Filtering mechanism and wafer storage device

Abstract

The utility model provides a filtering mechanism and a wafer storage device.The filtering mechanism comprises a base and a filtering part, the base is detachably connected with the wafer storage device, the filtering part is detachably connected with the base, and when the filtering part is damaged, the base is detached from the wafer storage device on the outer side of the wafer storage device, so that the wafer storage device is not damaged; and meanwhile, the base part is arranged in the wafer storage device in a protruding manner, so that foreign matters on the outer side of the wafer storage device are prevented from damaging the filtering piece.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor production technology, and more specifically, relates to a filtering mechanism and a wafer storage device. Background Art

[0002] In the semiconductor industry, FOUP (Front Opening Unified Pod) is a sealed container for storing and transporting wafers. It is an extremely important device in the wafer transfer process.

[0003] During chip production, the cleanliness level inside the FOUP (former folding unpacking) is critical to prevent chip contamination. To maintain this cleanliness, nitrogen is purged into the FOUP. The nitrogen outlet is integrated with the FOUP and located at its bottom. A filter is installed on the nitrogen outlet to filter dust and other foreign matter from outside the FOUP, maintaining internal cleanliness.

[0004] The above technical solution results in the following problems: since the air outlet is integrated with the FOUP and flush with the bottom of the FOUP, and the filter is located inside the FOUP, when the filter at the bottom of the FOUP and on the air outlet is subjected to external pressure, the filter is easily damaged. If the filter is not replaced in time, the inside of the FOUP is easily contaminated by foreign matter. Moreover, when replacing the filter, the wafer needs to be taken out before the filter can be replaced. Therefore, in the existing technology, the filter inside the FOUP is not easy to replace. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a filtering mechanism and a wafer storage device to solve the technical problem in the prior art that the filter element in the wafer storage device is difficult to replace.

[0006] To achieve the above objectives, the first aspect of the present application is to provide a filtering mechanism for a wafer storage device, comprising:

[0007] a base detachably connected to the wafer storage device, wherein the base is partially protruded from the interior of the wafer storage device, and a gas flow channel is provided on the base, and the gas flow channel penetrates the base along the axial direction of the base;

[0008] The filter element is detachably connected to one end of the base located inside the wafer storage device.

[0009] Optionally, an external thread structure is provided on the base, and the base is detachably connected to the wafer storage device via the external thread structure.

[0010] Optionally, the base includes:

[0011] a first base, provided with the external thread structure and partially located in the wafer storage device;

[0012] a second base, slidably connected to one end of the first base located inside the wafer storage device along the axial direction of the first base, and having a first position and a second position relative to the first base, wherein the filter element is detachably connected to the second base;

[0013] The gas flow channel includes a first gas flow channel and a second gas flow channel that are interconnected, the first gas flow channel is provided on the first base, and the second gas flow channel is provided on the second base;

[0014] When the second base is located at the first position, the second base abuts against the first base;

[0015] When the second base is located at the second position, the second base is separated from the first base.

[0016] Optionally, it also includes:

[0017] An elastic member has one end connected to the first base and the other end opposite to the one end connected to the second base, and the elastic member is used to drive the second base to move from the second position to the first position and maintain the second base in the first position.

[0018] Optionally, a first accommodating groove is provided on the outer wall of the first base, and a second accommodating groove is provided on the outer wall of the second base;

[0019] The elastic member is partially accommodated in the first accommodation groove, and the other part is accommodated in the second accommodation groove.

[0020] Optionally, there are multiple elastic members, and the multiple elastic members are evenly spaced along the circumference of the first base.

[0021] Optionally, the filter element includes:

[0022] a first filter element detachably connected to an end of the second base facing away from the first base;

[0023] a second filter element, arranged in an annular structure, connected to the second base and slidably connected to the first gas flow channel, with an outer wall of the second filter element abutting against a side wall of the first gas flow channel;

[0024] Along the axial direction of the first base, a length of the second filter element is greater than a distance between the second position and the first position.

