Circuit board and electronic equipment

Abstract

The utility model provides a circuit board and an electronic device. The circuit board comprises conductive layers, an isolation layer arranged between two adjacent conductive layers, and a solder mask layer located at one side, far away from the isolation layer, of the conductive layer. Wherein the conductive layer is provided with a sound hole and a lead which is conducted with the sound hole; a welding ring is arranged on the solder mask layer on one side of the conductive layer provided with the lead; and the lead is conducted with the welding ring, so that static electricity in the sound hole is guided to the welding ring through the lead. According to the utility model, the electrostatic discharge path can be shortened, and rapid grounding of static electricity is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically, to a circuit board and electronic equipment. Background Art

[0002] With the advancement of society and technology, the size of electronic products such as mobile phones, computers, and wearable devices has continued to decrease in recent years. People's performance requirements for these portable electronic products are also becoming increasingly higher, which in turn requires the electronic components to be continuously reduced in size while improving their performance and consistency. Products integrated using MEMS (Micro-Electro-Mechanical-System) technology are beginning to be mass-produced in such electronic products, and their packaging volume is even smaller than that of traditional electronic devices.

[0003] Currently, in MEMS products with a three-layer PCB design, due to the lack of a metal casing to conduct ground, the main conduction path for electrostatic discharge is the acoustic hole, copper foil layer, and through-hole in the PCB. When static electricity is transmitted through the acoustic hole, it is easy to damage the MEMS chip located at the acoustic hole. Static electricity in the copper foil layer or through-hole will affect the performance of the ASIC chip. In severe cases, it will cause the chip to fail and fail the electrostatic test.

[0004] Therefore, there is an urgent need for a circuit board that can quickly release static electricity in products without metal casings to prevent static electricity from affecting the chips thereon. Utility Model Content

[0005] In view of the above problems, the purpose of the present invention is to provide a circuit board and an electronic device to solve the problems that the existing circuit board cannot quickly release static electricity, resulting in the performance of the chip thereon being affected.

[0006] The circuit board provided by the present invention includes a conductive layer, an isolation layer arranged between two adjacent conductive layers, and a solder resist layer located on the side of the conductive layer away from the isolation layer; wherein, a sound hole and a lead wire connected to the sound hole are provided on the conductive layer; a soldering ring is provided on the solder resist layer on the side of the conductive layer provided with the lead wire; the lead wire is connected to the soldering ring so that static electricity in the sound hole is guided to the soldering ring through the lead wire.

[0007] In addition, an optional structural feature is that the conductivity of the lead is greater than the conductivity of the conductive layer.

[0008] In addition, an optional structural feature is that at least one lead wire is provided, and the lead wire is provided on the shortest path from the sound hole to the welding ring.

[0009] In addition, an optional structural feature is that three lead wires are provided, and the three lead wires extend from the sound hole to three edge positions of the conductive layer respectively.

[0010] In addition, an optional structural feature is that the lead is a silver wire and is provided on the conductive layer by embedding.

[0011] In addition, an optional structural feature is that the conductive layer includes a first copper foil layer and a second copper foil layer, and the isolation layer is arranged between the first copper foil layer and the second copper foil layer; the solder mask layer includes a first solder mask layer arranged on a side of the first copper foil layer away from the isolation layer, and a second solder mask layer arranged on a side of the second copper foil layer away from the isolation layer.

[0012] In addition, an optional structural feature is that the sound hole is set through the first solder mask layer, the first copper foil layer, the isolation layer, the second solder mask layer and the second copper foil layer; and corresponding through holes are respectively provided on the first solder mask layer, the first copper foil layer, the isolation layer, the second solder mask layer and the second copper foil layer; the first copper foil layer and the second copper foil layer achieve signal conduction through the through holes.

[0013] In addition, an optional structural feature is that the lead is provided on the second copper foil layer.

[0014] In addition, an optional structural feature is that the isolation layer is a PI layer.

