Improved semiconductor gas spray header

Abstract

The utility model relates to the technical field of gas spraying, in particular to an improved semiconductor gas spraying head, which is applied to gas spraying equipment and comprises a cylinder body, an inner chassis is fixedly arranged at one end of the cylinder body, an annular outer edge is fixedly arranged at the other end of the cylinder body, a plurality of hole channels are arranged in the inner chassis, each hole channel is obliquely arranged, and the annular outer edge is arranged at the other end of the cylinder body. The two ends of each hole channel are each provided with an air inlet and an air outlet, each air inlet is communicated with the top face of the inner base plate, each air outlet is communicated with the bottom face of the inner base plate, and the diameter of the inner wall of the barrel is the same as that of the inner wall of the annular outer edge. The cylinder is used for being installed on a spraying pipe of the gas spraying equipment, the uniformity and precision of gas spraying are remarkably improved, the durability of a spraying head is enhanced, the manufacturing cost and the maintenance difficulty are reduced, and an efficient and economical solution is provided for the semiconductor manufacturing industry.

Description

Technical Field

[0001] The utility model relates to the technical field of gas spraying, in particular to an improved semiconductor gas spraying head. Background Art

[0002] In the semiconductor manufacturing process, gas spray equipment is one of the indispensable key equipment. It is mainly used for cleaning, deposition, etching and other processing processes on the wafer surface.

[0003] However, traditional gas showerheads often suffer from uneven spraying, low precision, and poor durability. These issues not only affect the manufacturing quality of semiconductor products but also increase operating costs and replacement frequency. Therefore, developing a new type of gas showerhead to address these issues has become a pressing technical challenge for the semiconductor manufacturing industry. Utility Model Content

[0004] In view of this, the purpose of the present invention is to provide an improved semiconductor gas shower head to solve the problem that regular maintenance and replacement of the gas shower head increases the operating costs of the enterprise.

[0005] Based on the above-mentioned purpose, the utility model provides an improved semiconductor gas shower head, which is used for gas shower equipment, including a cylinder, an inner chassis is fixedly provided at one end of the cylinder, and an annular outer edge is fixedly provided at the other end of the cylinder, and a plurality of channels are provided inside the inner chassis, each of the channels is arranged at an angle, and an air inlet and an air outlet are provided at both ends of each channel, each of the air inlet is connected to the top surface of the inner chassis, and each of the air outlet is connected to the bottom surface of the inner chassis, the inner wall diameter of the cylinder is the same as the inner wall diameter of the annular outer edge, and the cylinder is used to be installed on the spray pipe of the gas shower equipment.

[0006] Preferably, the shape of the hole is trumpet-shaped, and the aperture of the air inlet is smaller than the aperture of the air outlet.

[0007] Preferably, the aperture of the air inlet is 0.4-0.6 mm.

[0008] Preferably, the aperture of the air outlet is 0.7-0.9 mm.

[0009] Preferably, the distance between adjacent air inlets is 1 mm.

[0010] Preferably, the distance between adjacent air outlets is 0.5 mm.

[0011] Preferably, the cylinder, inner chassis and annular outer edge are all made of high-performance alloy materials that are corrosion-resistant and high-temperature resistant.

[0012] The beneficial effects of the utility model are: significantly improving the uniformity and accuracy of gas spraying, enhancing the durability of the shower head, reducing manufacturing costs and maintenance difficulty, and providing an efficient and economical solution for the semiconductor manufacturing industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 This is a schematic top view of a gas shower head according to an embodiment of the present invention;

[0015] Figure 2 This is a front view schematic diagram of a gas shower head according to an embodiment of the present utility model;

[0016] Figure 3 This is a schematic internal cross-sectional view of the cylinder according to an embodiment of the present utility model;

[0017] Figure 4 It is a schematic diagram of the enlarged structure of the channel of the embodiment of the utility model.

[0018] The following are marked in the figure:

[0019] 1. Inner chassis; 2. Annular outer edge; 3. Cylinder; 4. Channel; 5. Air inlet; 6. Air outlet. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0021] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the usual meanings understood by people with ordinary skills in the field to which this utility model belongs. The "first", "second" and similar words used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.

