Drying device

Abstract

The drying apparatus comprises: a chamber for accommodating a substrate; a stage for supporting the substrate inside the chamber; and a rotatable rectifying plate disposed laterally above the stage inside the chamber so as to overlap with a portion of the substrate in a plan view.

Description

Technical Field

[0001] The utility model relates to a drying device. More specifically, the utility model relates to a drying device used in a process for manufacturing a display device. Background Art

[0002] With the development of information technology, the importance of display devices as a connection medium between users and information has become increasingly prominent. As a result, the use of display devices such as liquid crystal display devices, organic light emitting display devices, and plasma display devices has gradually increased.

[0003] Recently, a display device including a light-emitting element containing organic matter is being studied. The organic layer included in the light-emitting element can be formed by an inkjet process. Utility Model Content

[0004] The purpose of the utility model is to provide a drying device for large substrates.

[0005] However, the purpose of the present invention is not limited to the above-mentioned purpose, and can be expanded in various ways without departing from the scope of the idea and field of the present invention.

[0006] In order to achieve the aforementioned purpose of the present invention, a drying device of one embodiment of the present invention may include: a chamber for accommodating a substrate; a workbench for supporting the substrate inside the chamber; and a rotatable rectifying plate arranged above the side of the workbench inside the chamber in a manner overlapping with a portion of the substrate in a plan view.

[0007] In one embodiment, the rectifying plate may be arranged to overlap with each side of the workbench in a plan view.

[0008] In one embodiment, the drying device may further include a rotating plate, and the rotating plate is arranged below the workbench inside the chamber.

[0009] In one embodiment, the rotating plate can rotate freely in one direction.

[0010] In one embodiment, the rotating plate may include an anti-reversal device, wherein the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

[0011] In order to achieve the aforementioned purpose of the present invention, a drying device in another embodiment of the present invention may include: a chamber for accommodating a substrate; a workbench for supporting the substrate inside the chamber; and a rectifying plate arranged on the side of the workbench inside the chamber in a manner separated from the substrate.

[0012] In one embodiment, the rectifying plate may include: a shaft; a first plate, a first end of the first plate being connected to the shaft, and a second end of the first plate being located above the base plate; and a second plate, a third end of the second plate being connected to the shaft, and a fourth end of the second plate being located below the workbench.

[0013] In one embodiment, a distance between the second end of the first plate and the fourth end of the second plate is adjustable.

[0014] In one embodiment, the rectifying plate may have a curved shape when viewed from a cross-section.

[0015] In one embodiment, the rectifying plate is rotatable.

[0016] In one embodiment, the drying device may further include a rotating plate, and the rotating plate is arranged below the workbench inside the chamber.

[0017] In one embodiment, the rotating plate can rotate freely in one direction.

[0018] In one embodiment, the rotating plate may include an anti-reversal device, wherein the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

[0019] In order to achieve the aforementioned purpose of the present invention, a drying device in another embodiment of the present invention may include: a chamber for accommodating a substrate; a workbench for supporting the substrate inside the chamber; and a rotating plate arranged below the workbench inside the chamber.

[0020] In one embodiment, the rotating plate can rotate freely in one direction.

[0021] In one embodiment, the rotating plate may include an anti-reversal device, wherein the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

[0022] In one embodiment, the drying device may further include a rectifying plate, which is arranged above the side of the workbench inside the chamber in a manner overlapping with a portion of the substrate in a plan view, and the rectifying plate has a rotation axis that overlaps with the center of the rectifying plate.

[0023] In one embodiment, the drying device may further include a rectifying plate, which is arranged on the side of the workbench inside the chamber in a manner separated from the substrate, and has a clamp shape capable of adjusting the distance between the ends of the rectifying plate when viewed from a cross-section.

[0024] In one embodiment, the drying device may further include a rectifying plate, which is arranged on the side of the workbench inside the chamber in a manner separated from the substrate and has a curved shape when viewed from a cross-section, and the rectifying plate has a rotation axis that overlaps with the center of the rectifying plate.

[0025] The drying device of an embodiment of the present invention may include: a chamber for accommodating a substrate; a workbench for supporting the substrate within the chamber; and a rectifying plate disposed above and to the side of the workbench so as to overlap a portion of the substrate when viewed from above, or disposed to the side of the workbench so as to be spaced apart from the substrate. Thus, the drying device can control the drying speed of the substrate at different positions.