[0015] On the other hand, the utility model also provides an electronic device, including a first circuit board, a third circuit board arranged parallel to the first circuit board, and a second circuit board arranged between the first circuit board and the third circuit board, wherein the first circuit board is as described above; wherein, a sound hole, an ASIC chip and a MEMS chip covering the sound hole are provided on the first circuit board, and a grounding pad is provided on the third circuit board; the static electricity in the sound hole is transferred to the grounding pad in turn through the leads, welding rings and second circuit board in the first circuit board.

[0016] According to the circuit board and electronic equipment of the above-mentioned utility model, a lead connected to the sound hole is provided on the conductive layer, and a welding ring is provided on the solder resist layer on the side of the conductive layer provided with the lead. The static electricity at the conductive layer or the sound hole can be quickly led to the welding ring through the lead, and finally the static electricity is grounded and released through the welding ring. The static electricity release path can be shortened, and the static electricity can be quickly and effectively released in products without metal casings, thereby ensuring the stable and reliable performance of other structures on the product circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0018] Figure 1 Schematic diagram of the structure of an electronic device according to an embodiment of the present utility model;

[0019] Figure 2 This is a schematic structural diagram of a circuit board according to an embodiment of the present utility model;

[0020] Figure 3 4 is a lead distribution diagram according to an embodiment of the present utility model.

[0021] Markings in the accompanying drawings: first circuit board 1, second circuit board 2, third circuit board 3, ground pad 4, MEMS chip 5, ASIC chip 6, acoustic via 7, first solder resist layer 11, acoustic via 111, through hole 112, first copper foil layer 12, isolation layer 13, second copper foil layer 14, lead 141, through hole 142, acoustic via 143, second solder resist layer 15, welding ring 151.

[0022] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0023] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0024] In the following description, for illustrative purposes, numerous specific details are set forth to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that the embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate description of one or more embodiments.

[0025] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the following terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the content or structure of the present invention.

[0026] In order to describe the structure of the circuit board and the electronic device of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Figures 1 to 3 The schematic structures of a circuit board, an electronic device and lead distribution according to an embodiment of the present utility model are respectively shown.

[0028] like Figures 1 to 3 As shown together, the circuit board of the embodiment of the present invention includes a conductive layer, an isolation layer 13 arranged between two adjacent conductive layers, and a solder resist layer located on the side of the conductive layer away from the isolation layer 13; wherein, sound holes are provided on the circuit board, and the sound holes are respectively located on the conductive layer, the isolation layer 13 and the solder resist layer and correspond to the upper and lower positions. In addition, in addition to the sound holes provided on the conductive layer, a lead 141 connected to the sound hole is also provided, and a second solder resist layer 151 is provided on the solder resist layer on the side of the conductive layer provided with the lead 141. The lead 141 can extend from the sound hole to the edge of the conductive layer and be connected to the second solder resist layer 151, so as to guide the static electricity in the sound hole to the second solder resist layer 151 through the lead 141, and finally lead it to the grounding position through the second solder resist layer 151 to complete the release of static electricity.

[0029] It can be seen that the purpose of setting the lead 141 on the conductive layer is to prevent static electricity from being transmitted through the through-hole or the acoustic hole and affecting the chip located on the circuit board. To this end, the lead 141 needs to be made of a material with a conductivity greater than that of the conductive layer, so that the conductivity of the lead 141 is greater than the conductivity of the conductive layer. In this way, when static electricity exists in the acoustic hole, the conductive layer or the through-hole, it can be conducted to the ground end through the lead 141 as quickly as possible, thereby shortening the conduction path and release time of the static electricity. To this end, the lead 141 can be made of silver wire or other metal wire with a conductivity greater than copper.