[0022] like Figures 1 to 4 As shown, an improved semiconductor gas shower head is applied to gas shower equipment, including a cylinder 3, an inner chassis 1 is fixedly provided at one end of the cylinder 3, an annular outer edge 2 is fixedly provided at the other end of the cylinder 3, a plurality of channels 4 are provided inside the inner chassis, each of the channels 4 is inclined, and an air inlet 5 and an air outlet 6 are provided at both ends of each channel 4, each of the air inlet 5 is connected to the top surface of the inner chassis 1, and each of the air outlet 6 is connected to the bottom surface of the inner chassis 1, the inner wall diameter of the cylinder 3 is the same as the inner wall diameter of the annular outer edge 2, and the cylinder 3 is used to be installed on the spray pipe of the gas shower equipment.

[0023] For example, the shower head device is designed to be concave in shape to form a certain concave surface. A plurality of holes 4 are evenly distributed on the inner chassis 1. These holes 4 are arranged at an inclined angle to ensure that the gas can cover the wafer surface at an optimized spray angle.

[0024] As an optional embodiment, the shape of the channel 4 is trumpet-shaped, and the aperture of the air inlet 5 is smaller than the aperture of the air outlet 6.

[0025] For example, by designing the channel 4 into a trumpet shape, not only the flow resistance of the gas in the hole is reduced, but also the overall spraying efficiency is improved.

[0026] For example, in order to ensure that the shower head can work stably and long-term in the semiconductor manufacturing environment, the alloy material not only has excellent corrosion resistance and can resist the erosion of corrosive gases and chemicals commonly used in the semiconductor manufacturing process, but also has excellent high-temperature resistance and can maintain structural stability and performance reliability in high-temperature environments. Therefore, the service life of the shower head is significantly extended, reducing the company's operating costs and replacement frequency.

[0027] As an optional embodiment, the aperture of the air inlet 5 is 0.4-0.6 mm.

[0028] As an optional embodiment, the aperture of the air outlet 6 is 0.7-0.9 mm.

[0029] As an optional embodiment, the distance between adjacent air inlets is 1 mm.

[0030] As an optional embodiment, the distance between adjacent air outlets is 0.5 mm.

[0031] As an optional embodiment, the cylinder 3, the inner chassis 1 and the annular outer edge 2 are all made of a high-performance alloy material that is corrosion-resistant and high-temperature-resistant.

[0032] The main working principle of the present invention is as follows: the shower head equipment is designed to be concave in shape to form a certain concave surface, and a plurality of channels 4 are evenly distributed on the inner chassis 1. These channels 4 are arranged at an inclined angle to ensure that the gas can cover the wafer surface at an optimized injection angle. At the same time, the channel 4 adopts a "trumpet-shaped" design to accelerate the gas flow rate and form a pressure difference that is conducive to uniform distribution of the gas during the ejection process, ensuring that the gas can be evenly sprayed and improving the quality and uniformity of the film.

[0033] Those skilled in the art will understand that the discussion of any of the above embodiments is merely illustrative and is not intended to limit the scope of the present invention to these examples. Within the spirit and principles of the present invention, the technical features of the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and many other variations exist in the various aspects of the present invention described above, which are not provided in detail for the sake of clarity. Any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An improved semiconductor gas shower head, used in gas shower equipment, characterized in that: The invention comprises a cylinder (3), one end of which is fixedly provided with an inner chassis (1), the other end of which is fixedly provided with an annular outer edge (2), a plurality of channels (4) are provided inside the inner chassis, each of the channels (4) is arranged at an angle, and both ends of each channel (4) are provided with an air inlet (5) and an air outlet (6), each of the air inlet (5) is communicated with the top surface of the inner chassis (1), and each of the air outlet (6) is communicated with the bottom surface of the inner chassis (1), the inner wall diameter of the cylinder (3) is the same as the inner wall diameter of the annular outer edge (2), and the cylinder (3) is used to be installed on the spray pipe of the gas spray equipment.

2. The improved semiconductor gas shower head according to claim 1, characterized in that: The shape of the hole (4) is trumpet-shaped, and the aperture of the air inlet (5) is smaller than the aperture of the air outlet (6).

3. The improved semiconductor gas shower head according to claim 2, characterized in that: The aperture of the air inlet (5) is 0.4-0.6 mm.

4. The improved semiconductor gas shower head according to claim 2, characterized in that: The aperture of the air outlet (6) is 0.7-0.9 mm.

5. The improved semiconductor gas shower head according to claim 1, characterized in that: The distance between adjacent air inlets is 1 mm.

6. The improved semiconductor gas shower head according to claim 1, characterized in that: The distance between adjacent air outlets is 0.5 mm.

7. The improved semiconductor gas shower head according to claim 1, characterized in that: The cylinder (3), the inner chassis (1) and the annular outer edge (2) are all made of corrosion-resistant and high-temperature-resistant high-performance alloy materials.

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