[0026] The drying device of an embodiment of the present invention may include: a chamber for accommodating substrates; a workbench for supporting the substrates within the chamber; and a rotating plate disposed below the workbench within the chamber. Thus, the drying device can prevent the substrates from being contaminated by backflow caused by fluctuations in internal pressure.

[0027] However, the effects of the present invention are not limited to the aforementioned effects, and can be expanded in various ways without departing from the scope of the idea and field of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a cross-sectional view of a drying device for explaining one embodiment of the present invention.

[0029] Figure 2 Is used to describe the containment Figure 1 A top view of a substrate in a drying device.

[0030] Figures 3 to 5 Is used to illustrate Figure 1 Diagram of the drying method of the drying device.

[0031] Figure 6 It is a diagram for explaining a drying device according to another embodiment of the present invention.

[0032] Figures 7 and 8 Is used to illustrate Figure 6 Diagram of the drying method of the drying device.

[0033] Figure 9It is a diagram for explaining a drying device according to another embodiment of the present invention.

[0034] Figure 10 Is used to illustrate Figure 9 Diagram of the drying method of the drying device.

[0035] Figure 11 It is a diagram for explaining a display device formed by using the drying device according to an embodiment of the present invention.

[0036] Description of Reference Numerals

[0037] SUB: Substrate CH1, CH2, CH3: Chamber

[0038] BP: Workbench BA1, BA2, BA3: Rectifier plate

[0039] CP: Rotating Plate FRA: Anti-reverse device

[0040] RA1, RA3: Rotation axis RA2: Axis

[0041] SP1: First board

[0042] SP2: Second board

[0043] LE1, LE2, LE3: The distance between the second end of the first plate and the fourth end of the second plate DETAILED DESCRIPTION

[0044] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same structural elements in the drawings, and repeated descriptions of the same structural elements are omitted.

[0045] Figure 1 It is a cross-sectional view of a drying device for explaining one embodiment of the present invention.

[0046] Reference Figure 1 The drying device DE1 may include a chamber CH1, a workbench BP, a rectifying plate BA1, a rotating plate CP, and a decompression unit PU. The workbench BP, the rectifying plate BA1, and the rotating plate CP may be arranged in the chamber CH1. The decompression unit PU may be connected to the chamber CH1.

[0047] For example, the chamber CH1 may provide a sealed processing space. To this end, the chamber CH1 may include an upper surface and a lower surface arranged parallel to each other, and a plurality of side surfaces. The chamber CH1 may maintain a normal pressure atmosphere, a vacuum atmosphere, or a vacuum dry atmosphere injected with a specific gas.

[0048] In one embodiment, the chamber CH1 may accommodate a substrate SUB. For example, the substrate SUB may have ink (eg, a luminescent material) containing a solvent dispensed thereon. The chamber CH1 may also provide a processing space for a drying process to dry the solvent.

[0049] In one embodiment, the work table BP may support the substrate SUB inside the chamber CH1 .

[0050] For example, the workbench BP may be connected to a drive unit DU. The drive unit DU may move the workbench BP up and down. For example, the drive unit DU may be an actuator, a pneumatic cylinder, or the like.

[0051] In one embodiment, the rectifier plate BA1 may be arranged above and to the side of the workbench BP within the chamber CH1 so as to overlap a portion of the substrate SUB when viewed from above. In one embodiment, the rectifier plate BA1 may be arranged so as to overlap each side of the workbench BP when viewed from above. For example, the rectifier plate BA1 may be arranged so as to overlap all four sides of the workbench BP when viewed from above. However, the present invention is not limited to this. For example, the rectifier plate BA1 may be arranged so as to overlap only a portion of the sides of the workbench BP when viewed from above.

[0052] In one embodiment, the rectifier plate BA1 may have a rotation axis RA1 that may overlap the center of the rectifier plate BA1. For example, the rotation axis RA1 may be connected to a drive device. The drive device may be configured so that it does not overlap the substrate SUB when viewed from above. In this case, particles that may be generated by the rotation will not fall onto the substrate SUB, thereby preventing contamination of the substrate SUB.

[0053] In one embodiment, the rectifying plate BA1 is rotatable, thereby controlling the size of the drying space at the center portion of the substrate SUB and the size of the drying space at the edge portion of the substrate SUB. The edge portion may surround the center portion.

