidation or short circuiting between the PIN pins during long-term use, glue is usually applied to the PIN pin area to seal. The sealant is used to seal the PIN pin welding point, thereby isolating the PIN pin from contact with the outside air, and at the same time forming electrical isolation between multiple PIN pins, thereby preventing short circuits between the PIN pins. However, the existing glue-applying sealing method has the following disadvantages: first, after the glue is applied, during the curing process of the sealant, bubbles are generated in the sealant during the volatilization of the solvent, forming cavities, which deteriorates the internal sealing performance of the sealant and the anti-oxidation effect of the PIN pins; second, the space between the PIN pins of the existing CCS busbar connector port is small, and the viscosity of the sealant is high. During the glue-applying process, the sealant is difficult to fill the space between the PIN pins, resulting in poor insulation between the PIN pins due to insufficient sealant. Summary of the Invention
[0004] The utility model aims to provide an injection-molded packaged CCS busbar connector port, aiming to solve the above-mentioned defects of the existing dispensing-type packaged CCS busbar connector port.
[0005] In view of this, the technical solution provided by the present invention is: an injection-molded encapsulated CCS busbar connector port, comprising a connection port and a connection substrate, wherein a printed circuit film for electrically connecting to the CCS busbar is provided between the connection port and the connection substrate, wherein the connection port comprises a shell, wherein a plurality of plug-in posts connected to the outside are provided inside the shell, an extension end is provided on one side of the shell, a plurality of plug-in post heads corresponding to the plug-in posts are provided on the side wall between the extension end and the shell, the plug-in post heads are electrically connected to the plug-in posts, a PIN pin is welded on the plug-in post head, a plurality of conductive paste circuits corresponding to the plug-in posts are provided on the printed circuit film, and the PI The N pin passes through the bottom of the extension end and is attached to the bottom surface, and the PIN pin attached to the bottom of the extension end is attached to the conductive paste circuit, so that the plug-in column and the printed circuit film are electrically connected, and the plug-in column head includes a row of upper plug-in column heads and a row of lower plug-in column heads, and the upper plug-in column heads and the lower plug-in column heads are arranged in an up and down staggered manner, and the height of the upper plug-in column head protruding from the surface of the shell is greater than the height of the lower plug-in column head protruding from the surface of the shell, so that the PIN pins are arranged in a spatial three-dimensional staggered manner, and the extension end is provided with an injection molding packaging part that is integral with the shell, and the injection molding packaging part forms a seal for the PIN pin and the plug-in column head located on one side of the extension end.
[0006] Furthermore, connecting columns are provided on both sides of the shell, a first plug-in hole corresponding to the connecting column is provided on the connecting substrate, and a second plug-in hole corresponding to the connecting column is provided on the printed circuit film. The shell is plugged between the second plug-in hole and the first plug-in hole through the connecting column, so that the shell, the printed circuit film and the connecting substrate are connected together.
[0007] Furthermore, the extension end is open at the top and surrounded by three sides to form a cavity with the housing. Thus, during injection molding, the cavity at the extension end can better receive and seal the injection molding material, thereby facilitating injection molding.
[0008] Furthermore, the distance between the adjacent upper plug-in column heads and the lower plug-in column heads is half the distance between the adjacent upper plug-in column heads. Through the above arrangement, the upper plug-in column heads and the lower plug-in column heads have the largest staggered space.
[0009] Furthermore, the PIN pin is L-shaped, comprising an upper PIN pin for connecting to the upper plug-in post and a lower PIN pin for connecting to the lower plug-in post. The L-shaped bottom of the lower PIN pin is longer than the L-shaped bottom of the upper PIN pin. This allows the L-shaped bottom of the PIN pin to be flush with the bottom of the extended end, thereby facilitating better compression and contact between the connection port and the surface of the printed circuit film.
[0010] Furthermore, the conductive paste circuit is conductive carbon paste.
[0011] Furthermore, the conductive paste circuit is conductive silver paste.
[0012] The utility model converts the glue spot packaging into injection molding packaging. Since there is a certain injection molding pressure during the injection molding process, the sealing injection molding material can be well filled between the PIN pins, thereby avoiding the situation where the glue spot packaging is not filled in place, and also avoiding the problem of poor sealing caused by the formation of cavities due to the volatilization of solvent bubbles during the curing process of the glue spot packaging. Therefore, the anti-oxidation effect of the PIN pins after injection molding is good.
