Hot melt adhesive feeding device for gluing equipment

Abstract

The utility model relates to a hot melt adhesive feeding device for gluing equipment, and relates to the field of gluing machines, the hot melt adhesive feeding device comprises a bypass pipe, a three-way valve is installed on the bypass pipe, the three-way valve is located between a discharging port of the bypass pipe and a backflow valve, a backflow pipeline is arranged on the three-way valve in a communicating mode, and the discharging end of the backflow pipeline is communicated with a heating groove; a backflow gear pump is mounted on the backflow pipeline; a backflow control module used for controlling colloid to flow back into the heating groove when the temperature of the colloid is too low is installed on the bypass pipe, and the signal input end of the backflow control module is in signal connection with the signal output end of the gluing control module. The signal output end of the backflow control module is in signal connection with the signal input ends of the feeding gear pump, the three-way valve and the backflow gear pump. When the temperature of the hot melt adhesive in the colloid conveying pipeline is reduced, the hot melt adhesive with the reduced temperature can flow back into the heating groove, and the situation that the colloid conveying pipeline is blocked due to the fact that the temperature of the hot melt adhesive is reduced and the viscosity is increased can be avoided.

Description

Technical Field

[0001] The present application relates to the field of glue coating machines, and in particular to a hot melt adhesive feeding device for glue coating equipment. Background Art

[0002] Hot melt adhesive machines are widely used in the home appliance industry, automotive industry, filter industry, bottle cap bonding industry, non-woven fabric industry, packaging industry, packaging label industry, footwear industry, medical dressing industry and clothing material composite industry.

[0003] In the prior art, common gluing equipment primarily consists of a hot melt adhesive feeder and a gluing device mounted on a gluing machine frame. The hot melt adhesive feeder communicates with the gluing device via a glue delivery pipe, providing the gluing device with fluid hot melt adhesive. The hot melt adhesive feeder primarily consists of a heating system, a pressure system, and a gluing control module.

[0004] In common hot melt adhesive feeding devices, the heating system usually uses a heating tank, which heats the internal raw materials to the melting point and keeps the glue in the appropriate temperature range. Figure 1 The feed end of the colloid delivery pipeline 100 is connected to the heating tank 7, and the discharge end of the colloid delivery pipeline 100 is connected to the glue coating device 300; in order to avoid the occurrence of pipe bursting caused by excessive colloid pressure in the colloid delivery pipeline, a bypass pipe 1 is often provided on the colloid delivery pipeline 100, the feed gear pump 200 is located between the two ends of the bypass pipe, and a return valve 3 is installed on the bypass pipe 1. When the glue coating device 300 is closed, the colloid is transported back to the feed end of the feed gear pump 200 through the bypass pipe 1.

[0005] However, in the actual production and processing process, it is often necessary to input a start control signal and a stop control signal through the glue coating control module to shut down or start the glue coating device according to the processing needs. During the shutdown of the glue coating device, the colloid in the colloid delivery pipe is easy to circulate back into the colloid delivery pipe, and circulate in the colloid delivery pipe and the side pipe. In an environment with low temperature, the hot melt adhesive colloid is easy to lose its fluidity due to the drop in temperature and the increase in viscosity, which makes the hot melt adhesive colloid difficult to extrude. There is room for improvement. Utility Model Content

[0006] In order to return the hot melt adhesive with reduced temperature to the heating tank when the temperature of the hot melt adhesive in the colloid delivery pipeline decreases, and to prevent the colloid delivery pipeline from being blocked due to the decrease in temperature and increase in viscosity of the hot melt adhesive, the present application provides a hot melt adhesive feeding device for a gluing equipment.

[0007] The hot melt adhesive feeding device for glue coating equipment provided in this application adopts the following technical solution:

[0008] A hot melt adhesive feeding device for glue coating equipment includes a bypass pipe, a three-way valve installed on the bypass pipe, the three-way valve being located between the discharge port of the bypass pipe and a return valve, a return pipe being connected to the three-way valve, the discharge end of the return pipe being connected to a heating tank, and a return gear pump being installed on the return pipe;

[0009] A reflux control module is installed on the side pipe to control the colloid to reflux into the heating tank when the colloid temperature is too low. The signal input end of the reflux control module is connected to the signal output end of the glue coating control module, and the signal output end of the reflux control module is connected to the signal input end of the feeding gear pump, the three-way valve and the reflux gear pump.