[0054] For example, the rectifying plate BA1 may be arranged to be tilted downward from the center portion toward the edge portion of the substrate SUB. In this case, the size of the drying space at the center portion of the substrate SUB may be larger than the size of the drying space at the edge portion of the substrate SUB.

[0055] In one embodiment, the rotary plate CP may be disposed below the workbench BP.

[0056] In one embodiment, the rotating plate CP can rotate freely in one direction and cannot rotate in a direction opposite to the one direction. To this end, in one embodiment, the rotating plate CP can include an anti-reversal device FRA. For example, the anti-reversal device FRA can be a bearing.

[0057] The decompression unit PU can exhaust the gas inside the chamber CH1 to the outside of the chamber CH1. This reduces the internal pressure of the chamber CH1. For example, the decompression unit PU can include a dry pump, a turbo pump, or the like. The decompression unit PU can not only exhaust the gas outside the chamber CH1 but also exhaust substances evaporated from the solution on the substrate SUB to the outside of the chamber CH1.

[0058] Figure 1 It is a schematic diagram, and the drying device DE1 may further include various structural elements and may be changed into various structures.

[0059] For example, if the workbench BP is provided at the bottom of the chamber CH1, a heating unit may be provided at the top of the chamber CH1. The heating unit can apply heat to the substrate SUB. This heat can remove the solvent from the ink on the substrate SUB. For example, the heating unit may include a resistor, a heat wire, a heat source (e.g., infrared rays), etc.

[0060] For example, the heating unit may be connected to a control unit. For example, the control unit may be a programmable logic device (PLD) such as a field programmable gate array (FPGA), or a computer including an application-specific integrated circuit (ASIC) and a program. These may be used alone or in combination.

[0061] For example, the control unit can control the temperature of the heating unit. Furthermore, the control unit can also control the operation of other components. For example, the control unit can also control the internal pressure of chamber CH1, the rotation speed and rotation angle of the rectifier plate BA1, and other functions. Furthermore, if there are multiple rectifier plates BA1, the rotation speeds and rotation angles of each rectifier plate BA1 can be independently controlled.

[0062] Figure 2 Is used to describe the containment Figure 1 A top view of a substrate in a drying device.

[0063] Reference Figure 1 and Figure 2 The substrate SUB may be disposed on the workbench BP. The substrate SUB may include a central portion MP and an edge portion EP, and may be provided with a plurality of pixels PX1 and PX2.

[0064] The substrate SUB is enlarged, and different materials with different drying speeds can be discharged onto the substrate SUB at the same time. In this case, the drying speed and drying amount can be determined by the size and density of the space that allows the solvent to evaporate freely from the materials.

[0065] In the case of the drying apparatus of the comparative example, the rectifying plate BA1 may not be included. In this case, the drying rate at the center portion MP of the substrate SUB may be lower than the drying rate at the edge portion EP of the substrate SUB. In this case, even if the drying process is performed at the same temperature, the film flatness at the center portion MP and the edge portion EP of the substrate SUB may be lower.

[0066] The drying device of the comparative example may also include a rectifying plate. The rectifying plate may have a porous plate shape. For example, the rectifying plate included in the drying device of the comparative example may be arranged above the substrate SUB and arranged to overlap with the substrate SUB in a plan view. In this case, the larger the size of the substrate SUB, the larger the area of ​​the porous plate, which may cause sagging. In order to prevent the rectifying plate from sagging, the drying device of the comparative example may include a complex supporting structure. As a result, the device is enlarged and becomes complex, which may increase the manufacturing cost of the device.

[0067] The drying device DE1 of one embodiment of the present invention may include a rectifying plate BA1 that overlaps a portion of the substrate SUB when viewed from above. The rectifying plate BA1 can adjust the size of the drying space and the length of the flow path to the decompression unit PU based on its degree of inclination relative to the substrate SUB. In other words, the drying device DE1 can control the drying speed at different locations on the substrate SUB. This further improves the film flatness at the center MP and edge EP of the substrate SUB.

[0068] Furthermore, since the size of the rectifying plate BA1 included in the drying device DE1 is smaller than that of the rectifying plate included in the drying device of the comparative example, the occurrence of sagging can be prevented. Therefore, the equipment of the drying device DE1 is made relatively small and simple, thereby reducing the manufacturing cost of the equipment.

[0069] Although Figure 2 In the above description, one substrate SUB is arranged on the workbench BP as an example, but the present invention is not limited thereto. For example, multiple substrates SUB may also be arranged on the workbench BP.