[0025] Optionally, the first filter element includes:

[0026] a support ring, detachably connected to the second base;

[0027] a filter screen connected to the support ring;

[0028] a first support skeleton extending from the center of the support ring along the radial direction of the support ring, wherein the outer end of the first support skeleton is connected to the support ring, and the number of the first support skeletons is multiple, and the multiple first support skeletons are evenly spaced along the circumference of the support ring;

[0029] The second support skeleton is arranged in a ring structure and is connected to the first support skeleton. There are multiple second support skeletons, and the multiple second support skeletons are evenly spaced along the radial direction of the support ring.

[0030] Optionally, the base further includes:

[0031] a third base connected to an end of the first base away from the second base and located outside the wafer storage device;

[0032] The gas flow channel includes a third gas flow channel, and the third gas flow channel is communicated with the first gas flow channel.

[0033] The beneficial effect of the filtering mechanism provided by the present application is that: compared with the prior art, the filtering mechanism provided by the present application includes a base and a filter element, wherein the base is detachably connected to the wafer storage device, and the filter element is detachably connected to the base. When the filter element is damaged, the base can be removed from the wafer storage device on the outside of the wafer storage device, thereby facilitating the replacement of the filter element on the base. At the same time, the base portion protrudes from the interior of the wafer storage device to prevent foreign objects on the outside of the wafer storage device from damaging the filter element.

[0034] A second aspect of the present application is to provide a wafer storage device, comprising:

[0035] Box;

[0036] a frame, installed in the box, for storing target wafers;

[0037] The filter mechanism is detachably connected to the box body, and the filter mechanism is any one of the filter mechanisms described above.

[0038] The beneficial effect of the filtering mechanism provided in the present application is that: compared with the prior art, the wafer storage device provided in the present application includes a box body, a frame installed in the box body, and the filtering mechanism provided by any one of the above items, and the filtering mechanism includes a base and a filter element, wherein the base is detachably connected to the wafer storage device, and the filter element is detachably connected to the base. When the filter element is damaged, the base can be removed from the wafer storage device on the outside of the wafer storage device, thereby facilitating the replacement of the filter element on the base. At the same time, the base portion protrudes from the interior of the wafer storage device to prevent foreign objects on the outside of the wafer storage device from damaging the filter element. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 A schematic structural diagram of a wafer storage device provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of the structure of the filtering mechanism provided in an embodiment of the present application;

[0042] Figure 3 A cross-sectional view of a filter mechanism provided in an embodiment of the present application;

[0043] Figure 4 This is a structural diagram of the second base in the embodiment of the present application when it is located at the second position;

[0044] Figure 5 This is a schematic structural diagram of the second filter element provided in an embodiment of the present application.

[0045] Among them, the reference numerals in the figures are:

[0046] 10. Wafer storage device; 20. Base; 21. First base; 211. External thread structure; 212. First gas flow channel; 213. First accommodating tank; 22. Second base; 221. Second gas flow channel; 222. Second accommodating tank; 23. Third base; 231. Third gas flow channel; 30. Filter element; 31. First filter element; 311. Support ring; 312. Filter screen; 313. First support frame; 314. Second support frame; 32. Second filter element; 40. Elastic member; 50. Box; 60. Frame; 70. Wafer. DETAILED DESCRIPTION

[0047] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0048] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0049] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0051] Please also refer to Figures 1 to 5 , the filtering mechanism provided in the embodiment of the present application is now described.

[0052] A first aspect of the present application is to provide a filtering mechanism for a wafer storage device 10 , comprising a base 20 and a filter element 30 .

[0053] For details, please refer to Figure 1 and Figure 2 In the present application, a mounting hole is provided at the bottom of the wafer storage device 10, the base 20 is detachably connected to the mounting hole, and a portion of the base 20 is protruded from the interior of the wafer storage device 10, and a gas flow channel is provided on the base 20, and the gas flow channel passes through the base 20 along the axial direction of the base 20.

[0054] The operator can install the base 20 in the mounting hole outside the wafer storage device 10, or install and remove the base 20 from the mounting hole outside the wafer storage device 10. When the interior of the wafer storage device 10 is purged with nitrogen, the nitrogen flows out of the wafer storage device 10 through the gas flow channel on the base 20.

