Dispensing mechanism for semiconductor lighting device

Abstract

The utility model relates to a dispensing mechanism for a semiconductor lighting device, which relates to the technical field of semiconductor dispensing and comprises a conveyor belt, an inverted U-shaped frame is fixed on the front side and the rear side of the conveyor belt, and a heating mechanism for heating adhesive is arranged on the frame. Auxiliary mechanisms used for improving the dispensing effect are arranged on the left side and the right side of the frame. According to the dispensing mechanism for the semiconductor lighting device, the semiconductor lighting device is placed on the conveying belt, and the inverted-U-shaped frames on the two sides and the dispensing mechanism are matched, so that automatic dispensing can be achieved, manual operation is reduced, and the production efficiency is improved; according to the adhesive dispensing device, viscosity increase caused by too low temperature of the adhesive can be avoided, the fluidity of the adhesive is ensured, so that the uniformity of adhesive dispensing and the bonding effect of the device are ensured, the auxiliary mechanism can heat the semiconductor device before and after adhesive dispensing, and heating of the semiconductor is beneficial to improving the fluidity of the adhesive.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor dispensing, in particular to a dispensing mechanism for semiconductor lighting devices. Background Art

[0002] Semiconductor lighting devices are devices made of semiconductor materials and used for lighting. Common examples include LEDs (light-emitting diodes) and OLEDs (organic light-emitting diodes). They offer advantages such as high efficiency, long lifespan, and low power consumption, and are widely used in indoor lighting, traffic signals, vehicle lights, backlighting, and other fields.

[0003] Previously, the steps for dispensing glue on semiconductor lighting devices were to manually place the semiconductor lighting device to be dispensed on a workbench accurately, and then start the dispensing machine so that the dispensing machine can perform dispensing operations on the semiconductor lighting device according to preset parameters. For example, CN220759797U discloses a dispensing device for semiconductor packaging, which relates to the field of component processing equipment and includes a machine base, a clamping mechanism, and a dispensing machine body. The clamping mechanism is arranged on the machine base and includes two parallel clamping blocks and a lifting structure arranged at the bottom of the clamping blocks. The top opposite sides of the two clamping blocks are respectively provided with a stepping block. The clamping blocks include a fixed clamping block and a movable clamping block. The bottom of the movable clamping block is also provided with a translation structure; the dispensing machine body is connected to the machine base and is arranged above the clamping mechanism. The utility model is a dispensing device for semiconductor packaging, which has a detachable and liftable clamping block, and one of the clamping blocks is adjustable. The semiconductor components are directly fixed to the machine base and are not limited by the size of the pallet. The size adaptation range of the components is large.

[0004] Then, in order to improve the dispensing efficiency, the existing technology will place the semiconductor device on a conveyor for dispensing to improve the dispensing efficiency. However, the temperature of the adhesive is very important at this time. The temperature of the adhesive is often too low. At this time, the temperature will increase the viscosity of the adhesive, resulting in poor fluidity of the colloid during the dispensing process. This may make the colloid not evenly distributed in the dispensing part of the semiconductor device, affecting the bonding effect and electrical performance of the device. At the same time, the curing speed of the adhesive may slow down at low temperatures, which will increase the production cycle and reduce production efficiency. In some cases, if the curing is incomplete, it may affect the final performance of the adhesive. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present invention provides a dispensing mechanism for semiconductor lighting devices, which has the advantages of good dispensing effect and solves the problem that the dispensing effect is affected by the low temperature of the adhesive.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: a dispensing mechanism for semiconductor lighting devices, comprising a conveyor belt, wherein the same inverted U-shaped frame is fixed to the front and rear sides of the conveyor belt, the frame is provided with a heating mechanism for heating the adhesive, and the left and right sides of the frame are provided with auxiliary mechanisms for improving the dispensing effect, a dual-axis module is fixed to the top wall inside the frame, and a dispensing machine body is fixed to the dual-axis module;

[0007] The heating mechanism includes a storage box fixed to the upper surface of the frame, a motor is fixed to the right side of the upper surface of the storage box, a stirring rod with one end passing through and extending into the interior is rotatably connected to the center of the upper surface of the storage box through a bearing, and the motor output shaft and the stirring rod are rotatably connected through a bearing, a plurality of equally spaced blades are fixed to the outside of the stirring rod, an inner box is fixed to the inside of the storage box, and a spiral heating plate is sleeved on the outside of the inner box.

