Inverted device of electronic equipment and liquid cooling electronic equipment

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to an upside-down mounting device of electronic equipment and liquid cooling electronic equipment. The upside-down mounting device comprises a first mounting plate and a second mounting plate, the first mounting plate and the second mounting plate are used for being detachably connected with the two sides of the electronic equipment respectively in the first direction, the first mounting plate and the second mounting plate are each provided with a hanging hole and a positioning hole which are communicated in the second direction, and the positioning holes are used for being connected with positioning pieces of the electronic equipment in a clamped mode; the hanging hole comprises a guide section close to the positioning hole, and the size of the guide section in the first direction is gradually reduced in the direction from the hanging hole to the positioning hole; wherein the first direction is perpendicular to the second direction; the first mounting plate and the second mounting plate are provided with connecting structures, and the connecting structures are used for being detachably connected with the liquid cooling cabinet. According to the inversion device, the electronic equipment can be inversely installed in the liquid cooling cabinet on the premise that the structure of the electronic equipment is not changed, and the inversion device is convenient to disassemble and assemble and facilitates maintenance and replacement of the electronic equipment.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a flip-chip device for electronic equipment and a liquid-cooled electronic equipment. Background Art

[0002] Liquid-cooled electronic equipment mainly refers to equipment that uses liquid instead of air to remove the heat generated by heat-generating components of electronic equipment such as servers, chipsets, memory sticks, and expansion cards during operation. Liquid cooling technology can be divided into cold plate liquid cooling and full immersion liquid cooling according to the different ways in which the coolant contacts the heat-generating components. Cold plate liquid cooling technology uses working fluid as an intermediate heat transfer medium to transfer heat from the hot zone to a distant location for cooling. Full immersion liquid cooling technology is a cooling technology that uses liquid as a heat transfer medium, immerses the heat-generating components in the liquid, and performs heat exchange through direct contact. It is understandable that for electronic equipment with high cooling requirements and the pursuit of higher heat dissipation efficiency and reliability, full immersion liquid cooling has more advantages.

[0003] Among them, when electronic equipment, such as servers, are installed in a liquid-cooled cabinet, the use of an inverted installation method can effectively reduce the internal space occupied by the liquid-cooled cabinet compared to upright installation. In addition, the cables of the server are usually distributed at the bottom of the server. In the liquid-cooled scenario, the server is hoisted up and down for operation and maintenance. When the server with the cables routed at the bottom is put into use in the liquid-cooled scenario, the cables at the bottom of the server need to be transferred from the bottom of the liquid-cooled cabinet cavity to the top for routing. As a result, space needs to be reserved inside the liquid-cooled cabinet to support the server cable routing, which increases the volume of the liquid-cooled cabinet and the cost of the coolant inside the cabinet. Moreover, the server cables are at the bottom of the liquid-cooled cabinet, and each maintenance of the server cables requires the server to be completely lifted out of the liquid-cooled cabinet, which is very unfriendly to server operation and maintenance. However, traditional air-cooled servers cannot adapt to the inverted installation method because the structure of the server conflicts with the implementation of the inverted installation solution. How to design a liquid-cooled cabinet to accommodate an inverted server without changing the server structure has become an urgent need to be solved. Utility Model Content

[0004] The present application discloses an inverted mounting device for electronic equipment and a liquid-cooled electronic equipment, which are used to install the electronic equipment in an inverted manner in a liquid-cooled cabinet without changing the structure of the electronic equipment.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] In the first aspect, the present application provides a flip-up device, which includes a first mounting plate and a second mounting plate. Along the first direction, the first mounting plate and the second mounting plate are respectively used to be detachably connected to the two sides of the electronic device, and the first mounting plate and the second mounting plate are both provided with hanging holes and positioning holes connected along the second direction, and the positioning holes are used to be clamped with the positioning parts of the electronic device; the hanging hole includes a guide section close to the positioning hole, and the size of the guide section along the first direction gradually decreases along the direction from the hanging hole to the positioning hole; wherein the first direction and the second direction are perpendicular to each other; the first mounting plate and the second mounting plate are both provided with a connecting structure, and the connecting structure is used to be detachably connected to the liquid cooling cabinet.