[0013] The utility model arranges the upper plug-in column head and the lower plug-in column head in an up-down staggered manner, and the height of the upper plug-in column head protruding from the surface of the shell is greater than the height of the lower plug-in column head protruding from the surface of the shell, so that the PIN pins are arranged in a spatial three-dimensional staggered manner, and the PIN pins have a larger spacing, which can improve the insulation distance between the PIN pins. Moreover, after the insulation distance between the PIN pins is increased, the sealing injection molding material can be better filled, further improving the sealing effect between the PIN pins. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is one of the three-dimensional structural diagrams of the utility model.
[0015] Figure 2 This is the second schematic diagram of the three-dimensional structure of the utility model.
[0016] Figure 3 This is a schematic diagram of the three-dimensional structure of the utility model before injection molding and packaging.
[0017] Figure 4 This is a schematic diagram of the bottom direction structure of the connection port.
[0018] Figure 5 This is a schematic diagram of the connection between the PIN pin and the conductive paste circuit.
[0019] Figure 6 for Figure 5 Schematic diagram of the three-dimensional structure decomposition.
[0020] Among them: 1-connecting substrate, 11-connecting hole, 12-first plugging hole, 2-printed circuit film, 21-conductive paste circuit, 22-second plugging hole, 3-connection port, 31-shell, 311-extension end, 32-plugging column, 33-plugging column head, 331-upper plugging column head, 332-lower plugging column head, 34-PIN foot, 341-upper PIN foot, 342-lower PIN foot, 35-connecting column, 4-injection molding packaging part. DETAILED DESCRIPTION
[0021] The following is a brief description of the embodiments of the present invention with reference to the accompanying drawings.
[0022] An injection molded CCS busbar connector port, see 1- Figure 6 , including a connection port 3, a connection substrate 1, a printed circuit film 2 for electrically connecting to the CCS busbar is provided between the connection port 3 and the connection substrate 1, connection holes 11 are provided on both sides of the connection substrate 1, the connection holes 11 are used to connect to the CCS busbar, and the printed circuit film 2 is attached to the connection substrate 1 by gluing. Figure 4 The connection port 3 includes a shell 31. The interior of the shell 31 is provided with a plurality of plug-in columns 32 connected to the outside. An extension end 311 is provided on one side of the shell 31. The extension end 311 is an upper opening, and three sides are surrounded by the shell 31 to form a chamber. The extension end 311 is provided with an injection molding packaging part 4 that is integral with the shell 31. The injection molding packaging part 4 is realized by a conventional injection molding process. When the injection molding is performed, the injection molding packaging part 4 can better receive the sealing injection molding material through the cavity of the extension end 311, which is convenient for injection molding. A plurality of plug-in columns corresponding to the plug-in columns 32 are provided on the side wall between the extension end 311 and the shell 31. The column head 33 is electrically connected to the plug-in column head 32, and a PIN pin 34 is welded on the plug-in column head 33. The injection molding packaging part 4 forms a seal between the PIN pin 34 and the plug-in column head 33 located on one side of the extension end 311. A plurality of conductive paste lines 21 corresponding to the plug-in column 32 are provided on the printed circuit film 2. The conductive paste line 21 can be made of conductive carbon paste or conductive silver paste. The PIN pin 34 passes through the bottom of the extension end 311 and is attached to the bottom surface, and the PIN pin 34 attached to the bottom of the extension end 311 is attached to the conductive paste line 21, so that the plug-in column 32 is electrically connected to the printed circuit film 2.
[0023] Among them, the plug-in column caps 33 include a row of upper plug-in column caps 331 and a row of lower plug-in column caps 332. The upper plug-in column caps 331 and the lower plug-in column caps 332 are arranged in an up-and-down staggered manner. The height of the upper plug-in column caps 331 protruding from the surface of the shell 31 is greater than the height of the lower plug-in column caps 332 protruding from the surface of the shell 31, so that the PIN pins 34 are arranged in a spatial three-dimensional staggered manner. Preferably, the staggered distance between adjacent upper plug-in column caps 331 and lower plug-in column caps 332 is half the distance between adjacent upper plug-in column caps 331. Such an arrangement allows the upper plug-in column caps 331 and the lower plug-in column caps 332 to have the maximum staggered space. Therefore, there is a larger spacing between the PIN pins 34 welded on the plug-in column caps 33, which can increase the insulation distance between the PIN pins 34. Moreover, after increasing the insulation distance between the PIN pins 34, the sealing injection molding material can be better filled, further improving the sealing effect between the PIN pins 34.