[0030] It can be seen that in the application process of the circuit board, a MEMS chip will be set at the sound hole and an ASIC chip connected to the MEMS chip will be set on the circuit board. When conducting an electrostatic test on the circuit board, it is necessary to apply static electricity externally and detect whether the performance of the circuit board and the chip is abnormal. The static electricity release path of a conventional circuit board is: sound hole-conductive layer-through hole. The through hole usually uses copper pillars as the conductive channel between the conductive layers. Therefore, external static electricity will be transmitted in the conductive layer and the through hole, thereby affecting the MEMS chip at the sound hole and the ASIC chip on the circuit board.

[0031] To this end, in the circuit board of the embodiment of the present invention, a lead 141 structure is provided on the conductive layer on the side closer to the ground terminal, and at least one lead 141 is provided and is provided on the conductive layer by burying, so that the lead 141 is provided on the shortest path from the sound hole to the second solder resist layer 151. As a specific example, Figure 3 As shown, a lead is provided on the left side, upper side and lower side of the sound hole respectively. The three lead wires extend straight from the sound hole position to the three edge positions of the conductive layer respectively, and are connected to the second solder resist layer 151 on the solder resist layer placed under the conductive layer.

[0032] It should be noted that the number of layers or structure of the circuit board is not limited to the specific structure shown in the accompanying drawings, and its structure may vary in different application scenarios. However, a lead 141 structure can be set on at least one of the conductive layers to shorten the electrostatic transmission path through the lead 141.

[0033] like Figure 2 As shown, in a specific embodiment of the present invention, the conductive layer includes a first copper foil layer 12 and a second copper foil layer 14, and the isolation layer 13 is arranged between the first copper foil layer 12 and the second copper foil layer 14. A PI layer can be used to protect the circuit and the stress generated during the buffer chip packaging process; the solder mask layer includes a first solder mask 11 arranged on the side of the first copper foil layer 12 away from the isolation layer 13, and a second solder mask 15 arranged on the side of the second copper foil layer 14 away from the isolation layer 13, wherein the first solder mask 11, the first copper foil layer 12, the isolation layer 13, the second solder mask 15 and the first solder mask are arranged in sequence. The two copper foil layers 14 are respectively provided with corresponding acoustic holes (for example, the acoustic hole 111 located on the first solder resist layer and the acoustic hole 143 located on the second copper foil layer) and through holes (for example, the through hole 112 located on the first solder resist layer and the through hole 142 located on the second copper foil layer). The first copper foil layer 12 and the second copper foil layer 14 are connected by signals through the through holes. In other words, the acoustic hole is set through the first solder resist layer 11, the first copper foil layer 12, the isolation layer 13, the second solder resist layer 15 and the second copper foil layer 14. Similarly, the through hole is similar to the acoustic hole, but the through hole often adopts metal conduction as the signal connection hole between the conductive layers.

[0034] Among them, during the application process of the circuit board embodiment of the present invention, it is usually assembled with other circuit boards. For this purpose, the lead 141 can be set on the second copper foil layer 14, and a second solder resist layer 151 is set on the second solder resist layer 15 outside the second copper foil layer 14, which can quickly realize the transfer of static electricity.

[0035] Corresponding to the above-mentioned circuit board, the present invention also provides an electronic device, such as Figure 1 As shown, the electronic device of an embodiment of the utility model includes a first circuit board 1, a third circuit board 3 arranged parallel to the first circuit board 1, and a second circuit board 2 arranged between the first circuit board 1 and the third circuit board 3. The first circuit board 1, the second circuit board 2 and the third circuit board 3 are connected to each other to form a packaging cavity structure for accommodating chips. An ASIC chip 6, an acoustic hole 7 and a MEMS chip 5 covering the acoustic hole 7 are arranged on the first circuit board 1, wherein the ASIC chip 6 and the MEMS chip 5 are both arranged on the second solder resist layer 15 of the first circuit board 1.