[0070] Figures 3 to 5 Is used to illustrate Figure 1 Diagram of the drying method of the drying device.

[0071] Reference Figure 1 、 Figure 3 、 Figure 4 and Figure 5 The drying device DE1 can adjust the size of the drying space and the length of the flow path to the decompression unit PU by including the rectifying plate BA1. In other words, the drying device DE1 can control the drying speed of the substrate SUB at different positions.

[0072] like Figure 1 As shown, the rectifying plate BA1 can be rotated in a downwardly tilted direction from the center MP of the substrate SUB toward the edge EP. In this case, the drying space in the center MP of the substrate SUB can be larger than that in the edge EP of the substrate SUB. Furthermore, the flow path in the edge EP of the substrate SUB can be made relatively small. Consequently, the drying speed of the edge EP of the substrate SUB can be controlled to be relatively slow. This also reduces the difference in drying speed between the center MP and edge EP of the substrate SUB.

[0073] like Figure 3 As shown, the rectifier plate BA1 can be rotated to be arranged parallel to the substrate SUB. For example, if material with a high drying rate is discharged to the center MP of the substrate SUB, and material with a low drying rate is discharged to the edge EP of the substrate SUB, the rectifier plate BA1 can be rotated to be arranged parallel to the substrate SUB. In this case, since the size of the drying space in the center MP of the substrate SUB and the size of the drying space in the edge EP of the substrate SUB can be similar, and the flow rate of the solvent dried from the substrate SUB toward the exhaust section (e.g., the decompression unit PU) is faster at the edge EP, the deviation in the drying rate between the center MP and the edge EP of the substrate SUB can be reduced.

[0074] like Figure 4 As shown, the rectifier plate BA1 can be rotated upwardly and tilted in the direction from the center portion MP of the substrate SUB toward the edge portion EP. For example, when material with a high drying speed is discharged to the center portion MP of the substrate SUB, and material with a low drying speed is discharged to the edge portion EP of the substrate SUB, the rectifier plate BA1 can be rotated upwardly and tilted in the direction from the center portion MP of the substrate SUB toward the edge portion EP. In this case, the size of the drying space in the center portion MP of the substrate SUB can be smaller than the size of the drying space in the edge portion EP of the substrate SUB. In addition, the flow path in the edge portion EP of the substrate SUB can be made relatively large. As a result, the drying speed of the edge portion EP of the substrate SUB can be controlled to be relatively large. As a result, the deviation in the drying speed between the center portion MP and the edge portion EP of the substrate SUB can be reduced.

[0075] Furthermore, the drying device DE1 may include the rotating plate CP to prevent the substrate SUB from being contaminated by a backflow caused by internal pressure fluctuations.

[0076] like Figure 5 As shown, for example, the rotating plate CP may be arranged below the workbench BP. For example, the rotating plate CP may be arranged on a flow path of the solvent dried (eg, evaporated) from the substrate SUB toward the decompression unit PU.

[0077] For example, the rotating plate CP can freely rotate in one direction. That is, during the drying process, the rotating plate CP can freely rotate. Furthermore, when the internal pressure of the chamber CH1 fluctuates, the rotating plate CP does not need to rotate in a direction opposite to the one direction. This prevents contaminants that should be removed by the decompression unit PU from flowing back toward the substrate SUB.

[0078] Figure 6 It is a diagram for explaining a drying device according to another embodiment of the present invention.

[0079] Reference Figure 6 The drying device DE2 may include a chamber CH2, a workbench BP, a rectifying plate BA2, the rotating plate (eg, Figure 1 The rotating plate CP) and the decompression unit PU in the chamber CH2 can be arranged in the workbench BP, the rectifying plate BA2 and the rotating plate. The decompression unit PU can be connected to the chamber CH2.

[0080] Below, the reference to the previous Figures 1 to 5 The description of the construction of the drying device DE1 is repeated.

[0081] In one embodiment, the chamber CH2 can accommodate the substrate SUB. For example, the chamber CH2 can provide a sealed processing space.

[0082] In one embodiment, the work table BP may support the substrate SUB inside the chamber CH2.

[0083] In one embodiment, the rectifying plate BA2 may be disposed on a side of the workbench BP in the chamber CH2 so as to be spaced apart from the substrate SUB.