[0010] By adopting the above technical solution, during the actual use of the gluing equipment, when the gluing control module controls the gluing device to stop gluing, the reflux control module monitors in real time the hot melt adhesive refluxed into the colloid delivery pipe through the bypass pipe. When the gluing device is closed for too long and the temperature of the hot melt adhesive in the bypass pipe is too low, the reflux control module controls the three-way valve to connect the bypass pipe and the reflux pipe, and at the same time controls the start of the reflux gear pump to transport the hot melt adhesive back to the heating tank through the reflux pipe for reheating, which can effectively reduce the occurrence of pipe blockage caused by the low temperature of the hot melt adhesive and the increased viscosity of the adhesive; when the gluing device is restarted, the reflux control device controls the three-way valve to re-close the reflux pipe and the bypass pipe, and at the same time controls the reflux gear pump to stop running, so that the bypass pipe re-flows the adhesive, providing hot melt adhesive for the gluing device and ensuring the temperature and pressure of the glue output.

[0011] Preferably, the reflux control module includes:

[0012] a temperature sensor, mounted on the bypass pipe, located between the feed end of the bypass pipe and the reflux valve, with a signal input end connected to a signal output end of the glue application control module, for receiving a stop control signal and detecting the temperature of the hot melt adhesive refluxed through the bypass pipe and outputting a glue temperature signal;

[0013] a single chip microcomputer, connected to the signal output terminal of the temperature sensor, for receiving the colloid temperature signal and outputting a reflux control signal;

[0014] The signal input ends of the three-way valve and the reflux gear pump are connected to the signal output ends of the single-chip microcomputer. The three-way valve receives the reflux control signal and connects the bypass pipe and the reflux pipe. The reflux gear pump receives the reflux control signal and transports the colloid back to the heating tank.

[0015] By adopting the above technical solution, when the glue coating control module controls the glue coating device to be closed, the temperature sensor is synchronously started to monitor the temperature of the hot melt adhesive in the side pipe. When the temperature of the hot melt adhesive in the side pipe is too low, the single-chip microcomputer outputs a reflux control signal, the three-way valve receives the reflux control signal and connects the reflux pipe and the side pipe. At the same time, the reflux gear pump receives the reflux control signal and starts to transport the hot melt adhesive flowing out of the side pipe back to the heating tank.

[0016] Preferably, a heat insulation film is fixedly connected to the outer wall of the return pipe.

[0017] By adopting the above technical solution, the thermal insulation film can reduce the further heat loss, temperature reduction and viscosity increase of the hot melt adhesive during the process of returning to the heating tank, thereby affecting the return of the hot melt adhesive.

[0018] Preferably, the return pipe is fixedly installed vertically on the frame of the glue coating equipment, and the heating tank is located directly below the return pipe.

[0019] By adopting the above technical solution, the return pipe is vertically downward, and the hot melt adhesive in the return pipe can flow into the heating tank under the action of gravity, reducing the occurrence of hot melt adhesive with high viscosity being retained in the return pipe.

[0020] Preferably, a cover is detachably mounted on the top of the heating tank, a connecting screw sleeve is fixedly mounted on the cover, a threaded connection port is provided in the connecting screw sleeve, a threaded connection end is provided at the discharge end of the reflux pipe, and the threaded connection end is threadedly connected to the threaded connection port.

[0021] By adopting the above technical solution, through the mutual coordination and use between the threaded connection end and the threaded connection sleeve, the technical effect of detachable connection between the discharge end of the return pipe and the heating tank can be achieved, which is convenient for the later disassembly of the return pipe and maintenance of the heating tank.

[0022] In summary, the hot melt adhesive feeding device for glue coating equipment of the present application has at least one of the following beneficial technical effects:

[0023] 1. During the actual use of the glue coating equipment, when the glue coating control module controls the glue coating device to stop glue coating, the reflux control module monitors the hot melt glue flowing back into the glue delivery pipe through the bypass pipe in real time. When the glue coating device is closed for too long and the temperature of the hot melt glue in the bypass pipe is too low, the reflux control module controls the three-way valve to connect the bypass pipe and the reflux pipe, and controls the reflux gear pump to start, so as to convey the hot melt glue back to the heating tank through the reflux pipe for reheating, which can effectively reduce the situation that the pipe is blocked due to the low temperature of the hot melt glue and the increased viscosity of the glue. When the glue coating device is restarted, the reflux control device controls the three-way valve to re-close the reflux pipe and the bypass pipe, and controls the reflux gear pump to stop running, so that the bypass pipe can reflux glue again, providing hot melt glue for the glue coating device and ensuring the temperature and pressure of the glue output.

[0024] 2. The thermal insulation film can reduce the further heat loss, temperature drop, and viscosity increase of the hot melt adhesive during the process of returning to the heating tank, which may affect the return of the hot melt adhesive;

[0025] 3. Through the mutual coordination and use between the threaded connection end and the threaded connection sleeve, the technical effect of detachable connection between the discharge end of the return pipe and the heating tank can be achieved, which is convenient for the later disassembly of the return pipe and maintenance of the heating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram used in the background technology of this application to illustrate the overall structure of a hot melt adhesive feeding device of an existing glue coating equipment.