[0007] When installing an electronic device into a liquid-cooled cabinet, first, the positioning members on both sides of the inverted electronic device along a first direction are inserted into the mounting holes of the first and second mounting plates, respectively. Then, the first and second mounting plates are lifted upward along a second direction. Guided by the guide sections, the positioning members move from the mounting holes into the positioning holes, and the positioning members engage with the positioning holes, thereby completing the assembly of the flip-up device and the electronic device. Finally, the assembled electronic device and flip-up device are installed together in the liquid-cooled cabinet and connected to the cabinet via a connecting structure. The flip-up device allows the electronic device to be installed upside down in the liquid-cooled cabinet without changing the structure of the electronic device. Furthermore, the flip-up device, the electronic device, and the liquid-cooled cabinet are detachably connected, making them easy to disassemble and install, and facilitating repair and replacement. For electronic devices with cables mounted on the bottom, the flip-up device exposes the cables above, making cable connections clearly visible and making cable maintenance more convenient and efficient for operators. Furthermore, no space is required within the liquid-cooled cabinet for routing the electronic device cables, reducing the cabinet's volume and coolant costs.

[0008] Furthermore, along the first direction, the size of the hanging hole is greater than or equal to the maximum size of the positioning hole.

[0009] Furthermore, along the second direction, a first limiting member is provided at one end of the first mounting plate, and the first limiting member includes a first limiting plate perpendicular to the first mounting plate; a second limiting member is provided at one end of the second mounting plate, and the second limiting member includes a second limiting plate perpendicular to the second mounting plate; both the first limiting plate and the second limiting plate are used to abut against the end face of the electronic device.

[0010] Furthermore, along the third direction, the size of the distance between the end of the first limit member located at the same end and the edge of the first mounting plate is greater than or equal to a first preset value, and the size of the distance between the end of the second limit member located at the same end and the edge of the second mounting plate is greater than or equal to the first preset value, wherein the third direction is perpendicular to the first direction and the second direction.

[0011] Furthermore, along the first direction, the size of the communication opening between the hanging hole and the positioning hole is smaller than or equal to the maximum size of the positioning hole.

[0012] Furthermore, the connection structure includes a first connection member and a second connection member. Along the second direction, the first connection member is provided at one end of the surface of the first mounting plate, and the second connection member is provided at one end of the surface of the second mounting plate.

[0013] Furthermore, the first connecting member and the second connecting member are both captive screws or telescopic buckles.

[0014] Furthermore, the first mounting plate is provided with a first hanging ear, and along the second direction, the first hanging ear is located on the side of the first connecting member away from the hanging hole, and the first hanging ear is provided with a first lifting hole; the second mounting plate is provided with a second hanging ear, and along the second direction, the second hanging ear is located on the side of the second connecting member away from the hanging hole, and the second hanging ear is provided with a second lifting hole.

[0015] Furthermore, a first guide member is provided on the surface of the first mounting plate where the first connecting member is provided, and the first guide member is used to slide and cooperate with a third guide member on the inner surface of the liquid cooling cabinet along the second direction; a second guide member is provided on the surface of the second mounting plate where the second connecting member is provided, and the second guide member is used to slide and cooperate with a fourth guide member on the inner surface of the liquid cooling cabinet along the second direction; wherein the first guide member and the second guide member are both sliders or grooves.

[0016] In a second aspect, the present application provides a liquid-cooled electronic device, which includes a liquid-cooled cabinet, an electronic device, and a flip-chip device as in the first aspect. Along a first direction, the electronic device includes a first surface and a second surface arranged opposite to each other, and both the first surface and the second surface are provided with positioning members. The first mounting plate is connected to the positioning member of the first surface, and the second mounting plate is connected to the positioning member of the second surface; the liquid-cooled cabinet includes a liquid-cooled chamber and an opening connected to the liquid-cooled chamber, and the electronic device and the flip-chip device can enter and exit the liquid-cooled chamber along the second direction through the opening.