[0084] In one embodiment, the rectifier plate BA2 may include a shaft RA2, a first plate SP1, and a second plate SP2. The first plate SP1 may have a first end connected to the shaft RA2 and a second end positioned above the base plate SUB. The second plate SP2 may have a third end connected to the shaft RA2 and a fourth end positioned below the workbench BP.

[0085] In one embodiment, the distance LE1 between the second end of the first plate SP1 and the fourth end of the second plate SP2 is adjustable, thereby controlling the size of the drying space at the center MP and the edge EP of the substrate SUB.

[0086] For example, the axis RA2 may be connected to a drive device. The drive device may be arranged so as not to overlap with the substrate SUB in a plan view. In this case, particles generated by adjusting the separation distance LE1 will not fall on the substrate SUB, thereby preventing contamination of the substrate SUB.

[0087] In one embodiment, the rectifier plate BA2 may have a clip-like shape. In this case, the distance LE1 between the second end of the first plate SP1 and the fourth end of the second plate SP2 can be adjusted. For example, the size of the drying space can be varied based on the distance LE1. In this case, the first plate SP1 may form an angle AN1 with the horizontal plane containing the axis RA2, and the second plate SP2 may form an angle AN2 with the horizontal plane containing the axis RA2.

[0088] Although Figure 6 Not shown in the figure, but similar to Figure 1 Similar to the illustrated embodiment, the rotating plate CP may be arranged below the workbench BP. In one embodiment, the rotating plate CP can freely rotate in one direction and cannot rotate in a direction opposite to the one direction. To this end, in one embodiment, the rotating plate CP may include an anti-reversal device FRA. For example, the anti-reversal device FRA may be a bearing.

[0089] The decompression unit PU can exhaust the gas inside the chamber CH2 to the outside of the chamber CH2. Thus, the decompression unit PU can reduce the internal pressure of the chamber CH2. The decompression unit PU can not only exhaust the gas outside the chamber CH2 but also exhaust substances evaporated from the solution on the substrate SUB to the outside of the chamber CH2.

[0090] Figures 7 and 8 Is used to illustrate Figure 6 Diagram of the drying method of the drying device.

[0091] Reference Figures 6 to 8 The drying device DE2 can adjust the size of the drying space and the length of the flow path to the decompression unit PU by including the rectifying plate BA2. In other words, the drying device DE2 can control the drying speed of the substrate SUB at different positions.

[0092] For example, Figure 6 and Figure 7As shown, the rectifier plate BA2 may include a first plate SP1 and a second plate SP2. The separation distance LE1 between the second end of the first plate SP1 and the fourth end of the second plate SP2 is adjustable. For example, the separation distance LE1 may be adjusted to a second separation distance LE2. In this case, the first plate SP1 may form an angle AN3 with the horizontal plane containing the axis RA2, and the second plate SP2 may form an angle AN4 with the horizontal plane containing the axis RA2.

[0093] For example, Figure 6 and Figure 8 As shown, the rectifier plate BA2 may include a first plate SP1 and a second plate SP2. The separation distance LE1 between the second end of the first plate SP1 and the fourth end of the second plate SP2 is adjustable. For example, the separation distance LE1 may be adjusted to a third separation distance LE3. In this case, the first plate SP1 may form an angle AN5 with the horizontal plane containing the axis RA2, and the second plate SP2 may form an angle AN6 with the horizontal plane containing the axis RA2.

[0094] In this case, the size of the flow path defined by the substrate SUB and the first plate SP1 and the size of the flow path defined by the workbench BP and the second plate SP2 can be controlled to be asymmetrical, thereby more variably changing the control speed of the substrate SUB at different positions.

[0095] Figure 9 It is a diagram for explaining a drying device according to another embodiment of the present invention.

[0096] Reference Figure 9 The drying device DE3 may include a chamber CH3, a workbench BP, a rectifying plate BA3, the rotating plate (eg, Figure 1 The rotating plate CP) and the decompression unit PU in the chamber CH3 can be arranged in the workbench BP, the rectifying plate BA3 and the rotating plate. The decompression unit PU can be connected to the chamber CH3.

[0097] Below, the reference to the previous Figures 1 to 8 The description of the structure of the drying device DE1 or DE2 is repeated.

[0098] In one embodiment, the chamber CH3 can accommodate the substrate SUB. For example, the chamber CH3 can provide a sealed processing space.

[0099] In one embodiment, the work table BP may support the substrate SUB inside the chamber CH3.

[0100] In one embodiment, the rectifying plate BA3 may be disposed on a side of the workbench BP in the chamber CH3 so as to be spaced apart from the substrate SUB.