[0055] The filter element 30 is detachably connected to one end of the base 20 located inside the wafer storage device 10, and is used to filter foreign particles outside the wafer storage device 10. While ensuring the cleanliness inside the wafer storage device 10, it can also prevent foreign particles outside the wafer storage device 10 from entering the interior of the wafer storage device 10 and contaminating the target wafer 70 inside the wafer storage device 10.

[0056] Compared with the prior art, the filtering mechanism provided in the present application includes a base 20 and a filter element 30, wherein the base 20 is detachably connected to the wafer storage device 10, and the filter element 30 is detachably connected to the base 20. When the filter element 30 is damaged, the base 20 can be removed from the wafer storage device 10 on the outside of the wafer storage device 10, thereby facilitating the replacement of the filter element 30 on the base 20. At the same time, a portion of the base 20 protrudes from the interior of the wafer storage device 10 to prevent foreign objects on the outside of the wafer storage device 10 from damaging the filter element 30.

[0057] In one implementation of this application, see Figure 2 The base 20 is provided with an external thread structure 211 , and the base 20 is detachably connected to the wafer storage device 10 via the external thread structure 211 .

[0058] Specifically, an internal thread structure is provided on the inner wall of the mounting hole, and the installed internal thread structure is threadedly connected to the external thread structure 211 on the base 20 to facilitate the removal of the base 20 from the mounting hole. At the same time, through the threaded cooperation between the installed internal thread structure and the external thread structure 211 on the base 20, the connection part between the base 20 and the mounting hole can also be sealed to prevent particles on the outside of the wafer storage device 10 from entering the wafer storage device 10, thereby further ensuring the cleanliness of the wafer storage device 10.

[0059] See also Figure 3 and Figure 4 In one embodiment of the application, the base 20 includes a first base 21 and a second base 22 , and the gas flow channel includes a first gas flow channel 212 and a second gas flow channel 221 .

[0060] Specifically, an external thread structure 211 is provided on the outer wall of the first base 21, and a portion of the first base 21 is located inside the wafer storage device 10, and a portion of the first base 21 is located outside the wafer storage device 10. A first gas flow channel 212 is provided inside the first base 21 and penetrates the first base 21 along the axial direction of the first base 21.

[0061] The second base 22 is slidably connected to the first base 21 and slides relative to the first base along the axial direction of the first base 21. The second base 22 is located at the end of the first base 21 within the wafer storage device 10. The second gas flow channel 221 is disposed within the second base 22 and extends through the second base 22 along the axial direction. The second gas flow channel 221 is connected to the first flow channel. The filter element 30 is detachably connected to the side of the second base 22 away from the first base 21.

[0062] The second base 22 has a first position and a second position relative to the first base 21 , and the second base 22 moves relative to the first base 21 between the first position and the second position.

[0063] When the second base 22 is located at the first position, the second base 22 is in contact with the first base 21. When the second base 22 is located at the second position, the second base 22 is separated from the first base 21.

[0064] When nitrogen is purged inside the wafer storage device 10 , the nitrogen passes through the filter 30 and then flows out of the wafer storage device 10 through the second gas flow channel 221 and the first gas flow channel 212 in sequence.

[0065] If a foreign object enters the first gas flow channel 212 , the second base 22 is driven by the foreign object to move from the first position to the second position.

[0066] When the second base 22 is located at the second position, a side of the second base 22 facing away from the first base 21 is spaced apart from the target wafer 70 of the wafer storage device 10 .

[0067] In one embodiment of the present application, please refer again to Figure 3 and Figure 4 , the base 20 also includes a third base 23.

[0068] The third base 23 is connected to one end of the first base 21 away from the second base 22 , and the third base 23 is integrally provided with the first base 21 . The third base 23 is located outside the wafer storage device 10 .

[0069] The gas flow channel includes a third gas flow channel 231, which is connected to the first gas flow channel 212. Nitrogen enters the first gas flow channel 212 and then enters the third gas flow channel 231 before being discharged.

[0070] In one embodiment of the present application, the third base 23 is a polygonal structure, such as a quadrilateral or a hexagon, so that the operator can use the third base 23 to drive the first base 21 to be installed in the installation hole or to be removed from the installation hole.