[0017] Because the flip-up device in the present application is included, the electronic equipment can be installed upside down in the liquid-cooled cabinet with the help of the flip-up device, and there is no need to change the structure of the electronic equipment. Moreover, the flip-up device is detachably connected to the electronic equipment and the liquid-cooled cabinet, making disassembly and assembly convenient. In addition, cables are usually provided at the bottom of the electronic equipment. When the electronic equipment is installed upside down in the liquid-cooled cabinet, the cables are exposed above. The operation and maintenance personnel can clearly see the cable connection status through the opening of the liquid-cooled cabinet, making cable maintenance more convenient and quick. At the same time, there is no need to provide routing space for the electronic equipment cables in the liquid-cooled cabinet, which reduces the volume of the liquid-cooled cabinet and the cost of coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of an existing electronic device;

[0019] Figure 2 for Figure 1A partial enlarged view of point A shown in FIG;

[0020] Figure 3 A schematic diagram of the structure of installing existing electronic equipment into a liquid cooling cabinet;

[0021] Figure 4 This is a schematic structural diagram of a flip-chip device for an electronic device according to an embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of the structure of the assembled flip-chip device and electronic device according to one embodiment of the present application;

[0023] Figure 6 for Figure 5 A partial enlarged view of point B shown in FIG;

[0024] Figure 7 This is a schematic structural diagram of a hanging hole and a positioning hole according to an embodiment of the present application;

[0025] Figure 8 This is a schematic diagram of the structure of the assembled server and flip-chip device according to an embodiment of the present application;

[0026] Figure 9 This is a schematic diagram of the structure of the assembled server and flip-chip device according to an embodiment of the present application;

[0027] Figure 10 for Figure 9 A partial enlarged view of point C shown in FIG;

[0028] Figure 11 This is a schematic structural diagram of a hanging hole and a positioning hole in another embodiment of the present application;

[0029] Figure 12 This is a structural diagram of an electronic device flip-chip mounted into a liquid cooling cabinet according to an embodiment of the present application;

[0030] Figure 13 This is a schematic structural diagram of a liquid-cooled electronic device according to an embodiment of the present application.

[0031] Reference numerals: 100 - flip-up device; 110 - first mounting plate; 120 - second mounting plate; 140 - second limiting member; 141 - second limiting plate; 142 - second connecting plate; 150 - first connecting member; 151 - first supporting plate; 152 - first screw; 153 - first buckle; 160 - second connecting member; 161 - second supporting plate; 162 - second screw; 163 - second buckle; 170 - first hanging ear; 180 - second hanging ear; 20, 200 - electronic equipment; 21, 210 - positioning member; 22, 220 - equipment body; 221 - housing; 23, 230 - hanging ear; 24, 240 - first surface; 25, 250 - second surface; 30, 300 - liquid cooling cabinet; 310 - third guide member;

[0032] 10- guide section; 40- first guide member; 50- second guide member;

[0033] 01-hanging hole; 02-positioning hole; 03-connecting port; 04-first lifting hole; 05-second lifting hole; 6, 06-opening. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] With the rapid growth of data volumes, electronic devices are faced with the need to process massive amounts of data throughput and computation, resulting in unprecedented energy consumption and heat dissipation challenges. Against this backdrop, liquid-cooled electronic devices have emerged, utilizing liquid cooling technology to cool electronic devices. Based on their physical form, liquid-cooled electronic devices can be categorized into two types: cold plate-type and fully immersed. Cold plate-type liquid cooling utilizes a working fluid as an intermediate heat transfer medium, transferring heat from a hot zone to a remote location for cooling. Full immersion-type liquid cooling, on the other hand, uses liquid as a heat transfer medium, immersing the heat-generating device in the liquid for direct heat exchange. Understandably, fully immersed liquid cooling offers advantages for applications with large data volumes, demanding cooling requirements, and the need for higher heat dissipation efficiency and reliability.