[0027] Figure 2 This is a schematic diagram of an embodiment of the present application used to illustrate the overall structure of a hot melt adhesive feeding device.

[0028] Figure 3 This is a schematic diagram of an embodiment of the present application used to illustrate the connection structure between the heating tank and the return pipe.

[0029] Explanation of the accompanying symbols: 100, colloid delivery pipeline; 200, feed gear pump; 300, glue coating device; 1, bypass pipe; 2, three-way valve; 3, reflux valve; 4, reflux pipeline; 41, thermal insulation film; 42, threaded connection end; 5, reflux gear pump; 6, temperature sensor; 7, heating tank; 71, sealing cover; 72, connecting screw sleeve; 73, threaded connection port. DETAILED DESCRIPTION

[0030] The following is combined with Figure 2-3 This application is described in further detail.

[0031] Example

[0032] The embodiment of the present application discloses a hot melt adhesive feeding device for glue coating equipment. Figure 2, including a bypass pipe 1, a three-way valve 2 is installed on the bypass pipe 1, the three-way valve 2 is located between the discharge port of the bypass pipe 1 and the reflux valve 3, a reflux pipe 4 is connected to the three-way valve 2, the discharge end of the reflux pipe 4 is connected to the heating tank 7, and a reflux gear pump 5 is installed on the reflux pipe 4.

[0033] A reflux control module is installed on the side pipe 1 for controlling the reflux of the colloid into the heating tank 7 when the colloid temperature is too low. The signal input end of the reflux control module is connected to the signal output end of the glue coating control module, and the signal output end of the reflux control module is connected to the signal input end of the feeding gear pump, the three-way valve 2 and the reflux gear pump 5.

[0034] During the actual use of the glue coating equipment, when the glue coating control module controls the glue coating device 300 to stop coating, the reflux control module monitors in real time the hot melt glue refluxed into the glue delivery pipe 100 through the bypass pipe 1. When the glue coating device 300 is closed for too long and the temperature of the hot melt glue in the bypass pipe 1 is too low, the reflux control module controls the three-way valve 2 to connect the bypass pipe 1 and the reflux pipe 4, and at the same time controls the reflux gear pump 5 to start, and transports the hot melt glue back to the heating tank 7 through the reflux pipe 4 for reheating, which can effectively reduce the occurrence of pipe blockage caused by the low temperature of the hot melt glue and the increased viscosity of the glue; when the glue coating device 300 is restarted, the reflux control device controls the three-way valve 2 to re-close the reflux pipe 4 and the bypass pipe 1, and at the same time controls the reflux gear pump 5 to stop running, so that the bypass pipe 1 refluxes the glue again, providing hot melt glue for the glue coating device 300 and ensuring the temperature and pressure of the glue output.

[0035] Reference Figure 2 The reflux control module includes: a temperature sensor 6, which is installed on the bypass pipe 1 and is located between the feeding end of the bypass pipe 1 and the reflux valve 3. The signal input end is connected to the signal output end of the glue control module, and is used to receive a stop control signal and detect the temperature of the hot melt adhesive refluxed through the bypass pipe 1 and output a glue temperature signal; a single-chip microcomputer is connected to the signal output end of the temperature sensor 6, and is used to receive the glue temperature signal and output a reflux control signal; the signal input end of the three-way valve 2 and the reflux gear pump 5 is connected to the signal output end of the single-chip microcomputer, the three-way valve 2 receives the reflux control signal and connects the bypass pipe 1 with the reflux pipe 4, the reflux gear pump 5 receives the reflux control signal and transports the glue back to the heating tank 7.

[0036] When the glue coating control module controls the glue coating device 300 to be closed, the temperature sensor 6 is synchronously started to monitor the temperature of the hot melt adhesive in the side pipe 1. When the temperature of the hot melt adhesive in the side pipe 1 is too low, the single chip microcomputer outputs a reflux control signal, the three-way valve 2 receives the reflux control signal and connects the reflux pipe 4 with the side pipe 1. At the same time, the reflux gear pump 5 receives the reflux control signal and starts to transport the hot melt adhesive flowing out of the side pipe 1 back to the heating tank 7.

[0037] Reference Figure 3 A heat-insulating film 41 is fixedly connected to the outer wall of the return pipe 4. The heat-insulating film 41 can reduce the further heat loss, temperature reduction and viscosity increase of the hot melt adhesive during the process of returning to the heating tank 7, thereby affecting the return of the hot melt adhesive.