[0101] In one embodiment, the rectifying plate BA3 may have a curved shape when viewed from a cross-section.

[0102] For example, the rectifying plate BA3 may be a plate having a predetermined curvature, or may be a plate similar to that described above. Figures 6 to 8 The described straightening plate BA2 is similarly provided with two plates having the prescribed curvature.

[0103] In one embodiment, the rectifier plate BA3 may have a rotation axis RA3 that may overlap the center of the rectifier plate BA3. For example, the rotation axis RA3 may be connected to a drive device. The drive device may be arranged so that it does not overlap the substrate SUB when viewed from above. In this case, particles that may be generated by the rotation will not fall onto the substrate SUB, thereby preventing contamination of the substrate SUB.

[0104] In one embodiment, the rectifying plate BA3 is rotatable, thereby controlling the size of the drying space at the center portion MP of the substrate SUB and the size of the drying space at the edge portion EP of the substrate SUB. The edge portion EP may surround the center portion MP.

[0105] For example, the rectifying plate BA3 may be arranged to be tilted downward from the center portion MP toward the edge portion EP of the substrate SUB. In this case, the size of the drying space at the center portion MP of the substrate SUB may be larger than the size of the drying space at the edge portion EP of the substrate SUB.

[0106] Although Figure 9 Not shown in the figure, but similar to Figure 1 Similar to the illustrated embodiment, the rotating plate CP may be arranged below the workbench BP. In one embodiment, the rotating plate CP can freely rotate in one direction and cannot rotate in a direction opposite to the one direction. To this end, in one embodiment, the rotating plate CP may include an anti-reversal device FRA. For example, the anti-reversal device FRA may be a bearing.

[0107] The decompression unit PU can exhaust the gas inside the chamber CH3 to the outside of the chamber CH3. Thus, the decompression unit PU can reduce the internal pressure of the chamber CH3. The decompression unit PU can not only exhaust the gas outside the chamber CH3 but also exhaust substances evaporated from the solution on the substrate SUB to the outside of the chamber CH3.

[0108] Figure 10 Is used to illustrate Figure 9 Diagram of the drying method of the drying device.

[0109] Reference Figures 9 and 10The drying device DE3 can adjust the size of the drying space and the length of the flow path to the decompression unit PU by including a rectifying plate BA3. In other words, the drying device DE3 can control the drying speed of the substrate SUB at different positions.

[0110] like Figure 9 As shown, the rectifying plate BA3 can be rotated tilted downward and leftward in the direction from the upper surface to the lower surface of the chamber CH3. In this case, the flow path at the edge portion EP of the substrate SUB can be relatively narrowed. This allows the drying rate at the edge portion EP of the substrate SUB to be controlled to be relatively slow. This also reduces the difference in drying rate between the center portion MP and the edge portion EP of the substrate SUB.

[0111] like Figure 10 As shown, the rectifying plate BA3 can be rotated tilted downward and rightward in the direction from the upper surface to the lower surface of the chamber CH3. In this case, the flow path at the edge portion EP of the substrate SUB can be relatively widened. This allows the drying speed of the edge portion EP of the substrate SUB to be controlled to be relatively high. For example, a material with a slow drying speed may be discharged toward the edge portion EP of the substrate SUB. In this case, the rectifying plate BA3 can be rotated tilted downward and rightward in the direction from the upper surface to the lower surface of the chamber CH3. This can reduce the deviation in drying speed between the center portion MP and the edge portion EP of the substrate SUB.

[0112] Figure 11 It is a diagram for explaining a display device formed by using the drying device according to an embodiment of the present invention.

[0113] Reference Figure 11 The display device may include a display panel PNL. The display panel PNL may include a base substrate 100, a display element layer 200, an encapsulation layer 300, and a cover substrate 400. The display element layer 200 may include a circuit element layer 210 and a light emitting element layer 220.

[0114] The circuit element layer 210 may be disposed on the base substrate 100 and may include a buffer layer BFR, at least one transistor TR, a connection electrode CE, a first insulating layer IL1, a second insulating layer IL2, a third insulating layer IL3, and a fourth insulating layer IL4. The transistor TR may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting element layer 220 may be disposed on the circuit element layer 210 and may include a fifth insulating layer IL5, a spacer SPC, and at least one light-emitting diode LD. The light-emitting diode LD may include a first electrode E1, a light-emitting layer LEL, and a second electrode E2.