[0036] Figure 1 It is a structural diagram of an existing electronic device. Figure 2 for Figure 1 The enlarged view of the part A shown in the figure, Figure 3 Please refer to the schematic diagram of the structure for installing existing electronic equipment into the liquid cooling cabinet. Figures 1 to 3The conventional electronic device 20 includes a device body 22, a positioning member 21, and a lifting lug 23. Along a first direction D1, the device body 22 includes a first surface 24 and a second surface 25 that are opposite each other. The positioning member 21 is disposed on the first surface 24 and the second surface 25. The positioning member 21 can be a guide pin. Along a second direction D2, i.e., the height direction of the electronic device 20, a lifting lug 23 is provided on the top of the device body 22. The lifting lug 23 is used to connect to the liquid cooling cabinet 30.

[0037] Please refer to Figure 3 Along the height direction D2 of the liquid cooling cabinet 30, an opening 6 is provided at the top of the liquid cooling cabinet 30. When the electronic device 20 needs to be installed upright in the liquid cooling cabinet 30, first, the electronic device 20 is driven through the opening 6 and placed into the liquid cooling cabinet 30 by a lifting device (not shown in the figure), and then the lifting lug 23 of the electronic device 20 is connected to the liquid cooling cabinet 30. Among them, when the electronic device 20 is a server, the bottom of the server is usually provided with cables. When the server is installed upright in the liquid cooling cabinet 30, the cables at the bottom of the server need to be routed from the bottom of the inner cavity of the liquid cooling cabinet 30 to the top, resulting in the need to reserve space inside the liquid cooling cabinet 30 to support the routing of the server cables, which increases the volume of the liquid cooling cabinet 30 and the cost of the coolant in the cabinet; in addition, the server cables are at the bottom of the liquid cooling cabinet 30. Each time the server cables are maintained, the server needs to be completely lifted out of the liquid cooling cabinet 30, which is very unfriendly to server operation and maintenance.

[0038] Therefore, when electronic equipment, such as servers, are installed in a liquid-cooled cabinet, using an inverted installation method can effectively reduce the internal space occupied by the liquid-cooled cabinet compared to upright installation, and it also makes server cable maintenance easier. However, existing servers are not suitable for inverted installation because their structure conflicts with the implementation of an inverted installation solution. How to enable inverted installation in a liquid-cooled cabinet without changing the server's structure has become an urgent need.

[0039] In view of this, an embodiment of the present application provides a flip-chip device for an electronic device. Figure 4 This is a schematic structural diagram of a flip-chip device for an electronic device according to an embodiment of the present application. Figure 5 This is a schematic diagram of the structure of the assembled flip-chip device and electronic device according to one embodiment of the present application. Figure 6 for Figure 5 The local enlarged view of point B is shown in the figure. Figure 7 This is a structural diagram of the hanging hole and positioning hole of an embodiment of this application. Please refer to Figures 4 to 7The flip-chip device 100 includes a first mounting plate 110 and a second mounting plate 120. The first mounting plate 110 and the second mounting plate 120 are respectively configured to be detachably connected to two sides of the electronic device 200 along a first direction D1. The first mounting plate 110 and the second mounting plate 120 are each provided with a docking hole 01 and a positioning hole 02 that communicate along a second direction D2. The positioning hole 02 is configured to engage with a positioning member 210 of the electronic device 200, thereby enabling assembly of the flip-chip device 100 and the electronic device 200. The docking hole 01 includes a guide section 10 proximate to the positioning hole 02. The guide section 10 has a dimension d1 that gradually decreases along the first direction D1 as the docking hole 01 points toward the positioning hole 02. The first direction D1 and the second direction D2 are perpendicular to each other. The guide section 10 is configured to guide the positioning member 210 of the electronic device 200 from the docking hole 01 into the positioning hole 02.

[0040] In addition, the first mounting plate 110 and the second mounting plate 120 are both provided with a connecting structure, which is used to be detachably connected to the liquid cooling cabinet 300, so that the electronic device 200 can be fixed inside the liquid cooling cabinet 300 through the first mounting plate 110 and the second mounting plate 120.

[0041] It should be noted that the shapes and structures of the first mounting plate 110 and the second mounting plate 120 in the present application may be the same or different, and are specifically designed according to the structures on both sides of the electronic device 200 .