[0038] Reference Figure 3 The return pipe 4 is vertically fixed on the frame of the glue coating equipment, and the heating tank 7 is located directly below the return pipe 4. The return pipe 4 is vertically downward, and the hot melt adhesive in the return pipe 4 can flow into the heating tank 7 under the action of gravity, reducing the occurrence of hot melt adhesive colloid stagnation in the return pipe 4 due to increased viscosity caused by temperature drop.

[0039] Reference Figure 3 A cover 71 is detachably installed on the top of the heating tank 7, and a connecting screw sleeve 72 is fixedly installed on the cover 71. A threaded connection port 73 is provided in the connecting screw sleeve 72, and a threaded connection end 42 is provided at the discharge end of the reflux pipe 4, which is threadedly connected to the threaded connection port 73.

[0040] By matching and using the threaded connection end 42 and the threaded connection sleeve 72, the technical effect of detachable connection between the discharge end of the return pipe 4 and the heating tank 7 can be achieved, which facilitates the later disassembly of the return pipe 4 and maintenance of the heating tank 7.

[0041] The implementation principle of a hot melt adhesive feeding device for a gluing device according to an embodiment of the present application is as follows: during actual use of the gluing device, when the gluing control module controls the gluing device 300 to stop gluing, the reflux control module monitors in real time the hot melt adhesive refluxed into the adhesive delivery pipe 100 through the bypass pipe 1. When the gluing device 300 is closed for too long and the temperature of the hot melt adhesive in the bypass pipe 1 is too low, the reflux control module controls the three-way valve 2 to connect the bypass pipe 1 and the reflux pipe 4, and controls the reflux gear pump 5 to start, so that the hot melt adhesive is transported back to the heating tank 7 through the reflux pipe 4 for reheating, which can effectively reduce the occurrence of pipe blockage caused by the low temperature of the hot melt adhesive and the increased viscosity of the adhesive. When the gluing device 300 is restarted, the reflux control device controls the three-way valve 2 to re-close the reflux pipe 4 and the bypass pipe 1, and controls the reflux gear pump 5 to stop running, so that the bypass pipe 1 refluxes the adhesive again, providing the hot melt adhesive to the gluing device 300 and ensuring the temperature and pressure of the adhesive.

[0042] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A hot melt adhesive feeding device for a glue coating device, characterized in that: The invention comprises a bypass pipe (1), a three-way valve (2) is installed on the bypass pipe (1), the three-way valve (2) is located between the discharge port of the bypass pipe (1) and the reflux valve (3), a reflux pipe (4) is connected to the three-way valve (2), the discharge end of the reflux pipe (4) is connected to the heating tank (7), and a reflux gear pump (5) is installed on the reflux pipe (4); The side pipe (1) is provided with a reflux control module for controlling the colloid to reflux into the heating tank (7) when the colloid temperature is too low. The signal input end of the reflux control module is connected to the signal output end of the glue coating control module. The signal output end of the reflux control module is connected to the signal input end of the feeding gear pump, the three-way valve (2) and the reflux gear pump (5).

2. A hot melt adhesive feeding device for glue coating equipment according to claim 1, characterized in that: The reflux control module includes: A temperature sensor (6) is installed on the bypass pipe (1) and is located between the feed end of the bypass pipe (1) and the return valve (3), with a signal input end connected to a signal output end of the glue coating control module, and is used to receive a stop control signal and detect the temperature of the hot melt glue returning through the bypass pipe (1) and output a glue temperature signal; A single chip microcomputer, connected to the signal output terminal of the temperature sensor (6), for receiving the colloid temperature signal and outputting a reflux control signal; The signal input ends of the three-way valve (2) and the reflux gear pump (5) are connected to the signal output end of the single chip microcomputer; the three-way valve (2) receives the reflux control signal and connects the bypass pipe (1) and the reflux pipe (4); the reflux gear pump (5) receives the reflux control signal and transports the colloid back into the heating tank (7).

3. A hot melt adhesive feeding device for glue coating equipment according to claim 2, characterized in that: A heat insulation film (41) is fixedly connected to the outer wall of the return pipe (4).

4. A hot melt adhesive feeding device for glue coating equipment according to claim 2, characterized in that: The return pipe (4) is fixedly installed vertically on the frame of the glue coating equipment, and the heating tank (7) is located directly below the return pipe (4).

5. The hot melt adhesive feeding device for glue coating equipment according to claim 4, characterized in that: A cover (71) is detachably mounted on the top of the heating tank (7), a connecting screw sleeve (72) is fixedly mounted on the cover (71), a threaded connection port (73) is provided in the connecting screw sleeve (72), and a threaded connection end (42) is provided at the discharge end of the return pipe (4), and the threaded connection end (42) is threadedly connected in the threaded connection port (73).

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