[0071] In the present application, the filtering mechanism further includes an elastic member 40 .

[0072] See also Figures 2 to 5 One end of the elastic member 40 is connected to the first base 21, and the other end opposite to the one end is connected to the second base 22. The elastic member 40 is made of elastic material, such as rubber.

[0073] When the second base 22 is located at the first position, the elastic member 40 is in a stretched state to generate elastic deformation. Under the action of the elastic force of the elastic member 40 , the elastic member 40 maintains the second base 22 at the first position.

[0074] When the second base 22 moves to the second position, the elastic member 40 is further stretched. Driven by the elastic force of the elastic member 40 , the second base 22 moves from the second position to the first position and maintains the second base 22 in the first position.

[0075] In the present application, to facilitate threaded connection between the first base 21 and the mounting hole, a first receiving groove 213 is provided on the outer wall of the first base 21, and a second receiving groove 222 is provided on the outer wall of the second base 22. The elastic member 40 is partially accommodated in the first receiving groove 213 and the other part is accommodated in the second receiving groove 222.

[0076] When the elastic member 40 is accommodated in the first accommodating groove 213 and the second accommodating groove 222, the outer wall of the elastic member 40 is spaced apart from the outer walls of the first base 21 and the second base 22, so that the first base 21 can be threadedly connected to the mounting hole and removed from the mounting hole.

[0077] In the present application, there are multiple elastic members 40 , and the multiple elastic members 40 are evenly spaced along the circumference of the first base 21 .

[0078] Preferably, there are two elastic members 40 , which are symmetrically arranged so as to apply pressure to the second base 22 from both radial ends of the second base 22 at the same time, thereby ensuring uniform force on the second base 22 .

[0079] In one embodiment of the present application, see Figure 3 and Figure 4 The filter element 30 includes a first filter element 31 and a second filter element 32 .

[0080] The first filter element 31 is detachably connected to an end of the second base 22 facing away from the first base 21 to prevent particles and foreign matter from entering the wafer storage device 10 through the second gas flow channel 221 .

[0081] The second filter element 32 is annularly arranged and connected to the second base 22. It is also slidably connected to the first gas flow channel 212, with the outer wall of the second filter element 32 abutting against the sidewall of the first gas flow channel 212. In the axial direction of the first base 21, the length of the second filter element 32 is greater than the distance between the second position and the first position.

[0082] When the second base 22 moves from the first position to the second position, since the length of the second filter element 32 is greater than the distance between the second position and the first position, when the second base 22 moves to the second position, the second filter element 32 is used to prevent particulate foreign matter from entering the wafer storage device 10 through the gap between the first base 21 and the second base 22.

[0083] In one embodiment of the present application, see Figure 5 The first filter element 31 includes a support ring 311 , a filter screen 312 , a first support frame 313 and a second support frame 314 .

[0084] The support ring 311 is detachably connected to the second base 22 . The filter screen 312 is connected to the support ring 311 .

[0085] The first support skeleton 313 extends from the center of the support ring 311 along the radial direction of the support ring 311. The outer end of the first support skeleton 313 is connected to the support ring 311. There are multiple first support skeletons 313, and the multiple first support skeletons 313 are evenly spaced along the circumference of the support ring 311.

[0086] The second support skeleton 314 is provided in a ring-shaped structure and is connected to the first support skeleton 313 . There are multiple second support skeletons 314 , and the multiple second support skeletons 314 are evenly spaced along the radial direction of the support ring 311 .

[0087] By providing a plurality of first support frames 313 and second support frames 314 , the support strength of the filter screen 312 is increased, thereby preventing the filter screen 312 from being damaged when impacted.

[0088] Preferably, in the present application, the number of the first support skeletons 313 is 6, and the number of the second support skeletons 314 is 3.

[0089] In one embodiment of the present application, the support ring 311 is threadedly connected to the second base 22 so that the first filter element 31 and the second base 22 can be detachably connected.

[0090] In one embodiment of the present application, the support ring 311 is sleeved on the second base 22 and threadedly connected to facilitate the detachable connection between the first filter element 31 and the second base 22 .

[0091] A second aspect of the present application is to provide a wafer storage device 10 , comprising a box 50 , a frame 60 and a filtering mechanism.