[0042] Reference Figure 4 The connection structure may include a first connection member 150 and a second connection member 160. The first connection member 150 is disposed at one end of the surface of the first mounting plate 110 along the second direction D2. Specifically, the first connection member 150 is disposed at the top of the first mounting plate 110 to facilitate assembly of the first mounting plate 110 with the liquid cooling cabinet 300 after the first mounting plate 110 is installed. Similarly, the second connection member 160 is disposed at one end of the surface of the second mounting plate 120. Specifically, the second connection member 160 is disposed at the top of the second mounting plate 120 to facilitate assembly of the second mounting plate 120 with the top of the liquid cooling cabinet 300 after the second mounting plate 120 is installed.

[0043] It is understood that the specific structure of the connection structure is not limited in this application, as long as the first mounting plate 110 and the second mounting plate 120 can be fixed on both sides of the liquid cooling cabinet 300. For example, the first connecting member 150 and the second connecting member 160 can both be captive screws or retractable buckles.

[0044] For example, Figure 4As shown, a first support plate 151 is perpendicularly mounted on the surface of the first mounting plate 110, and a first screw 152 is mounted on the first support plate 151. The first screw 152 can be a captive screw. Similarly, a second support plate 161 is perpendicularly mounted on the surface of the second mounting plate 120, and a second screw 162 is mounted on the second support plate 161. The second screw 162 can be a captive screw.

[0045] For example, Figure 4 As shown, the surface of the first mounting plate 110 facing away from the electronic device 200 is provided with a first latch 153, and the surface of the second mounting plate 120 facing away from the electronic device 200 is provided with a second latch 163. Both the first latch 153 and the second latch 163 can be telescopic latches. Correspondingly, the inner surface of the liquid cooling cabinet 300 is provided with grooves, into which the telescopic latches can extend, thereby fixing the first mounting plate 110 and the second mounting plate 120 to the inner surfaces of the liquid cooling cabinet 300 on both sides, respectively, and facilitating assembly and disassembly.

[0046] Of course, the connection structure may also be a threaded hole provided on the first mounting plate 110 or the second mounting plate 120 , so that the first mounting plate 110 or the second mounting plate 120 is connected to the liquid cooling cabinet 300 by screws or bolts.

[0047] Reference Figure 4 and Figure 5 The first mounting plate 110 may be provided with a first hanging ear 170. Along the second direction D2, the first hanging ear 170 is located on the side of the first connector 150 away from the hanging hole 01. The first hanging ear 170 has a first lifting hole 04, which is used to engage with the hook of the lifting device. Similarly, the second mounting plate 120 may be provided with a second hanging ear 180. Along the second direction, the second hanging ear 180 is located on the side of the second connector 160 away from the hanging hole 01. The second hanging ear 180 has a second lifting hole 05, which is used to engage with the hook of the lifting device.

[0048] It is understandable that the shape and structure of the first hoisting hole 04 and the second hoisting hole 05 are designed according to the shape and structure of the hook of the hoisting device, and are not specifically limited in this application. Figure 4 As shown, the first hoisting hole 04 and the second hoisting hole 05 can both be tapered holes.

[0049] Reference Figure 5 and Figure 6 The electronic device 200 in the present application includes a device body 220 and a positioning member 210. Along the first direction D1, the device body 220 includes a first surface 240 and a second surface 250 that are relatively arranged. The positioning member 210 is respectively arranged on the first surface 240 and the second surface 250, wherein the positioning member 210 can be a guide pin or a screw, etc.

[0050] The shape and structure of positioning hole 02 are designed based on positioning member 210 on electronic device 200, so that positioning member 210 can be snapped into positioning hole 02. For example, when positioning member 210 is a guide pin, the diameter of positioning hole 02 is equal to the outer diameter of the guide pin. It is understood that the number and position of mounting holes 01 and positioning holes 02 are designed based on the number and position of positioning members 210 on electronic device 200.

[0051] Continue to refer to Figure 5 , along the second direction D2, that is, the height direction D2 of the electronic device 200, the top of the device body 220 ( Figure 5 The electronic device 200 is placed upside down and is provided with a lifting lug 230. When the electronic device 200 is installed upright in the liquid cooling cabinet 300, the lifting lug 230 can be used to connect to the top of the liquid cooling cabinet 300. The flip-up mounting device 100 of the present application can install the electronic device 200 upside down in the liquid cooling cabinet 300 without changing the structure of the electronic device 200.