[0024] In this embodiment, the PIN pin 34 is L-shaped, including an upper PIN pin 341 for connecting to the upper plug-in column 331 and a lower PIN pin 342 for connecting to the lower plug-in column 332, and the L-shaped bottom length of the lower PIN pin 342 is greater than the L-shaped bottom length of the upper PIN pin 341. When the L-shaped bottom of the PIN pin 34 is attached to the bottom of the extension end 311, the end face can be kept flush, thereby facilitating the connection port 3 to be better pressed and attached to the surface of the printed circuit film 2.
[0025] In this embodiment, in order to better achieve the connection, connecting columns 35 are provided on both sides of the shell 31, a first plug-in hole 12 corresponding to the connecting column 35 is provided on the connecting substrate 1, and a second plug-in hole 22 corresponding to the connecting column 35 is provided on the printed circuit film 2. The shell 31 is inserted between the second plug-in hole 22 and the first plug-in hole 12 through the connecting column 35, so that the shell 31, the printed circuit film 2, and the connecting substrate 1 are connected together.
[0026] In this embodiment, when the L-shaped bottom of the PIN pin 34 and the conductive paste circuit on the surface of the printed circuit film 2 are aligned, they can be first bonded together using conductive glue and then pressed together by inserting the connecting column 35 .
[0027] The above embodiments merely represent implementation methods of the present invention. Although the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention.
Claims
1. An injection-molded CCS busbar connector port, characterized by: It includes a connection port and a connection substrate. A printed circuit film for electrically connecting to the CCS busbar is provided between the connection port and the connection substrate. The connection port includes a shell. A plurality of plug-in posts connected to the outside are provided inside the shell. An extension end is provided on one side of the shell. A plurality of plug-in post heads corresponding to the plug-in posts are provided on the side wall between the extension end and the shell. The plug-in post heads are electrically connected to the plug-in posts. PIN pins are welded on the plug-in post heads. A plurality of conductive paste circuits corresponding to the plug-in posts are provided on the printed circuit film. The PIN pins pass through the bottom of the extension end and are attached to the bottom surface. , and the PIN pin at the bottom of the extended end is in contact with the conductive paste circuit, so that the plug-in column is electrically connected to the printed circuit film, and the plug-in column head includes a row of upper plug-in column heads and a row of lower plug-in column heads, and the upper plug-in column heads and the lower plug-in column heads are arranged in an up and down staggered manner, and the height of the upper plug-in column head protruding from the surface of the shell is greater than the height of the lower plug-in column head protruding from the surface of the shell, so that the PIN pins are arranged in a spatial three-dimensional staggered manner, and the extended end is provided with an injection molding packaging part that is integral with the shell, and the injection molding packaging part forms a seal for the PIN pin and the plug-in column head located on one side of the extended end.
2. The injection-molded CCS busbar connector port according to claim 1, characterized in that: Connecting columns are provided on both sides of the shell, a first plug-in hole corresponding to the connecting column is provided on the connecting substrate, and a second plug-in hole corresponding to the connecting column is provided on the printed circuit film. The shell is plugged between the second plug-in hole and the first plug-in hole through the connecting column, so that the shell, the printed circuit film and the connecting substrate are connected together.
3. The injection-molded CCS busbar connector port according to claim 1, characterized in that: The extension end has an upper opening and is surrounded by three sides to form a chamber with the shell.
4. The injection-molded CCS busbar connector port according to claim 1, characterized in that: The staggered distance between adjacent upper inserted column heads and lower inserted column heads is half the distance between adjacent upper inserted column heads.
5. The injection-molded CCS busbar connector port according to claim 1, characterized in that: The PIN pin is L-shaped, including an upper PIN pin for connecting to the upper plug-in column and a lower PIN pin for connecting to the lower plug-in column. The L-shaped bottom length of the lower PIN pin is greater than the L-shaped bottom length of the upper PIN pin.
6. The injection-molded CCS busbar connector port according to claim 1, characterized in that: The conductive paste circuit is conductive carbon paste.
7. The injection-molded CCS busbar connector port according to claim 1, characterized in that: The conductive paste circuit is conductive silver paste.