[0008] Furthermore, the heating mechanism also includes air outlet holes A opened on the left and right sides of the upper surface of the storage box, and the two air outlet holes A are connected to connecting pipes. The top end of the stirring rod is rotatably connected to a three-way valve through a bearing, and the two connecting pipes are connected to the three-way valve.

[0009] Furthermore, the stirring rod is shaped as a round rod with a hollow interior, and a plurality of air outlet holes B are provided on the outer side of the stirring rod.

[0010] Furthermore, the inner box is composed of a hollow cylinder and a frustum, and the frustum is fixed to the lower surface of the cylinder. The outer diameter of the cylinder is smaller than the length and width of the storage box.

[0011] Furthermore, the auxiliary mechanism includes a hollow plate fixed on the left and right sides of the frame, and the upper surfaces of the two hollow plates are respectively connected to the left and right sides of the storage box with a hot air pipe, and a fan is fixed inside the hot air pipe. The lower surface of the hollow plate is provided with a plurality of evenly distributed air outlet holes C, and an air outlet head is fixed inside the air outlet hole C.

[0012] Furthermore, the auxiliary mechanism also includes connecting rods fixed to the left and right sides of the frame, the other ends of the connecting rods are fixed to the upper surface of the hollow plate, and the two connecting rods are distributed in an eight-shaped shape.

[0013] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0014] The dispensing mechanism for semiconductor lighting devices can realize automatic dispensing by placing the semiconductor lighting devices on a conveyor belt and cooperating with the inverted U-shaped frames and dispensing mechanism on both sides, thereby reducing manual operations and improving production efficiency. The adhesive is heated by the heating mechanism to avoid the increase in viscosity caused by the adhesive temperature being too low, ensuring the fluidity of the colloid, thereby ensuring the uniformity of dispensing and the bonding effect of the device. The auxiliary mechanism can heat the semiconductor device before and after dispensing. Heating the semiconductor helps to improve the fluidity of the adhesive, so that the adhesive can better fill the gap between the chip and the packaging substrate, thereby ensuring a stronger bond between the chip and the substrate. Secondly, heating after dispensing is completed can increase the curing speed of the adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the heating mechanism of the utility model;

[0017] Figure 3 This is a schematic diagram of the auxiliary mechanism of the utility model;

[0018] Figure 4 This is a schematic diagram of the connection structure between the frame and the hollow plate of the utility model.

[0019] In the figure: 1 conveyor belt, 2 frame, 3 heating mechanism, 301 storage box, 302 motor, 303 stirring rod, 304 blade, 305 inner box, 306 heating plate, 307 connecting pipe, 308 three-way valve, 4 auxiliary mechanism, 401 hollow plate, 402 hot air pipe, 403 fan, 404 air outlet head, 405 connecting rod, 5 dual-axis module, 6 dispensing machine body. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 In this embodiment, a dispensing mechanism for semiconductor lighting devices includes a conveyor belt 1. A frame 2 having the same inverted U-shape is fixed to the front and rear sides of the conveyor belt 1. A heating mechanism 3 for heating the adhesive is provided on the frame 2. Auxiliary mechanisms 4 for improving the dispensing effect are provided on the left and right sides of the frame 2. A dual-axis module 5 is fixed to the top wall inside the frame 2. A dispensing machine body 6 is fixed to the dual-axis module 5.