[0092] The frame 60 is installed in the box 50 for storing the target wafer 70. The filter mechanism is detachably connected to the box 50, and the filter mechanism is any one of the filter mechanisms provided in the above embodiments.

[0093] Compared with the prior art, the wafer storage device 10 provided in the present application includes a box body 50, a frame body 60 installed in the box body, and a filtering mechanism provided by any one of the above items, the filtering mechanism includes a base 20 and a filter element 30, wherein the base 20 is detachably connected to the wafer storage device 10, and the filter element 30 is detachably connected to the base 20. When the filter element 30 is damaged, the base 20 can be removed from the wafer storage device 10 on the outside of the wafer storage device 10, thereby facilitating the replacement of the filter element 30 on the base 20. At the same time, a portion of the base 20 protrudes from the interior of the wafer storage device 10 to prevent foreign objects on the outside of the wafer storage device 10 from damaging the filter element 30.

[0094] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A filter mechanism for a wafer storage device, characterized in that ,include: a base detachably connected to the wafer storage device, wherein the base is partially protruded from the interior of the wafer storage device, and a gas flow channel is provided on the base, and the gas flow channel penetrates the base along the axial direction of the base; The filter element is detachably connected to one end of the base located inside the wafer storage device.

2. The filter mechanism according to claim 1, wherein: The base is provided with an external thread structure, and the base is detachably connected to the wafer storage device via the external thread structure.

3. The filter mechanism according to claim 2, wherein: The base comprises: a first base, provided with the external thread structure and partially located in the wafer storage device; a second base, slidably connected to one end of the first base located inside the wafer storage device along the axial direction of the first base, and having a first position and a second position relative to the first base, wherein the filter element is detachably connected to the second base; The gas flow channel includes a first gas flow channel and a second gas flow channel that are interconnected, the first gas flow channel is provided on the first base, and the second gas flow channel is provided on the second base; When the second base is located at the first position, the second base abuts against the first base; When the second base is located at the second position, the second base is separated from the first base.

4. The filter mechanism according to claim 3, wherein: Also includes: An elastic member has one end connected to the first base and the other end opposite to the one end connected to the second base, and the elastic member is used to drive the second base to move from the second position to the first position and maintain the second base in the first position.

5. The filter mechanism according to claim 4, wherein: A first accommodating groove is provided on the outer wall of the first base, and a second accommodating groove is provided on the outer wall of the second base; The elastic member is partially accommodated in the first accommodation groove, and the other part is accommodated in the second accommodation groove.

6. The filter mechanism according to claim 5, wherein: There are multiple elastic members, and the multiple elastic members are evenly spaced along the circumference of the first base.

7. The filtering mechanism according to claim 3 or 6, characterized in that: The filter element comprises: a first filter element detachably connected to an end of the second base facing away from the first base; a second filter element, arranged in an annular structure, connected to the second base and slidably connected to the first gas flow channel, with an outer wall of the second filter element abutting against a side wall of the first gas flow channel; Along the axial direction of the first base, a length of the second filter element is greater than a distance between the second position and the first position.

8. The filter mechanism according to claim 7, wherein: The first filter element comprises: a support ring, detachably connected to the second base; a filter screen connected to the support ring; a first support skeleton extending from the center of the support ring along the radial direction of the support ring, wherein the outer end of the first support skeleton is connected to the support ring, and the number of the first support skeletons is multiple, and the multiple first support skeletons are evenly spaced along the circumference of the support ring; The second support skeleton is arranged in a ring structure and is connected to the first support skeleton. There are multiple second support skeletons, and the multiple second support skeletons are evenly spaced along the radial direction of the support ring.

9. The filter mechanism according to claim 3, wherein: The base further comprises: a third base connected to an end of the first base away from the second base and located outside the wafer storage device; The gas flow channel includes a third gas flow channel, and the third gas flow channel is communicated with the first gas flow channel.

10. A wafer storage device, characterized in that: include: Box; a frame, installed in the box, for storing target wafers; A filter mechanism is detachably connected to the box body, and the filter mechanism is the filter mechanism according to any one of claims 1 to 9.

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