[0115] The base substrate 100 may be an insulating substrate formed of a transparent material, such as glass or plastic.

[0116] The buffer layer BFR may be disposed on the base substrate 100. The buffer layer BFR may prevent a phenomenon in which metal atoms and impurities are diffused from the base substrate 100 toward the active layer ACT.

[0117] The active layer ACT may be disposed on the buffer layer BFR. The active layer ACT may be divided into a source region and a drain region doped with impurities and a channel region between the source region and the drain region.

[0118] The first insulating layer IL1 may be disposed on the buffer layer BFR. The first insulating layer IL1 may cover the active layer ACT and be formed with substantially the same thickness along the contour of the active layer ACT. However, the present invention is not limited thereto. For example, the first insulating layer IL1 may include an inorganic substance.

[0119] The gate electrode GE may be disposed on the first insulating layer IL1 . In one embodiment, the gate electrode GE may overlap the channel region of the active layer ACT.

[0120] The second insulating layer IL2 may be disposed on the first insulating layer IL1. Furthermore, the second insulating layer IL2 may cover the gate electrode GE and be disposed along the contour of the gate electrode GE with substantially the same thickness. However, the present invention is not limited thereto. For example, the second insulating layer IL2 may include an inorganic substance.

[0121] The source electrode SE and the drain electrode DE may be disposed on the second insulating layer IL2. The source electrode SE may contact the source region of the active layer ACT through a first contact hole formed in the first insulating layer IL1 and the second insulating layer IL2. The drain electrode DE may contact the drain region of the active layer ACT through a second contact hole formed in the first insulating layer IL1 and the second insulating layer IL2.

[0122] The third insulating layer IL3 may be disposed on the second insulating layer IL2. Furthermore, the third insulating layer IL3 may cover the source electrode SE and the drain electrode DE and may have a substantially flat upper surface without forming steps around the source electrode SE and the drain electrode DE. For example, the third insulating layer IL3 may include an organic substance.

[0123] The connection electrode CE may be disposed on the third insulating layer IL3 and may contact the source electrode SE or the drain electrode DE through a third contact hole formed in the third insulating layer IL3.

[0124] The fourth insulating layer IL4 may be disposed on the third insulating layer IL3. Furthermore, the fourth insulating layer IL4 may cover the connection electrode CE and have a substantially flat upper surface without forming steps around the source electrode SE and the drain electrode DE. For example, the fourth insulating layer IL4 may include an organic substance.

[0125] The first electrode E1 may be disposed on the fourth insulating layer IL4. The first electrode E1 may be reflective or translucent. For example, the first electrode E1 may include metal.

[0126] The first electrode E1 may contact the connection electrode CE through a fourth contact hole formed in the fourth insulating layer IL4 , thereby connecting the first electrode E1 to the transistor TR.

[0127] The fifth insulating layer IL5 may be disposed on the fourth insulating layer IL4 , and an opening exposing the upper surface of the first electrode E1 may be defined in the fifth insulating layer IL5 . For example, the fifth insulating layer IL5 may include an organic substance or an inorganic substance.

[0128] The spacer SPC may be disposed on the fifth insulating layer IL5. For example, the spacer SPC may include an organic substance or an inorganic substance. The spacer SPC may maintain a gap between the encapsulation layer 300 and the base substrate 100.

[0129] The spacer SPC may include a material different from that of the fifth insulating layer IL5. The spacer SPC may be formed after the fifth insulating layer IL5 is formed. However, embodiments of the present invention are not limited thereto, and the spacer SPC may include the same material as that of the fifth insulating layer IL5. For example, the fifth insulating layer IL5 and the spacer SPC may include an organic material such as polyimide. Furthermore, the fifth insulating layer IL5 and the spacer SPC may be formed simultaneously using a halftone mask.

[0130] The light-emitting layer LEL may be disposed on the first electrode E1. The light-emitting layer LEL may be disposed in the opening formed in the fifth insulating layer IL5. In one embodiment, the light-emitting layer LEL may have a multilayer structure including a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer. The organic light-emitting layer may include a light-emitting substance.

[0131] The second electrode E2 may cover the light emitting layer LEL and may be disposed on the fifth insulating layer IL5 and the spacer SPC. In one embodiment, the second electrode E2 may have a plate shape. In addition, the second electrode E2 may have light transmittance or reflectivity. For example, the second electrode E2 may include metal.