[0052] In some optional embodiments, such as Figure 7 As shown, along the first direction D1, the dimension d1 of the mounting hole 01 is greater than or equal to the maximum dimension d2 of the positioning hole 02. The larger dimension d1 of the mounting hole 01 facilitates insertion of the positioning member 210 into the mounting hole 01. The smaller dimension of the positioning hole 02 along the first direction D1 allows the positioning member 210 to fit into the positioning hole 02, thereby limiting the freedom of the positioning member 210 along the first direction D1 and, in turn, the freedom of the electronic device 200 along the first direction D1.

[0053] You can continue to refer to Figure 7 The guide section 10 includes two guide surfaces arranged opposite to each other along the second direction D2. The guide surfaces may be arc-shaped surfaces or inclined surfaces, so that the positioning member 210 slides along the guide surfaces to the communication port 03.

[0054] To limit the freedom of the electronic device 200 along the second direction D2, a first stopper (not shown) is provided at one end of the first mounting plate 110 along the second direction D2. Specifically, the first stopper is provided at the top of the first mounting plate 110 so that the first stopper abuts against the top surface of the electronic device 200, thereby limiting the freedom of the electronic device 200 along the second direction D2. Similarly, a second stopper 140 is provided at one end of the second mounting plate 120. Specifically, the second stopper 140 is provided at the top of the second mounting plate 120 so that the second stopper 140 abuts against the top surface of the electronic device 200, thereby limiting the freedom of the electronic device 200 along the second direction D2.

[0055] The structures of the first and second limiting members 140 are described in detail below by taking the electronic device 200 as a server as an example. Figure 8This is a schematic diagram of the structure of the server and the flip-chip device after assembly according to an embodiment of the present application. Figure 9 This is a schematic diagram of the structure of the server and the flip-chip device after assembly according to an embodiment of the present application. Figure 10 for Figure 9 Please refer to the enlarged view of the part C shown in Figures 8 to 10 The second limiting member 140 may include a second limiting plate 141 perpendicular to the second mounting plate 120, a second connecting plate 142 and the second limiting plate 141 forming an L-shaped structure, the second connecting plate 142 being attached to and fixed to the second mounting plate 120, and the second limiting plate 141 being perpendicular to the second mounting plate 120. The specific structure of the first limiting member can refer to the above description of the structure of the second limiting member 140 and will not be repeated here.

[0056] It is worth mentioning that due to process limitations or other factors, some deviations or errors may exist in the actual process, resulting in the "L-shaped structure" described above not being completely accurate. For example, the "L-shaped structure" described above may be an L-shaped structure that is allowed within the allowable error range. Of course, "L-shaped structure" can also be understood as a "standard L-shaped structure" or "similar to an L-shaped structure." Therefore, as long as the "L-shaped structure" described above generally meets the above conditions, it falls within the scope of protection of this application.

[0057] Continue to refer to Figure 10 The server includes a device body 220, which includes a shell 221 and components disposed in the shell 221. The first limit plate and the second limit plate 141 are both in contact with the top end surface of the shell 221, thereby limiting the freedom of the server along the second direction D2 and avoiding interference with the components inside the shell 221.

[0058] You can continue to refer to Figure 10Along the third direction D3, the shell 221 includes a front panel F and a rear panel. When operating and maintaining the server, the front panel F may need to be removed to repair the components inside the server. The third direction D3 is perpendicular to the first direction D1 and the second direction D2. During the maintenance process, the front panel F usually needs to be moved along the second direction D2 to complete the disassembly and assembly. In order to avoid interference between the second limiter 140 and the front panel F, along the third direction D3, the dimension L of the distance between the end of the second limiter 140 close to the front panel F and the edge of the second mounting plate 120 located at the same end is greater than or equal to a first preset value, so as to avoid the second limiter 140 affecting the disassembly and assembly of the front panel F. Similarly, along the third direction D3, the dimension L of the distance between the end of the first limiter close to the front panel F and the edge of the first mounting plate 110 located at the same end is greater than or equal to a first preset value, wherein the first preset value is the dimension of the front panel F along the third direction D3, thereby avoiding the first limiter affecting the disassembly and assembly of the front panel F.