[0022] The heating mechanism 3 includes a storage box 301 fixed to the upper surface of the frame 2, and a motor 302 is fixed to the right side of the upper surface of the storage box 301. A stirring rod 303 with one end passing through and extending into the interior is rotatably connected to the center of the upper surface of the storage box 301 through a bearing, and the output shaft of the motor 302 and the stirring rod 303 are rotatably connected through a bearing. A plurality of equally spaced blades 304 are fixed to the outside of the stirring rod 303, and an inner box 305 is fixed to the inside of the storage box 301. The outer side of the inner box 305 is provided with a spiral heating plate 306.

[0023] It should be noted that the storage box 301 is fixed to the upper surface of the frame 2 and serves as a major component of the heating mechanism 3, storing the adhesive to be heated. During the heating process, a temperature sensor monitors the temperature of the adhesive to ensure that it remains within an appropriate temperature range to prevent overheating or underheating. A temperature sensor is also fixed to the storage box 301.

[0024] Among them, the heating mechanism 3 also includes air outlet holes A opened on the left and right sides of the upper surface of the storage box 301. The two air outlet holes A are connected to the connecting pipe 307. The top of the stirring rod 303 is connected to the three-way valve 308 through the bearing rotation. The two connecting pipes 307 are connected to the three-way valve 308.

[0025] It should be noted that the air outlet holes A are provided on the left and right sides of the upper surface of the storage box 301, allowing the air or other gases inside the storage box 301 to be discharged through these holes. Through the coordinated operation of these components, the heating mechanism 3 can not only heat the adhesive but also control the gas flow, thereby improving the quality of the adhesive and the stability of the dispensing process.

[0026] The stirring rod 303 is shaped like a round rod with a hollow interior, and a plurality of air outlet holes B are formed on the outer side of the stirring rod 303 .

[0027] During the stirring process, hot air will enter the interior of the adhesive through the air outlet B to evenly deheat the adhesive.

[0028] The inner box 305 is composed of a hollow cylinder and a frustum, and the frustum is fixed to the lower surface of the cylinder. The outer diameter of the cylinder is smaller than the length and width of the storage box 301.

[0029] Among them, the auxiliary mechanism 4 includes a hollow plate 401 fixed on the left and right sides of the frame 2, and the upper surfaces of the two hollow plates 401 are respectively connected to the left and right sides of the storage box 301 with a hot air pipe 402, and a fan 403 is fixed inside the hot air pipe 402. The lower surface of the hollow plate 401 is provided with a plurality of evenly distributed air outlet holes C, and the air outlet head 404 is fixed inside the air outlet hole C.

[0030] The auxiliary mechanism 4 further includes connecting rods 405 fixed to the left and right sides of the frame 2 , the other ends of the connecting rods 405 are fixed to the upper surface of the hollow plate 401 , and the two connecting rods 405 are distributed in an eight-shaped pattern.

[0031] It should be noted that the auxiliary mechanism 4 provides hot air through the hollow plates 401 fixed to the left and right sides of the frame 2. The upper surface of the hollow plate 401 is connected to the left and right sides of the storage box 301 through the hot air pipe 402. This design allows hot air to be transferred from the storage box 301 to the hollow plate 401. After the glue is dispensed, the hot air provided by the air outlet C can accelerate the curing process of the adhesive and improve production efficiency. Before dispensing, the hot air can be used to preheat the semiconductor lighting device, reduce the temperature difference between the device and the adhesive, and help improve the bonding quality and thermal stability of the device.

[0032] Through these functions of the auxiliary mechanism 4, the dispensing mechanism can not only provide precise dispensing operation, but also improve the dispensing quality and production efficiency through hot air assistance, while increasing the applicability and flexibility of the equipment.