[0132] The encapsulation layer 300 may be disposed on the light emitting element layer 220. The encapsulation layer 300 may prevent moisture and oxygen from invading the light emitting diode LD from the outside. For example, the encapsulation layer 300 may include a first inorganic encapsulation layer IEL1, an organic encapsulation layer OEL, and a second inorganic encapsulation layer IEL2.

[0133] The first inorganic encapsulation layer IEL1 may be arranged on the second electrode E2 along the contour of the second electrode E2 with substantially the same thickness. The organic encapsulation layer OEL may be arranged on the first inorganic encapsulation layer IEL1 and may have a substantially flat upper surface without forming steps around the first inorganic encapsulation layer IEL1. The second inorganic encapsulation layer IEL2 may be arranged on the organic encapsulation layer OEL.

[0134] The cover substrate 400 may be disposed on the encapsulation layer 300. For example, the cover substrate 400 may be made of a rigid glass, etc. For another example, the cover substrate 400 may be made of a flexible polymer resin, etc. For another example, the cover substrate 400 may be a film having a multilayer structure. For example, the multilayer structure may be a structure in which organic and inorganic films are alternately arranged. However, the present invention is not limited to this.

[0135] For example, the display panel PNL included in the display device may be formed by an inkjet method. The inkjet method may include a process of ejecting ink onto the base substrate 100 and a drying process of removing a solvent from the ink. The drying process may be performed by referring to the above Figures 1 to 10 The drying is carried out in the described drying devices DE1, DE2 or DE3.

[0136] As mentioned above, the drying device DE1 , DE2 or DE3 may include a rectifying plate BA1 , BA2 or BA3 , thereby controlling the drying speed of the base substrate 100 at different positions.

[0137] In addition, the drying device DE1 , DE2 , or DE3 may include a rotating plate CP, thereby preventing the base substrate 100 from being contaminated by a backflow caused by a change in the internal pressure of the chamber CH1 , CH2 , or CH3 .

[0138] The drying device of the exemplary embodiment of the present invention can be applied to the process of manufacturing a display device, which is included in a computer, a notebook computer, a mobile phone, a smart phone, a smart tablet, a portable media player (PMP), a personal digital assistant (PDA), an MP3 player, etc.

[0139] The above description refers to the embodiments of the present invention, but a person having ordinary knowledge in the technical field should understand that the present invention can be modified and changed in various ways without departing from the scope of the invention and the scope of the invention described in the claims.

Claims

1. A drying device, characterized in that: include: a chamber for receiving a substrate; a workbench, for supporting the substrate inside the chamber; as well as A rotatable rectifying plate is arranged above and to the side of the stage in the chamber so as to overlap with a portion of the substrate in a plan view.

2. The drying device according to claim 1, characterized in that The drying device further includes a rotating plate arranged below the workbench inside the chamber.

3. The drying device according to claim 2, characterized in that The rotating plate can rotate freely in one direction. The rotating plate includes an anti-reversal device, and the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

4. A drying device, characterized in that: include: a chamber for receiving a substrate; a workbench, for supporting the substrate inside the chamber; as well as A rectifying plate is arranged on a side of the workbench in the chamber in a manner spaced apart from the substrate.

5. The drying device according to claim 4, characterized in that The rectifier plate includes: axis; a first plate, a first end of the first plate being connected to the shaft and a second end of the first plate being located above the base plate; and a second plate, a third end of the second plate being connected to the shaft, and a fourth end of the second plate being located below the workbench, A distance between the second end of the first plate and the fourth end of the second plate is adjustable.

6. The drying device according to claim 4, characterized in that When viewed from a cross-section, the rectifying plate has a curved shape. The rectifying plate is rotatable.

7. The drying device according to claim 4, characterized in that The drying device further includes a rotating plate arranged below the workbench inside the chamber.

8. The drying device according to claim 7, characterized in that The rotating plate can rotate freely in one direction. The rotating plate includes an anti-reversal device, and the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

9. A drying device, characterized in that: include: a chamber for receiving a substrate; a workbench, for supporting the substrate inside the chamber; as well as A rotating plate is arranged below the workbench in the interior of the chamber.

10. The drying device according to claim 9, characterized in that The rotating plate can rotate freely in one direction. The rotating plate includes an anti-reversal device, and the anti-reversal device is used to prevent the rotating plate from rotating in a direction opposite to the one direction.

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