[0059] Figure 11 This is a structural diagram of the hanging hole and the positioning hole of another embodiment of the present application, referring to Figure 11 Along the first direction, the dimension d3 of the communication opening 03 between the hanging hole 01 and the positioning hole 02 is less than or equal to the maximum dimension d4 of the positioning hole 02, to prevent the positioning member 210 from being separated from the positioning hole 02. In addition, when the positioning member 210 passes through the communication opening 03, it needs to press against the first mounting plate 110 or the second mounting plate 120 at the communication opening 03, so that the friction and collision sound between the positioning member 210 and the plate body can be clearly heard. Therefore, the friction sound can be used to determine whether the positioning member 210 is stuck in the positioning hole 02.

[0060] Figure 12 This is a structural diagram of an electronic device flip-chip mounted into a liquid cooling cabinet according to an embodiment of the present application. Figure 13 This is a structural diagram of a liquid-cooled electronic device according to an embodiment of the present application. Please refer to Figure 4 、 Figure 12 and Figure 13 The surface of the first mounting plate 110 provided with the first connecting member 150 is provided with a first guide member 40, and the first guide member 40 is used to slide along the second direction D2 with the third guide member 310 on the inner surface of the liquid cooling cabinet 300. The surface of the second mounting plate 120 provided with the second connecting member 160 is provided with a second guide member 50, and the second guide member 50 is used to slide along the second direction D2 with the fourth guide member (not shown in the figure) on the inner surface of the liquid cooling cabinet 300. The first guide member 40 and the second guide member 50 are both sliders or slide grooves. For example, as Figure 4As shown, the first guide member 40 is a slider provided on the surface of the first mounting plate 110, and correspondingly, the third guide member 310 is a slide provided on the inner surface of the liquid cooling cabinet 300. Similarly, the second guide member 50 is a slider provided on the surface of the second mounting plate 120, and correspondingly, the fourth guide member is a slide provided on the inner surface of the liquid cooling cabinet 300.

[0061] Based on the same technical concept, the embodiment of the present application also provides a liquid-cooled electronic device, and further reference is made to Figure 12 and Figure 13 The liquid-cooled electronic device includes a liquid-cooling cabinet 300, an electronic device 200, and a flip-chip device 100 according to various possible embodiments of the present application. Along a first direction D1, the electronic device 200 includes a first surface 240 and a second surface 250 disposed opposite each other. Both the first surface 240 and the second surface 250 are provided with positioning members 210. The first mounting plate 110 is connected to the positioning members 210 on the first surface 240, and the second mounting plate 120 is connected to the positioning members 210 on the second surface 250. The liquid-cooling cabinet 300 includes a liquid-cooling chamber and an opening 06 communicating with the liquid-cooling chamber. The electronic device 200 and the flip-chip device 100 can enter and exit the liquid-cooling chamber along a second direction D2 through the opening 06.

[0062] The electronic device 200 may be a square plug-in frame product such as a server or a switch with a positioning member 210 on the side.

[0063] like Figure 12 and Figure 13 As shown, when the assembled electronic device 200 and the flip-chip device 100 are installed together in the liquid cooling cabinet 300, first, the first guide member 40 on the first mounting plate 110 is aligned with the third guide member 310 on the inner surface of the liquid cooling cabinet 300, and the second guide member 50 on the second mounting plate 120 is aligned with the fourth guide member on the inner surface of the liquid cooling cabinet 300, so that the flip-chip device 100 drives the electronic device 200 to slide into the liquid cooling chamber of the liquid cooling cabinet 300. Finally, the first connecting member 150 on the first mounting plate 110 is fixedly connected to the liquid cooling cabinet 300, and the second connecting member 160 on the second mounting plate 120 is fixedly connected to the liquid cooling cabinet 300, thereby completing the assembly of the liquid-cooled electronic device 200. For electronic devices 200 with cables at the bottom, such as servers, the server is installed upside down in the liquid cooling chamber of the liquid cooling cabinet 300 through the flip-up device 100, with the cables facing the opening 06 of the liquid cooling cabinet 300, which makes it convenient for operation and maintenance personnel to repair the server cables. In addition, there is no need to provide routing space for the server cables in the liquid cooling cabinet 300, reducing the volume of the liquid cooling cabinet 300 and the cost of coolant.