[0033] The working principle of the above embodiment is:

[0034] First, the conveyor belt 1 is started to transport the semiconductor lighting device to be glued to the glue dispensing position. The heating mechanism 3 starts to work. The heating plate 306 inside the storage box 301 heats the adhesive to ensure that the adhesive has appropriate viscosity and fluidity. The motor 302 is started and drives the stirring rod 303 to rotate through the bearing. The blades 304 on the stirring rod 303 stir the adhesive to ensure uniform heating and prevent the adhesive from settling or stratification. The outlet A of the heating mechanism 3 is connected to the three-way valve 308 through the connecting pipe 307. The three-way valve 308 controls the gas flow so that the hot air enters the adhesive through the outlet B to adjust the pressure in the storage box 301 and the degassing of the adhesive, further improving the uniform heating effect of the adhesive. The auxiliary mechanism 4 provides auxiliary heating to the hollow plate 401 and the hot air pipe 402 through the circulation of hot air from the storage box 301 and the operation of the fan 403. The hot air will pass through the outlet head 404 and reach the semiconductor lighting devices on both sides of the glue dispensing to perform preheating and secondary heating to improve the glue dispensing effect.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0036] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A dispensing mechanism for semiconductor lighting devices, comprising a conveyor belt (1), characterized in that: The front and rear sides of the conveyor belt (1) are fixed with a frame (2) in the same inverted U shape, the frame (2) is provided with a heating mechanism (3) for heating the adhesive, the left and right sides of the frame (2) are provided with auxiliary mechanisms (4) for improving the dispensing effect, the top wall inside the frame (2) is fixed with a double-axis module (5), and the dispensing machine body (6) is fixed on the double-axis module (5); The heating mechanism (3) comprises a material storage box (301) fixed to the upper surface of the frame (2); a motor (302) is fixed to the right side of the upper surface of the material storage box (301); a stirring rod (303) having one end extending through and into the interior of the material storage box (301) is rotatably connected at the center of the upper surface of the material storage box (301) via a bearing; an output shaft of the motor (302) and the stirring rod (303) are rotatably connected via a bearing; a plurality of blades (304) distributed at equal distances are fixed to the outside of the stirring rod (303); an inner box (305) is fixed inside the material storage box (301); and a spiral heating plate (306) is sleeved on the outside of the inner box (305).

2. The dispensing mechanism for a semiconductor lighting device according to claim 1, characterized in that: The heating mechanism (3) further comprises air outlet holes A provided on the left and right sides of the upper surface of the material storage box (301), both of the air outlet holes A are connected to a connecting pipe (307), the top end of the stirring rod (303) is rotatably connected to a three-way valve (308) via a bearing, and both of the connecting pipes (307) are connected to the three-way valve (308).

3. The dispensing mechanism for a semiconductor lighting device according to claim 1, characterized in that: The stirring rod (303) is in the shape of a round rod with a hollow interior, and a plurality of air outlet holes B are provided on the outer side of the stirring rod (303).

4. The dispensing mechanism for a semiconductor lighting device according to claim 1, characterized in that: The inner box (305) is composed of a hollow cylinder and a frustum, and the frustum is fixed to the lower surface of the cylinder. The outer diameter of the cylinder is smaller than the length and width of the storage box (301).

5. The dispensing mechanism for a semiconductor lighting device according to claim 1, characterized in that: The auxiliary mechanism (4) comprises a hollow plate (401) fixed to the left and right sides of the frame (2); a hot air pipe (402) is connected between the upper surfaces of the two hollow plates (401) and the left and right sides of the storage box (301), respectively; a fan (403) is fixed inside the hot air pipe (402); a plurality of evenly distributed air outlet holes C are opened on the lower surface of the hollow plate (401); an air outlet head (404) is fixed inside the air outlet hole C.

6. The dispensing mechanism for a semiconductor lighting device according to claim 5, characterized in that: The auxiliary mechanism (4) further comprises connecting rods (405) fixed to the left and right sides of the frame (2), the other ends of the connecting rods (405) being fixed to the upper surface of the hollow plate (401), and the two connecting rods (405) being distributed in an eight-shaped pattern.

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