[0036] Among them, the second circuit board 2 and the second solder resist layer 151 on the second solder resist layer 15 in the first circuit board 1 are connected and conductive. Similarly, the second circuit board 2 is connected and conductive with the welding ring in the third circuit board 3. The static electricity on the first circuit board 1 can be transferred to the ground pad 4 on the third circuit board 3 through the lead 141 and the second solder resist layer 151 through the second circuit board 2, that is, the static electricity in the sound hole 7 is transferred to the ground pad 4 through the lead 141, the second solder resist layer 151 and the second circuit board 2 in the first circuit board 1 in turn, thereby realizing the shortest path release of static electricity in electronic products without metal casings, effectively improving the problem of electrostatic failure of products.

[0037] According to the above-mentioned circuit board and electronic equipment of the present invention, a lead connected to the sound hole is provided on the conductive layer adjacent to other circuit boards, and a welding ring is provided on the solder resist layer on the side of the conductive layer provided with the lead. The static electricity at the conductive layer or the sound hole can be quickly led to the welding ring through the lead, and the circuit boards are welded and conducted with each other through the welding ring. Therefore, the static electricity on the circuit board can be transferred to the ground terminal of the other circuit board in the shortest path through the welding ring connected to the lead. It can be applied to electronic products without metal casings, effectively improve ESD failure, and ensure the stable and reliable performance of the circuit board and the chip thereon.

[0038] The circuit board and electronic device according to the present invention are described above by way of example with reference to the accompanying drawings. However, those skilled in the art will appreciate that various improvements may be made to the circuit board and electronic device described above without departing from the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the contents of the appended claims.

Claims

1. A circuit board, characterized in that: It includes a conductive layer, an isolation layer arranged between two adjacent conductive layers, and a solder resist layer located on a side of the conductive layer away from the isolation layer; wherein, A sound hole and a lead wire connected to the sound hole are provided on the conductive layer; A soldering ring is provided on the solder resist layer on one side of the conductive layer where the lead is provided; The lead wire is connected to the welding ring so as to guide the static electricity in the sound hole to the welding ring through the lead wire.

2. The circuit board according to claim 1, wherein: The electrical conductivity of the lead is greater than the electrical conductivity of the conductive layer.

3. The circuit board according to claim 1, wherein: At least one lead wire is provided, and the lead wire is arranged on the shortest path from the sound hole to the welding ring.

4. The circuit board according to claim 3, wherein: There are three lead wires, which extend from the sound hole to three edge positions of the conductive layer respectively.

5. The circuit board according to claim 1, wherein: The lead wire is a silver wire and is arranged on the conductive layer in a buried manner.

6. The circuit board according to claim 1, wherein: The conductive layer includes a first copper foil layer and a second copper foil layer, and the isolation layer is provided between the first copper foil layer and the second copper foil layer; The solder resist layer includes a first solder resist layer located on a side of the first copper foil layer away from the isolation layer, and a second solder resist layer located on a side of the second copper foil layer away from the isolation layer.

7. The circuit board according to claim 6, wherein: The acoustic hole is provided through the first solder resist layer, the first copper foil layer, the isolation layer, the second solder resist layer and the second copper foil layer; and The first solder resist layer, the first copper foil layer, the isolation layer, the second solder resist layer and the second copper foil layer are respectively provided with through holes corresponding to their positions; The first copper foil layer and the second copper foil layer achieve signal conduction through the through hole.

8. The circuit board according to claim 7, wherein: The lead is arranged on the second copper foil layer.

9. The circuit board according to claim 1, wherein: The isolation layer is a PI layer.

10. An electronic device comprising a first circuit board, a third circuit board arranged in parallel with the first circuit board, and a second circuit board arranged between the first circuit board and the third circuit board, characterized in that: The first circuit board is as claimed in any one of claims 1 to 9; wherein, An acoustic hole, an ASIC chip, and a MEMS chip covering the acoustic hole are provided on the first circuit board, and a ground pad is provided on the third circuit board; The static electricity in the sound hole is transferred to the ground pad through the lead wires in the first circuit board, the welding ring and the second circuit board in sequence.

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