[0064] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations.

Claims

1. A flip-chip device for an electronic device, characterized in that: The electronic device includes a first mounting plate and a second mounting plate, wherein the first mounting plate and the second mounting plate are respectively used to be detachably connected to two sides of the electronic device along a first direction, and the first mounting plate and the second mounting plate are both provided with a hanging hole and a positioning hole communicating along a second direction, and the positioning hole is used to be engaged with a positioning member of the electronic device; The hanging hole includes a guide section close to the positioning hole, and the guide section gradually decreases in size along the first direction from the hanging hole to the positioning hole, wherein the first direction and the second direction are perpendicular to each other; The first mounting plate and the second mounting plate are both provided with a connection structure, and the connection structure is used for detachably connecting to the liquid cooling cabinet.

2. The flip-chip device according to claim 1, wherein: Along the first direction, the size of the hanging hole is greater than or equal to the maximum size of the positioning hole.

3. The flip-chip device according to claim 1, wherein: Along the second direction, a first limiting member is provided at one end of the first mounting plate, and the first limiting member includes a first limiting plate perpendicular to the first mounting plate. A second limiting member is provided at one end of the second mounting plate, and the second limiting member includes a second limiting plate perpendicular to the second mounting plate. Both the first limiting plate and the second limiting plate are used to abut against the end face of the electronic device.

4. The flip-chip device according to claim 3, wherein: Along the third direction, the distance between the end of the first limiting member located at the same end and the edge of the first mounting plate is greater than or equal to a first preset value, and the distance between the end of the second limiting member located at the same end and the edge of the second mounting plate is greater than or equal to a first preset value, wherein the third direction is perpendicular to the first direction and the second direction.

5. The flip-chip device according to claim 1, wherein: Along the first direction, a size of a communication opening between the hanging hole and the positioning hole is smaller than or equal to a maximum size of the positioning hole.

6. The flip-chip device according to any one of claims 1 to 5, characterized in that: The connection structure includes a first connection member and a second connection member. Along the second direction, the first connection member is provided at one end of the surface of the first mounting plate, and the second connection member is provided at one end of the surface of the second mounting plate.

7. The flip-chip device according to claim 6, wherein: The first connecting member and the second connecting member are both captive screws or telescopic buckles.

8. The flip-chip device according to claim 6, wherein: The first mounting plate is provided with a first hanging ear, and along the second direction, the first hanging ear is located on a side of the first connecting member away from the hanging hole, and the first hanging ear is provided with a first hanging hole; The second mounting plate is provided with a second hanging ear. Along the second direction, the second hanging ear is located on a side of the second connecting member away from the hanging hole. The second hanging ear is provided with a second lifting hole.

9. The flip-chip device according to claim 6, wherein: A first guide member is provided on the surface of the first mounting plate provided with the first connecting member, and the first guide member is configured to slide along the second direction with a third guide member on the inner surface of the liquid cooling cabinet; A second guide member is provided on the surface of the second mounting plate provided with the second connecting member, and the second guide member is configured to slide along the second direction with a fourth guide member on the inner surface of the liquid cooling cabinet; Wherein, the first guide member and the second guide member are both sliders or sliding grooves.

10. A liquid-cooled electronic device, characterized in that: The device comprises a liquid cooling cabinet, an electronic device, and the flip-chip device according to any one of claims 1 to 9, wherein the electronic device comprises a first surface and a second surface arranged opposite to each other along the first direction, the first surface and the second surface are both provided with positioning members, the first mounting plate is connected to the positioning members on the first surface, and the second mounting plate is connected to the positioning members on the second surface; The liquid cooling cabinet includes a liquid cooling chamber and an opening communicating with the liquid cooling chamber, and the electronic device and the flip-chip device can enter and exit the liquid cooling chamber along the second direction through the opening.

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